Display panel, display module and display device

Abstract

The utility model provides a display panel, a display module and a display device. The display panel comprises a first area used for arranging a driving chip, and a first protection layer is arranged on one side of the first area; in the first direction, the first protective layer sequentially comprises a first insulating layer and a first electromagnetic interference shielding layer; in the second direction, the first insulating layer and the first electromagnetic interference shielding layer are the same in size, and the second direction is perpendicular to the first direction. According to the technical scheme, the electrostatic discharge protection capability of the display device can be improved, and then the probability that the display device is damaged is reduced.

Description

Technical Field

[0001] This application relates to the field of display technologies, and more particularly, to a display panel, a display module, and a display device. Background Art

[0002] Driver chips (Integrated Circuits, ICs) are extremely vulnerable to reliability issues. One of the reliability problems is the possible damage that ICs may suffer during electrostatic discharge (ESD). When a charged object, such as a statically charged human body or a device with a different potential from the IC, discharges the static electricity it carries to the IC, an ESD event will occur. This discharge amount is usually a current of more than 1 ampere within 200 nanoseconds. This is determined by this peak current value and inductance. ESD events usually cause parts of the IC without protection devices to dissolve or explode. Therefore, existing display devices need to be provided with some additional insulating elements to prevent the display device from being damaged by ESD.

[0003] However, the size of the insulating elements provided in current display devices only covers above the IC. During the actual production process of the display device, due to reasons such as attachment tolerances, the IC may not be tightly wrapped, resulting in damage to the IC due to ESD. Therefore, how to improve the situation of the IC not being tightly wrapped in the existing setting and thus improve the ESD protection ability of the display module is an urgent problem to be solved currently. Summary of the Utility Model

[0004] In view of the above problems, this application provides a display panel, a display module, and a display device, which can improve the ESD protection ability of the display device and thus reduce the probability of the display device being damaged.

[0005] The first aspect of this application provides a display panel. The display panel includes: a first area for setting a driver chip, and a first protective layer is provided on one side of the first area; in a first direction, the first protective layer sequentially includes a first insulating layer and a first electromagnetic interference shielding layer; wherein, in a second direction perpendicular to the first direction, the first insulating layer and the first electromagnetic interference shielding layer have the same size.

[0006] In a possible implementation manner, the display panel further includes a second area; in a third direction perpendicular to the second direction, the second area is located on both sides of the first area; in the second direction, a second protective layer is provided on one side of the second area.

[0007] In a possible implementation, the first protective layer and the second protective layer are integrally designed.

[0008] In a possible implementation, in the first direction, the second protective layer sequentially includes a second insulating layer and a second electromagnetic interference shielding layer.

[0009] In a possible implementation, in the first direction, the first electromagnetic interference shielding layer includes a first adhesive layer, a first metal layer, and a first barrier layer arranged in sequence, and the second electromagnetic interference shielding layer includes a second adhesive layer, a second metal layer, and a second barrier layer arranged in sequence.

[0010] In a possible implementation, in the first direction, the size of the first insulating layer is 0.005 mm - 0.03 mm, and the size of the second insulating layer is 0.005 mm - 0.03 mm.

[0011] The second aspect of the present application provides a display module, including a display panel as described in any implementation of the first aspect, and a flexible circuit board.

[0012] In a possible implementation, a third electromagnetic interference shielding layer is provided on one side of the flexible circuit board.

[0013] In a possible implementation, the flexible circuit board is provided with a copper leakage area, the third electromagnetic interference shielding layer has a protruding portion, and the protruding portion faces the copper leakage area.

[0014] In a possible implementation, the display panel and the flexible circuit board have an overlapping bonding area; in the second direction, the first area and the bonding area are arranged in sequence.

[0015] In a possible implementation, in the first direction, the third electromagnetic interference shielding layer includes a third adhesive layer, a third metal layer, and a third shielding layer arranged in sequence; wherein, in the first direction, the size of the third metal layer is 1 μm - 4 μm.

[0016] In a possible implementation, in the first direction, the size of the first electromagnetic interference shielding layer is 0.01 mm - 0.03 mm, the size of the second electromagnetic interference shielding layer is 0.01 mm - 0.03 mm, and the size of the third electromagnetic interference shielding layer is 0.01 mm - 0.03 mm.

[0017] The third aspect of the present application provides a display device, including the display panel as described in any implementation of the first aspect of the present application, or the display module as described in any implementation of the second aspect of the present application. Description of the Drawings

[0018] To more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required in the embodiments of the present application. Obviously, the following described drawings are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained according to the drawings.

[0019] Figure 1 Structural schematic diagram of a display panel according to an embodiment of the present application;

[0020] Figure 2 Structural schematic diagram of a first protective layer according to an embodiment of the present application;

[0021] Figure 3 Structural schematic diagram of a protective layer according to an embodiment of the related art;

[0022] Figure 4 Structural schematic diagram of a display panel according to another embodiment of the present application;

[0023] Figure 5 Structural schematic diagram of a first electromagnetic interference shielding layer according to an embodiment of the present application;

[0024] Figure 6 Structural schematic diagram of a display module according to an embodiment of the present application;

[0025] Figure 7 Structural schematic diagram of a third electromagnetic interference shielding layer according to an embodiment of the present application.

[0026] Reference numerals:

[0027] Display module - 10;

[0028] Display panel - 100, first region - 110, second region - 120;

[0029] Flexible circuit board - 200, copper leakage area - 210, bonding area - 220;

[0030] First protective layer - 300, first insulating layer - 310, first electromagnetic interference shielding layer - 320, first adhesive layer - 321, first metal layer - 322, first barrier layer - 323;

[0031] Third electromagnetic interference shielding layer - 400, convex portion - 410;

[0032] Second protective layer - 500;

[0033] First direction - X, second direction - Y, third direction - Z. Detailed implementation manners

[0034] The following further describes in detail the implementation manners of the present application in conjunction with the accompanying drawings and embodiments. The detailed descriptions and drawings of the following embodiments are used to exemplarily illustrate the principles of the present application, but cannot be used to limit the scope of the present application, that is, the present application is not limited to the described embodiments.

[0035] The "range" disclosed in the present application is defined in the form of a lower limit and an upper limit. A given range is defined by selecting a lower limit and an upper limit, and the selected lower limit and upper limit define the boundary of a specific range. The range defined in this way includes the endpoint values and can be combined arbitrarily, that is, any lower limit can be combined with any upper limit to form a range. For example, if ranges of 60 - 120 and 80 - 110 are listed for a specific parameter, ranges of 60 - 110 and 80 - 120 are also contemplated. In addition, if the minimum range values 1 and 2 are listed, and if the maximum range values 3, 4, and 5 are listed, then the following ranges are all contemplated: 1 - 3, 1 - 4, 1 - 5, 2 - 3, 2 - 4, and 2 - 5. In the present application, unless otherwise specified, the numerical range "a - b" represents an abbreviated representation of any real number combination between a and b, where a and b are both real numbers. For example, the numerical range "0 - 5" means that all real numbers between "0 - 5" have been fully listed herein, and "0 - 5" is only an abbreviated representation of these numerical combinations. Additionally, when stating that a certain parameter is an integer ≥2, it is equivalent to disclosing that the parameter is, for example, the integers 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, etc.

[0036] If there is no special instruction, all embodiments and optional embodiments of the present application can be combined with each other to form a new technical solution.

[0037] If there is no special instruction, all technical features and optional technical features of the present application can be combined with each other to form a new technical solution.

[0038] The terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to limit the present application. As used in the specification and appended claims of the present application, the singular forms "a", "an", "the", "above", "said", "this" are also intended to include forms such as "one or more", unless the context clearly indicates otherwise. It should also be understood that in the following embodiments of the present application, "at least one", "one or more" means one, two, or more than two. The term "and / or" is used to describe the association relationship of associated objects and indicates that three relationships can exist; for example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone, where A and B can be singular or plural. The character " / " generally represents an "or" relationship between the associated objects before and after.

[0039] References to "one embodiment", "some embodiments", "an embodiment", or "some embodiments" described in this specification mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. Thus, statements such as "in one embodiment", "in some embodiments", "in other some embodiments", "in still other embodiments", etc., which appear in different places in this specification, do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized. The terms "comprising", "including", "having", and their variants mean "including but not limited to", unless otherwise specifically emphasized.

[0040] In the description of the embodiments of the present application, technical terms such as "first", "second", etc. are only used to distinguish different described objects, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity, specific order, or primary-secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "a plurality" is more than two, unless otherwise specifically and clearly defined.

[0041] Embodiments of the present application will be described in more detail below with reference to the accompanying drawings. In each of the drawings, like elements are denoted by like reference numerals. For clarity, the various parts in the drawings are not drawn to scale. In addition, some well-known parts may not be shown in the figures.

[0042] Many specific details of the embodiments of the present application are described below, such as the structure, materials, dimensions, processing techniques, and technologies of components, in order to understand the present disclosure more clearly. However, as those skilled in the art can understand, the technical solutions of the present application can be implemented without these specific details.

[0043] ESD refers to a transient high-voltage discharge phenomenon caused by the accumulation of static electricity, which can occur between two objects or between an object and the ground, usually caused by an imbalance of charges. ESD can damage electronic devices and components, especially sensitive ICs, display panels, semiconductor chips, etc. When ESD occurs, high-energy charges are released in a very short time, which may cause transient current surges and excessive voltages, resulting in damage to electronic components. ICs and display panels are particularly vulnerable to ESD.

[0044] When the static voltage is 2000V, the human body cannot feel it, but the ICs we use in production will be damaged by it, because CMOS integrated circuit devices can only withstand voltages of 250 - 2000V, and exceeding this voltage will cause damage. ESD can cause dielectric breakdown of integrated circuit chips, fuse core wires, increase leakage current, accelerate aging, change electrical performance parameters, etc. Therefore, the protection against ESD is quite important.

[0045] In view of this, the present application provides a display panel, a display module, and a display device. Specifically, the driving chip in the display panel can be completely covered by a protective layer, and the first insulating layer and the first electromagnetic interference shielding layer of the protective layer have the same size in the second direction. In this way, during the production and transportation processes, ESD will not enter the driving chip from the CG gap of the display module due to insufficient coverage of the insulating layer, which can reduce the probability of damage to the driving chip and thus improve the ESD tolerance of the display module.

[0046] The display panel, display module, and display device described in the present application will be described in detail below with reference to the accompanying drawings.

[0047] Figure 1 It is a schematic structural diagram of a display panel according to an embodiment of the present application. As Figure 1 shown, the display panel 100 includes a first area 110 for setting a driving chip, that is, the first area 110 is used to set the driving chip.

[0048] It should be noted that the technical solution of the present application is based on the COG (Chip On Glass) technology. The COG technology is a packaging process adopted in liquid crystal display screens and other flat panel display technologies. In the COG technology, the IC is directly installed and bonded on the glass substrate of the liquid crystal panel, rather than the traditional method of first bonding to a flexible circuit board or a rigid printed circuit board and then connecting to the glass substrate.

[0049] Therefore, the IC is connected to the first area 110 in a bonded manner. If the first area 110 is mentioned hereinafter, it is default that the IC has been set.

[0050] A first protective layer 300 is provided on one side of the first area 110.

[0051] It should be understood that Figure 1 the first area 110 shown in [[ ]] is only for indicating the position of the first area 110. In an actual product, the first area 110 should be covered by the first protective layer 300.

[0052] To avoid damage to the IC by ESD, a first protective layer 300 is provided on the first area 110 where the IC is set.

[0053] The first area 110 is provided with a first protective layer 300 on one side, which means that the first area 110 is completely covered by the first protective layer 300.

[0054] Figure 2 It is a schematic structural diagram of the first protective layer according to an embodiment of the present application. As Figure 2As shown, in the first direction X, the first protective layer 300 sequentially includes a first insulating layer 310 and a first electromagnetic interference shielding layer 320.

[0055] Exemplarily, the first direction X is as Figure 2 shown, and the first direction X can also be referred to as the thickness direction of the display panel 100, the display module, or the display device.

[0056] That is to say, in the first direction X, the first insulating layer 310 and the first electromagnetic interference shielding layer 320 are sequentially disposed on the first region 110. Therefore, compared with the first electromagnetic interference shielding layer 320, the first insulating layer 310 is closer to the first region 110.

[0057] Specifically, the material of the first insulating layer 310 can be various insulating materials. For example, it can be insulating mylar.

[0058] Specifically, the first electromagnetic interference (EMI) shielding layer 320 is a structure or material layer designed to prevent or significantly reduce the passage of electromagnetic energy. Its purpose is to protect electronic devices or systems from external electromagnetic interference and prevent electromagnetic radiation generated by internal electronic devices from interfering with other devices or systems. For example, the first electromagnetic interference shielding layer 320 can be a PZ-6000-X shielding layer or other commonly used shielding layers.

[0059] The setting of the first electromagnetic interference shielding layer 320 on the first region 110 is mainly used to block external electromagnetic interference from entering the display module, and the setting of the first insulating layer 310 is mainly used to prevent electrical short circuits between different conductive layers or components, ensure the normal operation of the circuit, and further block external electromagnetic interference.

[0060] In the second direction Y, the first insulating layer 310 and the first electromagnetic interference shielding layer 320 have the same size, and the second direction Y is perpendicular to the first direction X.

[0061] Exemplarily, the second direction Y can be as Figure 2 shown, and the second direction Y can also be referred to as the width direction of the display panel 100, the display module, or the display device.

[0062] Figure 3 It is a schematic structural diagram of a protective layer in an embodiment of the related art. As Figure 3 shown, in the related art, the first insulating layer 310 often only exactly covers the first region 110 where the IC is disposed, so that ESD can easily enter the IC from the CG gap of the display module 10, thereby damaging the IC.

[0063] In the present application, in the second direction Y, the size of the first insulating layer 310 in the first protective layer 300 is kept the same as that of the first electromagnetic interference shielding layer 320, that is, the first insulating layer 310 is designed to be widened, so as to better protect the IC.

[0064] In the above solution, the display panel 100 includes a first area 110 where the IC is disposed. By disposing the first protective layer 300 including the first insulating layer 310 and the first electromagnetic interference shielding layer 320 on the first area 110, and making the width of the first insulating layer 310 equal to that of the first electromagnetic interference shielding layer 320, that is, designing the first insulating layer 310 to be widened, the IC in the display panel 100 can be completely covered by the first insulating layer 310, so that during the production and transportation processes, ESD will not enter the IC through the CG gap of the display panel 100 due to insufficient coverage of the first insulating layer 310, which can reduce the probability of damage to the IC and thus improve the ESD tolerance of the display module.

[0065] It should be understood that in addition to the first insulating layer 310 and the first electromagnetic interference shielding layer 320, the first protective layer 300 may also be provided with an adhesive layer, and the adhesive layer may be an insulating adhesive layer. Of course, some other conventional film layers may also be provided, which will not be elaborated herein in the present application.

[0066] Figure 4 It is a schematic structural diagram of a display panel according to another embodiment of the present application. As Figure 4 shown, the display panel 100 further includes a second area 120; in the third direction Z, the second area 120 is located on both sides of the first area 110, and the third direction Z is perpendicular to the first direction X and the second direction Y.

[0067] Exemplarily, as Figure 3 shown, the third direction Z may also be referred to as the length direction of the display panel 100, the display module or the display device.

[0068] In the third direction Z, the second area 120 is located on both sides of the first area 110, which means that the first area 110 and the second area 120 are located at positions with the same width and different lengths of the display panel 100.

[0069] In the second direction Y, a second protective layer 500 is disposed on one side of the second area 120.

[0070] That is to say, in addition to the first area 110 of the display panel 100 being covered by the first protective layer 300, the second area 120 is also covered by the second protective layer 500.

[0071] It should be understood that the side of the first area 110 where the first protective layer 300 is disposed and the side of the second area 120 where the second protective layer 500 is disposed should be the same side.

[0072] In the above solution, for the display panel 100 on the same width of the first region 110, in addition to the first region 110 being provided, a second region 120 is also provided. By also providing a second protective layer 500 on the second region 120, that is, by also providing a first insulating layer 310 and a first electromagnetic interference shielding layer 320 on the single-layer region of the display panel 100, it is possible to effectively block ESD from entering the interior of the display panel 100 through the test pad, thereby protecting the display panel 100 from being damaged by ESD and further enhancing the protection ability of the display panel 100.

[0073] In some embodiments, the second region 120 is also provided with a fluorinating agent and silicone glue.

[0074] Specifically, by providing a fluorinating agent in the display panel 100, the hydrophobic and oleophobic properties of the surface of the display panel 100 can be increased, moisture penetration can be reduced, and internal electronic components can be protected from damage by moisture. By providing silicone glue in the display panel 100, it can be sealed and bonded to cover the effective circuits in the terminal region.

[0075] In some embodiments, the first protective layer 300 and the second protective layer 500 are integrally designed.

[0076] In the above solution, by making the first protective layer 300 and the second protective layer 500 of the display panel 100 be integrally designed, the difficulty of process production can be reduced.

[0077] It should be understood that the first protective layer 300 and the second protective layer 500 may not be integrally designed either.

[0078] In some embodiments, in the first direction X, the second protective layer 500 sequentially includes a second insulating layer and a second electromagnetic interference shielding layer.

[0079] That is, the first protective layer 300 and the second protective layer 500 have the same structure.

[0080] In some embodiments, Figure 5 is a schematic structural diagram of the first electromagnetic interference shielding layer according to an embodiment of the present application. As Figure 5 shown, in the first direction X, the first electromagnetic interference shielding layer 320 includes a first adhesive layer 321, a first metal layer 322, and a first barrier layer 323 arranged in sequence.

[0081] In the first direction X, the first adhesive layer 321, the first metal layer 322, and the first barrier layer 323 are arranged in sequence. We can also say that in the first direction X, the first adhesive layer 321, the first metal layer 322, and the first barrier layer 323 are arranged in sequence from bottom to top.

[0082] It should be understood that the first adhesive layer 321 is mainly for adhesion. In some application scenarios, the first electromagnetic interference shielding layer 320 needs to be attached to the surface of a specific material. Therefore, the first adhesive layer 321 can be a highly conductive adhesive with insulating properties to ensure that the first electromagnetic interference shielding layer 320 can be firmly bonded to the target surface while maintaining good electrical contact.

[0083] The first metal layer 322 is generally composed of a highly conductive metal material, such as copper, aluminum, or a more complex composite metal film, such as nickel - copper - nickel (Ni - Cu - Ni). The first metal layer 322 shields electromagnetic waves through reflection and absorption to reduce electromagnetic interference.

[0084] The first barrier layer 323 is located outside the first metal layer 322 or embedded between the first metal layers 322. The first barrier layer 323 is composed of an insulating material, such as polyester (PET), polyimide (PI), or other high - performance plastics. It can ensure electrical isolation between the first metal layer 322 and the external environment or other conductive parts on the circuit board, while providing necessary mechanical support.

[0085] In some embodiments, the second electromagnetic interference shielding layer includes a second adhesive layer, a second metal layer, and a second barrier layer arranged in sequence.

[0086] That is, the second electromagnetic interference shielding layer has the same structure as the first electromagnetic interference shielding layer 320, and details are not described herein again in this application.

[0087] It should be understood that in the structures of the first protective layer 300 and the second protective layer 500, the first insulating layer 310 and the first EMI shielding layer 320 can not only maintain the same size in the second direction Y but also maintain the same size in the third direction Z, that is, having the same width and length, which can comprehensively reduce the possibility of the IC being damaged by ESD.

[0088] In some embodiments, in the first direction X, the size of the first insulating layer 310 is 0.005 mm - 0.03 mm, and the size of the second insulating layer is 0.005 mm - 0.03 mm.

[0089] Specifically, in the first direction X, the size of the first insulating layer 310 can be 0.005 mm, 0.01 mm, 0.015 mm, 0.02 mm, 0.024 mm, 0.03 mm, or any value within the above range.

[0090] Specifically, in the first direction X, the size of the second insulating layer can be 0.005 mm, 0.008 mm, 0.012 mm, 0.021 mm, 0.025 mm, 0.03 mm, or any value within the above range.

[0091] Figure 6 Schematic diagram of the structure of a display module according to an embodiment of the present application. As Figure 6 shown, the display module 10 includes the display panel 100 described in any of the above embodiments, and a flexible circuit board 200.

[0092] Along the first direction X, the display panel 100 and the flexible circuit board 200 are arranged. Combining Figure 6 , we can say that the display panel 100 is arranged above the flexible circuit board 200, or we can also say that the flexible circuit board 200 is arranged below the display panel 100.

[0093] It should be understood that the above and below here refer to the two being on the same plane.

[0094] Please continue to refer to Figure 6 . In some embodiments, a third electromagnetic interference shielding layer 400 is arranged on one side of the flexible circuit board 200.

[0095] Arranging the third electromagnetic interference shielding layer 400 on one side of the flexible circuit board 200 means that the flexible circuit board 200 is completely covered by the third electromagnetic interference shielding layer 400 in the first direction X.

[0096] It should be understood that Figure 6 in order to distinguish the third electromagnetic interference shielding layer 400 from the flexible circuit board 200, and in order to represent manufacturing tolerances, the size of the flexible circuit board 200 is shown slightly larger than that of the third electromagnetic interference shielding layer 400, but this size difference can be ignored in actual products.

[0097] It should be understood that the side where the third electromagnetic interference shielding layer 400 is arranged should be the same side as the side where the first protective layer 300 and the second protective layer 500 are respectively arranged in the first region 110 and the second region 120.

[0098] In the above solution, by arranging the third electromagnetic interference shielding layer 400 on the flexible circuit board 200, ESD damage to the flexible circuit board 200 can be avoided.

[0099] Figure 7 Schematic diagram of the structure of the third electromagnetic interference shielding layer according to an embodiment of the present application. As Figure 6 and Figure 7 shown, the flexible circuit board 200 is provided with a copper leakage area 210.

[0100] Arranging the copper leakage area 210 on the flexible circuit board 200 can have the following functions:

[0101] Heat dissipation: The copper leakage area can increase the heat conduction area, thereby improving the heat dissipation efficiency. For components with high power or large heat generation, the surrounding copper leakage can help absorb and dissipate heat, preventing local overheating from affecting the circuit performance and reliability.

[0102] Grounding and signal integrity: The copper pour area can serve as a large-area ground layer, reducing the ground wire impedance and improving the anti-interference ability of the circuit. This helps to reduce noise and improve signal integrity, which is particularly important in high-speed signal transmission and sensitive circuits.

[0103] EMI control: As a shielding means, the copper pour area can reduce electromagnetic interference, prevent external electromagnetic fields from having an adverse effect on the circuit, and at the same time can limit the electrical radiation generated by the circuit itself, which helps to meet the compatibility requirements.

[0104] Of course, setting the copper pour area 210 also has other functions, such as enhancing mechanical stability, assisting soldering and connection, etc., which are not described one by one in this application.

[0105] As Figure 7 shown, the third electromagnetic interference shielding layer 400 includes a protruding portion 410, and the copper pour area 210 is opposite to the protruding portion 410.

[0106] In the above solution, by providing a protruding portion 410 on the side of the third electromagnetic interference shielding layer 400 close to the flexible circuit board 200, the protruding portion 410 is disposed opposite to the copper pour area 210 on the flexible circuit board 200, so that ESD can be conducted away and the ESD protection effect can be enhanced.

[0107] It should be understood that the material of the protruding portion 410 is the same as that of the third electromagnetic interference shielding layer 400.

[0108] It should be understood that the length and width of the protruding portion 410 are also consistent with the length and width of the copper pour area 210.

[0109] Please continue to refer to Figure 6 . As Figure 6 shown, the display panel 100 and the flexible circuit board 200 have an overlapping bonding area 220, and in the second direction Y, the first area 110 and the bonding area 220 are arranged in sequence.

[0110] With the development of flexible display screens, display devices such as mobile phones, tablet computers, and notebook computers are gradually developing towards full-screen and narrow-bezel designs. At present, the Pad Bending technology has gradually replaced the COF Bending technology because it can gradually shorten the bezel width of the display panel and is called the mainstream bending technology. The Pad Bending technology requires the display substrate to be cut into a special shape, the test area of the display substrate to be removed, and the Pad area to be bent to the back of the display substrate to achieve the purpose of reducing the bezel width.

[0111] It should be understood that Pad Bending refers to a technology that bends the Pad area of the display panel to the back of the display substrate to reduce the width of the lower border; among them, the Pad area refers to the gasket area in the display panel; COF Bending refers to a technology that places the display driving chip into the flexible cable of the flexible circuit board and then folds the flexible circuit board to the back of the display substrate to reduce the width of the lower border; among them, COF refers to Chip On Film.

[0112] That is to say, the bonding area 220 is the overlapping part where the flexible circuit board 200 and the display panel 100 are bent. By making the two have an overlapping bonding area 220, the connection between the display panel 100 and the flexible circuit board 200 can be realized; and the bending of the flexible circuit board 200 can achieve the purpose of reducing the lower border of the display module 10.

[0113] It should be understood that generally in the production process, the flexible circuit board 200 is disposed above the display panel 100, but this application does not make special limitations on this.

[0114] In some embodiments, in the first direction X, the size of the third metal layer is 1um - 4um.

[0115] In the above solution, the flexible circuit board 200 can be bent to the back of the display panel 100 to reduce the width of the lower border of the display module 10. Therefore, the flexible circuit board 200 has a bending area. By making the thickness of the metal layer in the third electromagnetic interference shielding layer 400 be 1um - 4um, the rebound force of the bending area of the flexible circuit board 200 can be reduced, the wrinkling deformation of the bending area can be improved, and thus the flatness of the product appearance can be improved; in addition, by using the third electromagnetic interference shielding layer 400 with the third metal layer 430 having a thickness of only 1um - 4um, the production cost of the product can be reduced.

[0116] It should be understood that the bending area of the flexible circuit board 200 includes the bonding area 220.

[0117] It should be understood that the composition of the first electromagnetic interference shielding layer 320 is the same as that of the third electromagnetic interference shielding layer 400, but the sizes of the first metal layer 322 and the third metal layer in the first direction X can be different or the same.

[0118] Specifically, in the first direction X, the size of the metal layer can be 1um, 1.5um, 2.2um, 3um, 3.8um, 4um or any value within the above range.

[0119] In some embodiments, in the first direction X, the size of the first electromagnetic interference shielding layer 320 is 0.01 mm - 0.03 mm, the size of the second electromagnetic interference shielding layer is 0.01 mm - 0.03 mm, and the size of the third electromagnetic interference shielding layer 400 is 0.01 mm - 0.03 mm.

[0120] Specifically, in the first direction X, the sizes of the first electromagnetic interference shielding layer 320, the second electromagnetic interference shielding layer, and the third electromagnetic interference shielding layer 400 may be 0.01 mm, 0.015 mm, 0.02 mm, 0.024 mm, 0.03 mm, or any value within the above range.

[0121] The embodiment of the present application further provides a display device, including the display panel in any of the above possible implementation manners, or the display module in any of the above possible implementation manners.

[0122] The display device may be a display device such as an OLED display, as well as any product or component with a display function, such as a television, a digital camera, a mobile phone, a tablet computer, etc. that includes these display devices.

[0123] It should be noted that the present application is not limited to the above embodiments. The above embodiments are only examples, and embodiments with the same composition and the same function and effect as the technical idea within the technical solution scope of the present application are all included in the technical scope of the present application. In addition, within the scope of not departing from the gist of the present application, various modifications that can be thought of by those skilled in the art to the embodiments, and other manners constructed by combining some constituent elements in the embodiments are also included in the scope of the present application.

Claims

1. A display panel, characterized in that: include: A first area for setting a driving chip, wherein a first protective layer is set on one side of the first area; In the first direction, the first protection layer includes a first insulating layer and a first electromagnetic interference shielding layer in sequence; in, In a second direction, the first insulating layer and the first electromagnetic interference shielding layer have the same size, and the second direction is perpendicular to the first direction.

2. The display panel according to claim 1, characterized in that: The display panel also includes a second area; In a third direction, the second area is located on both sides of the first area, and the third direction is perpendicular to the first direction and the second direction; A second protective layer is disposed on one side of the second area.

3. The display panel according to claim 2, characterized in that: The first protective layer and the second protective layer are integrated into one.

4. The display panel according to claim 2, characterized in that: In the first direction, the second protection layer includes a second insulating layer and a second electromagnetic interference shielding layer in sequence.

5. The display panel according to claim 4, characterized in that: In the first direction, the first electromagnetic interference shielding layer includes a first adhesive layer, a first metal layer and a first barrier layer arranged in sequence, and the second electromagnetic interference shielding layer includes a second adhesive layer, a second metal layer and a second barrier layer arranged in sequence.

6. The display panel according to claim 4 or 5, characterized in that: In the first direction, the size of the first insulating layer is 0.005 mm-0.03 mm, and the size of the second insulating layer is 0.005 mm-0.03 mm.

7. A display module, characterized in that: include: A display panel as claimed in any one of claims 1 to 6, and a flexible circuit board.

8. The display module according to claim 7, characterized in that: A third electromagnetic interference shielding layer is disposed on one side of the flexible circuit board.

9. The display module according to claim 8, characterized in that: The flexible circuit board is provided with a copper leakage area; The third electromagnetic interference shielding layer has a protruding portion, and the protruding portion is opposite to the copper leakage area.

10. The display module according to claim 9, characterized in that: The display panel and the flexible circuit board have overlapping binding areas; In the second direction, the first area and the binding area are arranged in sequence.

11. The display module according to any one of claims 8 to 10, characterized in that: In the first direction, the third electromagnetic interference shielding layer includes a third adhesive layer, a third metal layer and a third barrier layer arranged in sequence; Wherein, in the first direction, the size of the third metal layer is 1um-4um.

12. The display module according to any one of claims 8 to 10, characterized in that: In the first direction, the size of the first electromagnetic interference shielding layer is 0.01 mm-0.03 mm, the size of the second electromagnetic interference shielding layer is 0.01 mm-0.03 mm, and the size of the third electromagnetic interference shielding layer is 0.01 mm-0.03 mm.

13. A display device, characterized in that: It comprises a display panel as described in any one of claims 1 to 6, or a display module as described in any one of claims 7 to 12.

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