Adjustable support for testing semiconductor chip

Abstract

The utility model discloses an adjustable support for testing a semiconductor chip, and relates to the technical field of chip testing. The adjustable support for testing the semiconductor chip comprises a support body, a servo motor is arranged under the support body in a limiting mode, the servo motor is limited on an installation column at the top of the support body, a testing module connected with the output end of the servo motor through a coupler is rotationally installed at the top of the installation column, and the testing module comprises an installation frame which is internally provided with an embedding groove; an annular testing seat located in the embedding groove is rotationally installed on the installation frame, the annular testing seat is integrally hollow, and scanners are axially arranged on the inner wall of the annular testing seat. According to the utility model, the annular test seat on the mounting rack rotates along with the mounting rack in the process of circular motion, so that both the chip in the annular test seat and the scanner for scanning the chip complete rotation, and the annular test seat still longitudinally rotates in the process of horizontal rotation, so that the scanning range of the scanner is further expanded; and the comprehensiveness in the packaging test of the semiconductor chip is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of chip testing, in particular to an adjustable bracket for semiconductor chip testing. Background Technique

[0002] A semiconductor chip is an integrated circuit. When processing and producing, it is necessary to test the components on the semiconductor chip to obtain various data and performances of the components. When testing a semiconductor, it needs to be installed on a bracket and tested through a testing device. The existing testing brackets can only test semiconductor chips of a specific size. When replacing a semiconductor chip with a larger size, it is necessary to replace the test pin board of the same size on the bracket, which is inconvenient to use.

[0003] For example, an adjustable bracket for semiconductor chip testing disclosed in Chinese Patent Publication No. CN213688425U. The adjustable bracket is provided with an L-shaped fixing plate, a fixing frame, an L-shaped rod and a second telescopic rod. When replacing a large-size chip, the distance between the two L-shaped fixing plates increases, driving the fixing frames on the two first telescopic rods to move away from each other, pulling the two L-shaped rods to rotate, so that the two second telescopic rods extend downward, and the lower pressing plates on the rear sides of the bottoms of the two second telescopic rods respectively press the two connecting plates downward, so that the two connecting plates move downward. By installing connecting plates on both sides of the pin board and moving the two connecting plates downward so that the probes at their bottoms are at the same height as the probes at the bottom of the pin board, the large-size chip can be tested, thereby improving the applicability of chip testing.

[0004] The above device completes the detection of the chip operation state by inserting the probe into the chip. However, due to the pressing and fixing of the chip and the fixing of the pin board for installing the probe, it is difficult to complete the appearance test of whether there are obvious physical damages, defects or poor encapsulation in each part of the semiconductor chip during the encapsulation detection of the semiconductor chip. Content of the Utility Model

[0005] Aiming at the deficiencies of the prior art, the utility model provides an adjustable bracket for semiconductor chip testing, which solves the problems put forward in the above background technique.

[0006] To achieve the above purposes, the utility model is realized through the following technical solutions: An adjustable bracket for semiconductor chip testing, including a bracket and legs fixedly installed on four sides of the bracket. A servo motor is limitedly arranged directly below the bracket. An installation column limited to the top of the bracket is rotatably installed on the output end of the servo motor. A testing module connected to the output end of the servo motor through a coupling is rotatably installed on the top of the installation column;

[0007] The test module includes a mounting bracket connected to a servo motor. A fitting groove is provided inside the mounting bracket. An annular test seat located in the fitting groove is rotatably mounted on the mounting bracket. The annular test seat is hollow as a whole, and scanners are axially arranged on its inner wall. The servo motor drives the test module on the mounting column to rotate. Therefore, during the circular motion of the mounting bracket, the annular test seat thereon rotates accordingly. Thus, the chips in the annular test seat and the scanners for scanning the chips both complete rotation. Further, during the horizontal rotation of the annular test seat, there is still longitudinal rotation, further expanding the scanning range of the scanners and ensuring comprehensiveness in the semiconductor chip packaging test, avoiding test dead angles.

[0008] A further improvement of the technical solution of the present utility model is that in order to cause the annular test seat to have longitudinal rotation during the horizontal rotation following the mounting bracket, thereby improving the detection range and scanning angle. Therefore, a toothed plate is welded to the outer wall end face of the annular test seat. A gear is provided in the fitting groove. A rotating shaft is rotatably mounted on the mounting bracket. The toothed plate is meshed and connected with the gear.

[0009] A further improvement of the technical solution of the present utility model is that a first bevel gear is fixedly mounted on the mounting column, and the first bevel gear is meshed and connected with a second bevel gear. The second bevel gear is mounted on the rotating shaft through a connection key. In the above, the first bevel gear is on the mounting column, and because the mounting column is rotationally connected to the servo motor, when the second bevel gear rotates with the horizontal circular motion of the mounting bracket on the rotating shaft, the second bevel gear meshes with the fixed first bevel gear and then rotates. Therefore, during the rotation of the mounting bracket, the torque force causes the gear and the toothed plate to rotate, finally completing the rotation of the longitudinal position of the annular test seat.

[0010] A further improvement of the technical solution of the present utility model is that extension plates are symmetrically and fixedly mounted at the left and right ends of the mounting bracket. A partition is connected to the top of the extension plate through a fastening limit. Electric control push rods are limit-mounted at the left and right ends of the partition, and the other ends of the electric control push rods are fixedly connected to a limit plate.

[0011] A further improvement of the technical solution of the present utility model is that the limit plate is integrally concave, and when the two limit plates are abutted against each other, the whole is in a closed state. Suction cups are arranged in an array on the inner wall end face of the limit plate. For the limit fixation of semiconductor chip testing, through the propulsion of the limit plate by the electric control push rod, the mutual approximation of the two partitions is completed, and finally the suction cups on it complete the adsorption and fixation of both ends of the semiconductor chip, avoiding damage to the chip or breakage of the outer shell caused by direct pressing.

[0012] A further improvement of the technical solution of the present utility model is that air pipes matching the number of suction cups are limit-connected to the limit plate, and the air pipes are fixedly connected to the suction cups.

[0013] Compared with the prior art, the beneficial effects of the utility model are as follows: during the circular motion of the mounting rack, the annular test seat thereon rotates accordingly. Therefore, both the chip in the annular test seat and the scanner for scanning the chip complete rotation. During the horizontal rotation of the annular test seat, there is still longitudinal rotation, further expanding the scanning range of the scanner, ensuring comprehensiveness in the packaging test of semiconductor chips, and avoiding test dead angles.

[0014] Through the propulsion of the limit plate by the electric control push rod, the mutual approach of the two side partitions is completed, and finally the suction cups thereon complete the adsorption and fixation of both ends of the semiconductor chip, avoiding chip damage or shell breakage caused by direct pressing. Brief Description of the Drawings

[0015] Figure 1 It is a schematic diagram of the overall structure in the adjustable bracket for semiconductor chip testing;

[0016] Figure 2 It is a front view of the adjustable bracket for semiconductor chip testing;

[0017] Figure 3 It is a schematic diagram of the relevant structure of the annular test seat in the adjustable bracket for semiconductor chip testing;

[0018] Figure 4 It is a schematic diagram of the structure of the mounting rack in the adjustable bracket for semiconductor chip testing.

[0019] In the figure: 1, bracket; 2, leg; 3, servo motor; 4, mounting column;

[0020] 41, mounting rack; 42, fitting groove; 43, annular test seat; 44, rotating shaft; 45, bevel gear 1;

[0021] 42a, gear;

[0022] 43a, scanner; 43b, toothed plate;

[0023] 44a, bevel gear 2;

[0024] 5, extension plate; 51, partition; 52, electric control push rod; 53, limit plate; 54, suction cup;

[0025] 54a, air pipe. Detailed Embodiments

[0026] The following will describe in detail various exemplary embodiments, features, and aspects of the present application with reference to the drawings. The same reference numerals in the drawings denote elements with the same or similar functions. Although various aspects of the embodiments are shown in the drawings, the drawings do not have to be drawn to scale unless otherwise specified.

[0027] As used herein, the term "exemplary" means "serving as an example, embodiment, or illustration". Any embodiment described as "exemplary" herein need not be construed as superior to or better than other embodiments.

[0028] In addition, for a better illustration of the present application, numerous specific details are given in the following specific embodiments. Those skilled in the art should understand that the present application can also be implemented without certain specific details. In some instances, methods, means, and elements well-known to those skilled in the art are not described in detail so as to highlight the gist of the present application.

[0029] Referring to Figures 1 - 4 , the present utility model provides three technical solutions:

[0030] Embodiment 1:

[0031] An adjustable bracket for semiconductor chip testing, comprising a bracket 1 and legs 2 fixedly installed on the four sides of the bracket 1. A servo motor 3 is limitedly arranged directly below the bracket 1. An installation column 4 limited to the top of the bracket 1 is rotatably installed on the output end of the servo motor 3. A test module connected to the output end of the servo motor 3 through a coupling is rotatably installed on the top of the installation column 4;

[0032] The test module includes a mounting frame 41 connected to the servo motor 3. A fitting groove 42 is arranged inside the mounting frame 41. An annular test seat 43 rotatably installed in the mounting frame 41 is located in the fitting groove 42. The annular test seat 43 is hollow as a whole and scanners 43a are axially arranged on its inner wall.

[0033] In this embodiment, the servo motor 3 drives the test module on the installation column 4 to rotate. Therefore, during the circular motion of the mounting frame 41, the annular test seat 43 thereon rotates accordingly. Thus, the chips in the annular test seat 43 and the scanners 43a for scanning the chips all complete rotation. Further, during the horizontal rotation of the annular test seat 43, there is still longitudinal rotation, further expanding the scanning range of the scanners 43a and ensuring comprehensiveness in semiconductor chip package testing to avoid test dead angles.

[0034] In order to enable the annular test seat 43 to have longitudinal rotation during the horizontal rotation following the mounting frame 41, thereby improving the detection range and scanning angle. Therefore, a toothed plate 43b is welded to the outer wall end face of the annular test seat 43. A gear 42a is arranged in the fitting groove 42. A rotating shaft 44 is rotatably installed on the mounting frame 41. The toothed plate 43b is meshed and connected with the gear 42a.

[0035] A first bevel gear 45 is fixedly installed on the installation column 4, and the first bevel gear 45 is meshed and connected with a second bevel gear 44a. The second bevel gear 44a is installed on the rotating shaft 44 through a connection key.

[0036] In the above, the first bevel gear 45 is on the mounting post 4, and because the mounting post 4 is rotationally connected to the servo motor 3, when the second bevel gear 44a rotates horizontally in a circle along with the mounting frame 41 on the rotating shaft 44, the second bevel gear 44a meshes with the fixed first bevel gear 45 and then rotates. Therefore, during the rotation of the mounting frame 41, the torque force causes the gear 42a and the toothed plate 43b to rotate, and finally the longitudinal position of the annular test seat 43 is rotated.

[0037] Embodiment 2:

[0038] Based on Embodiment 1:

[0039] Extension plates 5 are symmetrically and fixedly installed at the left and right ends of the mounting frame 41. The top of the extension plate 5 is connected to the partition plate 51 through a fastening limit connection. Electric control push rods 52 are installed at the left and right ends of the partition plate 51 in a limited manner, and the other end of the electric control push rod 52 is fixedly connected to the limit plate 53.

[0040] The limit plate 53 is integrally concave, and when the two limit plates 53 are abutted against each other, the whole is in a closed state. Suction cups 54 are arranged in an array on the inner wall end face of the limit plate 53.

[0041] In this embodiment, for the limit fixation of the semiconductor chip test, through the electric control push rod 52 pushing the limit plate 53, the two partition plates 51 are brought closer to each other, and finally the suction cups 54 on them complete the adsorption and fixation of both ends of the semiconductor chip, avoiding chip damage or shell breakage caused by direct pressing.

[0042] Air pipes 54a with a quantity matching that of the suction cups 54 are connected to the limit plate 53 in a limited manner, and the air pipes 54a are fixedly connected to the suction cups 54.

[0043] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variation thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device.

[0044] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An adjustable support for testing semiconductor chips, comprising a support (1) and legs (2) fixedly mounted on four sides of the support (1), characterized in that: A servo motor (3) is limitedly arranged just below the bracket (1); a mounting column (4) limitedly located at the top of the bracket (1) is rotatably mounted on the output end of the servo motor (3); a test module connected to the output end of the servo motor (3) via a coupling is rotatably mounted on the top of the mounting column (4); The test module comprises a mounting frame (41) connected to a servo motor (3), wherein an engaging groove (42) is arranged in the mounting frame (41), and an annular test seat (43) located in the engaging groove (42) is rotatably mounted on the mounting frame (41), wherein the annular test seat (43) is hollow as a whole and a scanner (43a) is axially arranged on its inner wall.

2. The adjustable support for semiconductor chip testing according to claim 1, characterized in that: A toothed plate (43b) is welded on the outer wall end face of the annular test seat (43), a gear (42a) is arranged in the engaging groove (42), a rotating shaft (44) is rotatably mounted on the mounting frame (41), and the toothed plate (43b) is meshingly connected with the gear (42a).

3. The adjustable support for semiconductor chip testing according to claim 2, characterized in that: The mounting column (4) is fixedly mounted with a bevel gear 1 (45), and the bevel gear 1 (45) is meshingly connected with a bevel gear 2 (44a), and the bevel gear 2 (44a) is mounted on the rotating shaft (44) via a connecting key.

4. The adjustable support for semiconductor chip testing according to claim 1, characterized in that: Extension plates (5) are symmetrically fixedly installed at the left and right ends of the mounting frame (41); the top of the extension plate (5) is connected to a partition plate (51) by a fastening limiter; electric control push rods (52) are limitedly installed at the left and right ends of the partition plate (51); the other end of the electric control push rod (52) is fixedly connected to a limiter plate (53).

5. The adjustable support for semiconductor chip testing according to claim 4, characterized in that: The limiting plates (53) are concave in shape as a whole, and are in a closed state as a whole after the two limiting plates (53) are in contact with each other, and suction cups (54) are arranged in an array on the inner wall end surfaces of the limiting plates (53).

6. The adjustable support for semiconductor chip testing according to claim 5, characterized in that: The upper limit of the limit plate (53) is connected to air pipes (54a) whose number matches the suction cup (54), and the air pipes (54a) are fixedly connected to the suction cup (54).

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