Integrated automatic system and equipment for cutting, measuring and sleeving LED (light-emitting diode) chip

Abstract

The utility model provides an LED chip cutting, measuring and sleeving integrated automatic system, an LED substrate comprises a body and a plate edge, and the automatic system further comprises a conveying module used for conveying the LED substrate; the cutting unit comprises an edge cutting module and a board dividing module which are connected in process, the edge cutting module cuts off board edges, and the board dividing module is used for dividing the body into a plurality of LED modules; the detection unit is in link connection with the board splitting module and is used for detecting each LED module so as to generate label information; and the packaging module is used for packaging the LED module marked with the qualified code. A plurality of processes such as edge cutting, board splitting, detection and packaging are integrated in a unified system, so that the separation bottleneck between different processes is eliminated, the performance of the LED module can be accurately and rapidly detected and qualified and defective products can be automatically marked through the automatic detection unit, and the labor intensity of manual operation is greatly reduced. And meanwhile, the automatic packaging module ensures efficient packaging of qualified products, and the production efficiency and the product consistency are improved.

Description

Technical Field

[0001] This application relates to the field of LED automation technology, and particularly to an integrated automated system and equipment for LED chip cutting, testing, and encapsulation. Background Art

[0002] The rapid development of LED technology has promoted the automation process of LED chip production lines. In modern LED chip production lines, the introduction of automated equipment has significantly improved production efficiency and consistency. Automated equipment can complete complex processes such as cutting of LED substrates, soldering of chips, and optical testing, greatly reducing manual intervention and ensuring production consistency and high quality.

[0003] Currently, many LED chip production lines use split-type equipment to achieve automated processing. These devices are used to cut LED substrates into multiple independent LED modules. Workers detect the independent LED modules to check if the LEDs are normal. Qualified LEDs are transported to the next process, and the qualified LEDs are encapsulated.

[0004] Although existing automated technology solutions have made significant progress in improving production efficiency, they still have some drawbacks. First, due to the split nature of automated equipment, the connection between different processes may lead to bottlenecks in the production process. Second, existing automated systems usually lack sufficient flexibility, and manual labor is still required to conduct detailed inspections and encapsulations of the LED beads, which not only increases labor intensity but may also introduce human errors, affecting product consistency and reliability. Summary of the Utility Model

[0005] In view of this, it is necessary to provide a higher-automation integrated automated system for LED chips to solve the above problems.

[0006] An embodiment of this application provides an integrated automated system for LED chip cutting, testing, and encapsulation. The LED substrate includes a body and a board edge. The automated system further includes:

[0007] A transfer module for transferring the LED substrate;

[0008] A cutting unit including a cutting-edge module and a board-splitting module with process connection. The cutting-edge module cuts off the board edge, and the board-splitting module is used to divide the body into multiple LED modules;

[0009] A detection unit linked to the board-splitting module for detecting each LED module to generate label information. Qualified LED modules are marked with a qualified code, and unqualified LED modules are marked with a defective code;

[0010] An encapsulation module for encapsulating the LED modules marked with the qualified code.

[0011] In at least one embodiment of the present application, the automation system further includes a fixed identification unit electrically connected to the cutting unit, configured to identify the body to generate first area information and identify the board edge to generate second area information.

[0012] In at least one embodiment of the present application, the fixed identification unit includes a first identification module and a fixing module electrically connected to the first identification module;

[0013] The first identification module respectively identifies the body and the board edge to generate the first area information and the second area information. The cutting edge module performs cutting according to the first area information, and the fixing module fixes the LED substrate.

[0014] In at least one embodiment of the present application, the fixed identification unit further includes a vision module, and the vision module is electrically connected to the board splitting module and the first identification module respectively;

[0015] The vision module scans the LED substrate to generate LED position information. The first identification module identifies the LED position information to generate third area information. The board splitting module divides the body into a plurality of LED modules according to the third area information.

[0016] In at least one embodiment of the present application, the cutting unit further includes a manipulator, and the manipulator is arranged in the board splitting module. The manipulator respectively grabs a plurality of LED modules to transport them into the detection unit.

[0017] In at least one embodiment of the present application, the detection unit includes an electrical test module and a marking module electrically connected to the electrical test module. The electrical test module is used to detect the LED module;

[0018] When the LED module is qualified, the marking module marks the LED module with a qualified code;

[0019] When the LED module is unqualified, the marking module marks the LED module with a defective code.

[0020] In at least one embodiment of the present application, the detection unit further includes a shunt module, and the shunt module respectively shunts the LED modules marked with the qualified code and the defective code.

[0021] In at least one embodiment of the present application, the detection unit further includes a second identification module electrically connected to the shunt module. The second identification module identifies the qualified code and the defective code, and the shunt module transports the LED modules marked with the qualified code to the encapsulation module.

[0022] In at least one embodiment of the present application, the automated system further includes an alignment module, which is electrically connected to the encapsulation module. The alignment module scans the LED module to align the LED module with the encapsulation housing for encapsulation.

[0023] An integrated automated device for LED chip cutting, testing, and encapsulation includes the integrated automated system for LED chip cutting, testing, and encapsulation as described above.

[0024] The above-provided integrated automated system and device for LED chip cutting, testing, and encapsulation integrate multiple processes such as trimming, panel separation, detection, and encapsulation into a unified system, thereby eliminating the separation bottleneck between different processes. Moreover, the modular design of the automated system allows for quick switching and adjustment of different LED substrates, enabling the production line to rapidly adapt to different production requirements and enhancing the production adaptability and flexibility of the system. Through the automated detection unit, the performance of the LED module can be accurately and rapidly detected, and qualified and defective products can be automatically marked, significantly reducing the labor intensity of manual operations. At the same time, the automated encapsulation module ensures the efficient encapsulation of qualified products, avoids errors in manual operations, and improves production efficiency and product consistency. Description of the Drawings

[0025] Figure 1 It is a flowchart of an integrated automated system for LED chip cutting, testing, and encapsulation in an embodiment of the present application.

[0026] Figure 2 is Figure 1 A detailed flowchart of the integrated automated system for LED chip cutting, testing, and encapsulation as described above.

[0027] Description of the Main Component Symbols

[0028] 100, an integrated automated system for LED chip cutting, testing, and encapsulation; 10, an LED substrate; 11, a body; 12, a board edge; 20, a transfer module; 30, a cutting unit; 31, a trimming module; 32, a panel separation module; 321, an LED module; 33, a manipulator; 40, a detection unit; 41, an electrical testing module; 42, a marking module; 421, a qualified code; 422, a defective code; 43, a shunt module; 44, a second identification module; 50, an encapsulation module; 51, an alignment module; 60, a fixed identification unit; 61, a first identification module; 611, a first area information; 612, a second area information; 62, a fixing module; 63, a vision module; 631, a third area information. Detailed Embodiments

[0029] The embodiments of the present application will be described below in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments.

[0030] It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be an intermediate component at the same time. When a component is considered to be "provided on" another component, it can be directly provided on the other component or there may be an intermediate component at the same time. The terms "top", "bottom", "upper", "lower", "left", "right", "front", "rear", and similar expressions used herein are only for the purpose of illustration.

[0031] An embodiment of the present application provides an integrated automated system for LED chip cutting, testing, and encapsulation. The LED substrate includes a body and a board edge. The automated system further includes:

[0032] A transfer module for transferring the LED substrate;

[0033] A cutting unit including a cutting edge module and a board splitting module in process connection. The cutting edge module cuts off the board edge, and the board splitting module is used to divide the body into multiple LED modules;

[0034] A detection unit is connected in link with the board splitting module and is used to detect each LED module to generate label information. The qualified LED modules are marked with a qualified code, and the unqualified LED modules are marked with a defective code;

[0035] An encapsulation module for encapsulating the LED modules marked with the qualified code.

[0036] The above-provided integrated automated system and equipment for LED chip cutting, testing, and encapsulation integrate multiple processes such as cutting edge, board splitting, detection, and encapsulation into a unified system, thereby eliminating the separation bottleneck between different processes. Moreover, the modular design of the automated system allows for quick switching and adjustment of different LED substrates, enabling the production line to quickly adapt to different production requirements and enhancing the production adaptability and flexibility of the system. Through the automated detection unit, the performance of the LED modules can be accurately and quickly detected, and the qualified and defective products are automatically marked, greatly reducing the labor intensity of manual operations. At the same time, the automated encapsulation module ensures the efficient encapsulation of qualified products, avoids errors in manual operations, and improves production efficiency and product consistency.

[0037] The following will describe in detail some embodiments of the present application in conjunction with the accompanying drawings. Without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0038] Please refer to Figure 1 - Figure 2, an embodiment of the present application provides an integrated automated system 100 for LED chip cutting and testing. The LED substrate 10 includes a body 11 and a board edge 12. The automated system further includes:

[0039] A conveying module 20 for conveying the LED substrate 10;

[0040] A cutting unit 30, including a trimming module 31 and a board splitting module 32 in process connection. The trimming module 31 cuts off the board edge 12, and the board splitting module 32 is used to divide the body 11 into multiple LED modules 321;

[0041] A detection unit 40, which is connected to the board splitting module 32 in a link, for detecting each LED module 321 to generate label information 45. The qualified LED modules 321 are marked with a qualified code 421, and the unqualified LED modules 321 are marked with a defective code 422;

[0042] A packaging module 50 for packaging the LED modules 321 marked with the qualified code 421.

[0043] Specifically, through automated conveyance, the steps of manual handling operations are reduced, production efficiency is improved, and errors and damages caused by human intervention are reduced. The cutting unit 30 is responsible for two key steps. The trimming module 31 is used to cut off the board edge 12 of the LED substrate 10, and the board splitting module 32 divides the remaining body 11 into multiple LED modules 321 according to the design requirements. Integrating the trimming and board splitting processes in the same unit not only optimizes the production process but also improves the processing accuracy, ensuring that the cut LED modules 321 have consistent shapes and sizes. At the same time, the need for separate equipment is reduced, and the equipment complexity and maintenance costs are lowered.

[0044] Furthermore, the detection unit 40 generates qualified or unqualified label information 45 by automatically testing the performance of each LED module 321 and marks the corresponding LED modules 321. The automated detection unit 40 improves the detection efficiency and accuracy and can quickly and accurately identify the working conditions of each LED module 321. Through the generation of label information 45, subsequent processing can be automatically diverted according to the qualification of the modules, reducing human judgment errors.

[0045] Furthermore, during the detection process, the system automatically tags each module according to the detection results. Qualified modules are marked with the qualified code 421, and defective products are marked with the defective code 422. This marking system can ensure that LED modules 321 of different quality grades can be accurately distinguished. Qualified products can directly enter the encapsulation process, while defective products can be processed or reused through other channels, ensuring the rationality of the production process and resource utilization rate. The encapsulation module 50 automatically encapsulates the LED modules 321 that pass the detection and are marked as qualified. This module greatly improves the encapsulation efficiency, avoids quality problems that may occur in manual encapsulation, and ensures that each module is encapsulated in a standardized manner, enhancing the consistency and reliability of the product.

[0046] In a specific embodiment, the automated system further includes a fixed identification unit 60 electrically connected to the cutting unit 30, which is used to identify the body 11 to generate the first area information 611 and identify the board edge 12 to generate the second area information 612.

[0047] Specifically, the function of the fixed identification unit 60 is to accurately identify and position the LED substrate 10 to generate the area information of the body 11 and the board edge 12. It determines different parts of the LED substrate 10 through identification technology, thereby providing necessary data support for subsequent cutting and processing processes. Through the fixed identification unit 60, the system can accurately distinguish the body 11 and the board edge 12 parts of the LED substrate 10, ensuring the accuracy of the edge cutting and board splitting processes. Accurate area identification avoids the need for manual measurement and adjustment, improves the working efficiency and processing quality of the automated system. Reduces cutting errors caused by inaccurate positioning, ensures that each LED module 321 is cut according to the predetermined specifications, and improves the consistency and reliability of the product.

[0048] Furthermore, the first area information 611 refers to the position information and size data of the identified body 11 part of the LED substrate 10. These information are very important for the subsequent cutting module to ensure that the edge cutting module 31 can accurately cut off the board edge 12 without affecting the body 11. Generating accurate first area information 611 can guide the edge cutting module 31 to accurately retain the body 11 area and avoid damaging the body 11 part during the cutting process. Through accurate area information, the cutting path can be optimized, improving the processing efficiency and product quality. The second area information 612 refers to the position information and size data of the identified board edge 12 part of the LED substrate 10. These information are used to guide the edge cutting module 31 to accurately remove the board edge 12 without affecting the body 11 part.

[0049] In a specific embodiment, the fixed identification unit 60 includes a first identification module 61 and a fixed module 62 electrically connected to the first identification module 61;

[0050] The first recognition module 61 respectively recognizes the body 11 and the board edge 12 to generate the first area information 611 and the second area information 612. The trimming module 31 performs trimming according to the first area information 611, and the fixing module 62 fixes the LED substrate 10.

[0051] Specifically, the main function of the first recognition module 61 is to recognize different areas of the LED substrate 10, including the body 11 and the board edge 12, through a vision sensor or a scanning device. It scans and analyzes the LED substrate 10 to obtain the position information about the body 11 and the board edge 12 and generates corresponding area information. Through a high-precision recognition module, the system can accurately distinguish the body 11 and the board edge 12 of the LED substrate 10, thus ensuring the precision of the trimming and board splitting processes. The automatic recognition function reduces the dependence on manual intervention and improves the efficiency and reliability of the entire automated system. Providing accurate area information helps to optimize the trimming and board splitting processes and ensure the processing quality and consistency.

[0052] Furthermore, the function of the fixing module 62 is to stabilize the position of the LED substrate 10 and prevent the substrate from moving or vibrating during the cutting and processing. It firmly fixes the substrate at a specified position through a fixture, a support structure or other fixing devices. By stabilizing the substrate, the fixing module 62 can reduce the processing errors caused by the movement of the substrate and ensure the accuracy of trimming and board splitting. The stable substrate position helps to improve the quality of the processing process and ensure that each LED module 321 meets the design requirements. It reduces the production problems caused by the instability of the substrate.

[0053] In a specific embodiment, the fixing and recognition unit 60 further includes a vision module 63, and the vision module 63 is electrically connected to the board splitting module 32 and the first recognition module 61 respectively;

[0054] The vision module 63 scans the LED substrate 10 to generate LED position information. The first recognition module 61 recognizes the LED position information to generate third area information 631, and the board splitting module 32 divides the body 11 into a plurality of LED modules 321 according to the third area information 631.

[0055] Specifically, the vision module 63 is responsible for scanning the surface of the LED substrate 10 to obtain detailed information about the positions of the LED chips. It uses a high-resolution camera or other imaging devices for image acquisition and analysis to generate LED position information. The vision module 63 is electrically connected to the board-splitting module 32 and the first identification module 61 to ensure that the scanned data can be transmitted in real time to other modules for further processing. Through precise scanning and image processing, the vision module 63 can provide high-precision LED position information, ensuring the accuracy of the subsequent board-splitting process. The automated scanning process reduces manual intervention, lowers the possibility of human errors, and improves the overall production efficiency.

[0056] Further, the first identification module 61 receives the LED position information from the vision module 63 and generates third region information 631 based on this information. This information includes data such as the specific positions, sizes, and shapes of each LED module 321. The generated third region information 631 is used to guide the board-splitting module 32 on how to divide the LED substrate 10 into multiple LED modules 321. By accurately identifying the LED position information and generating detailed third region information 631, the first identification module 61 ensures that the board-splitting module 32 can precisely cut and divide the substrate.

[0057] Still further, the board-splitting module 32 cuts the body 11 of the LED substrate 10 into multiple individual LED modules 321 according to the third region information 631 provided by the first identification module 61. It performs the actual cutting operation to divide the substrate into LED modules 321 of a predetermined size and shape. Through automated board splitting, the production process is more efficient, reducing manual intervention and operation time. The automated board-splitting process ensures that the sizes and shapes of each LED module 321 are consistent, improving the product consistency and quality.

[0058] In a specific embodiment, the cutting unit 30 further includes a manipulator 33. The manipulator 33 is disposed within the board-splitting module 32, and the manipulator 33 grabs multiple of the LED modules 321 respectively to transport them into the detection unit 40.

[0059] Specifically, the manipulator 33 is an automated device disposed within the board-splitting module 32, responsible for grabbing multiple divided LED modules 321 from the board-splitting module 32 and moving them to the detection unit 40 for further processing. The manipulator 33 is generally equipped with multiple grabbing devices (such as grippers, suction cups, etc.), and can adjust the grabbing method according to the size and shape of the LED module 321 to ensure stable and accurate handling of the LED module 321. Automated handling reduces errors in manual operations, ensuring the safety and accuracy of each LED module 321 during handling.

[0060] Further, the manipulator 33 is disposed inside the board splitting module 32, enabling it to directly grab the already split LED modules 321 from the board splitting module 32 without the need for an additional handling system. Placing the manipulator 33 inside the board splitting module 32 can achieve seamless docking with the board splitting module 32, such that the LED modules 321 can be directly processed by the manipulator 33 after board splitting is completed, reducing the time for material transfer and possible errors.

[0061] In a specific embodiment, the detection unit 40 includes an electrical testing module 41 and a marking module 42 electrically connected to the electrical testing module 41. The electrical testing module 41 is used to detect the LED module 321.

[0062] When the LED module 321 is qualified, the marking module 42 marks the LED module 321 with a qualified code 421.

[0063] When the LED module 321 is unqualified, the marking module 42 marks the LED module 321 with a defective code 422.

[0064] Specifically, the electrical testing module 41 is specifically used for electrical performance testing of the LED module 321. This module will detect the circuit of each LED module 321 to ensure that it can work properly. The electrical testing module 41 usually includes measurement functions such as voltage, current, connectivity, and luminous intensity to verify whether the LED module 321 meets the specification requirements. By detecting the electrical performance of the LED module 321, it can be ensured that each module can work properly before being put into use, thereby improving the overall quality and reliability of the product. The automation of electrical testing can reduce manual intervention, improve the detection efficiency, and speed up the production rhythm.

[0065] Further, the marking module 42 is a supporting component of the electrical testing module 41 and is used to mark the tested LED module 321. When the LED module 321 passes the electrical test, the marking module 42 will mark the "qualified code 421" on the LED module 321; when the LED module 321 fails the test, the "defective code 422" will be marked. The marking information helps to track and record the detection results of each LED module 321, facilitating quality control and problem tracing.

[0066] In a specific embodiment, the detection unit 40 further includes a shunt module 43, and the shunt module 43 shunts the LED modules 321 marked with the qualified code 421 and the defective code 422 respectively.

[0067] Specifically, the shunt module 43 in the detection unit 40 is responsible for classifying the marked LED modules 321. According to the marks (qualified code 421 or defective code 422) on the LED module 321, the shunt module 43 guides these LED modules 321 to different processing paths respectively. The LED module 321 marked with "qualified code 421" will be guided to the qualified product processing area, such as the encapsulation module 50; while the LED module 321 marked with "defective code 422" will be guided to the defective product processing area, such as the repair area or the waste area.

[0068] Furthermore, automated shunting reduces manual intervention, improves the classification speed and accuracy, enabling the production line to process a large number of LED modules 321 more efficiently. Through automatic shunting, qualified products and defective products can be quickly separated, ensuring the rational allocation of resources and process flows, and avoiding the mixing of defective products and qualified products. The need for manual classification is reduced, thus reducing the possibility of classification errors caused by human errors.

[0069] In a specific embodiment, the detection unit 40 further includes a second identification module 44 electrically connected to the shunt module 43. The second identification module 44 identifies the qualified code 421 and the defective code 422, and the shunt module 43 transports the LED module 321 marked with the qualified code 421 to the encapsulation module 50.

[0070] Specifically, the second identification module 44 is used to identify the qualified code 421 and the defective code 422 on the LED module 321. It determines the classification status (qualified or defective) of each LED module 321 by reading or scanning the label information 45 on the LED module 321. The second identification module 44 transmits the status of the LED module 321 to the shunt module 43 according to the read mark information to guide its further processing. The second identification module 44 ensures the classification accuracy of each LED module 321. By accurately identifying the qualified code 421 and the defective code 422, classification errors can be reduced, ensuring that qualified products are correctly sent to the encapsulation module 50. The automated identification process reduces manual intervention, improves the classification speed and consistency, and helps to speed up the production pace.

[0071] In a specific embodiment, the automated system further includes an alignment module 51. The alignment module 51 is electrically connected to the encapsulation module 50. The alignment module 51 scans the LED module 321 and is used to align the LED module 321 with the encapsulation housing for encapsulation.

[0072] Specifically, the alignment module 51 is used to precisely align the LED module 321 and the encapsulation housing. It determines the exact position of the LED module 321 through scanning and detection techniques to ensure that the LED module 321 can be accurately placed at the predetermined position of the encapsulation housing during the encapsulation process. The alignment module 51 scans the appearance and position of the LED module 321, identifies its specific placement position, and adjusts the posture of the LED module 321 to make it perfectly dock with the encapsulation housing. The alignment module 51 ensures the precise alignment of the LED module 321 and the encapsulation housing, thereby improving the overall quality of the encapsulation and reducing the possible errors during the encapsulation process.

[0073] Furthermore, the automated alignment process reduces the need for manual operation and decreases the encapsulation problems caused by improper manual operation. Through automated alignment, the speed and efficiency of the production line are improved, especially in high-volume production environments. It ensures the consistency of each LED module 321 during the encapsulation process, improves the reliability and consistency of the product, and reduces the generation of defective products.

[0074] An integrated automated device for LED chip cutting, testing, and encapsulation includes the various structures of the above-mentioned integrated automated system for LED chip cutting, testing, and encapsulation. Since this embodiment includes all the features of the above embodiment, this embodiment has all the beneficial effects of the above embodiment, which will not be elaborated here.

[0075] The above are only the implementation manners of the present application. It should be noted here that for those of ordinary skill in the art, improvements can be made without departing from the creative concept of the present application, but these all fall within the protection scope of the present application.

Claims

1. An integrated automatic system for cutting and testing LED chips, wherein the LED substrate comprises a body and a board edge, characterized in that: The automation system also includes: A conveying module, used for conveying LED substrates; A cutting unit, including a trimming module and a panel splitting module with connected processes, wherein the trimming module cuts off the panel edge, and the panel splitting module is used to divide the body into a plurality of LED modules; A detection unit is connected to the sub-board module link, and is used to detect each of the LED modules to generate label information, wherein a qualified LED module is marked with a qualified code, and an unqualified LED module is marked with a defective code; A packaging module is used to package the LED module marked with the qualification code.

2. The LED chip cutting and testing integrated automatic system according to claim 1, characterized in that: The automation system further comprises a fixed identification unit electrically connected to the cutting unit, and configured to identify the body to generate first region information, and identify the board edge to generate second region information.

3. The LED chip cutting and testing integrated automatic system according to claim 2, characterized in that: The fixed identification unit includes a first identification module and a fixed module electrically connected to the first identification module; The first recognition module recognizes the body and the board edge respectively to generate the first area information and the second area information. The trimming module performs trimming according to the first area information. The fixing module fixes the LED substrate.

4. The LED chip cutting and testing integrated automatic system according to claim 3, characterized in that: The fixed identification unit further comprises a visual module, and the visual module is electrically connected to the sub-board module and the first identification module respectively; The visual module scans the LED substrate to generate LED position information, the first recognition module recognizes the LED position information to generate third area information, and the panel division module divides the body into a plurality of LED modules according to the third area information.

5. The LED chip cutting and testing integrated automatic system according to claim 1, characterized in that: The cutting unit further comprises a robot arm, which is arranged in the panel separation module. The robot arm grabs a plurality of the LED modules respectively to transport them to the detection unit.

6. The LED chip cutting and testing integrated automatic system according to claim 1, characterized in that: The detection unit includes an electrical test module and a marking module electrically connected to the electrical test module, wherein the electrical test module is used to detect the LED module; When the LED module is qualified, the marking module marks a qualified code on the LED module; When the LED module is unsuitable, the marking module marks a defective code on the LED module.

7. The LED chip cutting and testing integrated automatic system according to claim 6, characterized in that: The detection unit further comprises a shunt module, and the shunt module separately shunts the LED modules marked with the qualified code and the defective code.

8. The LED chip cutting and testing integrated automatic system according to claim 7, characterized in that: The detection unit further comprises a second identification module electrically connected to the shunt module, the second identification module identifies the qualified code and the defective code, and the shunt module transports the LED module marked with the qualified code to the packaging module.

9. The LED chip cutting and testing integrated automatic system according to claim 1, characterized in that: The automation system further comprises an alignment module, which is electrically connected to the packaging module. The alignment module scans the LED module and is used to align the LED module with the packaging housing for packaging.

10. An integrated automated device for cutting, testing and sleeveing ​​LED chips, comprising an integrated automated system for cutting, testing and sleeveing ​​LED chips as claimed in any one of claims 1 to 9.

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