Semiconductor dehumidification device

Abstract

The utility model discloses a semiconductor dehumidification device, which comprises a shell, a first dehumidification device, a second dehumidification device and a control device, wherein the shell is internally provided with a first cavity and a second cavity; the refrigeration end of the semiconductor refrigeration sheet is connected with a first heat exchange piece, and the heating end of the semiconductor refrigeration sheet is connected with a second heat exchange piece; the second heat exchange piece comprises a heat conduction piece attached to the heating end, a copper pipe piece extending in the horizontal direction and a plurality of heat exchange fins allowing the copper pipe piece to penetrate through and arranged at intervals, and a gap between every two adjacent heat exchange fins faces the second ventilation opening; and the fan is arranged in the second cavity. Heat generated by the heating end of the semiconductor chilling plate can be transmitted in the extending direction of the copper pipe fitting so that all positions of the copper pipe fitting can be evenly heated, heat conduction can be fully achieved through the cooperation of the semiconductor chilling plate and the heat exchange fins, and then gas is driven by the draught fan to pass through gaps between the heat exchange fins and then is exhausted outwards from the second ventilation opening. The heat exchange area is increased, the heat exchange efficiency is improved, and therefore the purpose of improving the heat exchange efficiency to promote the dehumidification effect is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of household appliances, in particular to a semiconductor dehumidifying device. Background Art

[0002] The working principle of a semiconductor dehumidifier is to dehumidify by using the temperature difference between the cold and hot ends of a semiconductor refrigeration sheet. Moist air enters the condensation part and liquefies into water. The cold end of the semiconductor refrigerates and the hot end generates heat, forming a cyclic temperature difference. The higher the power of the machine, the greater the temperature difference between the cold end and the hot end, and the better the dehumidifying effect. If the heat dissipation effect of the hot end is not good, the semiconductor will enter a protection state and the power will decrease.

[0003] For the semiconductor refrigeration sheets of semiconductor dehumidifiers on the market, the heat dissipation of the hot end is generally through aluminum fins extending from the back. The heat dissipation area of the aluminum fins is limited, resulting in poor heat dissipation effect and ultimately affecting the dehumidifying effect. In order to improve the dehumidifying performance of semiconductor dehumidifiers, it is necessary to optimize their heat dissipation structure. Summary of the Utility Model

[0004] In order to overcome the deficiencies of the prior art, one of the purposes of the utility model is to provide a semiconductor dehumidifying device that promotes the dehumidifying effect by improving the heat exchange efficiency.

[0005] According to the semiconductor dehumidifying device of the embodiment of the utility model, it includes: a housing, a first cavity and a second cavity are arranged inside the housing, the housing is provided with a first air vent communicated with the first cavity and a second air vent communicated with the second cavity; a semiconductor refrigeration sheet is arranged inside the housing, the semiconductor refrigeration sheet has a refrigeration end located in the first cavity and a heating end located in the second cavity, a first heat exchange member is connected to the refrigeration end of the semiconductor refrigeration sheet, and a second heat exchange member is connected to the heating end of the semiconductor refrigeration sheet; wherein, the second heat exchange member includes a heat conducting member attached to the heating end of the semiconductor refrigeration sheet, a copper pipe member connected to the heat conducting member and extending in the horizontal direction, and a plurality of heat exchange fins through which the copper pipe member passes and are arranged at intervals along the length direction of the copper pipe member, and the gap between adjacent heat exchange fins faces the second air vent; a blower is arranged inside the second cavity and can drive gas to pass through the gap between adjacent heat exchange fins and be discharged outwards from the second air vent.

[0006] The semiconductor dehumidifying device according to the embodiment of the utility model has at least the following beneficial effects:

[0007] The heat generated at the heating end of the semiconductor refrigeration chip is transferred to the copper pipe fitting through the heat conducting member. The heat can be transferred along the extending direction of the copper pipe fitting so that each position of the copper pipe fitting is evenly heated. The heat exchange fins arranged at intervals along the length direction of the copper pipe fitting can fully conduct the heat to the heat exchange fins, and then the fan drives the gas to pass through the gap between the heat exchange fins and be discharged outward from the second ventilation port, which not only increases the heat exchange area but also improves the heat exchange efficiency, thereby achieving the purpose of enhancing the heat exchange efficiency to promote the dehumidification effect.

[0008] In some embodiments of the present invention, two semiconductor refrigeration chips are provided, and two corresponding second heat exchange members are provided. The two semiconductor refrigeration chips and the two second heat exchange members are all arranged at intervals. The fan is located between the two second heat exchange members, and the traveling path of the gas driven by the fan points to the second ventilation port.

[0009] In some embodiments of the present invention, the two semiconductor refrigeration chips and the two second heat exchange members are all arranged at intervals in the vertical direction. The second ventilation port is opened at the top of the housing, and the housing is provided with an air inlet structure communicated with the second cavity.

[0010] In some embodiments of the present invention, the two semiconductor refrigeration chips and the two second heat exchange members are all arranged at intervals in the horizontal direction. The second ventilation port is arranged on the side wall of the housing, and an air inlet facing the second ventilation port is opened on the side wall of the housing.

[0011] In some embodiments of the present invention, the heat conducting member has a contact plane attached to the heating end of the semiconductor refrigeration chip. A positioning groove adapted to the outer diameter size of the copper pipe fitting is concavely arranged in the contact plane. Both ends of the positioning groove penetrate through the opposite sides of the heat conducting member. A part of the copper pipe fitting is accommodated in the positioning groove and can abut against the heating end of the semiconductor refrigeration chip. Both ends of the copper pipe fitting extend out of both ends of the positioning groove and horizontally extend in a direction away from the heat conducting member.

[0012] In some embodiments of the present invention, it further includes a mounting strip. Waist-shaped through holes are respectively provided at both ends of the mounting strip. A bracket for fixing the semiconductor refrigeration chip is provided in the housing. Mounting holes opposite to the waist-shaped through holes are provided on the bracket. Bolt fasteners pass through the waist-shaped through holes and the corresponding mounting holes so that the mounting strip presses the heat conducting member against the bracket.

[0013] In some embodiments of the present invention, the multiple heat exchange fins are aluminum fins and / or copper fins.

[0014] In some embodiments of the present utility model, a frame member is provided inside the housing, the first cavity is located in the region between the housing and the frame member, and the internal space of the frame member constitutes the second cavity, so that the first cavity and the second cavity are isolated from each other.

[0015] In some embodiments of the present utility model, a partition is provided inside the housing along the vertical direction, the partition divides the internal space of the housing into the first cavity and the second cavity, and a gas communication port for communicating the first cavity and the second cavity is provided on the partition.

[0016] In some embodiments of the present utility model, a switching mechanism for adjusting the opening size of the gas communication port is provided on the partition.

[0017] Additional aspects and advantages of the present utility model will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present utility model. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present utility model will be further described below in conjunction with the drawings and embodiments.

[0019] Figure 1 is a schematic external view of Embodiment 1 of the semiconductor dehumidification device of the present utility model;

[0020] Figure 2 is Figure 1 a schematic cross-sectional view taken along line A-A of the embodiment;

[0021] Figure 3 is Figure 1 a schematic structural view of the second heat exchange member and the fan of the embodiment installed on the partition;

[0022] Figure 4 is a schematic cross-sectional view of Embodiment 2 of the semiconductor dehumidification device of the present utility model;

[0023] Figure 5 is Figure 4 a schematic exploded view of the embodiment;

[0024] Figure 6 is a schematic internal structure view of Embodiment 3 of the semiconductor dehumidification device of the present utility model.

[0025] Reference numerals:

[0026] Housing 100; first cavity 110; first ventilation port 111; second cavity 120; second ventilation port 121; air inlet 122; bracket 130; mounting hole 131; frame member 140; partition 150; gas communication port 151; semiconductor refrigeration chip 200; first heat exchanger 300; second heat exchanger 400; heat conducting member 410; positioning groove 411; copper pipe fitting 420; heat exchange fins 430; fan 500; mounting strip 600; kidney-shaped through hole 610. Detailed implementation manners

[0027] The embodiments of the present utility model will be described in detail below. The examples of the embodiments are shown in the drawings, in which the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present utility model and should not be construed as a limitation to the present utility model.

[0028] In the description of the present utility model, it should be understood that with regard to the orientation description, for example, terms such as "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model.

[0029] In the description of the present utility model, the meaning of "several" is one or more, the meaning of "multiple" is two or more, understandings such as "greater than", "less than", "exceeding", etc. do not include the present number, and understandings such as "above", "below", "within", etc. include the present number. If there is a description of "first" and "second", it is only for the purpose of distinguishing technical features and should not be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence relationship of the indicated technical features.

[0030] In the description of the present utility model, it should be noted that unless otherwise clearly specified and limited, the terms "installation", "connection", "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0031] Refer to Figures 1 to 3 or see Figure 4 and Figure 5, the semiconductor dehumidification device of the present utility model includes: a housing 100, a first cavity 110 and a second cavity 120 are provided inside the housing 100, the housing 100 is provided with a first ventilation port 111 communicating with the first cavity 110 and a second ventilation port 121 communicating with the second cavity 120; a semiconductor refrigeration sheet 200, which is arranged inside the housing 100, the semiconductor refrigeration sheet 200 has a refrigerating end located in the first cavity 110 and a heating end located in the second cavity 120, a first heat exchanger 300 is connected to the refrigerating end of the semiconductor refrigeration sheet 200, and a second heat exchanger 400 is connected to the heating end of the semiconductor refrigeration sheet 200; wherein, the second heat exchanger 400 includes a heat conducting member 410 attached to the heating end of the semiconductor refrigeration sheet 200, a copper pipe member 420 connected to the heat conducting member 410 and extending in the horizontal direction, and a plurality of heat exchange fins 430 through which the copper pipe member 420 passes and are arranged at intervals along the length direction of the copper pipe member 420, and the gap between adjacent heat exchange fins 430 faces the second ventilation port 121; a fan 500, which is arranged inside the second cavity 120 and can drive gas to pass through the gap between adjacent heat exchange fins 430 and discharge it outwards from the second ventilation port 121.

[0032] When the semiconductor dehumidification device with the above structure works, the gas with higher humidity enters the first cavity 110 from the first ventilation port 111. The water vapor in the gas contacts the first heat exchanger 300 and liquefies to achieve dehumidification. The heat generated by the heating end of the semiconductor refrigeration sheet 200 is transferred to the copper pipe member 420 through the heat conducting member 410, and the heat can be transferred along the extension direction of the copper pipe member 420 so that each position of the copper pipe member 420 is evenly heated. The heat exchange fins 430 arranged at intervals along the length direction of the copper pipe member 420 can fully conduct the heat to the heat exchange fins 430, and then the fan 500 drives the gas to pass through the gap between the heat exchange fins 430 and discharge it outwards from the second ventilation port 121. Since the gap between adjacent heat exchange fins 430 faces the second ventilation port 121, the gas can be quickly and smoothly discharged outside the housing 100. The semiconductor dehumidification device with the above structure not only increases the heat exchange area but also improves the heat exchange efficiency, so as to achieve the purpose of improving the heat exchange efficiency to promote the dehumidification effect.

[0033] See Figure 2 and Figure 3 , or see Figure 4 and Figure 5, in some embodiments of the present utility model, two semiconductor refrigeration chips 200 are provided, and two corresponding second heat exchange members 400 are provided. The two semiconductor refrigeration chips 200 and the two second heat exchange members 400 are arranged at intervals. The fan 500 is located between the two second heat exchange members 400, and the traveling path of the gas driven by the fan 500 points to the second ventilation port 121. Since the gap between adjacent heat exchange fins 430 faces the second ventilation port 121, and the traveling path of the gas driven by the fan 500 also points to the second ventilation port 121, that is: under the driving action of the fan 500, the gas first passes through one of the second heat exchange members 400 and then enters the intake side of the fan 500, and then is discharged from the exhaust side of the fan 500 and passes through the other second heat exchange member 400 before being discharged from the second through-hole, thereby further improving the heat exchange efficiency. It can be understood that if the gas discharged from the exhaust side of the fan 500 needs to pass through two second heat exchange members 400 in sequence before being discharged from the second through-hole, a part of the airflow driven by the fan 500 is likely to backflush, resulting in low utilization rate of the airflow. The layout mode where the fan 500 is located between the two second heat exchange members 400 can improve the above problems.

[0034] In addition, in other embodiments, the number of the semiconductor refrigeration chips 200 and the second heat exchange members 400 can also be set to three or more, which can be configured according to actual needs.

[0035] See Figure 2 and Figure 3 , in some embodiments of the present utility model, the two semiconductor refrigeration chips 200 and the two second heat exchange members 400 are all arranged at intervals in the vertical direction. The second ventilation port 121 is opened at the top of the housing 100, and the housing 100 is provided with an intake structure communicating with the second cavity 120. It should be noted that the hot air flow has an upward movement trend, and a convection can be formed between the intake structure and the second ventilation port 121. The external gas or the gas passing through the first heat exchange member 300 enters from the intake structure and flows upward under the drive of the fan 500, so as to sequentially pass through the two second heat exchange members 400 and then be discharged from the second ventilation port 121, which is beneficial to accelerating the gas flow rate to improve the heat exchange efficiency. At this time, the intake side of the fan 500 is located below, and the exhaust side of the fan 500 is located above.

[0036] See Figure 4 and Figure 5, in some embodiments of the present utility model, the two semiconductor refrigeration chips 200 and the two second heat exchange components 400 are arranged at intervals in the horizontal direction. The second air vent 121 is provided on the side wall of the housing 100, and an air inlet 122 facing the second air vent 121 is formed on the side wall of the housing 100. The above layout means that the two second heat exchange components 400 and the fan 500 are horizontally arranged along a certain straight line direction, and a convection can be formed between the air inlet 122 and the second air vent 121. After the external gas enters from the air inlet 122, it passes through the two second heat exchange components 400 under the drive of the fan 500 and is discharged from the second air vent 121. The flow direction of the gas is approximately linear, and the wind noise is small.

[0037] Referring to FIG. 3, in some embodiments of the present utility model, the heat conducting member 410 has a contact plane attached to the heating end of the semiconductor refrigeration chip 200. A positioning groove 411 adapted to the outer diameter of the copper pipe fitting 420 is recessed in the contact plane. Both ends of the positioning groove 411 penetrate through the opposite sides of the heat conducting member 410. A part of the copper pipe fitting 420 is accommodated in the positioning groove 411 and can abut against the heating end of the semiconductor refrigeration chip 200. Both ends of the copper pipe fitting 420 extend out of both ends of the positioning groove 411 and horizontally extend in a direction away from the heat conducting member 410. It can be understood that the outer peripheral wall of the part of the copper pipe fitting 420 located within the positioning groove 411 can directly contact the heating end of the semiconductor refrigeration chip 200, so that a part of the heat generated by the heating end of the semiconductor refrigeration chip 200 is directly transferred to the copper pipe fitting 420, and another part of the heat generated by the heating end of the semiconductor refrigeration chip 200 is transferred to the copper pipe fitting 420 through the heat conducting member 410. Through the above structure, not only the positioning and fixing of the copper pipe fitting 420 are realized, but also the heat conduction efficiency of the second heat exchange component 400 is improved. In this embodiment, after the copper pipe fitting 420 extends out of both ends of the positioning groove 411, it is bent and extends horizontally. Each heat exchange fin 430 is provided with a hole through which the end of the copper pipe fitting 420 can pass, and the hole can be tightly fitted with the outer peripheral wall of the copper pipe fitting 420.

[0038] Referring to Figure 4 and Figure 5, in some embodiments of the present utility model, for the convenience of installing the second heat exchange member 400, the semiconductor dehumidifying device of the present utility model further includes a mounting strip 600. Both ends of the mounting strip 600 are respectively provided with an oblong through hole 610. A bracket 130 for fixing the semiconductor refrigeration sheet 200 is provided inside the housing 100. The bracket 130 is provided with a mounting hole 131 opposite to the oblong through hole 610. A bolt fastener passes through the oblong through hole 610 and the corresponding mounting hole 131 so that the mounting strip 600 presses the heat conducting member 410 against the bracket 130. Among them, the mounting hole 131 on the bracket 130 is a threaded hole. When the bolt fastener is threadedly connected to this threaded hole, it can press and fix the heat conducting member 410 through the mounting strip 600. Moreover, the oblong through holes 610 at both ends of the mounting strip 600 can match heat conducting members 410 of various size specifications.

[0039] In some embodiments of the present utility model, multiple pieces of the heat exchange fins 430 are aluminum fins and / or copper fins. The function of the heat exchange fins 430 is to increase the contact area with the air flow, so that heat is carried out by the air flow to achieve heat dissipation. The cost of all the heat exchange fins 430 being aluminum fins is relatively low and the weight is relatively light; the cost of all the heat exchange fins 430 being copper fins increases, but the heat dissipation effect is better; a part of the heat exchange fins 430 are aluminum fins and a part of the heat exchange fins 430 are copper fins. Such a combination method can not only take into account the requirements of cost and light weight, but also appropriately reduce the cost and maintain good heat conduction performance.

[0040] See Figure 6 , in some embodiments of the present utility model, a frame member 140 is provided inside the housing 100. The first cavity 110 is located in the area between the housing 100 and the frame member 140. The internal space of the frame member 140 forms the second cavity 120, so that the first cavity 110 and the second cavity 120 are isolated from each other. When the first cavity 110 and the second cavity 120 are independent of each other, the first heat exchange member 300 and the second heat exchange member 400 work independently, and the cold in the first cavity 110 will not shift to the second cavity 120, which is beneficial to the refrigerating end and the heating end of the semiconductor refrigeration sheet 200 having a large temperature difference.

[0041] See Figure 2 and Figure 3, in some embodiments of the present utility model, a partition 150 is provided in the housing 100 and arranged vertically. The partition 150 divides the internal space of the housing 100 into the first cavity 110 and the second cavity 120. A gas communication port 151 is formed on the partition 150 to communicate the first cavity 110 and the second cavity 120. It can be understood that in order to improve the rate of entry and exit of humid gas into and out of the second cavity 120, thereby improving the dehumidification efficiency, a power structure capable of driving external gas to enter and then leave the second cavity 120 needs to be configured. In the above embodiment, due to the existence of the gas communication port 151, under the action of the fan 500, a negative pressure can be formed at the gas communication port 151, and at least part of the gas in the first cavity 110 can enter the second cavity 120. A convection is formed between the gas communication port 151 and the first ventilation port 111, improving the dehumidification efficiency.

[0042] In some embodiments of the present utility model, a switching mechanism for adjusting the opening size of the gas communication port 151 is provided on the partition 150. Using the switching mechanism to adjust the opening size of the gas communication port 151 is beneficial for adjusting a better dehumidification effect. The switching mechanism can be a baffle that can move to block part of the gas communication port 151. Of course, in other embodiments, when manufacturing the partition 150, the surplus material can be cut according to the usage requirements to obtain a gas communication port 151 with a corresponding size. During assembly, the partition 150 with a gas communication port 151 of different opening sizes can be selected according to different specifications of the semiconductor dehumidification device.

[0043] The technical features of the above embodiments can be combined arbitrarily. For the sake of brief description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0044] Although the embodiments of the present utility model have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and purposes of the present utility model. The scope of the present utility model is defined by the claims and their equivalents.

Claims

1. A semiconductor dehumidification device, characterized in that: include: A shell (100), wherein a first cavity (110) and a second cavity (120) are provided in the shell (100), and the shell (100) is provided with a first vent (111) connected to the first cavity (110) and a second vent (121) connected to the second cavity (120); A semiconductor refrigeration chip (200) is arranged in the housing (100), the semiconductor refrigeration chip (200) having a refrigeration end located in the first cavity (110) and a heating end located in the second cavity (120), the refrigeration end of the semiconductor refrigeration chip (200) is connected to a first heat exchange element (300), and the heating end of the semiconductor refrigeration chip (200) is connected to a second heat exchange element (400); The second heat exchange member (400) comprises a heat conducting member (410) attached to the heating end of the semiconductor refrigeration plate (200), a copper pipe (420) connected to the heat conducting member (410) and extending in a horizontal direction, and a plurality of heat exchange fins (430) for the copper pipe (420) to pass through and arranged at intervals along the length direction of the copper pipe (420), and the gaps between adjacent heat exchange fins (430) face the second vent (121); The fan (500) is arranged in the second cavity (120) and can drive the gas to pass through the gap between the adjacent heat exchange fins (430) and be discharged outward from the second vent (121); the semiconductor refrigeration fins (200) are provided with two pieces, and the second heat exchange components (400) are correspondingly provided, the two semiconductor refrigeration fins (200) and the two second heat exchange components (400) are arranged at intervals, the fan (500) is located between the two second heat exchange components (400), and the path of the gas flow driven by the fan (500) is directed to the second vent (121); a frame component (140) is provided inside the shell (100), the first cavity (110) is located in the area between the shell (100) and the frame component (140), and the internal space of the frame component (140) constitutes the second cavity (120), so that the first cavity (110) and the second cavity (120) are isolated from each other.

2. The semiconductor dehumidification device according to claim 1, characterized in that: The two semiconductor refrigeration plates (200) and the two second heat exchange components (400) are arranged at intervals in the vertical direction, the second air vent (121) is opened at the top of the shell (100), and the shell (100) is provided with an air intake structure connected to the second cavity (120).

3. The semiconductor dehumidification device according to claim 1, characterized in that: The two semiconductor refrigeration plates (200) and the two second heat exchange components (400) are arranged at intervals in the horizontal direction, the second air vent (121) is arranged on the side wall of the shell (100), and the side wall of the shell (100) is provided with an air inlet (122) arranged face to face with the second air vent (121).

4. The semiconductor dehumidification device according to claim 1, characterized in that: The heat conducting member (410) has a contact plane that fits against the heating end of the semiconductor cooling plate (200), and a positioning groove (411) that matches the outer diameter of the copper pipe (420) is concavely arranged in the contact plane, and the two ends of the positioning groove (411) pass through the opposite sides of the heat conducting member (410), and a part of the copper pipe (420) is accommodated in the positioning groove (411) and can abut against the heating end of the semiconductor cooling plate (200), and the two ends of the copper pipe (420) respectively extend out of the two ends of the positioning groove (411) and extend horizontally in a direction away from the heat conducting member (410).

5. The semiconductor dehumidification device according to claim 4, characterized in that: It also includes a mounting strip (600), wherein both ends of the mounting strip (600) are respectively provided with a waist-shaped through hole (610), a bracket (130) for fixing the semiconductor cooling plate (200) is provided in the shell (100), and a mounting hole (131) opposite to the waist-shaped through hole (610) is provided on the bracket (130), and bolt fasteners are passed through the waist-shaped through hole (610) and the corresponding mounting hole (131) so that the mounting strip (600) presses the heat conducting member (410) against the bracket (130).

6. The semiconductor dehumidification device according to claim 1, characterized in that: The plurality of heat exchange fins (430) are aluminum fins and / or copper fins.

7. The semiconductor dehumidification device according to claim 1, characterized in that: A partition (150) is provided in the shell (100) and is arranged in a vertical direction. The partition (150) divides the internal space of the shell (100) into the first cavity (110) and the second cavity (120). The partition (150) is provided with a gas communication port (151) that connects the first cavity (110) and the second cavity (120).

8. The semiconductor dehumidification device according to claim 7, characterized in that: The partition plate (150) is provided with a switch mechanism for adjusting the opening size of the gas communication port (151).

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