Vapor deposition equipment with cooling structure
By introducing a cooling structure into the vapor deposition equipment, the problem of deposition reaction in the reaction gas before it reaches the deposition container is solved, and the effective utilization of gas and the improvement of deposition effect is achieved.
Patent Information
- Application Number
- CN202421810089.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-29
- Publication Date
- 2025-07-01
- Estimated Expiration
- 2034-07-29
AI Technical Summary
During the chemical vapor deposition process, the deposition reaction begins before reaching the deposition container, causing silicon carbide to block the pipeline, affecting the deposition effect, and it is difficult to effectively utilize the reaction gas.
A vapor deposition device with a cooling structure is designed, including a deposition container, an intake pipe and a storage member. The storage member is used to temporarily store the gas entering the intake pipe and cool the gas through the cooling member to prevent early reactions.
The cooling structure effectively reduces the temperature of the reaction gas, prevents early reactions, reduces gas waste, improves the deposition effect, and ensures that the reaction gas can reach the deposition container for deposition smoothly.
Smart Images
Figure CN223047587U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of gas deposition intake tools, in particular to a gas deposition device with a cooling structure. Background Art
[0002] Chemical vapor deposition technology has a wide range of applications in the field of surface engineering. In the semiconductor field, various functional film layers can be prepared through CVD technology. For example, silicon carbide coating products prepared using methyltrichlorosilane (MTS) and hydrogen (H2) as reaction precursors are widely used in the components of semiconductor equipment. The general process of chemical vapor deposition is to transport the reaction gas to the reaction zone of a high-temperature deposition container, where the reaction gas undergoes a chemical reaction in the reaction zone to produce a silicon carbide coating and deposit it on the workpiece. However, the inside of the deposition container is a high-temperature environment. Before the reaction gas approaches and enters the deposition container, the closer it is to the deposition container, the easier it is to be heated to a high temperature, causing the reaction gas to start the deposition reaction before reaching the deposition container, resulting in the blockage of the pipeline by the generated silicon carbide, affecting the use of the pipeline, and inevitably causing a certain consumption of the reaction gas, resulting in insufficient reaction gas concentration in the deposition container and affecting the deposition reaction. To solve the problem of premature consumption of the reaction gas, the present invention proposes a gas deposition device with a cooling structure to reduce the waste phenomenon caused by premature reaction of the reaction gas. Content of the Utility Model
[0003] The purpose of the utility model is to provide a gas deposition device with a cooling structure, which can adjust the temperature of the reaction gas, so that the reaction gas can smoothly reach the deposition container for reaction, deposit to form a coating, and reduce the waste of the reaction precursor gas caused by premature reaction.
[0004] To achieve the above purpose, the utility model adopts the following technical scheme:
[0005] A gas deposition device with a cooling structure includes a deposition container, an intake pipeline, and a storage member. The deposition container forms a constant-temperature reaction chamber. One end of the storage member is hermetically connected to the intake pipeline, and the other end is hermetically communicated with the deposition container. The storage member is used to temporarily store the gas introduced by the intake pipeline. A gas-dispersing plate is provided at the end of the storage member hermetically communicated with the deposition container, and uniformly distributed gas-dispersing holes are formed on the gas-dispersing plate. The gas-dispersing holes are used to introduce the gas in the storage member into the deposition container. A cooling member is provided around the storage member, and a cooling cavity is formed between the cooling member and the storage member. A cooling pipeline is communicated with the cooling cavity for introducing cooling gas into the cooling cavity. The cooling cavity is also communicated with an air outlet pipeline, and the air outlet pipeline is used to discharge the cooling gas that has been used in the cooling cavity.
[0006] The beneficial effects are as follows: When gas-phase deposition needs to be performed on the workpiece in the deposition container, hydrogen and methyltrichlorosilane need to pass through the intake channel and the storage member, and then be transported to the deposition container through the storage member. Since the deposition container has a constant high-temperature environment, hydrogen and methyltrichlorosilane can react to deposit on the workpiece. However, during the operation of hydrogen and methyltrichlorosilane, as they approach the deposition container, the temperature gradually rises. Therefore, it is easy for the deposition reaction to occur before entering the deposition container, and the reaction rate will become intense as the temperature rises. If cooling is not carried out in time, the reaction gas will not be deposited on the workpiece but will be deposited in the intake pipeline and the deposition member. In addition, the deposited gas will also block the intake channel and the storage member, affecting the subsequent gas-phase deposition effect in the deposition container;
[0007] Therefore, by providing a storage member, the reaction gas transported through the intake channel is first stored, and the gas stored in the storage member is cooled by the cooling member, so that the gas is not easily reacted in the storage member and can then enter the deposition container to perform gas-phase deposition on the workpiece; the provision of the storage member can centrally cool the deposition gas, with higher efficiency and better cooling effect. Subsequently, the reaction gas has a good gas-phase deposition effect on the workpiece, and the waste of the deposition gas is also reduced.
[0008] A further technical solution of the present utility model is that the cooling pipeline is sleeved on the intake channel, and a cooling channel is formed between the cooling pipeline and the intake channel. The cooling channel is communicated with the cooling cavity for transporting cooling gas to the cooling cavity.
[0009] A further technical solution of the present utility model is that the storage member is arranged in a cavity structure with one end wide and one end narrow. The narrower end of the storage member is hermetically connected to the intake channel, and the other end is hermetically communicated with the deposition container.
[0010] A further technical solution of the present utility model is that one end of the cooling pipeline connected to the cooling member is inserted into the cooling cavity inside the cooling member, and air outlet holes are provided on the side wall of the cooling pipeline inserted into the cooling cavity.
[0011] A further technical solution of the present utility model is that the number of the air outlet holes is set to be multiple, and the multiple air outlet holes are uniformly distributed along the circumferential direction of the side wall of the cooling pipeline.
[0012] A further technical solution of the present utility model is that a sealing plate is provided at one end of the cooling pipeline facing away from the cooling member. The sealing plate is used to seal the cooling channel at the end facing away from the cooling member; an intake pipeline is connected to the sealing plate, and the intake pipeline is communicated with the cooling pipeline through the sealing plate.
[0013] The beneficial effect is: By providing a sealing plate, the probability of the cooling gas leaking from the cooling pipeline is reduced, making the process of introducing the cooling gas into the cooling channel more stable.
[0014] A further technical solution of the present utility model is that the diameter of the air outlet pipe is smaller than that of the air inlet pipe.
[0015] The beneficial effect is that by limiting the diameter of the air outlet pipe to be smaller than that of the air inlet pipe, in order to maintain the dynamic balance of the air flow in the cooling cavity, this makes the air flow rate in the air outlet pipe relatively fast, while the air flow rate in the air inlet pipe is relatively slow. This enables the cooling gas to slowly flow in the cooling channel to cool the deposited gas in the air inlet channel. After the temperature of the cooling gas rises, it can be quickly discharged, improving the cooling effect of the cooling gas.
[0016] A further technical solution of the present utility model is that a cooling device is connected between the air outlet pipe and the air inlet pipe. The cooling device is used to cool the cooling gas leaving the cooling part from the air outlet pipe and transport it back into the air inlet pipe.
[0017] A further technical solution of the present utility model is that a cooling device is connected between the air outlet pipe and the air inlet pipe. The cooling device is used to cool the cooling gas leaving the cooling part from the air outlet pipe and transport it back into the air inlet pipe.
[0018] The beneficial effect of this application is that when depositing a workpiece, after placing the workpiece in the deposition container, the deposition gas is transported through the air inlet channel. The deposition gas first enters the storage part through the air inlet channel and is cooled in both the air inlet channel and the storage part. Due to the upper-wide and lower-narrow structure of the storage part, the deposition gas can be temporarily stored in the storage part. At the same time, the contact area between the cooling pipe and the storage part is relatively large, which makes the cooling effect on the deposition gas in the storage part better, helping the cooled deposition gas enter the deposition container, reducing the waste of the deposition gas caused by the premature reaction of the deposition gas due to high temperature, and also reducing the blockage of the air inlet channel caused by the premature deposition reaction, and helping to achieve a better deposition effect on the workpiece subsequently. Description of the Drawings
[0019] Figure 1 is a schematic diagram showing the connection relationship between the deposition container and the storage part of the present utility model.
[0020] Figure 2 is Figure 1 a cross-sectional view showing the cooling assembly;
[0021] Figure 3 is Figure 2 a partial enlarged view of part A in
[0022] In the figure: 1 - deposition container, 2 - intake channel, 3 - storage member, 4 - cooling assembly, 41 - cooling pipe, 42 - cooling member, 43 - exhaust hole, 44 - cooling cavity, 5 - gas diffusing plate, 51 - gas diffusing hole, 6 - sealing plate, 7 - outlet pipe, 71 - intake pipe, 8 - cooling ring, 81 - connecting groove. Detailed implementation manner
[0023] The following combines the attached Figures 1 - 3 to further illustrate the detailed implementation manner of the present utility model.
[0024] As Figures 1 - 2 shown, the present utility model discloses a chemical vapor deposition device with a cooling structure. The chemical vapor deposition device with a cooling structure includes a deposition container 1, an intake pipe 2 and a storage member 3. The deposition container 1 is a vertically arranged cylindrical structure. The storage member 3 is arranged as a hollow frustum of a cone with a wider upper end and a narrower lower end. The wider upper end of the storage member 3 is hermetically communicated with the deposition container 1, and the narrower lower end is communicated with the intake pipe 2. A heating device is connected to the deposition container 1 for heating the deposition container 1 to maintain a high-temperature constant environment inside the deposition container 1, so that the deposition gas reacts and deposits on the workpiece placed inside the deposition container 1.
[0025] As Figures 1 - 2 shown, a cooling pipe 41 is arranged outside the intake pipe 2. The cooling pipe 41 is arranged as a tubular structure. The diameter of the intake pipe 2 is smaller than that of the cooling pipe 41 and is arranged inside the cooling pipe 41 along the length direction of the cooling pipe 41. A cooling channel is formed between the cooling pipe 41 and the intake channel 2. During use, a cooling gas is introduced into the cooling pipe 41 to cool the deposition gas in the intake channel 2. The storage member 3 is wrapped with a cooling member 42. In this embodiment, the cooling member 42 is also arranged as a hollow frustum of a cone with a wider upper end and a narrower lower end. The size of the cooling member 42 is larger than that of the storage member 3. A cooling cavity 44 is formed between the storage member 3 and the cooling member 42. Since the deposition container is heated, when the deposition gas approaches the inside of the deposition container 1, the temperature gradually rises. When it reaches a certain temperature, a deposition reaction is likely to occur, causing the deposition gas to deposit before entering the deposition container 1 and blocking the intake pipe 2 and the storage member 3. Therefore, through the cooling effect of the cooling pipe 41 and the cooling member 42, the gas close to the deposition container 1 is cooled, reducing the premature reaction deposition of the deposition gas and improving the utilization rate of the deposition gas. Combined with Figure 3One end of the cooling pipe 41 is inserted into the cooling cavity 44, and an exhaust hole 43 is opened on the wall of the cooling pipe 41 at one end inserted into the cooling cavity 44. The number of the exhaust holes 43 is set to be multiple, and the multiple exhaust holes 43 are evenly distributed on the wall of the cooling pipe 41 along the circumferential direction with the central axis of the cooling pipe 41 as the center of the circle; when it is necessary to cool the deposited gas in the intake channel 2 and the storage member 3, the cooling gas is transported to the cooling cavity 44 through the cooling pipe 41, and the setting of the diffuser holes 51 allows the cooling gas to The cooling gas enters the cooling cavity 44 from the cooling channel more quickly; a sealing plate 6 is provided at one end of the cooling channel 4 away from the storage member 3, the sealing plate 6 is provided in a circular ring shape, the inner ring is provided for the intake channel 2 to pass through, the sealing plate 6 is used to seal the end of the cooling channel away from the storage member 3, the sealing plate 6 is connected with an intake pipe 71, the intake pipe 71 is connected with the cooling channel 4 through the sealing plate 6, the arrangement of the sealing plate 6 and the intake pipe 71 enables the cooling gas to be effectively stored in the cooling channel 4, thereby realizing the cooling of the gas in the intake pipe 2;
[0026] Reference Figures 1 - 2, a diffuser plate 5 is provided at one end of the storage member 3 facing away from the intake passage 2. The diffuser plate 5 is arranged as a circular plate corresponding to the wider end of the storage member 3. A plurality of air diffusing holes 51 are evenly formed in the diffuser plate 5. The deposited gas can enter the deposition container 1 evenly through the air diffusing holes 51 to perform vapor deposition on the workpiece in the deposition container 1, improving the uniformity of the deposition on the workpiece. A cooling ring 8 is connected to the cooling member 42. The cooling ring 8 is arranged as an annular structure. The inner wall of the cooling ring 8 is coaxially welded to the cooling member 42 and the storage member 3 for sealing the cooling cavity 44. An annular connection groove 81 is formed on the inner wall of the inner ring of the cooling ring 8, and the connection groove 81 communicates with the cooling cavity 44. An air outlet pipe 7 is connected to the cooling ring 8. The diameter of the air outlet pipe 7 is smaller than that of the intake pipe 71. This enables the cooling gas to enter the cooling pipe 41 and the cooling member 42 through the intake pipe 71. In order to ensure the cooling air pressure balance in the cooling cavity 44, the gas flow rate in the air outlet pipe is relatively fast. This enables the cooling gas to fully cool the gas in the intake passage 2 and the storage member 3 and then be discharged at a relatively fast rate, enhancing the cooling effect. A cooling device is connected between the air outlet pipe and the intake pipe. The cooling device is used to cool the cooling gas leaving the cooling member from the air outlet pipe and transport it back into the intake pipe to realize the recycling of the cooling gas. Additionally, since the deposited gas input into the intake passage 2 and the storage member 3 is mainly hydrogen and methyltrichlorosilane, it is necessary to react them under heating conditions in the deposition container 1 to produce silicon carbide and deposit it on the workpiece. However, in the heating environment of the deposition container 1, it is easy for the two gases to be heated and react before reaching the deposition container 1. Therefore, by cooling the intake passage 2 and the storage member 3, the pre-reaction of the two reaction gases before reaching the deposition container 1 can be reduced, enabling the two gases to smoothly enter the deposition container 1 for reaction and uniformly deposit on the workpiece, improving the utilization efficiency of the deposited gas.
Claims
1. A vapor deposition device with a cooling structure, characterized in that: It includes a deposition container, an air intake pipe and a storage component, wherein the deposition container forms a constant temperature reaction chamber, one end of the storage component is sealedly connected to the air intake pipe, and the other end is sealedly connected to the deposition container, the storage component is used to temporarily store the gas introduced through the air intake pipe, and one end of the storage component sealedly connected to the deposition container is provided with a diffuser plate, the diffuser plate is provided with evenly distributed diffuser holes, and the diffuser holes are used to pass the gas in the storage component into the deposition container; a cooling component is arranged around the outside of the storage component, and a cooling cavity is formed between the cooling component and the storage component, the cooling cavity is connected with a cooling pipe for introducing cooling gas into the cooling cavity; the cooling cavity is also connected with an outlet pipe, and the outlet pipe is used to discharge the cooling gas after use in the cooling cavity.
2. The vapor deposition device with a cooling structure according to claim 1, characterized in that: The cooling pipe is sleeved on the air inlet passage, and a cooling channel is formed between the cooling pipe and the air inlet passage. The cooling channel is communicated with the cooling cavity and is used for conveying cooling gas to the cooling cavity.
3. The vapor deposition device with a cooling structure according to claim 1, characterized in that: The storage member is configured as a cavity structure with one end being wide and the other end being narrow, the narrower end of the storage member being sealed and connected to the air inlet channel, and the other end being sealed and connected to the deposition container.
4. The vapor deposition device with a cooling structure according to claim 2, characterized in that: One end of the cooling pipe connected to the cooling element is inserted into the cooling cavity inside the cooling element, and an air outlet is provided on the side wall of the end of the cooling pipe inserted into the cooling cavity.
5. The vapor deposition device with a cooling structure according to claim 4, characterized in that: The number of the air outlet holes is set to be multiple, and the multiple air outlet holes are evenly distributed along the circumferential direction of the side wall of the cooling pipe.
6. The vapor deposition device with a cooling structure according to claim 2, characterized in that: A sealing plate is provided at one end of the cooling pipe away from the cooling element, and the sealing plate is used to seal the cooling channel at the end away from the cooling element; an air intake pipe is connected to the sealing plate, and the air intake pipe is connected to the cooling pipe through the sealing plate.
7. The vapor deposition device with a cooling structure according to claim 6, characterized in that: The diameter of the air outlet pipe is smaller than that of the air inlet pipe.
8. The vapor deposition device with a cooling structure according to claim 7, characterized in that: A cooling device is connected between the air outlet pipe and the air inlet pipe, and is used for cooling the cooling gas leaving the cooling element from the air outlet pipe and conveying it back to the air inlet pipe.