Low-melting-point solder ball

Abstract

The utility model discloses a low melting point solder ball relates to solder ball field, including inner ball core and antioxidation protection mechanism, the top of inner ball core is provided with the straight-through hole equidistantly of annular array, and the side edge of inner ball core is provided with the anti-slip arc groove equidistantly of annular. According to the low-melting-point solder ball, through the arrangement of the straight-through hole and the anti-skid arc-shaped groove, the contact area between the solder ball and heat is larger after the anti-oxidation protection mechanism is molten, so that the melting speed of the solder ball can be further increased, and the situation that the solder ball is not completely molten is effectively prevented; meanwhile, the inner ball core is formed by fusing the tin-silver-copper metal layer and the tin-bismuth metal layer, so that the melting point of the solder ball is lower, the oxidation resistance of the solder ball is more excellent through the arrangement of the anti-oxidation resin layer and the anti-oxidation coating film, and the service life of the solder ball is prolonged. Therefore, the situation that subsequent melting of the solder balls and interference on the welding quality are caused by the oxidation phenomenon after the solder balls make contact with air for a long time is avoided.

Description

Technical Field

[0001] The utility model relates to the field of solder balls, in particular to a low-melting-point solder ball. Background Art

[0002] Solder balls are mainly widely used in tinplate, fluxes, organic synthesis, chemical production, alloy manufacturing, and the assembly of multiple integrated circuits in the electronics industry, etc. They are also used as reagents for determining arsenic and phosphates, reducing agents, tin-plated products, etc.

[0003] However, there are still some deficiencies in the current solder balls. For example, the existing solder balls have low oxidation resistance, resulting in easy oxidation after long-term contact with air, which brings certain interference to the subsequent melting and welding quality of the solder balls, and thus there are certain usage defects.

[0004] Therefore, it is urgent to improve this shortcoming. The utility model studies and improves the existing structural deficiencies and provides a low-melting-point solder ball. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a low-melting-point solder ball to solve the problems raised in the above background art.

[0006] To achieve the above purpose, the utility model provides the following technical solution: A low-melting-point solder ball, including an inner ball core and an antioxidant protection mechanism. The top of the inner ball core is equidistantly provided with straight through holes in a circular array, and the side of the inner ball core is equidistantly provided with anti-slip arc-shaped grooves. The antioxidant protection mechanism is wrapped and fixed on the outer surface of the inner ball core.

[0007] Further, the inner ball core includes a tin-silver-copper metal layer and a tin-bismuth metal layer. The tin-bismuth metal layer is wrapped inside the tin-silver-copper metal layer, and the tin-silver-copper metal layer and the tin-bismuth metal layer are alternately arranged in a fused manner.

[0008] Further, the straight through holes are equidistantly arranged through the inside of the inner ball core, and the straight through holes are parallel to each other.

[0009] Further, the anti-slip arc-shaped grooves are equidistantly arranged on the outer surface of the side of the inner ball core, and the ends of the anti-slip arc-shaped grooves are not communicated with the side of the straight through holes.

[0010] Further, the antioxidant protection mechanism includes an antioxidant resin layer, an antioxidant coating, anti-slip patterns, and a flexible buffer layer. The antioxidant coating is attached and fixed on the outer surface of the antioxidant resin layer, and the anti-slip patterns are provided on the outer surface of the antioxidant coating. Moreover, the flexible buffer layer is fixedly connected to the inner surface of the antioxidant resin layer in a fitting manner.

[0011] Furthermore, the inner surface of the anti-oxidation resin layer is fixedly connected to the outer surface of the flexible buffer layer, and the inner surface of the flexible buffer layer is fixedly connected to the outer surface of the inner core, and the anti-oxidation resin layer forms a fixed structure with the inner core through the flexible buffer layer.

[0012] The utility model provides a low melting point solder ball, which has the following beneficial effects:

[0013] 1. The utility model provides a straight through hole and an anti-slip arc groove, so that the contact area between the tin ball and the heat of the anti-oxidation protection mechanism is larger after melting, so that the melting speed of the tin ball can be further improved, thereby effectively preventing the tin ball from being completely melted. At the same time, since the inner ball core is made of a fusion of a tin-silver-copper metal layer and a tin-bismuth metal layer, the melting point of the tin ball is lower, and the anti-oxidation resin layer and the anti-oxidation coating are provided, the oxidation resistance of the tin ball is better, thereby avoiding the oxidation phenomenon of the tin ball after long-term contact with the air, which causes the subsequent melting of the tin ball and the welding quality to be disturbed. Moreover, since the melting points of the anti-oxidation resin layer and the anti-oxidation coating are lower than the melting point of the inner ball core, the anti-oxidation protection mechanism will not interfere with the low melting point function of the inner ball core.

[0014] 2. The utility model provides anti-skid patterns and anti-skid arc grooves to make the solder ball more anti-skid, thereby effectively preventing the solder ball from falling off and being broken when the staff grabs the solder ball. In addition, the flexible buffer layer is provided to prevent the inner core of the solder ball from being excessively damaged when a collision occurs, thereby ensuring that the inner core will not be disturbed during subsequent melting and welding. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the front view of a three-dimensional structure of a low-melting-point solder ball of the utility model;

[0016] Figure 2 This is a schematic diagram of the three-dimensional structure of a tin-silver-copper metal layer and a tin-bismuth metal layer of a low-melting-point tin ball of the utility model;

[0017] Figure 3 The utility model is a schematic diagram of the three-dimensional structure of an anti-oxidation resin layer-anti-oxidation coating of a low-melting-point solder ball.

[0018] In the figure: 1. inner core; 101. tin-silver-copper metal layer; 102. tin-bismuth metal layer; 2. through hole; 3. anti-slip arc groove; 4. anti-oxidation protection mechanism; 401. anti-oxidation resin layer; 402. anti-oxidation coating; 403. anti-slip pattern; 404. flexible buffer layer. DETAILED DESCRIPTION

[0019] The following further describes in detail the implementation manners of the present utility model in conjunction with the accompanying drawings and embodiments. The following embodiments are used to illustrate the present utility model, but cannot be used to limit the scope of the present utility model.

[0020] As Figures 1 - 3 shown, a low-melting-point solder ball includes an inner ball core 1 and an antioxidant protection mechanism 4. The top of the inner ball core 1 is equidistantly provided with straight through-holes 2 in a circular array. The inner ball core 1 includes a tin-silver-copper metal layer 101 and a tin-bismuth metal layer 102, and the tin-bismuth metal layer 102 is wrapped inside the tin-silver-copper metal layer 101, and the tin-silver-copper metal layer 101 and the tin-bismuth metal layer 102 are alternately arranged in a fused manner. The side of the inner ball core 1 is equidistantly provided with anti-slip arc-shaped grooves 3 in a circular shape. The antioxidant protection mechanism 4 is wrapped and fixed on the outer surface of the inner ball core 1. The antioxidant protection mechanism 4 includes an antioxidant resin layer 401, an antioxidant coating 402, anti-slip patterns 403, and a flexible buffer layer 404. The outer surface of the antioxidant resin layer 401 is fixedly attached with the antioxidant coating 402, and anti-slip patterns 403 are provided on the outer surface of the antioxidant coating 402. The inner surface of the antioxidant resin layer 401 is fixedly attached and connected to the flexible buffer layer 404. By providing the anti-slip patterns 403, it is not easy for the staff to drop the solder ball when grasping it. The inner surface of the antioxidant resin layer 401 is fixedly connected to the outer surface of the flexible buffer layer 404, and the inner surface of the flexible buffer layer 404 is fixedly connected to the outer surface of the inner ball core 1. And the antioxidant resin layer 401 and the inner ball core 1 are formed into a fixed structure. By setting the antioxidant resin layer 401 and the inner ball core 1 into a fixed structure, when the solder ball accidentally drops to the ground, the antioxidant resin layer 401 will not become loose.

[0021] As Figures 1 - 3 shown, the top of the inner ball core 1 is equidistantly provided with straight through-holes 2 in a circular array. The straight through-holes 2 are equidistantly arranged through the inside of the inner ball core 1, and the straight through-holes 2 are parallel to each other. By setting the straight through-holes 2 to be parallel to each other, it not only provides convenience for the staff to process and manufacture the solder ball, but also ensures that heat can enter the inner ball core 1 more conveniently to increase the melting speed of the inner ball core 1. The side of the inner ball core 1 is equidistantly provided with anti-slip arc-shaped grooves 3 in a circular shape. The anti-slip arc-shaped grooves 3 are equidistantly arranged on the outer surface of the side of the inner ball core 1, and the end of the anti-slip arc-shaped groove 3 is not communicated with the side of the straight through-hole 2. The antioxidant protection mechanism 4 is wrapped and fixed on the outer surface of the inner ball core 1.

[0022] In summary, for this low-melting-point solder ball, first according to Figures 1 to 3In the structure shown, when the staff grabs the solder ball, the anti-slip pattern 403 is used to increase the anti-slip property of the solder ball, so as to ensure that there is flexibility in rigidity and the solder ball is not easily loosened during grasping. If the solder ball accidentally falls to the ground, the flexible buffer layer 404 is used to prevent the inner ball core 1 from being damaged. And through the mutual cooperation of the antioxidant resin layer 401 and the antioxidant coating 402, it is ensured that the inner ball core 1 is not interfered by oxygen. When the solder ball receives heat, the antioxidant protection mechanism 4 gradually begins to melt. After the antioxidant protection mechanism 4 melts completely, through the mutual cooperation of the straight through hole 2 and the anti-slip arc-shaped groove 3, the contact surface between the inner ball core 1 and the heat is larger, thus effectively improving the melting speed of the inner ball core 1, and further avoiding the phenomenon of non-melting of the inner ball core 1. At the same time, the mutual cooperation of the tin-silver-copper metal layer 101 and the tin-bismuth metal layer 102 makes the melting point of the inner ball core 1 lower, thereby further improving the melting speed of the inner ball core 1.

[0023] The embodiments of the present invention are given for purposes of illustration and description, and are not exhaustive or limit the present invention to the disclosed form. Many modifications and variations are obvious to those of ordinary skill in the art. The embodiments are chosen and described in order to better illustrate the principles of the present invention and its practical application, and to enable those of ordinary skill in the art to understand the present invention and design various embodiments with various modifications suitable for specific purposes.

Claims

1. A low melting point solder ball, comprising an inner ball core (1) and an anti-oxidation protection mechanism (4), characterized in that: The top of the inner core (1) is provided with straight through holes (2) at equal distances in a circular array, and the side of the inner core (1) is provided with anti-slip arc grooves (3) at equal distances in a circular array, and the anti-oxidation protection mechanism (4) is wrapped and fixed on the outer surface of the inner core (1).

2. A low melting point solder ball according to claim 1, characterized in that: The inner ball core (1) comprises a tin-silver-copper metal layer (101) and a tin-bismuth metal layer (102), the tin-silver-copper metal layer (101) is wrapped with the tin-bismuth metal layer (102), and the tin-silver-copper metal layer (101) and the tin-bismuth metal layer (102) are fused and alternately arranged.

3. The low melting point solder ball according to claim 1, characterized in that: The through holes (2) are arranged at equal distances through the interior of the inner core (1), and the through holes (2) are arranged parallel to each other.

4. The low melting point solder ball according to claim 1, characterized in that: The anti-slip arc-shaped grooves (3) are arranged in an annular shape and at equal distances on the outer surface of the side edge of the inner ball core (1), and the ends of the anti-slip arc-shaped grooves (3) are not connected to the sides of the straight through holes (2).

5. The low melting point solder ball according to claim 1, characterized in that: The anti-oxidation protection mechanism (4) comprises an anti-oxidation resin layer (401), an anti-oxidation coating (402), anti-skid patterns (403) and a flexible buffer layer (404), wherein the anti-oxidation coating (402) is attached and fixed to the outer surface of the anti-oxidation resin layer (401), the anti-skid patterns (403) are provided on the outer surface of the anti-oxidation coating (402), and the flexible buffer layer (404) is bonded and fixedly connected to the inner surface of the anti-oxidation resin layer (401).

6. A low melting point solder ball according to claim 5, characterized in that: The inner surface of the anti-oxidation resin layer (401) is fixedly connected to the outer surface of the flexible buffer layer (404), and the inner surface of the flexible buffer layer (404) is fixedly connected to the outer surface of the inner core (1), and the anti-oxidation resin layer (401) and the inner core (1) form a fixed structure through the flexible buffer layer (404).

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