Photoresist glue coating device

Abstract

The utility model discloses a photoresist coating device which comprises a frame body, a bearing assembly for fixing a silicon wafer, a photoresist spraying assembly for spraying photoresist to the surface of the silicon wafer and a photoresist scraping assembly for uniformly scraping the photoresist on the surface of the silicon wafer are arranged on the frame body, and the photoresist coating device further comprises two groups of heat storage assemblies which are respectively arranged on two sides of the bearing assembly. The heat storage assembly is used for storing redundant photoresist based on the movement of the glue scraping assembly; according to the photoresist coating device, by arranging the two sets of heat storage assemblies capable of heating photoresist, after photoresist coating operation on the surface of a silicon wafer is completed, the excessive photoresist is scraped into the heat storage assemblies through the photoresist scraping assembly, the photoresist inside is heated through the heat storage assemblies, the photoresist is prevented from being solidified, and the service life of the photoresist coating device is prolonged. Therefore, the residual photoresist can be continuously used, and waste is avoided.

Description

Technical Field

[0001] The utility model relates to the field of wet etching, and particularly relates to a photoresist coating device. Background Art

[0002] Photoresist is a photosensitive material widely used in semiconductor manufacturing and microelectronic processes; when a photoresist is coated on the surface of a silicon wafer 2, the photoresist can protect certain areas of the silicon wafer 2 from damage during subsequent etching or ion implantation processes; areas not covered by the photoresist can be etched or otherwise processed, while the areas protected by the photoresist remain intact, enabling high-precision pattern drawing on the substrate.

[0003] For example, the invention patent application with the publication number CN116786342A and the publication date of September 22, 2023 discloses a uniform coater for silicon wafer processing, including a machine frame, a placement plate, a sliding support plate, a glue storage tank, a liquid outlet pipe, a linear motor, a glue rolling mechanism, a lifting mechanism, etc.; a placement plate is connected to the middle of the machine frame, a sliding support plate for placing and supporting the silicon wafer is slidably connected to the front of the placement plate, a glue storage tank for storing glue is connected to the upper rear part of the machine frame, two liquid outlet pipes are connected to the front part of the lower side of the glue storage tank, and linear motors are connected to both the left and right sides of the machine frame; the silicon wafer is placed on the sliding support plate and positioned by the placement plate, the glue receiving box drives the glue coating roller to move downward to evenly apply the glue on the silicon wafer, and the uniform blanking plate can clean the glue outlet before the glue receiving box discharges the glue to ensure the smoothness of glue discharge, and block the glue outlet after the glue coating is completed to avoid the hardening of the glue affecting the glue coating effect.

[0004] When the existing photoresist is coated on the surface of a silicon wafer, methods such as spin coating, blade coating, and dip coating are usually used. Among them, when using the blade coating method to level the photoresist on the surface of the silicon wafer, as the blade moves, the photoresist is gradually coated on the surface of the silicon wafer. As the blade continues to move, the amount of photoresist to be coated on the surface of the silicon wafer becomes less and less. To ensure that the photoresist on the surface of the silicon wafer can be coated evenly, a large amount of photoresist is often sprayed on the surface of the silicon wafer to avoid uneven coating on the surface of the silicon wafer. Thus, after the photoresist on the surface of the silicon wafer is coated, there will still be a part of the photoresist remaining, and there will also be a residue. This remaining photoresist is likely to solidify after staying outside for a period of time. When using the solidified photoresist to coat the surface of the silicon wafer, the coating effect of the photoresist on the surface of the silicon wafer will become worse. To avoid affecting the quality of the silicon wafer, the staff usually directly discard the remaining photoresist, resulting in waste of the photoresist. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a photoresist coating device to solve the above deficiencies in the prior art.

[0006] To achieve the above object, the present utility model provides the following technical solutions:

[0007] A photoresist coating device, comprising a frame body, on which a loading assembly for fixing a silicon wafer, a glue spraying assembly for spraying photoresist onto the surface of the silicon wafer, and a glue scraping assembly for scraping the photoresist on the surface of the silicon wafer evenly are provided. It further includes two heat storage assemblies, which are respectively disposed on both sides of the loading assembly. The heat storage assemblies are based on the movement of the glue scraping assembly to store the excess photoresist.

[0008] As described above, the loading assembly includes a loading plate for placing the silicon wafer, and the loading plate is horizontally installed on the frame body.

[0009] As described above, the loading plate is of a telescopic structure.

[0010] As described above, the heat storage assembly includes a storage box, the opening of the storage box faces the loading plate directly, and an electric heating strip is arranged inside the storage box, and the electric heating strip is used to heat the photoresist in the storage box.

[0011] As described above, a guiding plate is arranged inside the storage box, and one end of the guiding plate is rotatably connected to the loading plate through a connecting rod.

[0012] As described above, the axial direction of the connecting rod is parallel to the width direction of the loading plate.

[0013] As described above, a coaxial mating gear is fixedly installed on the connecting rod, and a rack that meshes with each other is arranged above the mating gear. The rack is slidably installed inside the storage box along the length direction, and the rack is connected to the storage box through a return spring.

[0014] As described above, an arc-shaped groove is arranged inside the storage box, and the other end of the guiding plate is inserted into the arc-shaped groove, and the end of the guiding plate always abuts against the groove surface of the arc-shaped groove.

[0015] As described above, in the initial state, the end of the guiding plate away from the loading plate is inclined upward, and the two guiding plates form an inverted trapezoidal structure that inclines inward.

[0016] As described above, when the glue scraping assembly scrapes the corresponding excess photoresist into the storage box, the end of the guiding plate away from the loading plate is inclined downward.

[0017] The beneficial effect of the present utility model lies in that: in the above technical solution, by providing two heat storage assemblies that can heat the photoresist, after the photoresist coating operation on the surface of the silicon wafer is completed, the glue scraping assembly scrapes the excess photoresist into the heat storage assemblies, and the heat storage assemblies heat the photoresist inside, avoiding the solidification of the photoresist, so that the remaining photoresist can continue to be used, avoiding waste. Description of the Drawings

[0018] To more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the accompanying drawings required for use in the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments described in the present utility model. For those of ordinary skill in the art, other accompanying drawings can also be obtained based on these drawings.

[0019] Figure 1 It is a top view structural schematic diagram of a photoresist coating device provided by an embodiment of the present utility model;

[0020] Figure 2 It is a matching schematic diagram between the glue scraping assembly and the silicon wafer provided by an embodiment of the present utility model;

[0021] Figure 3 Provided by an embodiment of the present utility model Figure 2 An enlarged schematic diagram of part A;

[0022] Figure 4 It is a state schematic diagram after the guide plate rotates provided by an embodiment of the present utility model;

[0023] Figure 5 It is an internal structural schematic diagram of the storage box provided by an embodiment of the present utility model.

[0024] Explanation of reference numerals:

[0025] 1. Frame body; 2. Silicon wafer; 3. Loading assembly; 31. Loading plate; 4. Glue spraying assembly; 5. Glue scraping assembly; 6. Thermal storage assembly; 61. Storage box; 62. Electric heating strip; 63. Guide plate; 64. Link rod; 65. Matching gear; 66. Rack; 67. Return spring; 68. Arc groove. Detailed implementation manners

[0026] In order to enable those skilled in the art to better understand the technical solutions of the present utility model, the following will further introduce the present utility model in detail Figures 1-5 in conjunction with the accompanying drawings.

[0027] In each embodiment of the present utility model, for the convenience of description and understanding, the moving direction of the glue scraping assembly 5 is called the length direction, the direction perpendicular to the length direction on the horizontal plane is called the width direction, and the gravity direction is called the vertical direction. That is, the length direction, the width direction, and the vertical direction form a three-dimensional rectangular coordinate system.

[0028] An embodiment of the present utility model provides a photoresist coating device, including a frame body 1, on which a loading assembly 3 for fixing a silicon wafer 2, a glue spraying assembly 4 for spraying photoresist on the surface of the silicon wafer 2, and a glue scraping assembly 5 for scraping the photoresist on the surface of the silicon wafer 2 evenly are provided. It further includes:

[0029] Two sets of heat storage components 6 are disposed on both sides of the carrier component 3. Based on the movement of the glue scraping component 5, the heat storage components 6 store the excess photoresist glue.

[0030] Specifically, the carrier component 3 can be selected as a combination of a tray and a fixing part. The fixing part can be selected in ways such as suction cup adsorption fixation, clamping fixation, etc. In this embodiment, preferably, the silicon wafer 2 is fixed by the way of suction cup adsorption. Obviously, in order to expose the surface of the silicon wafer 2 that needs to be coated with glue, the fixing part is arranged on the tray, and the adsorption port of the fixing part is arranged upward, that is, the silicon wafer 2 is horizontally placed on the tray, the fixing part adsorbs the surface of the silicon wafer 2 close to the tray, and the other side of the silicon wafer 2 faces the glue scraping component 5. Among them, the glue spraying component 4 can be simply selected as a simple combination of a glue spraying nozzle, a conduit, and a material box. The material box is filled with photoresist glue. The glue spraying nozzle is connected to the material box through the conduit. The glue spraying nozzle is used to spray the photoresist glue in the material box onto the surface of the silicon wafer 2 close to the glue scraping component 5. Among them, the glue scraping component 5 can be selected as a combination of a scraper and a linear driving part. The linear driving part is connected to the scraper. The linear driving part is used to drive the scraper to move in the length direction to scrape the photoresist glue on the surface of the silicon wafer 2 evenly. The linear driving part can be selected as a ball screw. Thus, when coating the surface of the silicon wafer 2 with photoresist glue, a human or a mechanical device horizontally places the silicon wafer 2 on the tray of the carrier component 3. The fixing part on the carrier component 3 adsorbs the surface of the silicon wafer 2 close to the tray (that is, the fixing part adsorbs the lower surface of the silicon wafer 2), and the silicon wafer 2 is fixed by the adsorption of the fixing part. Subsequently, the glue spraying component 4 sprays a large amount of photoresist glue onto the other surface of the silicon wafer 2 (that is, sprays the photoresist glue onto the upper surface of the silicon wafer 2) through the glue spraying nozzle. Subsequently, the glue scraping component 5 moves along the surface of the silicon wafer 2, and the photoresist glue on the surface of the silicon wafer 2 is scraped evenly by the scraper, completing the coating operation of the photoresist glue on the surface of the silicon wafer 2.

[0031] Obviously, in order to coat the photoresist glue on the surface of the silicon wafer 2 evenly, before using the scraper for scraping, a large amount of photoresist glue is often applied to the surface of the silicon wafer 2 to avoid the occurrence of uneven coating on the surface of the silicon wafer 2 by increasing the amount of photoresist glue. However, when the surface of a silicon wafer 2 is completed with photoresist glue coating, the photoresist glue will not be exactly used up, and a part will remain. The remaining photoresist glue is likely to solidify after staying outside for a period of time. When using the solidified photoresist glue for coating on the surface of the silicon wafer 2, the coating effect of the photoresist glue on the surface of the silicon wafer 2 will become worse. In order not to affect the quality of the silicon wafer 2, the staff usually directly discard the remaining photoresist glue, resulting in waste of the photoresist glue.

[0032] To solve the above problems, in this embodiment, two sets of heat storage components 6 are provided. The two sets of heat storage components 6 are respectively disposed on both sides of the bearing component 3. The glue scraping component 5 is located between the two heat storage components 6. The connection direction of the two heat storage components 6 is the same as the moving direction of the glue scraping component 5. That is, the two heat storage components 6 are arranged at intervals along the length direction. The heat storage component 6 can be a simple combination of a storage box and a heating part. The bottom end of the opening of the storage box is connected to the tray. The heating part is arranged inside the storage box. The heating part can be a common electric heating wire. The heating part is used to heat the photoresist in the storage box. When it is necessary to coat the surface of the silicon wafer 2 with photoresist, the steps are as follows:

[0033] First, the silicon wafer 2 to be coated with photoresist is horizontally placed on the bearing component 3 manually or by a mechanical device. The fixing part on the bearing component 3 fixes the silicon wafer 2, and the fixing process of the silicon wafer 2 is completed;

[0034] Subsequently, the glue spraying nozzle in the glue spraying component 4 sprays a large amount of photoresist onto the surface of the silicon wafer 2, and the photoresist supply step is completed;

[0035] After that, the linear expansion and contraction rod starts to expand and contract, driving the scraper to reciprocate on the surface of the silicon wafer 2, scraping and coating the photoresist on the surface of the silicon wafer 2 evenly, so that the photoresist is evenly coated on the surface of the silicon wafer 2, and the coating operation of the photoresist on the surface of the silicon wafer 2 is completed;

[0036] Finally, the linear expansion and contraction rod drives the scraper to move towards the direction of any one of the heat storage components 6 until the scraper abuts against the surface of the heat storage component 6. At this time, the scraper hangs the excess photoresist into the interior of the heat storage component 6. The heat storage component 6 heats the photoresist to prevent the photoresist from solidifying. When coating the next silicon wafer 2 with photoresist, the scraper leaves the heat storage component 6, and the photoresist loses the block of the scraper. The photoresist flows out from the interior of the heat storage component 6. The heated photoresist still remains in a liquid state and can continue the coating operation on the surface of the silicon wafer 2, avoiding the situation that the residual photoresist solidifies, resulting in a poor coating effect, and directly discarding the residual photoresist, causing waste.

[0037] Obviously, in order to ensure that the heated photoresist flows out of the interior of the heat storage component 6 smoothly, the bottom of the heat storage component 6 is in the shape of an upwardly inclined slope. The bottom end of the slope of the heat storage component 6 is connected to the tray. Through this slope, the photoresist inside the heat storage component 6 can flow smoothly back onto the silicon wafer 2, facilitating the subsequent coating operation.

[0038] In the above implementation, the photoresist after heating has a certain fluidity, so that the photoresist easily flows out through the gap between the thermal storage component 6 and the squeegee. The flowing photoresist flows onto the surface of the silicon wafer 2, causing the thickness of the photoresist at the edge of the surface of the silicon wafer 2 to increase, affecting the uniformity of the photoresist on the surface of the silicon wafer 2, and thus resulting in a decrease in the quality of the silicon wafer 2.

[0039] Preferably, in this embodiment, the carrier component 3 includes a carrier plate 31 for placing the silicon wafer 2, and the thermal storage component 6 includes a storage box 61. The opening of the storage box 61 faces the carrier plate 31 directly. An electric heating strip 62 is arranged inside the storage box 61, and the electric heating strip 62 is used to heat the photoresist in the storage box 61. An arc-shaped groove 68 is arranged inside the storage box 61 along the vertical direction. A guiding plate 63 is arranged inside the storage box 61. One end of the guiding plate 63 is rotatably connected to the carrier plate 31 through a connecting rod 64. The axial direction of the connecting rod 64 is parallel to the width direction of the carrier plate 31. A coaxial mating gear 65 is fixedly installed on the connecting rod 64. The silicon wafer 2 is located between the two mating gears 65. A rack 66 that meshes with each other is arranged above the mating gear 65. The rack 66 is slidably installed inside the storage box 61 along the length direction. The rack 66 is connected to the storage box 61 through a return spring 67. The other end of the guiding plate 63 is inserted into the arc-shaped groove 68, and the end of the guiding plate 63 always abuts against the groove surface of the arc-shaped groove 68.

[0040] Specifically, in the initial state, the end of the guiding plate 63 away from the bearing plate 31 is inclined upward. The two guiding plates 63 form an inverted trapezoidal structure that inclines inward. At this time, a silicon wafer 2 to be coated with photoresist is placed between the two guiding plates 63 by manual or mechanical equipment. The silicon wafer 2 is clamped by the adjacent segments of the two guiding plates 63 to complete the fixing operation of the silicon wafer 2. Subsequently, the glue spraying nozzle in the glue spraying assembly 4 sprays a large amount of photoresist onto the surface of the silicon wafer 2. After that, the linear telescopic rod starts to expand and contract, driving the squeegee to reciprocate on the surface of the silicon wafer 2 to scrape the photoresist on the surface of the silicon wafer 2 evenly, so that the photoresist is evenly coated on the surface of the silicon wafer 2, completing the coating operation of the photoresist on the surface of the silicon wafer 2. Finally, the linear telescopic rod drives the squeegee to move towards the direction of any one of the heat storage assemblies 6. As the squeegee moves, the squeegee gradually squeezes the rack 66 to move towards the direction of the storage box 61. At this time, the return spring 67 connected to the rack 66 is compressed, accumulating elastic potential energy. As the rack 66 moves, the rack 66 meshes with the mating gear 65. The mating gear 65 drives the guiding plate 63 to deflect downward through the connecting rod 64, so that the end of the guiding plate 63 away from the bearing plate 31 inclines downward. At this time, the excess photoresist flows into the storage box 61 under the action of the squeegee. And because the end of the guiding plate 63 away from the bearing plate 31 inclines downward, the photoresist in the storage box 61 is also located below the bearing plate 31. Thus, the photoresist in the storage box 61 will not flow from the storage box 61 onto the silicon wafer 2, affecting the uniformity of the photoresist at the edge of the silicon wafer 2, thereby improving the coating quality of the photoresist on the surface of the silicon wafer 2;

[0041] Moreover, when one of the guiding plates 63 deflects, the locking of the silicon wafer 2 is released. At this time, the silicon wafer 2 can be conveniently removed from the bearing plate 31, facilitating the coating operation of the photoresist on the next silicon wafer 2;

[0042] When a new silicon wafer 2 is replaced on the bearing plate 31, the squeegee leaves the storage box 61. At this time, the previously compressed return spring 67 releases the accumulated elastic potential energy, driving the rack 66 to return to its initial position. When the rack 66 returns, it meshes with the mating gear 65, and the mating gear 65 rotates. The mating gear 65 drives the guiding plate 63 to deflect upward through the connecting rod 64, so that the guiding plate 63 returns to its initial state, that is, the end of the guiding plate 63 away from the bearing plate 31 inclines upward. At this time, the photoresist in the storage box 61 flows onto the surface of the silicon wafer 2 along the downward inclined surface of the guiding plate 63. Finally, the squeegee scrapes the photoresist on the surface of the silicon wafer 2 evenly, realizing the full utilization of the photoresist and avoiding the waste of the photoresist.

[0043] Obviously, the silicon wafers 2 can have different sizes. In order to enable the two guiding plates 63 to fix silicon wafers 2 of different sizes, preferably, the carrier plate 31 is a telescopic structure. By telescoping the carrier plate 31, the distance between the guiding plates 63 on both sides of the carrier plate 31 is adjusted so that the distance between the guiding plates 63 can exactly fix the silicon wafer 2, thereby completing the fixing process for silicon wafers 2 of different sizes.

[0044] Only some exemplary embodiments of the present invention have been described by way of illustration above. Without doubt, for those of ordinary skill in the art, various different ways can be used to modify the described embodiments without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A photoresist coating device, comprising a frame (1), on which a bearing assembly (3) for fixing a silicon wafer (2), a spray assembly (4) for spraying photoresist onto a surface of the silicon wafer (2), and a scraping assembly (5) for scraping the photoresist onto the surface of the silicon wafer (2) to make it uniform, characterized in that: Also includes: Two groups of heat storage components (6) are disposed on both sides of the carrier component (3). The heat storage components (6) store excess photoresist glue based on the movement of the scraper glue component (5).

2. The photoresist coating device according to claim 1, characterized in that: The bearing assembly (3) comprises a bearing plate (31) for placing the silicon wafer (2), and the bearing plate (31) is horizontally mounted on the frame (1).

3. The photoresist coating device according to claim 2, characterized in that: The bearing plate (31) is a retractable structure.

4. The photoresist coating device according to claim 2, characterized in that: The heat storage assembly (6) comprises a storage box (61), the opening of the storage box (61) faces the carrier plate (31), and an electric heating strip (62) is arranged inside the storage box (61), and the electric heating strip (62) is used to heat the photoresist glue in the storage box (61).

5. The photoresist coating device according to claim 4, characterized in that: A guide plate (63) is arranged in the storage box (61), and one end of the guide plate (63) is rotatably connected to the bearing plate (31) via a connecting rod (64).

6. The photoresist coating device according to claim 5, characterized in that: The axial direction of the connecting rod (64) is parallel to the width direction of the bearing plate (31).

7. The photoresist coating device according to claim 6, characterized in that: A coaxial matching gear (65) is fixedly mounted on the connecting rod (64), and mutually meshing racks (66) are arranged above the matching gear (65). The racks (66) are slidably mounted in the storage box (61) along the length direction, and the racks (66) and the storage box (61) are connected via a return spring (67).

8. The photoresist coating device according to claim 7, characterized in that: An arc-shaped groove (68) is provided inside the storage box (61), and the other end of the guide plate (63) is inserted into the arc-shaped groove (68), and the end of the guide plate (63) always abuts against the groove surface of the arc-shaped groove (68).

9. The photoresist coating device according to claim 8, characterized in that: In the initial state, one end of the guide plate (63) away from the bearing plate (31) is arranged to be tilted upward, and the two guide plates (63) form an inverted trapezoidal structure tilted inwards.

10. The photoresist coating device according to claim 9, characterized in that: When the scraping assembly (5) scrapes excess photoresist into the storage box (61), the end of the guide plate (63) away from the carrying plate (31) tilts downward.

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