Dust removal structure for silicon wafer scribing machine and scribing machine
By installing the dust removal structure of rotating brushes and negative pressure adsorption components on the scriber, the problem of difficulty in cleaning dust is solved, and the internal cleaning and normal operation of the scriber is achieved.
Patent Information
- Application Number
- CN202422197921.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-09
- Publication Date
- 2025-07-01
- Estimated Expiration
- 2034-09-09
AI Technical Summary
During the processing process of existing scribers, dust is difficult to clean, resulting in accumulation of dust on the workbench surface, affecting the processing accuracy and yield rate.
A dust removal structure for silicon wafer scribing machines is designed, including dust removal components, negative pressure adsorption components and horizontal moving components. The dust is cleaned with a rotating brush, and the dust is sucked into the dust collector through the negative pressure adsorption components and dust removal channels.
Effectively clean the dust on the workbench, ensure the cleanliness of the inside of the scriber, and improve processing accuracy and yield.
Smart Images
Figure CN223044878U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of cyclone separation, and particularly relates to a dust removal structure and a wafer dicing machine for a wafer dicing machine. Background Art
[0002] Dicing machines are widely used in the dicing processing of materials such as semiconductor wafers, LED wafers, electronic substrates, and ceramic thin plates. At present, a dicing machine generally consists of a cutting tool and a workbench. In the dicing process, the workpiece is usually fixed on the workbench, and the cutting tool is controlled to move to scratch the workpiece. When the existing dicing machine scratches the workpiece, a lot of dust will be generated. After long-term accumulation, most of the dust remains on the surface of the workbench or in the gaps between the fixing structures used to fix the workpiece on the workbench. These powders are not easy to clean, and at the same time, it will cause inaccurate scratch accuracy of the workpiece and reduce the yield. Summary of the Utility Model
[0003] An embodiment of the utility model provides a dust removal structure and a dicing machine for a wafer dicing machine to solve the technical problem that the dust on the workbench in the prior art is not easy to clean.
[0004] To achieve the above object, the technical solution adopted by the utility model is: to provide a dust removal structure for a wafer dicing machine, including:
[0005] A dust removal component, which is used to be installed in the dicing machine and is located above one side of the workbench; the dust removal component includes a support member, a rotating member, a brush and a driver; the support member has a degree of freedom of horizontal movement in a direction close to or away from the workbench, a rotating groove is provided at one end of the support member close to the workbench, and a plurality of dust removal channels are provided on the support member along the circumferential direction of the rotating groove; the rotating member is arranged in the rotating groove and is rotatably connected to the rotating groove; the brush is arranged on the rotating member, and the brush sweeps the workbench as the dust removal component moves; the driver is arranged on the support member, and the free end of the driver penetrates through the rotating groove and is in transmission connection with the rotating member;
[0006] A negative pressure adsorption component, which is arranged on the support member and is connected to a plurality of the dust removal channels for adsorbing dust;
[0007] A horizontal movement component, which is arranged in the dicing machine and is in transmission connection with the support member for driving the dust removal component to move.
[0008] In a possible implementation manner, a receiving groove is provided at one end of the rotating member close to the workbench, the brush is arranged in the receiving groove and has a degree of freedom of moving up and down along the inner wall of the receiving groove; an elastic member is further arranged in the receiving groove, and both ends of the elastic member are respectively connected to the inner wall of the receiving groove and the brush.
[0009] In a possible implementation, the negative pressure adsorption assembly includes a dust collection box, a plurality of connecting pipes, and a negative pressure adsorber; the dust collection box is arranged above the support member, and a plurality of adsorption holes corresponding to the dust removal channels one by one are formed in the lower end surface of the dust collection box; the plurality of connecting pipes correspond to the plurality of adsorption holes one by one, and two ends of each connecting pipe are respectively communicated with the adsorption hole and the dust removal channel; the negative pressure adsorber is arranged on the dust collection box and is connected to the dust collection box.
[0010] In a possible implementation, the negative pressure adsorption assembly is further provided with an adsorption pipe, the adsorption pipe is in a conical structure with a smaller upper part and a larger lower part, and the smaller opening end of the adsorption pipe is communicated with the dust removal channel.
[0011] In a possible implementation, a filtering assembly is further arranged in the dust collection box for filtering dust.
[0012] In a possible implementation, a filtering port is formed on one side of the dust collection box; the filtering assembly includes a support frame and a filter net, the support frame has the freedom to pass through the filtering port and enter and exit the dust collection box; the filter net is arranged on the support frame.
[0013] In a possible implementation, a limiting flange is arranged at one end of the support frame away from the filtering port.
[0014] In a possible implementation, a dust collection port and a closing plate for opening or closing the dust collection port are formed on the dust collection box.
[0015] In a possible implementation, the horizontal movement assembly includes a moving frame and a driving member, the moving frame is fixedly connected to the support member, the moving frame is slidably connected to the inner wall of the dicing machine; the driving member is fixedly connected to the inner wall of the dicing machine, and the free end of the driving member is in transmission connection with the moving frame.
[0016] The beneficial effect of the dust removal structure for a silicon wafer dicing machine provided by the utility model is that compared with the prior art, the dust removal structure for a silicon wafer dicing machine provided by the utility model, when in use, because the support member of the dust removal assembly has the freedom to move horizontally toward or away from the workbench, and the horizontal moving assembly is transmission-connected to the support member, and at the same time the rotating member installed in the rotating groove is rotationally connected to the rotating groove, and the brush is arranged on the rotating member, therefore when cleaning the dust on the workbench, the driver drives the rotating member to rotate, and the rotating member drives the brush to rotate, and at the same time the horizontal moving assembly controls the movement of the support member, thereby causing the brush to move above the workbench and contact the workbench, so that the rotating brush cleans the dust on the workbench Sweep the workbench; since the support is provided with a plurality of dust removal channels arranged along the circumference of the rotating groove, and the negative pressure adsorption component is connected to the plurality of dust removal channels, when the dust on the workbench is swept by the brush and diffuses around the brush, the dust removal channel arranged around the brush uses the suction force provided by the negative pressure adsorption component to suck the dust into the dust removal channel, thereby ensuring the cleanliness of the inside of the dicing machine; in this way, the dust on the workbench is cleaned with the help of the rotating brush, and the dust is sucked into the dust removal channel by the negative pressure adsorption component and the dust removal channel, thereby ensuring the cleanliness of the inside of the dicing machine; at the same time, the position of the dust removal component is controlled with the help of the horizontal moving component to ensure the normal operation of the dicing machine.
[0017] Another object of the present invention is to provide a dicing machine, which includes any one of the above-mentioned dust removal structures for silicon wafer dicing machines.
[0018] The dicing machine provided by the utility model has a dust removal structure installed inside the dicing machine, and uses a rotating brush to clean the dust on the workbench, and uses a negative pressure adsorption component and a dust removal channel to suck the dust into the dust removal channel, thereby ensuring the cleanliness of the inside of the dicing machine; at the same time, the position of the dust removal component is controlled by means of a horizontal moving component to ensure the normal operation of the dicing machine. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0020] Figure 1 A schematic diagram of the connection between the dust removal structure and the dicing machine provided in the embodiment of the utility model;
[0021] Figure 2 A schematic diagram of the structure of the dust removal structure provided by an embodiment of the utility model;
[0022] Figure 3The bottom view of the dust removal assembly provided by the embodiment of the present utility model;
[0023] Figure 4 The structural schematic diagram of the dust collection box provided by the embodiment of the present utility model.
[0024] Among them, each reference numeral in the figure:
[0025] 1. Dust removal assembly; 11. Support member; 111. Rotation groove; 112. Dust removal channel; 12. Rotating member; 121. Accommodation groove; 13. Brush; 14. Driver; 15. Elastic member; 2. Negative pressure adsorption assembly; 21. Dust collection box; 211. Adsorption hole; 212. Filter port; 213. Dust collection port; 214. Sealing plate; 22. Connecting pipe; 23. Negative pressure adsorber; 24. Adsorption pipe; 3. Horizontal movement assembly; 31. Moving frame; 32. Driving member; 4. Dicing machine; 41. Workbench; 5. Filter assembly; 51. Support frame; 52. Filter net; 53. Limiting flange. Specific embodiments
[0026] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present utility model clearer, the present utility model will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.
[0027] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.
[0028] It should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present utility model.
[0029] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, "a plurality of" means two or more unless otherwise specifically defined.
[0030] Please refer to Figures 1 to 4 and now a dust removal structure for a silicon wafer dicing machine provided by the present utility model will be described. A dust removal structure for a silicon wafer dicing machine includes a dust removal assembly 1, a negative pressure adsorption assembly 2, and a horizontal movement assembly 3. The dust removal assembly 1 is used to be installed in the dicing machine 4 and is located above one side of the workbench 41. The dust removal assembly 1 includes a support member 11, a rotating member 12, a brush 13, and a driver 14. The support member 11 has a degree of freedom to move in a direction approaching or departing from the workbench 41. One end of the support member 11 close to the workbench 41 is provided with a rotating groove 111, and a plurality of dust removal channels 112 are arranged circumferentially along the rotating groove 111 on the support member 11. The rotating member 12 is arranged in the rotating groove 111 and is rotatably connected to the rotating groove 111. The brush 13 is arranged on the rotating member 12, and the brush 13 cleans the workbench 41 as the dust removal assembly 1 moves. The driver 14 is arranged on the support member 11, and the free end of the driver 14 penetrates the rotating groove 111 and is in transmission connection with the rotating member 12. The negative pressure adsorption assembly 2 is arranged on the support member 11 and is connected to a plurality of dust removal channels 112 for adsorbing dust. The horizontal movement assembly 3 is arranged in the dicing machine 4 and is in transmission connection with the support member 11 for driving the dust removal assembly 1 to move.
[0031] For the dust removal structure for a silicon wafer dicing machine provided in this embodiment, compared with the prior art, for the dust removal structure for a silicon wafer dicing machine of the present utility model, during use, since the support member 11 of the dust removal assembly 1 has a degree of freedom to horizontally move in a direction approaching or departing from the workbench 41, and the horizontal movement assembly 3 is in transmission connection with the support member 11, and at the same time, the rotating member 12 installed in the rotating groove 111 is rotatably connected to the rotating groove 111, and the brush 13 is arranged on the rotating member 12. Therefore, when cleaning the dust on the workbench 41, the driver 14 drives the rotating member 12 to rotate, the rotating member 12 drives the brush 13 to rotate, and at the same time, the horizontal movement assembly 3 controls the movement of the support member 11, so that the brush 13 moves above the workbench 41 and contacts the workbench 41, thereby enabling the rotating brush 13 to clean the workbench 41. Since a plurality of dust removal channels 112 are arranged circumferentially along the rotating groove 111 on the support member 11, and the negative pressure adsorption assembly 2 is connected to a plurality of dust removal channels 112, when the dust on the workbench 41 is cleaned by the brush 13 and diffuses around the brush 13, the dust removal channels 112 arranged circumferentially along the brush 13 suck the dust into the dust removal channels 112 by means of the suction force provided by the negative pressure adsorption assembly 2, thereby ensuring the cleanliness inside the dicing machine 4. In this way, the dust on the workbench 41 is cleaned by means of the rotating brush 13, and the dust is sucked into the dust removal channels 112 by using the negative pressure adsorption assembly 2 and the dust removal channels 112, thereby ensuring the cleanliness inside the dicing machine 4. At the same time, the position of the dust removal assembly 1 is controlled by means of the horizontal movement assembly 3 to ensure the normal operation of the dicing machine 4. The driver 14 is a motor.
[0032] Please refer toFigure 1 and Figure 2 As a specific implementation manner of the dust removal structure for the silicon wafer dicing machine provided by the present utility model, a receiving groove 121 is formed at one end of the rotating member 12 close to the workbench 41. The brush 13 is arranged in the receiving groove 121 and has the freedom to move up and down along the inner wall of the receiving groove 121. An elastic member 15 is further arranged in the receiving groove 121, and both ends of the elastic member 15 are respectively connected to the inner wall of the receiving groove 121 and the brush 13. As the horizontal movement assembly 3 drives the support member 11 to move, when the brush 13 contacts the workbench 41, the brush 13 moves upward in the receiving groove 121 under the extrusion force of the workbench 41 and compresses the elastic member 15. The compressed elastic member 15 pushes the brush 13 to move downward by means of the elastic force, so that the bristles of the brush 13 are more likely to enter the gaps of the fixed structure arranged on the workbench 41, thereby cleaning the workbench 41 more thoroughly. The elastic member 15 is a spring.
[0033] Please refer to Figure 2 As a specific implementation manner of the dust removal structure for the silicon wafer dicing machine provided by the present utility model, the negative pressure adsorption assembly 2 includes a dust collection box 21, a plurality of connecting pipes 22 and a negative pressure adsorber 23. The dust collection box 21 is arranged above the support member 11, and a plurality of adsorption holes 211 corresponding to the dust removal channels 112 one by one are formed on the lower end surface of the dust collection box 21. The plurality of connecting pipes 22 correspond to the plurality of adsorption holes 211 one by one, and both ends of the connecting pipe 22 are respectively connected to the adsorption hole 211 and the dust removal channel 112. The negative pressure adsorber 23 is arranged on the dust collection box 21 and is connected to the dust collection box 21. The negative pressure adsorber 23 provides negative pressure suction for the dust removal channel 112, so that dust enters the dust removal channel 112 and the dust enters the dust collection box 21 through the connecting pipe 22.
[0034] Please refer to Figure 2 and Figure 3 As a specific implementation manner of the dust removal structure for the silicon wafer dicing machine provided by the present utility model, the negative pressure adsorption assembly 2 is further provided with an adsorption pipe 24. The adsorption pipe 24 is a conical structure with a smaller upper part and a larger lower part. The smaller opening end of the adsorption pipe 24 is connected to the dust removal channel 112. By means of the conical adsorption pipe 24, the adsorption range at the opening of the dust removal channel 112 can be increased, so as to adsorb dust more quickly.
[0035] Please refer to Figure 2 and Figure 4, as a specific implementation of the dust removal structure for the silicon wafer dicing machine provided by the present utility model, a filter assembly 5 is further provided in the dust collection box 21 for filtering dust; with the adsorption of the negative pressure adsorber 23, the dust entering the dust collection box 21 will enter the negative pressure adsorber 23 through the dust collection box 21. In order to keep the dust in the dust collection box 21, the filter assembly 5 is provided in the dust collection box 21. Through the filtration of the filter assembly 5, the dust stays in the dust collection box 21 when passing through the filter assembly 5.
[0036] Please refer to Figure 2 and Figure 4 , as a specific implementation of the dust removal structure for the silicon wafer dicing machine provided by the present utility model, a filter opening 212 is provided on one side of the dust collection box 21; the filter assembly 5 includes a support frame 51 and a filter net 52, and the support frame 51 has the freedom to enter and exit the dust collection box 21 through the filter opening 212; the filter net 52 is arranged on the support frame 51; after the filter assembly 5 is used for a long time, it is inevitable that a lot of dust will accumulate on the filter net 52. In order to prevent the filter net 52 from being blocked, the filter opening 212 is provided on the dust collection box 21, and the filter net 52 is made to enter and exit the dust collection box 21 by controlling the movement of the support frame 51, so as to facilitate the installation or disassembly of the filter assembly 5.
[0037] Please refer to Figure 4 , as a specific implementation of the dust removal structure for the silicon wafer dicing machine provided by the present utility model, a limit flange 53 is provided at one end of the support frame 51 away from the filter opening 212; with the help of the limit flange 53, it is easier for the staff to install or disassemble the filter assembly 5.
[0038] Please refer to Figure 2 , as a specific implementation of the dust removal structure for the silicon wafer dicing machine provided by the present utility model, a dust collection opening 213 and a closing plate 214 for opening or closing the dust collection opening 213 are provided on the dust collection box 21; after the dust removal structure is used for a long time, a lot of dust will accumulate in the dust collection box 21. In order to clean the dust collection box 21, the dust collection opening 213 is provided on the dust collection box 21 to facilitate the cleaning of the inside of the dust collection box 21; the closing plate 214 for opening or closing the dust collection opening 213 is provided to enable the normal use of the negative pressure adsorption assembly 2.
[0039] Please refer to Figure 1, as a specific implementation of the dust removal structure for a silicon wafer dicing machine provided by the present utility model, the horizontal movement assembly 3 includes a moving frame 31 and a driving member 32. The moving frame 31 is fixedly connected to the supporting member 11, and the moving frame 31 is slidably connected to the inner wall of the dicing machine 4; the driving member 32 is fixedly connected to the inner wall of the dicing machine 4, and the free end of the driving member 32 is drivingly connected to the moving frame 31; when the horizontal assembly controls the movement of the dust removal assembly 1, the driving member 32 controls the movement of the moving frame 31, the moving frame 31 drives the supporting member 11 to move, and further drives the dust removal assembly 1 to move; optionally, the driving member 32 is a cylinder.
[0040] Please refer to Figure 1 , another object of the present utility model is to provide a dicing machine 4, and the dicing machine 4 includes the dust removal structure for a silicon wafer dicing machine as described in any one of the above.
[0041] For the dicing machine 4 provided by the present utility model, since the dust removal structure is installed on the dicing machine 4, the dust on the workbench 41 is cleaned by means of the rotating brush 13, and the dust is sucked into the dust removal channel 112 by the negative pressure adsorption assembly 2 and the dust removal channel 112, thereby ensuring the cleanliness inside the dicing machine 4; at the same time, the position of the dust removal assembly 1 is controlled by means of the horizontal movement assembly 3 to ensure the normal operation of the dicing machine 4.
[0042] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present utility model shall be included in the protection scope of the present utility model.
Claims
1. A dust removal structure for a silicon wafer dicing machine, characterized in that: include: A dust removal assembly, for installation in a dicing machine and located above one side of a workbench; the dust removal assembly comprises a support member, a rotating member, a brush and a driver; the support member has the freedom to move horizontally toward or away from the workbench, a rotating groove is provided at one end of the support member close to the workbench, and a plurality of dust removal channels arranged along the circumference of the rotating groove are provided on the support member; the rotating member is arranged in the rotating groove and is rotatably connected to the rotating groove; the brush is arranged on the rotating member, and the brush cleans the workbench as the dust removal assembly moves; the driver is arranged on the support member, and the free end of the driver passes through the rotating groove and is transmission-connected to the rotating member; A negative pressure adsorption component is provided on the support member and connected to the plurality of dust removal channels for adsorbing dust; The horizontal moving component is arranged in the dicing machine and is transmission-connected with the supporting member, so as to drive the dust removal component to move.
2. A dust removal structure for a silicon wafer dicing machine as claimed in claim 1, characterized in that: A receiving groove is provided at one end of the rotating part close to the workbench, and the brush is arranged in the receiving groove and has the freedom to move up and down along the inner wall of the receiving groove; an elastic part is also provided in the receiving groove, and the two ends of the elastic part are respectively connected to the inner wall of the receiving groove and the brush.
3. A dust removal structure for a silicon wafer dicing machine as claimed in claim 1, characterized in that: The negative pressure adsorption component includes a dust collecting box, a plurality of connecting pipes and a negative pressure adsorber; the dust collecting box is arranged above the supporting member, and a plurality of adsorption holes corresponding to the dust removal channels are opened on the lower end surface of the dust collecting box; the plurality of connecting pipes correspond to the plurality of adsorption holes one by one, and the two ends of the connecting pipes are respectively connected with the adsorption holes and the dust removal channels; the negative pressure adsorber is arranged on the dust collecting box and connected to the dust collecting box.
4. A dust removal structure for a silicon wafer dicing machine as claimed in claim 3, characterized in that: The negative pressure adsorption component is also provided with an adsorption tube, which is a conical structure with a small top and a large bottom, and the end of the adsorption tube with a smaller opening is connected to the dust removal channel.
5. A dust removal structure for a silicon wafer dicing machine as claimed in claim 3, characterized in that: The dust collecting box is also provided with a filter assembly for filtering dust.
6. A dust removal structure for a silicon wafer dicing machine as claimed in claim 5, characterized in that: A filter port is provided on one side of the dust box; the filter assembly comprises a support frame and a filter net, the support frame has the freedom to pass through the filter port and enter and exit the dust box; the filter net is arranged on the support frame.
7. A dust removal structure for a silicon wafer dicing machine as claimed in claim 6, characterized in that: A limiting flange is provided at one end of the support frame away from the filter port.
8. A dust removal structure for a silicon wafer dicing machine as claimed in claim 3, characterized in that: The dust collecting box is provided with a dust collecting port and a closing plate used for opening or closing the dust collecting port.
9. A dust removal structure for a silicon wafer dicing machine as claimed in claim 1, characterized in that: The horizontal moving assembly includes a moving frame and a driving member, wherein the moving frame is fixedly connected to the supporting member, and the moving frame is slidably connected to the inner wall of the dicing machine; the driving member is fixedly connected to the inner wall of the dicing machine, and the free end of the driving member is transmission-connected to the moving frame.
10. A dicing machine, characterized in that: It comprises a dust removal structure for a silicon wafer dicing machine as described in any one of claims 1-9.