Rotary table structure for silicon wafer scribing machine
By using the design of clamping parts and limiting parts in the silicon wafer scriber, the problem of long fixing time of processing objects is solved, and a more efficient processing process is achieved.
Patent Information
- Application Number
- CN202422197920.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-09
- Publication Date
- 2025-07-01
- Estimated Expiration
- 2034-09-09
AI Technical Summary
In the prior art, the processed object takes a long time to fix on the scribe machine workbench, resulting in low working efficiency.
A rotary table structure for silicon wafer scribe machine is adopted, including a base, a rotary table, a work table and a clamping mechanism. The clamping member is arranged on the rotary table to clamp or loosen the blue film frame by rotating along the rotary table, and the rotation of the clamping member is restricted by the limiting member. The motor drives the rotary table to rotate to fix the silicon wafer.
Through the rotation of the clamping parts and the fixing of the limiting parts, the fixing process of the processed objects is simplified, the fixing time is shortened, and the working efficiency is improved.
Smart Images
Figure CN223044877U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of dicing machines, and particularly relates to a turntable structure for a silicon wafer dicing machine. Background Art
[0002] Dicing machines are widely used in dicing processing of materials such as semiconductor wafers, LED wafers, electronic substrates, and ceramic thin plates. At present, the turntable of a dicing machine generally consists of a motor and a workbench. During the dicing process, the workpiece is usually fixed on the workbench, and the cutting tool is controlled to move to scratch the workpiece, while the motor controls the rotation of the workbench, so as to scratch the workpiece in all directions. In order to fix the workpiece on the workbench, the workpiece is mostly pasted onto a blue film frame, and then the blue film frame is fixed on the workbench through bolts; however, the time required to fix the workpiece through bolts is relatively long, resulting in low work efficiency. Summary of the Utility Model
[0003] An embodiment of the utility model provides a turntable structure for a silicon wafer dicing machine to solve the technical problem in the prior art that the time required to fix the workpiece on the workbench is relatively long, resulting in low work efficiency.
[0004] To achieve the above object, the technical solution adopted by the utility model is: to provide a turntable structure for a silicon wafer dicing machine, including:
[0005] A base for being installed on a dicing machine; a receiving groove is formed in the base, and a motor is arranged in the receiving groove;
[0006] A rotating table is arranged in the receiving groove and is located above the motor; the free end of the motor is in transmission connection with the rotating table for driving the rotating table to rotate;
[0007] A workbench is arranged on the rotating table, and an installation groove for installing a silicon wafer and a blue film frame is arranged on the workbench;
[0008] There are a plurality of clamping mechanisms, and the plurality of clamping mechanisms are arranged circumferentially along the rotating table; each clamping mechanism includes a clamping member and a limiting member, the clamping member is arranged on the rotating table, and the clamping member has the freedom to clamp or loosen the blue film frame along with the rotation of the rotating table; the limiting member is arranged on the rotating table for restricting the rotation of the clamping member.
[0009] In a possible implementation manner, the clamping member is of an L-shaped structure, one end of the clamping member is rotatably connected to the rotating table, and the other end is located above the workbench for clamping or loosening the blue film frame.
[0010] In a possible implementation manner, a pressing member is arranged on one side of the clamping member close to the blue film frame, and the pressing member is located above the blue film frame for pressing the blue film frame.
[0011] In one possible implementation, the clamping member is provided with a clamping groove; the clamping member includes a clamping block and an elastic member, one end of the clamping block is arranged in the clamping groove, and has the freedom to move along the inner wall of the clamping groove toward or away from the blue film frame, and the other end of the clamping block extends out of the clamping groove; the elastic member is arranged in the clamping groove, and both ends are fixedly connected to the clamping block and the inner wall of the clamping groove, respectively.
[0012] In a possible implementation, the limit member includes a limit block, a limit plate and a locking rod; the limit block is fixed on the rotating table, and a limit opening is provided on the side of the limit block close to the clamping member, and a locking hole is provided on the limit block and passes through the limit opening; one end of the limit plate is fixed on the clamping member, and the other end is arranged toward the limit opening, and a limit hole is provided on the limit plate and coincides with the central axis of the locking hole, and the limit plate has the freedom to enter and exit the limit opening as the clamping member rotates; the locking rod passes through the limit hole and the locking hole, and is slidably connected to the limit hole and the locking hole.
[0013] In a possible implementation, a locking block is provided at one end of the locking rod, and a diameter of the locking block is greater than a diameter of the locking rod.
[0014] In a possible implementation, the outer side surface of the rotating platform is rotatably connected to the inner wall of the accommodating groove.
[0015] In a possible implementation, two centering blocks are further provided on the workbench for controlling the centering of the silicon wafer, and the two centering blocks are symmetrically arranged and respectively located on both sides of the receiving groove.
[0016] In a possible implementation, a side of the centering block close to the blue film frame is provided with an arc surface matching with an outer side surface of the blue film frame.
[0017] In a possible implementation, the rotating table is provided with a lifting slot; the workbench is fixed in the lifting slot, and the workbench is provided with two lifting holes corresponding to the centering block one by one, the centering block is arranged in the lifting holes, and has the freedom to move up and down along the inner wall of the lifting hole; a lifter is provided in the lifting slot and is transmission-connected to the centering block.
[0018] The beneficial effect of a turntable structure for a silicon wafer dicing machine provided by the utility model is that: compared with the prior art, the turntable structure for a silicon wafer dicing machine of the utility model, when in use, because the worktable is arranged on the rotating table and the worktable is provided with a mounting groove, after the silicon wafer is pasted on the blue film frame, the silicon wafer and the blue film frame are placed in the mounting groove; because the clamping member is arranged on the rotating table and the clamping member has the freedom to clamp or loosen the blue film frame by rotating along the rotating table, and the limiting member is arranged on the rotating table, when controlling the clamping mechanism to clamp the blue film frame, it is only necessary to rotate the clamping member, thereby making the clamping member clamp the blue film frame, and at the same time fix the clamping member with the help of the limiting member, thereby preventing the clamping member from rotating at will; because the electric The machine is installed in the receiving groove of the base, and the free end of the motor is connected to the rotating table in the receiving groove. Therefore, after the silicon wafer and the blue film frame are fixed on the workbench with the help of the clamping mechanism, the motor drives the rotating table to rotate, so that the cutting knife scratches the silicon wafer; since there are multiple clamping mechanisms and they are arranged along the circumference of the rotating table, the clamping effect of the clamping mechanism can be better with the help of multiple clamping mechanisms; in this way, the blue film frame in the receiving groove is clamped or loosened with the help of the rotation of the clamping member, and the rotation of the clamping member is limited by the limit member, so that the blue film frame is fixed in the receiving groove, and the staff does not need to turn the bolts, which greatly shortens the time required for fixing the silicon wafer, thereby improving work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0020] Figure 1 A schematic diagram of the structure of the turntable provided in the embodiment of the utility model Figure 1 ;
[0021] Figure 2 for Figure 1 The enlarged view of point A in the middle;
[0022] Figure 3 for Figure 1 The enlarged view of point B in the middle;
[0023] Figure 4 A schematic diagram of the connection between the clamping member and the limiting member provided in the embodiment of the utility model;
[0024] Figure 5 for Figure 4 Enlarged view of point C in the middle;
[0025] Figure 6Structural schematic of the turntable structure provided by the embodiment of the present utility model Figure 1 ;
[0026] Figure 7 Top view of the turntable structure provided by the embodiment of the present utility model.
[0027] Among them, each reference numeral in the figure:
[0028] 1, base; 11, receiving groove; 2, rotating table; 21, lifting groove; 22, lifting hole; 23, lifter; 3, workbench; 31, installation groove; 4, clamping mechanism; 41, clamping member; 411, pressing groove; 42, limiting member; 421, limiting block; 422, limiting plate; 423, locking rod; 424, locking hole; 425, limiting hole; 426, locking block; 427, limiting opening; 43, pressing member; 431, pressing block; 432, elastic member; 44, centering block; 441, arc surface; 5, motor; 6, blue film frame; 7, silicon wafer. Detailed implementation manners
[0029] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present utility model clearer, the present utility model will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.
[0030] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.
[0031] It should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present utility model.
[0032] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, "a plurality" means two or more unless otherwise specifically defined.
[0033] Please refer to Figures 1 to 7 and now a turntable structure for a silicon wafer dicing machine provided by the present utility model will be described. A turntable structure for a silicon wafer dicing machine includes a base 1, a rotating table 2, a workbench 3 and a clamping mechanism 4. The base 1 is used to be installed on the dicing machine. The base 1 is provided with a receiving groove 11, and a motor 5 is arranged in the receiving groove 11. The rotating table 2 is arranged in the receiving groove 11 and is located above the motor 5. The free end of the motor 5 is in transmission connection with the rotating table 2 for driving the rotating table 2 to rotate. The workbench 3 is arranged on the rotating table 2, and an installation groove 31 for installing a silicon wafer 7 and a blue film frame 6 is provided on the workbench 3. The number of the clamping mechanisms 4 is multiple, and the multiple clamping mechanisms 4 are arranged along the circumferential direction of the rotating table 2. The clamping mechanism 4 includes a clamping member 41 and a limiting member 42. The clamping member 41 is arranged on the rotating table 2, and the clamping member 41 has the freedom to clamp or loosen the blue film frame 6 along with the rotation of the rotating table 2. The limiting member 42 is arranged on the rotating table 2 for restricting the rotation of the clamping member 41.
[0034] For the turntable structure for a silicon wafer dicing machine provided in this embodiment, compared with the prior art, in the turntable structure for a silicon wafer dicing machine of the present utility model, during use, since the workbench 3 is arranged on the rotating table 2 and the workbench 3 is provided with the installation groove 31, after the silicon wafer 7 is pasted on the blue film frame 6, the silicon wafer 7 and the blue film frame 6 are then placed into the installation groove 31. Since the clamping member 41 is arranged on the rotating table 2 and the clamping member 41 has the freedom to clamp or loosen the blue film frame 6 along with the rotation of the rotating table 2, and at the same time the limiting member 42 is arranged on the rotating table 2, when controlling the clamping mechanism 4 to clamp the blue film frame 6, only need to rotate the clamping member 41, so that the clamping member 41 clamps the blue film frame 6, and at the same time the clamping member 41 is fixed by means of the limiting member 42, thereby preventing the clamping member 41 from rotating randomly. Since the motor 5 is installed in the receiving groove 11 of the base 1 and the free end of the motor 5 is in transmission connection with the rotating table 2 arranged in the receiving groove 11, after the silicon wafer 7 and the blue film frame 6 are fixed on the workbench 3 by means of the clamping mechanism 4, the motor 5 drives the rotating table 2 to rotate, so that the cutting tool makes a scratch on the silicon wafer 7. Since the number of the clamping mechanisms 4 is multiple and they are arranged along the circumferential direction of the rotating table 2, the clamping effect of the clamping mechanism 4 can be better by means of the multiple clamping mechanisms 4. In this way, by means of the rotation of the clamping member 41 to clamp or loosen the blue film frame 6 located in the receiving groove 11 and using the limiting member 42 to restrict the rotation of the clamping member 41, the blue film frame 6 is fixed in the receiving groove 11, without the need for the staff to rotate bolts, greatly shortening the time required for fixing the silicon wafer 7, thereby improving the work efficiency.
[0035] Please refer to Figure 1, as a specific embodiment of the turntable structure for the silicon wafer 7 dicing machine provided by the present utility model, the clamping member 41 has an L-shaped structure. One end of the clamping member 41 is rotatably connected to the rotating table 2, and the other end is located above the workbench 3 for clamping or loosening the blue film frame 6. Since the clamping member 41 is set to have an L-shaped structure and one end of the clamping member 41 is rotatably connected to the rotating table 2, when controlling the rotation of one end of the clamping member 41, the other end of the clamping member 41 clamps or loosens the blue film frame 6 as the clamping member 41 rotates, thereby clamping or loosening the silicon wafer 7.
[0036] Please refer to Figure 1 and Figure 2 , as a specific embodiment of the turntable structure for the silicon wafer 7 dicing machine provided by the present utility model, a pressing member 43 is provided on one side of the clamping member 41 close to the blue film frame 6, and the pressing member 43 is located above the blue film frame 6 for pressing the blue film frame 6. With the help of the pressing member 43, the clamping effect of the clamping member 41 on the blue film frame 6 can be better.
[0037] Please refer to Figure 1 and Figure 2 , as a specific embodiment of the turntable structure for the silicon wafer 7 dicing machine provided by the present utility model, the clamping member 41 is provided with a pressing groove 411. The pressing member 43 includes a pressing block 431 and an elastic member 432. One end of the pressing block 431 is arranged in the pressing groove 411 and has the freedom to move along the inner wall of the pressing groove 411 in the direction of approaching or departing from the blue film frame 6, and the other end of the pressing block 431 extends out of the pressing groove 411. The elastic member 432 is arranged in the pressing groove 411 and is fixedly connected to the pressing block 431 and the inner wall of the pressing groove 411 at both ends respectively. When the clamping member 41 rotates to clamp the blue film frame 6, the pressing block 431 contacts the blue film frame 6, and as the clamping member 41 rotates, the pressing block 431 moves in the pressing groove 411 in the direction away from the blue film frame 6 and compresses the elastic member 432. Then, the elastic member 432 reversely pushes the pressing block 431 to move by means of the elastic force, so that the pressing block 431 presses on the blue film frame 6, thereby increasing the clamping effect of the clamping member 41 by means of the elastic member 432 and the pressing block 431. The elastic member 432 is a spring.
[0038] Please refer to Figure 1 , Figure 3 , Figure 4 and Figure 5, as a specific embodiment of the turntable structure for the silicon wafer 7 dicing machine provided by the present utility model, the limiting member 42 includes a limiting block 421, a limiting plate 422 and a locking rod 423; the limiting block 421 is fixedly arranged on the rotating table 2, and a limiting opening 427 is formed on one side of the limiting block 421 close to the clamping member 41, and a locking hole 424 penetrating through the limiting opening 427 is formed on the limiting block 421; one end of the limiting plate 422 is fixedly arranged on the clamping member 41, the other end is arranged towards the limiting opening 427, and a limiting hole 425 whose central axis coincides with that of the locking hole 424 is formed on the limiting plate 422, and the limiting plate 422 has the freedom to enter and exit the limiting opening 427 along with the rotation of the clamping member 41; the locking rod 423 penetrates through the limiting hole 425 and the locking hole 424, and is slidably connected with the limiting hole 425 and the locking hole 424; when the blue film frame 6 is clamped along with the rotation of the clamping member 41, the limiting plate 422 rotates synchronously and enters into the limiting opening 427 of the limiting block 421, so that the central axes of the limiting hole 425 and the locking hole 424 coincide, and at the same time, the locking rod 423 is inserted into the limiting hole 425 and the locking hole 424, thereby fixing the limiting plate 422 on the limiting block 421, and thus fixing the clamping member 41.
[0039] Please refer to Figure 4 and Figure 5 , as a specific embodiment of the turntable structure for the silicon wafer 7 dicing machine provided by the present utility model, one end of the locking rod 423 is provided with a locking block 426, and the diameter of the locking block 426 is larger than that of the locking rod 423; by means of the locking block 426, while preventing the locking rod 423 from sliding randomly in the limiting hole 425 and the locking hole 424, it is also convenient for the staff to control the insertion or extraction of the locking rod 423 into or from the limiting hole 425 and the locking hole 424.
[0040] Please refer to Figure 1 and Figure 6 , as a specific embodiment of the turntable structure for the silicon wafer 7 dicing machine provided by the present utility model, the outer side surface of the rotating table 2 is rotationally connected with the inner wall of the receiving groove 11. Setting the outer side surface of the rotating table 2 and the inner wall of the receiving groove 11 to be rotationally connected can not only make the rotation of the rotating table 2 more stable, but also make the structure between the rotating table 2 and the base 1 more compact.
[0041] Please refer to Figure 6 and Figure 7 , as a specific embodiment of the turntable structure for the silicon wafer 7 dicing machine provided by the present utility model, two centering blocks 44 are further arranged on the workbench 3 for controlling the centering of the silicon wafer 7. The two centering blocks 44 are symmetrically arranged and are respectively located on both sides of the receiving groove 11; by means of the centering blocks 44 located on both sides of the receiving groove 11, the blue film frame 6 is placed between the two centering blocks 44, and the opposite ends of the blue film frame 6 are brought into contact with the centering blocks 44, so as to quickly center the silicon wafer 7.
[0042] Please refer to Figure 7 , as a specific embodiment of the turntable structure for the silicon wafer 7 dicing machine provided by the present utility model, an arc surface 441 which is matched with the outer side surface of the blue film frame 6 is formed on one side of the centering block 44 close to the blue film frame 6; by means of the arc surface 441, the centering effect of the centering block 44 on the blue film frame 6 can be better
[0043] Please refer to Figure 6 , as a specific embodiment of the turntable structure for the silicon wafer 7 dicing machine provided by the present utility model, a lifting groove 21 is formed in the rotating table 2; the workbench 3 is fixedly arranged in the lifting groove 21, two lifting holes 22 corresponding to the centering blocks 44 one by one are formed in the workbench 3, the centering blocks 44 are arranged in the lifting holes 22 and have the freedom to move up and down along the inner wall of the lifting holes 22; a lifter 23 which is in transmission connection with the centering blocks 44 is arranged in the lifting groove 21; when the dicing machine is not in use, the centering blocks 44 can be controlled to descend by means of the lifter 23, so that the centering blocks 44 enter the lifting holes 22, when the centering blocks 44 are used, the centering blocks 44 are controlled to ascend by means of the lifter 23, and one end of the centering blocks 44 extends out of the lifting holes 22, so as to center the blue film frame 6; by means of the lifting groove 21 and the lifter 23, when the dicing machine is not in use, the turntable structure can be made more compact and the centering blocks 44 can be better protected; the lifter 23 is a cylinder
[0044] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included in the protection scope of the present utility model
Claims
1. A turntable structure for a silicon wafer dicing machine, characterized in that: include: A base, used for being installed on a dicing machine; the base is provided with a receiving groove, and the motor is arranged in the receiving groove; A rotating table is arranged in the receiving groove and located above the motor; the free end of the motor is drivingly connected to the rotating table to drive the rotating table to rotate; A workbench, arranged on the rotating table, wherein the workbench is provided with mounting grooves for mounting silicon wafers and blue film frames; There are multiple clamping mechanisms, and the multiple clamping mechanisms are arranged along the circumference of the rotating table; the clamping mechanism includes a clamping member and a limiting member, the clamping member is arranged on the rotating table, and the clamping member has the freedom to clamp or release the blue film frame along the rotating table; the limiting member is arranged on the rotating table to limit the rotation of the clamping member.
2. A turntable structure for a silicon wafer dicing machine as claimed in claim 1, characterized in that: The clamping piece is an L-shaped structure, one end of which is rotatably connected to the rotating table, and the other end of which is located above the workbench and is used to clamp or loosen the blue film frame.
3. A turntable structure for a silicon wafer dicing machine as claimed in claim 2, characterized in that: A pressing piece is provided on one side of the clamping piece close to the blue film frame, and the pressing piece is located above the blue film frame and is used for pressing the blue film frame.
4. A turntable structure for a silicon wafer dicing machine as claimed in claim 3, characterized in that: The clamping member is provided with a clamping groove; the clamping member includes a clamping block and an elastic member, one end of the clamping block is arranged in the clamping groove, and has the freedom to move along the inner wall of the clamping groove toward or away from the blue film frame, and the other end of the clamping block extends out of the clamping groove; the elastic member is arranged in the clamping groove, and the two ends are respectively fixedly connected to the clamping block and the inner wall of the clamping groove.
5. A turntable structure for a silicon wafer dicing machine as claimed in claim 1, characterized in that: The limit member includes a limit block, a limit plate and a locking rod; the limit block is fixedly arranged on the rotating table, and a limit opening is provided on a side of the limit block close to the clamping member, and a locking hole is provided on the limit block that passes through the limit opening; one end of the limit plate is fixedly arranged on the clamping member, and the other end is arranged toward the limit opening, and a limit hole is provided on the limit plate that coincides with the central axis of the locking hole, and the limit plate has the freedom to enter and exit the limit opening as the clamping member rotates; the locking rod passes through the limit hole and the locking hole, and is slidably connected to the limit hole and the locking hole.
6. A turntable structure for a silicon wafer dicing machine as claimed in claim 5, characterized in that: A locking block is provided at one end of the locking rod, and the diameter of the locking block is greater than the diameter of the locking rod.
7. A turntable structure for a silicon wafer dicing machine as claimed in claim 1, characterized in that: The outer side surface of the rotating platform is rotatably connected to the inner wall of the containing groove.
8. A turntable structure for a silicon wafer dicing machine as claimed in claim 1, characterized in that: The workbench is also provided with two centering blocks for controlling the centering of the silicon wafer. The two centering blocks are symmetrically arranged and are respectively located on both sides of the containing groove.
9. A turntable structure for a silicon wafer dicing machine as claimed in claim 8, characterized in that: A side of the centering block close to the blue film frame is provided with an arc surface matched with the outer side surface of the blue film frame.
10. A turntable structure for a silicon wafer dicing machine as claimed in claim 8, characterized in that: The rotating table is provided with a lifting groove; the workbench is fixed in the lifting groove, and the workbench is provided with two lifting holes corresponding to the centering block one by one. The centering block is arranged in the lifting holes and has the freedom to move up and down along the inner wall of the lifting hole; a lifter is provided in the lifting groove and is transmission-connected to the centering block.