Full-automatic chip detector

Abstract

The utility model relates to a full-automatic chip detection machine, which comprises a detection table, a fixing frame is fixedly arranged at the top of the detection table, a camera fine-tuning shaft is fixedly arranged outside the fixing frame, a marking structure is arranged outside the camera fine-tuning shaft, an infrared test camera is fixedly arranged at the bottom of the camera fine-tuning shaft, and the infrared test camera is fixedly arranged at the top of the detection table. The top of the detection bench is fixedly provided with a probe fine tuning platform, and the exterior of the probe fine tuning platform is provided with a probe vertical moving shaft. According to the full-automatic chip detection machine, chips are driven to be fed through the elevator upper and lower modules, and when the chips are pushed to the test platform through the material pushing structure, the test platform moves according to mutual cooperation of the Y-axis moving module and the X-axis moving module, so that the chips at the top of the test platform can be driven to move to the test probes; the chip is lightened through the test probe, and when the chip moves to the bottom of the infrared test camera, the chip is detected through the infrared test camera.

Description

Technical Field

[0001] The utility model relates to the technical field of chip detectors, in particular to a full-automatic chip detector. Background Art

[0002] Chip detectors play a crucial role in the semiconductor industry. They are key devices to ensure that the quality and performance of chips meet the design requirements. When LED chips are fixed on the PCP board, poor fixation may occur. After being lit by the chip detector, defective products are detected by a special chip detection camera, and then marked automatically to select the defective products.

[0003] After the LED chips are fixed to the PCB, chips with poor fixation may cause uneven brightness or no light, thus failing to achieve the required product effect. Ordinary cameras cannot detect defective products. It is necessary to select defective products, adopt an automatic detection device, and use a special chip test camera to automatically check and mark, effectively and precisely selecting the defective products. Therefore, a full-automatic chip detector is proposed to solve the above problems. Content of the Utility Model

[0004] Aiming at the deficiencies of the prior art, the utility model provides a full-automatic chip detector, which has the advantages of marking and removing defective chips, and solves the problems that after the LED chips are fixed to the PCB, chips with poor fixation may cause uneven brightness or no light, thus failing to achieve the required product effect, ordinary cameras cannot detect defective products, it is necessary to select defective products, adopt an automatic detection device, and use a special chip test camera to automatically check and mark, effectively and precisely selecting the defective products.

[0005] To achieve the above object, the utility model provides the following technical solution: A full-automatic chip detector, including a detection table, a detection structure is arranged on the top of the detection table, a test structure is arranged on the top of the detection table, a feeding structure is arranged on the top of the detection table, and a moving structure is arranged on the top of the detection table;

[0006] A fixing frame is fixedly installed on the top of the detection table, a camera fine-tuning shaft is fixedly installed outside the fixing frame, a marking structure is arranged outside the camera fine-tuning shaft, and an infrared test camera is fixedly installed at the bottom of the camera fine-tuning shaft;

[0007] A probe fine-tuning platform is fixedly installed on the top of the detection table, a probe up-and-down moving shaft is arranged outside the probe fine-tuning platform, and a test probe is arranged outside the probe up-and-down moving shaft;

[0008] An elevator up-and-down module is fixedly installed outside the inspection table. A cartridge layer number is arranged outside the elevator up-and-down module. A cartridge body is arranged outside the cartridge layer number. A pushing structure is arranged outside the elevator up-and-down module.

[0009] A Y-axis movement module is arranged on the top of the inspection table. An X-axis movement module is arranged outside the Y-axis movement module. A test platform is arranged outside the X-axis movement module.

[0010] Furthermore, the fixing frame is located above the Y-axis movement module, the X-axis movement module, and the test platform.

[0011] Furthermore, the test platform is close to the infrared test camera, and the bottom of the marking structure is close to the inspection table.

[0012] Furthermore, the elevator up-and-down module is close to the probe fine-tuning platform, and the pushing structure is close to the cartridge layer number.

[0013] Furthermore, the pushing structure is in contact with the cartridge body, and the elevator up-and-down module is located on the left side of the inspection table.

[0014] Furthermore, the Y-axis movement module is located on the right side of the inspection table, and the Y-axis movement module is located on the left side of the inspection table.

[0015] Compared with the prior art, the technical solution of the present application has the following beneficial effects:

[0016] For this fully automatic chip inspection machine, when the elevator up-and-down module drives the chip for loading and pushes the chip to the test platform through the pushing structure, the test platform is moved according to the mutual cooperation of the Y-axis movement module and the X-axis movement module, so as to drive the chip on the top of the test platform to move to the test probe. The chip is lit by the test probe. When the chip moves to the bottom of the infrared test camera, the chip is detected by the infrared test camera. When there are defective products, the marking structure will mark the chip, so as to achieve the purpose of selecting defective chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is an exploded view of the structure of the present utility model;

[0018] Figure 2 is an enlarged view of the inspection structure of the present utility model;

[0019] Figure 3 is an enlarged view of the test structure of the present utility model;

[0020] Figure 4 is an enlarged view of the loading structure of the present utility model;

[0021] Figure 5This is an enlarged view of the moving structure of the utility model.

[0022] In the figure: 1. Detection table; 2. Detection structure; 201. Fixed frame; 202. Camera fine-tuning shaft; 203. Marking structure; 204. Infrared test camera; 3. Test structure; 301. Probe fine-tuning platform; 302. Probe up and down movement shaft; 303. Test probe; 4. Loading structure; 401. Elevator up and down module; 402. Number of layers of the cartridge; 403. Cartridge body; 404. Pushing structure; 5. Moving structure; 501. Y-axis moving module; 502. X-axis moving module; 503. Test platform. Specific embodiments

[0023] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0024] Embodiment 1, in Figure 1 A fully automatic chip detector includes a detection table 1, a detection structure 2 is arranged on the top of the detection table 1, a test structure 3 is arranged on the top of the detection table 1, a loading structure 4 is arranged on the top of the detection table 1, and a moving structure 5 is arranged on the top of the detection table 1.

[0025] The detection table 1 bears the entire detector, making the entire device form a whole, facilitating the detection and selection of chips.

[0026] Embodiment 2, in Figure 2 A fixed frame 201 is fixedly installed on the top of the detection table 1, a camera fine-tuning shaft 202 is fixedly installed outside the fixed frame 201, a marking structure 203 is arranged outside the camera fine-tuning shaft 202, and an infrared test camera 204 is fixedly installed at the bottom of the camera fine-tuning shaft 202.

[0027] The chip test camera takes pictures of the lit chip area.

[0028] Embodiment 3, in Figure 3 A probe fine-tuning platform 301 is fixedly installed on the top of the detection table 1, a probe up and down movement shaft 302 is arranged outside the probe fine-tuning platform 301, and a test probe 303 is arranged outside the probe up and down movement shaft 302.

[0029] Probe test: The product position is moved to the probe position by the X-axis and Y-axis moving platform, and the probe test is raised to provide current and voltage to light up the chip.

[0030] Embodiment 4, inFigure 4 In it, an elevator up and down module 401 is fixedly installed outside the detection table 1. A cartridge layer number 402 is arranged outside the elevator up and down module 401. A cartridge body 403 is arranged outside the cartridge layer number 402. A material pushing structure 404 is arranged outside the elevator up and down module 401.

[0031] The feeding and discharging elevator structure is controlled to move up and down by a linear module and a motor. The product is pushed from the cartridge to the product fixing platform for testing, and the tested product is then sent back to the same-layer cartridge from the fixing platform.

[0032] Example Five, in Figure 5 In it, a Y-axis moving module 501 is arranged on the top of the detection table 1. An X-axis moving module 502 is arranged outside the Y-axis moving module 501. A test platform 503 is arranged outside the X-axis moving module 502.

[0033] The X-axis and Y-axis moving platform. After the product is fixed, it is moved left and right by the X-axis and moved forward and backward by the Y-axis to perform single-chip chip lighting tests for different rows and columns.

[0034] In summary, for this fully automatic chip detector, when the elevator up and down module 401 drives the chip for feeding and pushes the chip to the test platform 503 through the material pushing structure 404, the test platform 503 is moved according to the mutual cooperation of the Y-axis moving module 501 and the X-axis moving module 502, so as to drive the chip on the top of the test platform 503 to move to the test probe 303. The chip is lit by the test probe 303. When the chip moves to the bottom of the infrared test camera 204, the chip is detected by the infrared test camera 204. When there are defective products, the marking structure 203 will mark the chip, so as to achieve the purpose of selecting defective chips, solving the problem that after the LED chip and the PCB are fixed, there will be chips that are not fixed properly, resulting in uneven or non-brightness, thus not meeting the requirements of the product effect. Ordinary cameras cannot detect defective products, and defective products need to be selected. By using an automatic detection device and a special chip test camera for automatic inspection and marking, the defective products can be accurately selected effectively.

[0035] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements not only includes those elements but also includes other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the phrase "comprising a..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the element.

[0036] Although embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A fully automatic chip testing machine, comprising a testing platform (1), characterized in that: The top of the detection platform (1) is provided with a detection structure (2), the top of the detection platform (1) is provided with a test structure (3), the top of the detection platform (1) is provided with a feeding structure (4), and the top of the detection platform (1) is provided with a moving structure (5); A fixing frame (201) is fixedly mounted on the top of the test platform (1); a camera fine-tuning shaft (202) is fixedly mounted on the outside of the fixing frame (201); a marking structure (203) is arranged on the outside of the camera fine-tuning shaft (202); and an infrared test camera (204) is fixedly mounted on the bottom of the camera fine-tuning shaft (202); A probe fine-tuning platform (301) is fixedly mounted on the top of the detection platform (1); a probe up-and-down moving shaft (302) is arranged outside the probe fine-tuning platform (301); and a test probe (303) is arranged outside the probe up-and-down moving shaft (302); An elevator upper and lower module (401) is fixedly installed on the outside of the inspection platform (1), a material box layer (402) is arranged on the outside of the elevator upper and lower module (401), a material box body (403) is arranged on the outside of the material box layer (402), and a material pushing structure (404) is arranged on the outside of the elevator upper and lower module (401); A Y-axis moving module (501) is arranged on the top of the detection platform (1), an X-axis moving module (502) is arranged outside the Y-axis moving module (501), and a test platform (503) is arranged outside the X-axis moving module (502).

2. A fully automatic chip inspection machine according to claim 1, characterized in that: The fixing frame (201) is located above the Y-axis moving module (501), the X-axis moving module (502) and the testing platform (503).

3. The fully automatic chip inspection machine according to claim 1, characterized in that: The test platform (503) is close to the infrared test camera (204), and the bottom of the marking structure (203) is close to the detection platform (1).

4. The fully automatic chip inspection machine according to claim 1, characterized in that: The elevator upper and lower modules (401) are close to the probe fine-tuning platform (301), and the material pushing structure (404) is close to the material box layer (402).

5. The fully automatic chip inspection machine according to claim 1, characterized in that: The material pushing structure (404) is fitted with the material box body (403), and the upper and lower elevator modules (401) are located on the left side of the detection platform (1).

6. The fully automatic chip inspection machine according to claim 1, characterized in that: The Y-axis moving module (501) is located on the right side of the detection platform (1), and the Y-axis moving module (501) is located on the left side of the detection platform (1).

Images