Membrane overlying mechanism

Abstract

The utility model provides a diaphragm overlying mechanism which comprises a rack, and a material taking position, an overlying position and a discharging position are arranged on the rack. The upper die overlying assembly is movably mounted on the rack, and an upper suction seat is mounted on the upper die overlying assembly; the upper die power assembly is mounted on the rack and connected with the upper die overlying assembly; the lower die overlying assembly is mounted at the overlying position; and the lower die power assembly is mounted on the rack and is connected with the lower die overlying assembly. The upper die power assembly can drive the upper die overlying assembly to reciprocate among a material taking position, an overlying position and a material discharging position. Diaphragms can be adsorbed at the material taking position through the upper material suction seat; the upper material suction seat with the adsorbed membranes is transferred to an overlying position, and the lower die power assembly drives the lower die overlying assembly to be close to the upper die overlying assembly, so that overlying treatment of the membranes is achieved; and the laminated product can be discharged from the discharging position. In this way, traditional material moving equipment and traditional discharging equipment can be omitted, feeding and discharging operation of the membranes can be achieved, the structure of the laminating machine is simplified, and cost is reduced.

Description

Technical Field

[0001] This application belongs to the technical field of diaphragm laminating, and more specifically, relates to a diaphragm laminating mechanism. Background Art

[0002] During the process of laminating diaphragms by a laminator, generally, a transfer device is used to place the diaphragms on the lower die laminating device, and by controlling the upper die laminating device to approach the lower die laminating device, the upper die laminating device and the lower die laminating device cooperate to press multiple diaphragms into shape, and the laminated product is removed by a blanking device.

[0003] However, since it is necessary to implement the feeding operation of the diaphragms through a transfer device and the blanking operation of the laminated product through a blanking device, that is, it is necessary to separately and independently set up a transfer device and a blanking device to complete the diaphragm laminating operation, resulting in a complex structure and high cost of the laminator. Utility Model Content

[0004] The purpose of the embodiments of this application is to provide a diaphragm laminating mechanism to solve the problems existing in the related art: separately and independently setting up a transfer device and a blanking device to complete the diaphragm laminating operation, resulting in a complex structure and high cost of the laminator.

[0005] To achieve the above purpose, the technical solution adopted in the embodiments of this application is:

[0006] Provide a diaphragm laminating mechanism, including:

[0007] A frame, on which a material taking position, a laminating position, and a blanking position are successively arranged;

[0008] An upper die laminating assembly, movably installed on the frame, and an upper suction seat for adsorbing diaphragms is installed on the upper die laminating assembly;

[0009] An upper die power assembly, installed on the frame and connected to the upper die laminating assembly, for driving the upper die laminating assembly to reciprocate through the material taking position, the laminating position, and the blanking position;

[0010] A lower die laminating assembly, installed at the laminating position;

[0011] A lower die power assembly, installed on the frame and connected to the lower die laminating assembly, for driving the lower die laminating assembly to approach or move away from the upper die laminating assembly.

[0012] In one embodiment, the upper die laminating assembly includes an upper support plate movably mounted on the frame and connected to the upper die power assembly; the upper material suction seat includes an upper heating seat mounted on the upper support plate and an upper adsorption seat mounted on the upper heating seat. The upper heating seat is provided with a first adsorption hole and an upper suction nozzle communicated with the first adsorption hole, and the upper adsorption seat is provided with a second adsorption hole communicated with the first adsorption hole; the upper heating seat is arranged between the upper support plate and the upper adsorption seat.

[0013] In one embodiment, the upper die laminating assembly further includes an upper heating element mounted on the upper heating seat, a lower cooling seat mounted on the upper support plate, and a lower heat insulation seat mounted on the lower cooling seat; the lower cooling seat, the lower heat insulation seat, and the upper heating seat are sequentially arranged from the upper support plate towards the upper adsorption seat.

[0014] In one embodiment, the lower die laminating assembly includes a lower support plate connected to the lower die power assembly and a lower material suction seat for adsorbing the diaphragm, and the lower material suction seat is mounted on the lower support plate.

[0015] In one embodiment, the lower material suction seat includes a lower heating seat mounted on the lower support plate and a lower adsorption seat mounted on the lower heating seat. The lower heating seat is provided with a first negative pressure hole and a lower suction nozzle communicated with the first negative pressure hole; the lower adsorption seat is provided with a second negative pressure hole communicated with the first negative pressure hole; the lower heating seat is arranged between the lower support plate and the lower adsorption seat.

[0016] In one embodiment, the lower die laminating assembly further includes a lower heating element mounted on the lower heating seat, a lower cooling seat mounted on the lower support plate, and a lower heat insulation seat mounted on the lower cooling seat; the lower cooling seat, the lower heat insulation seat, and the lower heating seat are sequentially arranged from the lower support plate towards the lower adsorption seat.

[0017] In one embodiment, the diaphragm laminating mechanism further includes a first cleaning assembly for cleaning the top surface of the lower die laminating assembly, and the first cleaning assembly is mounted on the upper die laminating assembly.

[0018] In one embodiment, the first cleaning assembly includes a first cleaning base, a first upper sticky roller rotatably mounted on the first cleaning base, a second upper sticky roller rotatably mounted on the first cleaning base, and a first cleaning lifting member for driving the first cleaning base to lift and lower; the first upper sticky roller is disposed below the second upper sticky roller, the outer peripheral surface of the first upper sticky roller is adhered to the outer peripheral surface of the second upper sticky roller, and the stickiness of the first upper sticky roller is less than the stickiness of the second upper sticky roller; the first cleaning lifting member is mounted on the upper die laminating assembly and connected to the first cleaning base.

[0019] In one embodiment, the diaphragm laminating mechanism further includes a second cleaning assembly for cleaning the bottom surface of the upper die laminating assembly, and the second cleaning assembly is mounted on the frame.

[0020] In one embodiment, the second cleaning assembly includes a second cleaning base, a first lower sticky roller rotatably mounted on the second cleaning base, a second lower sticky roller rotatably mounted on the second cleaning base, and a second cleaning lifting member for driving the second cleaning base to lift and lower; the first lower sticky roller is disposed above the second lower sticky roller, the outer peripheral surface of the first lower sticky roller is adhered to the outer peripheral surface of the second lower sticky roller, and the stickiness of the first lower sticky roller is less than the stickiness of the second lower sticky roller; the second cleaning lifting member is mounted on the frame and connected to the second cleaning base.

[0021] The diaphragm laminating mechanism provided by the embodiments of the present application has at least the following beneficial effects: In the present application, the upper die power assembly can drive the upper die laminating assembly to reciprocate between the material taking position, the laminating position, and the blanking position; the upper suction seat can adsorb the diaphragm at the material taking position; the upper suction seat adsorbed with the diaphragm is transferred to the laminating position, and the lower die power assembly drives the lower die laminating assembly to approach the upper die laminating assembly to realize the laminating process of the diaphragm; the product after laminating can be blanked at the blanking position. In this way, the laminator can cancel the traditional material transfer equipment and blanking equipment to separately realize the feeding and blanking operations of the diaphragm, thereby simplifying the structure of the laminator and reducing costs. Description of the Drawings

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments or exemplary technical descriptions. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0023] Figure 1 It is a schematic structural diagram of the diaphragm laminating mechanism provided by the embodiments of the present application;

[0024] Figure 2 Schematic diagram of the connection structure between the upper die stacking component and the upper suction seat provided by the embodiment of the present application;

[0025] Figure 3 For Figure 2 Partial exploded view;

[0026] Figure 4 Schematic diagram of the structure of the lower die stacking component provided by the embodiment of the present application;

[0027] Figure 5 For Figure 4 Partial exploded view;

[0028] Figure 6 Schematic diagram of the structure of the first cleaning component provided by the embodiment of the present application;

[0029] Figure 7 Schematic diagram of the structure of the second cleaning component provided by the embodiment of the present application.

[0030] Among them, the main reference signs in each drawing are as follows:

[0031] 1, frame; 11, upper die power component; 12, lower die power component; 13, positioning guide post;

[0032] 2, upper die stacking component; 21, upper support plate; 22, upper heating element; 23, upper cooling seat; 24, upper heat insulation seat;

[0033] 3, upper suction seat; 31, upper heating seat; 311, first adsorption hole; 312, upper suction nozzle; 32, upper adsorption seat;

[0034] 4, lower die stacking component; 41, lower support plate; 411, positioning guide sleeve; 42, lower suction seat; 421, lower heating seat; 4211, first negative pressure hole; 4212, lower suction nozzle; 422, lower adsorption seat; 4221, second negative pressure hole; 43, lower heating element; 44, lower cooling seat; 45, lower heat insulation seat;

[0035] 5, first cleaning component; 51, first cleaning seat; 52, first upper sticky roller; 53, second upper sticky roller; 54, first cleaning lifting member;

[0036] 6, second cleaning component; 61, second cleaning seat; 62, first lower sticky roller; 63, second lower sticky roller; 64, second cleaning lifting member. Detailed implementation manners

[0037] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer and more understandable, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0038] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0039] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality of" means two or more unless otherwise specifically defined. The meaning of "several" is one or more unless otherwise specifically defined.

[0040] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the present application.

[0041] In the description of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "mounted", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0042] Reference to "one embodiment" or "an embodiment" throughout the specification means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, the phrases "in one embodiment" or "in some embodiments" appearing in various places throughout the specification do not necessarily all refer to the same embodiment. In addition, in one or more embodiments, the particular features, structures, or characteristics may be combined in any suitable manner.

[0043] For the sake of convenience in description, three coordinate axes that are perpendicular to each other in space are defined as the X-axis, the Y-axis, and the Z-axis respectively. At the same time, the direction along the X-axis is the longitudinal direction, the direction along the Y-axis is the transverse direction, and the direction along the Z-axis is the vertical direction; among them, the X-axis and the Y-axis are two coordinate axes perpendicular to each other on the same horizontal plane, and the Z-axis is the coordinate axis in the vertical direction; the X-axis, the Y-axis, and the Z-axis are located in space and there are three mutually perpendicular planes, namely the XY plane, the YZ plane, and the XZ plane. Among them, the XY plane is the horizontal plane, and both the XZ plane and the YZ plane are vertical planes, and the XZ plane is perpendicular to the YZ plane. The three axes in space are the X-axis, the Y-axis, and the Z-axis. Moving along the three axes in space means moving along the three mutually perpendicular axes in space, specifically moving along the X-axis, the Y-axis, and the Z-axis in space; while the planar movement is moving in the XY plane.

[0044] Please refer to Figure 1 and Figure 2, the diaphragm laminating mechanism provided by the embodiment of the present application will be described. The diaphragm laminating mechanism includes a frame 1, an upper die laminating assembly 2, an upper die power assembly 11, a lower die laminating assembly 4, and a lower die power assembly 12. A material taking position, a laminating position, and a material discharging position are sequentially provided on the frame 1. The upper die laminating assembly 2 is movably installed on the frame 1, and an upper material suction seat 3 is installed on the upper die laminating assembly 2. The upper die laminating assembly 2 can be movably installed on the frame 1 through a guide rail pair, and the upper material suction seat 3 can adsorb the diaphragm. The upper die power assembly 11 is installed on the frame 1, and the upper die power assembly 11 is connected to the upper die laminating assembly 2. Among them, the upper die power assembly 11 can be a cylinder transmission mechanism, a lead screw transmission mechanism, a slide table linear mechanism, etc., and there is no unique limitation here. In the embodiment of the present application, the upper die power assembly 11 can be a lead screw transmission mechanism. The upper die power assembly 11 can drive the upper die laminating assembly 2 to reciprocate through the material taking position, the laminating position, and the material discharging position on the frame 1, specifically driving the upper die laminating assembly 2 to reciprocate along the X-axis direction. The lower die laminating assembly 4 is installed at the laminating position, and the lower die laminating assembly 4 can cooperate with the upper die laminating assembly 2 to perform laminating and forming on the diaphragm. The lower die power assembly 12 is installed on the frame 1, and the lower die power assembly 12 is connected to the lower die laminating assembly 4. The lower die power assembly 12 can drive the lower die laminating assembly 4 to approach or move away from the upper die laminating assembly 2. The lower die laminating assembly 4 can be arranged below the upper die laminating assembly 2, that is, the lower die power assembly 12 can drive the lower die laminating assembly 4 to move up and down along the Z-axis direction. Among them, the lower die laminating assembly 4 can be a cylinder, an electric cylinder, etc., and there is no unique limitation here. With this structure, the upper die power assembly 11 can drive the upper die laminating assembly 2 to reciprocate through the material taking position, the laminating position, and the material discharging position; the upper material suction seat 3 can adsorb the diaphragm at the material taking position; the upper material suction seat 3 adsorbed with the diaphragm is transferred to the laminating position, and the lower die power assembly 12 drives the lower die laminating assembly 4 to approach the upper die laminating assembly 2 to perform laminating treatment on the diaphragm; the product after laminating can be discharged through the material discharging position. In this way, the laminator can cancel the traditional material transfer equipment and material discharging equipment to separately perform the feeding and discharging operations of the diaphragm, thereby simplifying the structure of the laminator and reducing costs.

[0045] In one embodiment, please refer to Figure 2 and Figure 3, as a specific implementation of the diaphragm laminating mechanism provided in the embodiments of the present application, the upper die laminating assembly 2 includes an upper support plate 21 movably installed on the frame 1 and connected to the upper die power assembly 11; the upper suction seat 3 includes an upper heating seat 31 installed on the upper support plate 21 and an upper adsorption seat 32 installed on the upper heating seat 31. A first adsorption hole 311 is formed on the upper heating seat 31, and an upper suction nozzle 312 communicated with the first adsorption hole 311 is installed. A second adsorption hole (not shown in the figure) communicated with the first adsorption hole 311 is formed on the upper adsorption seat 32; the upper heating seat 31 is arranged between the upper support plate 21 and the upper adsorption seat 32. In this structure, the upper suction nozzle 312 can be communicated with the air extraction device of the laminator, so that a negative pressure adsorption force can be generated in the first adsorption hole 311 and the second adsorption hole, and thus the diaphragm can be adsorbed on the upper adsorption seat 32.

[0046] In one embodiment, please refer to Figure 3 , as a specific implementation of the diaphragm laminating mechanism provided in the embodiments of the present application, the upper die laminating assembly 2 further includes an upper heating element 22 installed on the upper heating seat 31, an upper cooling seat 23 installed on the upper support plate 21, and an upper heat insulation seat 24 installed on the upper cooling seat 23; the upper cooling seat 23, the upper heat insulation seat 24 and the upper heating seat 31 are arranged in sequence from the upper support plate 21 towards the upper adsorption seat 32. Among them, the upper heating element 22 can be a heating conduit; an installation groove for inserting the upper heating element 22 is formed on the upper heating seat 31 to realize the positioning installation of the upper heating element 22. In this structure, the heat generated by the upper heating element 22 can heat the upper heating seat 31, and the heat can be transferred to the diaphragm, thereby improving the laminating quality of the diaphragm. The heat can be blocked by the upper heat insulation seat 24 and the upper cooling seat 23 to avoid heat dissipation.

[0047] In one embodiment, please refer to Figure 4 and Figure 5 , as a specific implementation of the diaphragm laminating mechanism provided in the embodiments of the present application, the lower die laminating assembly 4 includes a lower support plate 41 connected to the lower die power assembly 12 and a lower suction seat 42 for adsorbing the diaphragm, and the lower suction seat 42 is installed on the lower support plate 41. In this structure, the diaphragm can be adsorbed and fixed by the lower suction seat 42; the lower support plate 41 can support and fix the lower suction seat 42. Among them, please refer to Figure 1 and Figure 4 , a positioning guide post 13 is installed on the frame 1, and a positioning guide sleeve 411 for the positioning guide post 13 to pass through is installed on the lower support plate 41, so as to realize the reliability of the lifting of the lower support plate 41. The number of the positioning guide post 13 and the positioning guide sleeve 411 can both be multiple, and there is no unique limitation here.

[0048] In one embodiment, please refer to Figure 4 and Figure 5, as a specific implementation of the diaphragm laminating mechanism provided in the embodiments of the present application, the lower material suction base 42 includes a lower heating base 421 installed on the lower support plate 41 and a lower adsorption base 422 installed on the lower heating base 421. The lower heating base 421 is provided with a first negative pressure hole 4211 and a lower suction nozzle 4212 installed and communicated with the first negative pressure hole 4211; the lower adsorption base 422 is provided with a second negative pressure hole 4221 communicated with the first negative pressure hole 4211; the lower heating base 421 is arranged between the lower support plate 41 and the lower adsorption base 422. With this structure, the lower suction nozzle 4212 can be communicated with the air extraction device of the laminator, so that a negative pressure adsorption force can be generated in the first negative pressure hole 4211 and the second negative pressure hole 4221, thereby adsorbing the diaphragm on the lower adsorption base 422.

[0049] In one embodiment, please refer to Figure 4 and Figure 5 , as a specific implementation of the diaphragm laminating mechanism provided in the embodiments of the present application, the lower die laminating assembly 4 further includes a lower heating element 43 installed on the lower heating base 421, a lower cooling base 44 installed on the lower support plate 41, and a lower heat insulation base 45 installed on the lower cooling base 44; the lower cooling base 44, the lower heat insulation base 45 and the lower heating base 421 are arranged in sequence from the lower support plate 41 towards the lower adsorption base 422. Among them, the lower heating element 43 can be a heating conduit; the lower heating base 421 is provided with an installation groove for inserting the lower heating element 43 to realize the positioning installation of the lower heating element 43. With this structure, the heat generated by the lower heating element 43 can heat the lower heating base 421, and the heat can be transferred to the diaphragm, thereby improving the laminating quality of the diaphragm. The heat can be blocked by the lower heat insulation base 45 and the lower cooling base 44 to avoid heat dissipation.

[0050] In one embodiment, please refer to Figure 1 and Figure 6 , as a specific implementation of the diaphragm laminating mechanism provided in the embodiments of the present application, the diaphragm laminating mechanism further includes a first cleaning component 5 for cleaning the top surface of the lower die laminating assembly 4, and the first cleaning component 5 is installed on the upper die laminating assembly 2. With this structure, the top surface of the lower die laminating assembly 4 can be cleaned by the first cleaning component 5, specifically, the top surface of the lower adsorption base 422 can be cleaned, so as to avoid contaminating the diaphragm and further improve the laminating quality of the diaphragm. Here, the top surface of the lower adsorption base 422 can be understood as the side surface of the lower adsorption base 422 facing the upper adsorption base 32, which is also the side surface for supporting the diaphragm.

[0051] In one embodiment, please refer to Figure 6, as a specific implementation of the diaphragm laminating mechanism provided in the embodiments of the present application, the first cleaning assembly 5 includes a first cleaning base 51, a first upper sticky roller 52 rotatably mounted on the first cleaning base 51, a second upper sticky roller 53 rotatably mounted on the first cleaning base 51, and a first cleaning lifting member 54 for driving the first cleaning base 51 to lift and lower; the first upper sticky roller 52 is disposed below the second upper sticky roller 53, the outer peripheral surface of the first upper sticky roller 52 is adhered to the outer peripheral surface of the second upper sticky roller 53, and the stickiness of the first upper sticky roller 52 is less than the stickiness of the second upper sticky roller 53; the first cleaning lifting member 54 is mounted on the upper die laminating assembly 2 and connected to the first cleaning base 51. Among them, the first cleaning lifting member 54 can be a cylinder, an electric cylinder, etc., and there is no unique limitation here. With this structure, the first cleaning lifting member 54 can drive the first cleaning base 51 to lift and lower along the Z-axis direction, so that the first upper sticky roller 52 can approach the top surface of the lower adsorption base 422, and the top surface of the lower adsorption base 422 can be cleaned by the stickiness of the first upper sticky roller 52. The sundries on the first upper sticky roller 52 can be transferred to the second upper sticky roller 53 by the second upper sticky roller 53 with greater stickiness to clean the first upper sticky roller 52.

[0052] Of course, in some embodiments, the first cleaning assembly 5 can also be a plurality of air nozzles mounted on the upper die laminating assembly 2. The plurality of air nozzles can be communicated with the air supply device of the laminator, and the sundries on the lower adsorption base 422 can be blown away through the plurality of air nozzles, which can also play a cleaning role.

[0053] In one embodiment, please refer to Figure 1 and Figure 7 , as a specific implementation of the diaphragm laminating mechanism provided in the embodiments of the present application, the diaphragm laminating mechanism further includes a second cleaning assembly 6 for cleaning the bottom surface of the upper die laminating assembly 2. The second cleaning assembly 6 is mounted on the frame 1. With this structure, the bottom surface of the upper die laminating assembly 2 can be cleaned by the second cleaning assembly 6. Specifically, the bottom surface of the upper adsorption base 32 can be cleaned, so as to avoid contaminating the diaphragm and further improve the laminating quality of the diaphragm. Here, the bottom surface of the upper adsorption base 32 can be understood as the side surface of the upper adsorption base 32 facing the lower adsorption base 422, which is also the side surface for adsorbing the diaphragm.

[0054] In one embodiment, please refer to Figure 7, as a specific implementation of the diaphragm laminating mechanism provided in the embodiments of the present application, the second cleaning component 6 includes a second cleaning base 61, a first lower sticky roller shaft 62 rotatably mounted on the second cleaning base 61, a second lower sticky roller shaft 63 rotatably mounted on the second cleaning base 61, and a second cleaning lifting member 64 for driving the second cleaning base 61 to lift and lower; the first lower sticky roller shaft 62 is disposed above the second lower sticky roller shaft 63, the outer peripheral surface of the first lower sticky roller shaft 62 is adhered to the outer peripheral surface of the second lower sticky roller shaft 63, and the stickiness of the first lower sticky roller shaft 62 is less than the stickiness of the second lower sticky roller shaft 63; the second cleaning lifting member 64 is mounted on the frame 1 and connected to the second cleaning base 61. Among them, the second cleaning lifting member 64 can be a cylinder, an electric cylinder, etc., and is not limited uniquely here. With this structure, the second cleaning base 61 can be driven by the second cleaning lifting member 64 to lift and lower in the Z-axis direction, so that the first lower sticky roller shaft 62 can approach the bottom surface of the upper adsorption seat 32, and the bottom surface of the upper adsorption seat 32 can be cleaned by the stickiness of the first lower sticky roller shaft 62. The sundries on the first lower sticky roller shaft 62 can be transferred to the second lower sticky roller shaft 63 by the second lower sticky roller shaft 63 with greater stickiness, so as to clean the first lower sticky roller shaft 62.

[0055] Of course, in some embodiments, the second cleaning component 6 can also be a plurality of air nozzles installed on the lower die laminating component 4. The plurality of air nozzles can be communicated with the air supply device of the laminating machine, and the sundries on the upper adsorption seat 32 can be blown away through the plurality of air nozzles, which can also play a cleaning role.

[0056] In one embodiment, the diaphragm laminating mechanism may further include a pressure sensor installed between the frame 1 and the upper die laminating component 2. The pressure sensor can detect the lamination pressure on the diaphragm when the upper die laminating component 2 and the lower die laminating component 4 are closed, so as to cooperate with the lower die power component 12 to adjust the lamination pressure to meet the pressure requirements during diaphragm lamination.

[0057] The above are only optional embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A diaphragm lamination mechanism, characterized in that: include: A frame, wherein a material taking position, a stacking position and a material unloading position are sequentially arranged on the frame; An upper die stacking assembly is movably mounted on the frame, and an upper suction seat for adsorbing the diaphragm is mounted on the upper die stacking assembly; An upper die power assembly is mounted on the frame and connected to the upper die stacking assembly, and is used to drive the upper die stacking assembly to reciprocate through the material taking position, the stacking position and the material unloading position; A lower mold stacking assembly is installed at the stacking position; A lower die power assembly is installed on the frame and connected to the lower die stacking assembly, and is used to drive the lower die stacking assembly to approach or move away from the upper die stacking assembly.

2. The diaphragm stacking mechanism according to claim 1, characterized in that: The upper mold stacking assembly includes an upper support plate movably mounted on the frame and connected to the upper mold power assembly; the upper suction seat includes an upper heating seat mounted on the upper support plate and an upper adsorption seat mounted on the upper heating seat, the upper heating seat is provided with a first adsorption hole and an upper suction nozzle connected to the first adsorption hole, and the upper adsorption seat is provided with a second adsorption hole connected to the first adsorption hole; the upper heating seat is arranged between the upper support plate and the upper adsorption seat.

3. The diaphragm stacking mechanism according to claim 2, characterized in that: The upper mold stacking assembly also includes an upper heating element installed on the upper heating seat, an upper cooling seat installed on the upper support plate, and an upper insulation seat installed on the upper cooling seat; the upper cooling seat, the upper insulation seat and the upper heating seat are arranged in sequence from the upper support plate toward the upper adsorption seat.

4. The diaphragm stacking mechanism according to claim 1, characterized in that: The lower die stacking assembly comprises a lower support plate connected to the lower die power assembly and a lower suction seat for adsorbing the diaphragm, and the lower suction seat is installed on the lower support plate.

5. The diaphragm stacking mechanism according to claim 4, characterized in that: The lower suction seat includes a lower heating seat installed on the lower support plate and a lower adsorption seat installed on the lower heating seat, the lower heating seat is provided with a first negative pressure hole and a lower suction nozzle connected to the first negative pressure hole; the lower adsorption seat is provided with a second negative pressure hole connected to the first negative pressure hole; the lower heating seat is arranged between the lower support plate and the lower adsorption seat.

6. The diaphragm stacking mechanism according to claim 5, characterized in that: The lower mold stacking assembly also includes a lower heating element installed on the lower heating seat, a lower cooling seat installed on the lower support plate, and a lower insulation seat installed on the lower cooling seat; the lower cooling seat, the lower insulation seat and the lower heating seat are arranged in sequence from the lower support plate toward the lower adsorption seat.

7. The diaphragm stacking mechanism according to any one of claims 1 to 6, characterized in that: The diaphragm stacking mechanism also includes a first cleaning assembly for cleaning the top surface of the lower mold stacking assembly, and the first cleaning assembly is installed on the upper mold stacking assembly.

8. The diaphragm stacking mechanism according to claim 7, characterized in that: The first cleaning assembly includes a first cleaning seat, a first upper adhesive roller rotatably mounted on the first cleaning seat, a second upper adhesive roller rotatably mounted on the first cleaning seat, and a first cleaning lifting member for driving the first cleaning seat to lift and lower; The first upper adhesive roller is arranged below the second upper adhesive roller, the outer circumference of the first upper adhesive roller is bonded to the outer circumference of the second upper adhesive roller, and the viscosity of the first upper adhesive roller is less than that of the second upper adhesive roller; the first cleaning lifting member is installed on the upper mold stacking assembly and connected to the first cleaning seat.

9. The diaphragm stacking mechanism according to any one of claims 1 to 6, characterized in that: The diaphragm lamination mechanism further comprises a second cleaning assembly for cleaning the bottom surface of the upper die lamination assembly, and the second cleaning assembly is mounted on the frame.

10. The diaphragm stacking mechanism according to claim 9, characterized in that: The second cleaning assembly includes a second cleaning seat, a first lower adhesive roller rotatably mounted on the second cleaning seat, a second lower adhesive roller rotatably mounted on the second cleaning seat, and a second cleaning lifting member for driving the second cleaning seat to lift and lower; The first lower adhesive roller is arranged above the second lower adhesive roller, the outer circumference of the first lower adhesive roller is bonded to the outer circumference of the second lower adhesive roller, and the viscosity of the first lower adhesive roller is less than that of the second lower adhesive roller; the second cleaning lifting member is installed on the frame and connected to the second cleaning seat.

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