Laminating assembly, display module and display device
By using composite materials of graphene and carbon nanotubes as heat dissipation layers in the display module, the problem of insufficient heat dissipation performance in the prior art is solved, and more efficient heat conduction and dissipation is achieved, meeting the needs of higher-end display products.
Patent Information
- Application Number
- CN202422089763.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-27
- Publication Date
- 2025-07-01
- Estimated Expiration
- 2034-08-27
AI Technical Summary
The heat dissipation performance of the heat dissipation layer in the existing display modules cannot meet the needs of higher-end display products.
The composite material of graphene and carbon nanotubes is used as the heat dissipation layer, and the heat passing through the graphene sheet is transmitted more quickly through the carbon nanotubes, improving the heat dissipation performance.
It effectively improves the heat dissipation performance of the heat dissipation layer, ensures rapid conduction and dispersion of heat, and meets the needs of higher-end display products.
Smart Images

Figure CN223045318U_ABST
Abstract
Description
Technical Field
[0001] The embodiments of the present application relate to the field of display technologies, and more particularly, to an attaching component, a display module, and a display device. Background Art
[0002] As one of the essential components of a display product, a heat dissipation layer needs to be attached to a display panel to improve the heat dissipation performance of the display module.
[0003] However, with the development of display technologies, the application fields of display devices have become increasingly extensive, and people's requirements for various performance of display products have gradually increased. This makes the heat dissipation performance of the heat dissipation layer in the current display module unable to meet the needs of higher-end display products. Therefore, how to improve the heat dissipation performance of the heat dissipation layer in a display product has become an urgent problem to be solved in this field. Utility Model Content
[0004] The embodiments of the present application aim to provide an attaching component, a display module, and a display device, aiming to solve the problem of how to improve the heat dissipation performance of the heat dissipation layer in a display product.
[0005] In the first aspect of the embodiments of the present application, an attaching component is provided, and the attaching component includes:
[0006] At least one functional layer. When there are multiple functional layers, the multiple functional layers are stacked, and adjacent functional layers are configured to be in direct contact with each other;
[0007] Removable first and second protective films, the first protective film and the second protective film are disposed on opposite sides of the functional layer;
[0008] Wherein, the functional layer includes a heat dissipation layer, and the heat dissipation layer is a composite material of graphene and carbon nanotubes.
[0009] In an optional implementation manner, the functional layer further includes:
[0010] A metal layer, the metal layer is disposed between the heat dissipation layer and the first protective film;
[0011] A first bonding layer, the first bonding layer is disposed between the metal layer and the heat dissipation layer, and the first bonding layer is configured to achieve the fixed connection between the metal layer and the heat dissipation layer.
[0012] In an optional implementation manner, the functional layer further includes:
[0013] A buffer layer, the buffer layer is disposed between the heat dissipation layer and the second protective film;
[0014] A second adhesive layer, which is disposed between the buffer layer and the heat dissipation layer, and is configured to fixedly connect the buffer layer and the heat dissipation layer.
[0015] In an alternative embodiment, the functional layer further includes:
[0016] A reticulated adhesive layer, which is disposed between the buffer layer and the second protective film.
[0017] In an alternative embodiment, the first protective film and the second protective film have the same area, and the orthographic projection area of the functional layer on the first protective film is smaller than the area of the first protective film.
[0018] The second aspect of the embodiments of the present application provides a display module, which includes:
[0019] A display panel, and
[0020] The lamination assembly according to any one of the first aspects of the embodiments of the present application.
[0021] In an alternative embodiment, the display panel is an OLED display panel, and the functional layer includes:
[0022] A heat dissipation layer, which is a composite material of graphene and carbon nanotubes;
[0023] A metal layer, which is disposed between the heat dissipation layer and the first protective film;
[0024] A first adhesive layer, which is disposed between the metal layer and the heat dissipation layer, and is configured to fixedly connect the metal layer and the heat dissipation layer;
[0025] A buffer layer, which is disposed between the heat dissipation layer and the display panel;
[0026] A second adhesive layer, which is disposed between the buffer layer and the heat dissipation layer, and is configured to fixedly connect the buffer layer and the heat dissipation layer.
[0027] A reticulated adhesive layer, which is disposed between the buffer layer and the display panel.
[0028] In an alternative embodiment, the display panel is an LCD display panel, and the functional layer includes:
[0029] A heat dissipation layer, which is a composite material of graphene and carbon nanotubes.
[0030] In an alternative embodiment, the bonding component is configured to be bonded to the backlight side of the display panel after removing the second protective film.
[0031] A third aspect of the embodiments of the present application provides a display device, which includes the display module as described in any one of the second aspects of the embodiments of the present application.
[0032] Beneficial effects:
[0033] The embodiments of the present application provide a bonding component, a display module, and a display device. The bonding component includes: at least one functional layer. When there are multiple functional layers, the multiple functional layers are stacked, and adjacent functional layers are configured to be in direct contact with each other; a removable first protective film and a second protective film, where the first protective film and the second protective film are disposed on opposite sides of the functional layer; wherein, the functional layer includes a heat dissipation layer, and the heat dissipation layer is a composite material of graphene and carbon nanotubes. By setting the material of the heat dissipation layer as a composite material of graphene and carbon nanotubes in the embodiments of the present application, after the heat dissipation layer absorbs heat, the heat of the graphene sheet can be transferred to another graphene sheet more quickly through the carbon nanotubes, thereby effectively improving the heat dissipation performance of the heat dissipation layer.
[0034] The above description is only an overview of the technical solution of the present application. In order to be able to understand the technical means of the present application more clearly, it can be implemented according to the content of the description. And in order to make the above and other purposes, features, and advantages of the present application more obvious and understandable, the following specifically describes the specific embodiments of the present application. Description of the Drawings
[0035] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the description of the embodiments of the present application will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0036] Figure 1 It is a schematic diagram of the hierarchical structure of a bonding component proposed in an embodiment of the present application;
[0037] Figure 2 It is a schematic diagram of the hierarchical structure of another bonding component proposed in an embodiment of the present application;
[0038] Figure 3 It is a schematic diagram of a composite material of graphene and carbon nanotubes proposed in an embodiment of the present application;
[0039] Figure 4 It is a schematic diagram of the hierarchical structure of a display module with an OLED display panel proposed in an embodiment of the present application;
[0040] Figure 5 It is a schematic diagram of the hierarchical structure of a display module with an LCD display panel proposed in an embodiment of the present application;
[0041] Figure 6 It is a process flow chart for preparing a composite material of graphene and carbon nanotubes proposed in an embodiment of the present application.
[0042] Explanation of reference numerals: 11, bonding assembly; 111, first protective film; 112, second protective film; 113, heat dissipation layer; 1131, graphene; 1132, carbon nanotube; 114, metal layer; 115, first adhesive layer; 116, second adhesive layer; 117, buffer layer; 118, reticulated adhesive layer; 21, display panel. Detailed implementation manners
[0043] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.
[0044] It should be understood that when a layer or element is referred to as being on another layer or substrate, it may be directly on the other layer or substrate, or there may be an intermediate layer between the layer or element and the other layer or substrate.
[0045] As one of the essential important components of a display product, the heat dissipation layer needs to be attached to the display panel to improve the heat dissipation performance of the display module.
[0046] However, with the development of display technology, the application fields of display devices are becoming more and more extensive, and people's requirements for various performances of display products are gradually increasing. This makes the heat dissipation performance of the heat dissipation layer in the current display module unable to meet the needs of higher-end display products. Therefore, how to improve the heat dissipation performance of the heat dissipation layer in a display product has become an urgent problem to be solved in the art.
[0047] In view of this, an embodiment of the present application proposes a bonding assembly, and the bonding assembly bonds to the display panel of the display module for functions such as heat dissipation and protection of the display module. Figure 1 Shows a schematic diagram of the hierarchical structure of a bonding assembly proposed in an embodiment of the present application, as Figure 1 shown, the bonding assembly 11 includes: at least one functional layer; removable first protective film 111 and second protective film 112, and the first protective film 111 and the second protective film 112 are disposed on opposite sides of the functional layer.
[0048] In the embodiments of the present application, the first protective film 111 and the second protective film 112 are used to protect the functional layer from physical damage (such as scratches, abrasions or impacts, etc.) and effectively prevent dust contamination and electromagnetic wave shielding when the bonding component 11 is not bonded to the display panel, so as to maintain the cleanliness and stability of each functional layer in the bonding component 11. Among them, since the bonding component 11 needs to be bonded to the display panel, the bonding surface of the bonding component 11 needs to be fixedly connected to the display panel through the functional layer. In the embodiments of the present application, the first protective film 111 and the second protective film 112 are configured as removable film layers on the bonding component 11. During the bonding process, by removing the protective film on one side, it is ensured that the bonding surface of the functional layer and the display panel are successfully fixedly connected.
[0049] In addition, in the embodiments of the present application, by providing the removable first protective film 111 and the second protective film 112, the occurrence of defects such as degumming, residual glue, bubbles, fogging, and dirt can be reduced during the bonding process, ensuring that the bonding effect reaches the best state, which helps to improve the overall quality and user experience of the display product.
[0050] In some alternative embodiments, in order to ensure the protective effect of the first protective film 111 and the second protective film 112 on the functional layer, the areas of the first protective film 111 and the second protective film 112 are the same, and the orthographic projection area of the functional layer on the first protective film 111 is smaller than the area of the first protective film 111.
[0051] In the embodiments of the present application, the functional layer can be one (as Figure 1 shown). When the functional layer is one, the functional layer includes a heat dissipation layer 113. When the functional layer is multiple, the functional layer at least includes the heat dissipation layer 113. The heat dissipation layer 113 is configured to improve the heat dissipation efficiency of the display module, reduce the temperature of the display module, and prevent the electronic components in the display module from having reduced lifespan and performance due to excessive temperature.
[0052] In the embodiments of the present application, Figure 3 shows a schematic diagram of a composite material of graphene and carbon nanotubes proposed in an embodiment of the present application, as Figure 3As shown, the material of the heat dissipation layer 113 is a composite material of graphene 1131 and carbon nanotubes 1132. Specifically, the thermal conductivity of single-layer graphene is as high as 5300 W / (m·K), which is one of the materials with the best thermal conductivity among currently known materials. Its high thermal conductivity mainly benefits from its unique two-dimensional structure and perfect lattice arrangement, enabling heat to be quickly conducted within the plane. Carbon nanotubes also have excellent thermal conductivity. Especially for single-walled carbon nanotubes, their thermal conductivity at room temperature can reach 6000 W / m·K, and that of multi-walled carbon nanotubes can also reach about 3000 W / m·K. The one-dimensional structure of carbon nanotubes gives them extremely high thermal conductivity in the axial direction. When graphene and carbon nanotubes combine to form a composite material, the two can cooperate with each other. The heat absorbed by graphene 1131 can be transmitted more quickly to another graphene 1131 in the heat dissipation layer 113 through carbon nanotubes 1132, thereby ensuring that heat is quickly conducted from the inside of the heat dissipation layer 113 to the surface and then dissipated through the thermal radiation of graphene 1131, further improving the overall thermal conductivity of the heat dissipation layer 113. Compared with the thermal conductivity of pure graphene, the heat dissipation layer 113 made of the composite material of graphene 1131 and carbon nanotubes 1132 can increase the thermal conductivity by 2.5 times.
[0053] In addition, when the composite material of graphene 1131 and carbon nanotubes 1132 is used as the heat dissipation layer 113, it can also greatly improve the electrical conductivity of the heat dissipation layer 113.
[0054] In some optional embodiments, Figure 6 shows a preparation flow chart of a composite material of graphene and carbon nanotubes proposed in an embodiment of the present application. As Figure 6 shown, the composite material of graphene and carbon nanotubes can be prepared as follows: Obtain a graphene solution and a carbon nanotube solution, and the concentrations of both the graphene solution and the carbon nanotube solution are 2 mg / ml; ultrasonically mix the graphene solution and the carbon nanotube solution in a mass ratio of 2:1 to obtain a mixed solution; place the mixed solution in a reaction kettle and carry out a hydrothermal reaction in a high-temperature furnace to obtain a hydrogel. Among them, the reaction conditions for the hydrothermal reaction are a temperature of 180 °C and a time of 12 h; take out the hydrogel formed by the high-temperature hydrothermal reaction and place it in a freeze dryer for freezing for 12 h, then the dryer is evacuated for drying. After taking it out, place the aerogel in a hot press for hot pressing treatment, with a pressure of 70 MPa, a temperature of 70 °C, and a time of 6 h. After the aerogel is hot-pressed into an aerogel film, take it out and place it in a tube furnace for annealing treatment at 1000 K to obtain the composite material of graphene and carbon nanotubes.
[0055] In the embodiment of the present application, the bonding component 11 provided is an integrated component. When there are multiple functional layers, the multiple functional layers are stacked, and adjacent functional layers are configured to be in direct contact with each other. Specifically, during the manufacturing process, the bonding component 11 directly pre-assembles multiple functional layers to form an integrated structure. Therefore, when forming each functional layer, there is no need to provide additional protective films formed on the opposite sides of the surface of each functional layer. Only after all functional layers are formed, the first protective film 111 and the second protective film 112 are provided on the opposite sides of the functional layer, thus avoiding the process of setting additional protective films on the opposite sides of each functional layer due to split assembly, significantly reducing the production steps and the number of protective films, simplifying the production process, thereby improving production efficiency and reducing production and material transportation costs.
[0056] In some alternative embodiments, Figure 2 shows a schematic diagram of the hierarchical structure of another bonding component proposed in an embodiment of the present application, as Figure 2 shown, the functional layer further includes a metal layer 114, and the metal layer 114 is disposed between the heat dissipation layer 113 and the first protective film 111. Optionally, the material of the metal layer 114 is copper foil. The metal layer 114 is used to provide mechanical support and stability for the display panel to ensure the structural performance of the display panel. At the same time, it is used to quickly conduct the heat generated during the light-emitting process of the display panel to the heat dissipation layer 113, improving the durability and performance of the display panel; in addition, the metal layer 114 is also used for electromagnetic shielding, and effectively absorbs electromagnetic waves through the metal layer 114, thereby achieving the effect of shielding interference, and further ensuring the normal operation of the display product. The electromagnetic shielding includes two types: electrical signal shielding and magnetic signal shielding. Exemplarily, when the material of the metal layer 114 is copper foil, the electrical signal shielding mainly relies on the excellent electrical conductivity of copper itself, while the magnetic shielding requires the conductive substance "nickel" on the adhesive surface of the copper foil tape to achieve the magnetic shielding effect. Among them, the purity of the copper foil is higher than 99.95%, and its function is to eliminate electromagnetic interference (EMI), isolate the harm of electromagnetic waves to the human body, and avoid affecting the function due to unnecessary voltage and current.
[0057] In some alternative embodiments, the functional layer further includes a first bonding layer 115, and the first bonding layer 115 is disposed between the metal layer 114 and the heat dissipation layer 113. The first bonding layer 115 is configured to achieve the fixed connection between the metal layer 114 and the heat dissipation layer 113. Optionally, the material of the first bonding layer 115 is double-sided tape.
[0058] In some alternative embodiments, the functional layer further includes a buffer layer 117 disposed between the heat dissipation layer 113 and the second protective film 112. The buffer layer 117 has a certain deformation ability and hardness, and is used to disperse the adverse effects on the display panel caused by stress through the deformation ability when the display module is affected by external stress due to foreign objects or the external environment, and at the same time plays a certain supporting and protecting role. Optionally, the material of the buffer layer 117 is foam.
[0059] In some alternative embodiments, the functional layer further includes a second adhesive layer 116 disposed between the buffer layer 117 and the heat dissipation layer 113. The second adhesive layer 116 is configured to achieve the fixed connection between the buffer layer 117 and the heat dissipation layer 113. Optionally, the material of the second adhesive layer 116 is double-sided tape.
[0060] In some alternative embodiments, the functional layer further includes a reticulated adhesive layer 118 disposed between the buffer layer 117 and the second protective film 112. The reticulated adhesive layer 118 is configured to achieve the fixed connection between the buffer layer 117 and the second protective film 112.
[0061] Exemplarily, such as Figure 2As shown, the bonding assembly 11 includes a plurality of functional layers, and the plurality of functional layers include: a heat dissipation layer 113, which is a composite material of graphene and carbon nanotubes; a metal layer 114, which is disposed between the heat dissipation layer 113 and the first protective film 111; a first bonding layer 115, which is disposed between the metal layer 114 and the heat dissipation layer 113; a buffer layer 117, which is disposed between the heat dissipation layer 113 and the second protective film 112; a second bonding layer 116, which is disposed between the buffer layer 117 and the heat dissipation layer 113; and a reticulated adhesive layer 118, which is disposed between the buffer layer 117 and the second protective film 112. In the embodiment of the present application, by providing an integrated bonding assembly 11, adjacent functional layers are configured to be in direct contact with each other, and no protective film needs to be provided between adjacent functional layers. Compared with separately disposing each functional layer, in the integrated bonding assembly 11 provided in the embodiment of the present application, only the first protective film 111 disposed on the side of the metal layer 114 away from the heat dissipation layer 113 and the second protective film 112 disposed on the side of the reticulated adhesive layer 118 away from the heat dissipation layer 113 need to be retained, and the protective film on the side of the metal layer 114 close to the heat dissipation layer 113, the protective film on the side of the reticulated adhesive layer 118 close to the heat dissipation layer 113, the protective films on the opposite sides of the buffer layer 117, and the protective films on the opposite sides of the heat dissipation layer are omitted, reducing a total of 6 layers of protective film formation, significantly reducing the production steps and the number of protective films, simplifying the production process, thereby improving the production efficiency and reducing the production and material transportation costs.
[0062] The embodiment of the present application provides a bonding assembly, a display module, and a display device. The bonding assembly includes: at least one functional layer. When there are a plurality of functional layers, the plurality of functional layers are stacked, and adjacent functional layers are configured to be in direct contact with each other; a removable first protective film and a second protective film, which are disposed on opposite sides of the functional layer; wherein, the functional layer includes a heat dissipation layer, and the heat dissipation layer is a composite material of graphene and carbon nanotubes. In the embodiment of the present application, by setting the material of the heat dissipation layer as a composite material of graphene and carbon nanotubes, after the heat dissipation layer absorbs heat, the heat of the graphene sheet can be transmitted to another graphene sheet more quickly through the carbon nanotubes, thereby effectively improving the heat dissipation performance of the heat dissipation layer.
[0063] Based on the same inventive concept, the embodiment of the present application discloses a display module, which includes a display panel and the bonding assembly as described in the embodiment of the present application.
[0064] In the embodiments of the present application, the display panel may be a liquid crystal (Liquid Crystal Display, abbreviated as LCD) display panel, or may be an organic light emitting diode (Organic Light Emitting Diode, abbreviated as OLED) display panel, a quantum dot light emitting diode (Quantum Dot Light Emitting Diode, abbreviated as QLED) display panel, etc. The embodiments of the present application do not make specific limitations here. It should be noted that the display panel includes a light-emitting side and a backlight side. In the embodiments of the present disclosure, the light-emitting side mentioned refers to the side where the light of the display panel emits and faces the user, and the backlight side of the display panel refers to the other side opposite to the light-emitting side of the display panel.
[0065] In some alternative embodiments, Figure 4 shows a schematic diagram of the hierarchical structure of a display module with an OLED display panel proposed in an embodiment of the present application, as Figure 4 shown, the bonding component 11 is configured to be bonded and disposed on the backlight side of the display panel 21 after removing the second protective film 112, so that the functional layer of the bonding component 11 and the first protective film 111 are both disposed on the backlight side of the display panel 21, and the first protective film 111 is disposed on the side of the functional layer away from the display panel 21.
[0066] In some alternative embodiments, as Figure 4 shown, the display panel 21 is an OLED display panel, and the functional layer includes: a heat dissipation layer 113, which is a composite material of graphene and carbon nanotubes; a metal layer 114, which is disposed between the heat dissipation layer 113 and the first protective film 111; a first bonding layer 115, which is disposed between the metal layer 114 and the heat dissipation layer 113, and the first bonding layer 115 is configured to realize the fixed connection between the metal layer 114 and the heat dissipation layer 113; a buffer layer 117, which is disposed between the heat dissipation layer 113 and the display panel 21; a second bonding layer 116, which is disposed between the buffer layer 117 and the heat dissipation layer 113, and the second bonding layer 116 is configured to realize the fixed connection between the buffer layer 117 and the heat dissipation layer 113; a reticulated adhesive layer 118, which is disposed between the buffer layer 117 and the display panel 21.
[0067] In some alternative embodiments, Figure 5 shows a schematic diagram of the hierarchical structure of a display module with an LCD display panel proposed in an embodiment of the present application, as Figure 5As shown, the display panel 21 is an LCD display panel. The functional layer includes a heat dissipation layer 113, and the heat dissipation layer 113 is disposed between the display panel 21 and the first protective film 111. The heat dissipation layer 113 is a composite material of graphene and carbon nanotubes.
[0068] Based on the same inventive concept, an embodiment of the present application discloses a display device, and the display device includes the display module described in the embodiment of the present application.
[0069] In some alternative embodiments, the display device includes, but is not limited to, any product or component having a touch display function such as a television, a laptop computer, a tablet computer, a mobile phone, a personal digital assistant (PDA), a navigator, a wearable device, a virtual reality (VR) device, etc. Those skilled in the art can make corresponding selections according to the actual use of the display device, and the present application will not elaborate herein.
[0070] It should be noted that, in addition to the display panel, the display device further includes other necessary components and compositions. Taking a display as an example, the display device may further include a housing, a circuit board, a power cord, etc. Those skilled in the art can make corresponding supplements according to the specific usage requirements of the display device, and the present application will not elaborate herein.
[0071] Each embodiment in this specification is described in a progressive manner. The key point of each embodiment is the difference from other embodiments. The same or similar parts among the embodiments can be referred to each other.
[0072] In the description of this specification, it should be understood that the orientation or positional relationship indicated by terms such as "center", "thickness", "upper", "lower", "front", "rear", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.
[0073] In this application, unless otherwise clearly defined or limited, terms such as "install", "connect", "link", "fix", etc. shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection, an electrical connection, or a communication connection; it can be directly connected, or indirectly connected through an intermediate medium, and can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0074] In this application, unless otherwise clearly defined or limited, the first feature being "on" or "under" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features between them. Moreover, the first feature being "above", "over" and "on top of" the second feature includes that the first feature is directly above and obliquely above the second feature, or simply means that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "underneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or simply means that the horizontal height of the first feature is lower than that of the second feature.
[0075] The above application provides many different embodiments or examples to implement different structures of this application. To simplify this application, the components and settings of specific examples are described above. Of course, they are only examples and are not intended to limit this application. In addition, this application may repeat reference numerals and / or reference letters in different examples. Such repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between various embodiments and / or settings discussed.
[0076] As used herein, the terms "one embodiment", "an embodiment" or "one or more embodiments" mean that the specific features, structures or characteristics described in connection with the embodiments are included in at least one embodiment of this application. In addition, please note that the examples of the phrase "in one embodiment" here do not necessarily all refer to the same embodiment.
[0077] In the specification provided herein, a large number of specific details are set forth. However, it can be understood that the embodiments of this application can be practiced without these specific details. In some instances, well-known methods, structures and technologies are not shown in detail so as not to obscure the understanding of this specification.
[0078] Finally, it should also be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, such that a process, method, article or terminal device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or terminal device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or terminal device comprising said element.
[0079] The above provides a detailed introduction to a fitting component, a display module, and a display device provided by the present application. Specific examples are used in this text to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the method and its core idea of the present application; at the same time, for those of ordinary skill in the art, according to the idea of the present application, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present application.
Claims
1. A bonding component, characterized in that: The fitting assembly comprises: at least one functional layer, in the case where there are multiple functional layers, the multiple functional layers are stacked and adjacent functional layers are configured to be in direct contact with each other; A removable first protective film and a second protective film, wherein the first protective film and the second protective film are arranged on opposite sides of the functional layer; Wherein, the functional layer comprises a heat dissipation layer, and the heat dissipation layer is a composite material of graphene and carbon nanotubes.
2. The fitting assembly according to claim 1, characterized in that: The functional layer also includes: a metal layer, the metal layer being disposed between the heat dissipation layer and the first protective film; A first bonding layer is disposed between the metal layer and the heat dissipation layer, and the first bonding layer is configured to achieve a fixed connection between the metal layer and the heat dissipation layer.
3. The fitting assembly according to claim 1 or 2, characterized in that: The functional layer also includes: a buffer layer, the buffer layer being arranged between the heat dissipation layer and the second protective film; A second adhesive layer is disposed between the buffer layer and the heat dissipation layer, and the second adhesive layer is configured to achieve a fixed connection between the buffer layer and the heat dissipation layer.
4. The fitting assembly according to claim 3, characterized in that: The functional layer also includes: A textured adhesive layer, wherein the textured adhesive layer is disposed between the buffer layer and the second protective film.
5. The fitting assembly according to claim 1, characterized in that: The first protective film and the second protective film have the same area, and the orthographic projection area of the functional layer on the first protective film is smaller than the area of the first protective film.
6. A display module, characterized in that: The display module comprises: display panel, and A fitting assembly as claimed in any one of claims 1 to 5.
7. The display module according to claim 6, characterized in that: The display panel is an OLED display panel, and the functional layer includes: A heat dissipation layer, wherein the heat dissipation layer is a composite material of graphene and carbon nanotubes; a metal layer, the metal layer being disposed between the heat dissipation layer and the first protective film; a first bonding layer, the first bonding layer being disposed between the metal layer and the heat dissipation layer, the first bonding layer being configured to achieve a fixed connection between the metal layer and the heat dissipation layer; a buffer layer, the buffer layer being disposed between the heat dissipation layer and the display panel; a second adhesive layer, the second adhesive layer being disposed between the buffer layer and the heat dissipation layer, the second adhesive layer being configured to achieve a fixed connection between the buffer layer and the heat dissipation layer; A textured adhesive layer is disposed between the buffer layer and the display panel.
8. The display module according to claim 6, characterized in that: The display panel is an LCD display panel, and the functional layer includes: The heat dissipation layer is a composite material of graphene and carbon nanotubes.
9. The display module according to claim 7 or 8, characterized in that: The laminating assembly is configured to be laminated on the backlight side of the display panel after the second protective film is removed.
10. A display device, characterized in that: The display device comprises the display module as described in any one of claims 6 to 9.