Testing tool for integrated circuit chip

Abstract

The utility model relates to the technical field of test tools, and discloses a test tool for an integrated circuit chip, which comprises a test board, the middle part of the test board is rotatably connected with a rotating table, the upper surface of the test board is provided with a plurality of placing tables which are arrayed by taking the rotating table as an axis, and the lower surface of the rotating table is provided with a driving motor for driving the rotating table to rotate. An L-shaped bearing frame is fixedly installed in the middle of the upper surface of the rotating table, a telescopic device is fixedly installed on the lower side face of the end, away from the rotating table, of the bearing frame, a fixing plate is fixedly installed at the telescopic lower end of the telescopic device, a testing plate is arranged on the lower surface of the fixing plate, and a plurality of testing probes are arranged on the lower surface of the testing plate. According to the integrated circuit chip testing device, integrated circuit chips to be tested and tested are sequentially and alternately placed and taken out, the driving motor is matched with the telescopic device to drive the testing plate and the testing probe to test the integrated circuit chips on the placing table, the waiting time needed in the testing process is shortened, and then the efficiency in the testing process of the integrated circuit chips is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of test tooling, in particular to a test tooling for integrated circuit chips. Background Technique

[0002] An integrated circuit fabricated on the surface of a semiconductor chip is also called a thin-film integrated circuit. Another type of thick-film integrated circuit is a miniaturized circuit composed of independent semiconductor devices and passive components integrated into a substrate or circuit board. Before the integrated circuit board is encapsulated, it is necessary to test its circuit chips to ensure its ex-factory quality, so test tooling is required.

[0003] In order to improve the efficiency of testing integrated circuit chips, many improvements have been made to the test tooling for integrated circuit chips in the prior art. For example, the patent with the publication number CN219266460U discloses a test tooling for integrated circuit chips, which relates to the technical field of circuit chips. It includes a device body, and the device body includes a workbench, a workbench component, a column, and a test component. Two columns are fixedly connected to one end of the workbench, and test components are connected to the upper ends of the columns. A workbench component is provided on the upper end of the workbench. The workbench component includes a controller, an operation panel, and a limiting plate. A controller is fixedly connected to one end of the top of the workbench, an operation panel is fixedly connected to the top of the workbench, and a limiting plate is connected to the upper end of the operation panel. The number of the limiting plates is two. The test component includes a top plate, a telescopic rod, a connecting plate, a test plate, screws, and test probes. Through the setting of the test component, by providing two test components, the working efficiency is improved to a certain extent, and it is easy to disassemble and is suitable for the test work of different integrated circuit chips, making the applicability of the device enhanced.

[0004] The above patent has obvious beneficial effects, but there are still the following deficiencies in actual operation:

[0005] In the above patent, two groups of test components are set to test the integrated circuit chips respectively. In reality, when testing, the integrated circuit chips need to be placed in the limiting plate and tested by the test components. After the test is completed, the integrated circuit chips in the limiting plate need to be taken out, and then the integrated circuit chips to be tested are placed again. The test components need to wait for the time of taking out and placing the integrated circuit chips, and a certain amount of time is wasted in this process. Therefore, the test efficiency of the integrated circuit chips in the above patent still needs to be improved. Therefore, it is urgent for this field to improve the test tooling for integrated circuit chips to solve the defects of the prior art. Content of the Utility Model

[0006] Aiming at the deficiencies of the prior art, the utility model provides a test tooling for integrated circuit chips, which reduces the waiting time required during testing, thereby improving the efficiency of testing integrated circuit chips.

[0007] To achieve the above object, the utility model provides the following technical solution: A test tooling for integrated circuit chips, including a test bench, a rotating table is rotatably connected to the middle of the test bench, several placing tables are arranged on the upper surface of the test bench in an array with the rotating table as the axis, a driving motor for driving the rotation of the rotating table is arranged on the lower surface of the rotating table, a carrier frame in an L shape is fixedly installed in the middle of the upper surface of the rotating table, a telescopic device is fixedly installed on the lower side of the end of the carrier frame away from the rotating table, a fixing plate is fixedly installed at the telescopic lower end of the telescopic device, a test board is fixedly installed on the lower surface of the fixing plate, several test probes are arranged on the lower surface of the test board, and positioning units for positioning are arranged on multiple sides of each placing table.

[0008] Preferably, the positioning unit includes clamping plates arranged on multiple sides of each placing table, one side of each clamping plate close to the placing table is fixedly connected with a guiding column whose one end penetrates through the side of the placing table, a first opening groove is formed on the side of the placing table, a first spring sleeved on the side of the guiding column is fixedly connected between the inner side wall of the first opening groove and the clamping plate, installation cavities are formed on the upper surface of the test bench and the lower surface of each placing table, a rotating shaft is rotatably connected to the bottom of the installation cavity, a rotating disk adapted to the position of one end of the guiding column is arranged on the side of the upper end of the rotating shaft, several arc-shaped convex blocks adapted to the guiding column are fixedly connected to the side of the rotating disk, and a driving unit for driving the rotation of the rotating shaft is arranged in the installation cavity.

[0009] Preferably, the driving unit includes several pulling rods penetrating through the side of the test bench and one end of which extends into the installation cavity, a rack plate is fixedly connected to the end of the pulling rod located in the installation cavity, a tooth groove adapted to the rack plate is formed on the side of the rotating shaft, and the end of the pulling rod away from the rack plate extends to the outside.

[0010] Preferably, a pulling plate is fixedly connected to the end of the pulling rod extending to the outside, a second opening groove is formed on the side of the test bench, and a second spring sleeved on the side of the pulling rod is fixedly connected between the inner side wall of the second opening groove and one side of the pulling plate.

[0011] Preferably, a polygonal insertion shaft is fixedly connected to the upper end of the rotating shaft, and the rotating disk is sleeved on the side of the insertion shaft.

[0012] Preferably, an installation plate is fixedly connected to the side of each placing table, and the installation plate is fixedly installed on the upper surface of the test bench through fasteners.

[0013] Preferably, the cross section of the guiding column is polygonal.

[0014] In view of the deficiencies of the prior art, the present utility model provides a test tooling for integrated circuit chips, which overcomes the deficiencies of the prior art. The beneficial effects of the present utility model are as follows:

[0015] 1. In the present utility model, the number of placement tables is at least two. By alternately placing and removing the integrated circuit chips to be tested and those that have been tested in sequence, the driving motor cooperates with the telescopic device to drive the test board and test probe to test the integrated circuit chips on the placement table, reducing the waiting time required for testing, and thus improving the efficiency of testing the integrated circuit chips.

[0016] 2. In the present utility model, when the pulling rod moves, it can drive the rotating shaft to rotate through the rack plate, and the arc-shaped convex block can squeeze the guide post to move. Cooperating with the first spring and the second spring, several clamping plates can center and clamp the integrated circuit chips on the placement table, facilitating the centering and limiting fixation of the integrated circuit chips, and improving the stability of testing the integrated circuit chips.

[0017] 3. In the present utility model, by setting the mounting plate and the insertion shaft, the placement table and the rotating disk can be replaced according to the size of the integrated circuit chip to be tested, improving the applicable range of the overall test tooling.

[0018] Other features and advantages of the present utility model will be described in the subsequent description, and part of them will be obvious from the description, or understood by implementing the present utility model. The objectives and other advantages of the present utility model can be achieved and obtained through the structures pointed out in the description, claims, and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The drawings are used to provide a further understanding of the present utility model, and constitute a part of the description. Together with the embodiments of the present utility model, they are used to explain the present utility model, and do not constitute a limitation to the present utility model.

[0020] Figure 1 It is a schematic structural diagram of the overall side and top view of the present utility model;

[0021] Figure 2 It is a schematic structural diagram of the overall side and bottom view of the present utility model;

[0022] Figure 3 It is a schematic structural diagram of partial cross-section of the test table and placement table in the present utility model;

[0023] Figure 4 It is a schematic structural diagram of the rotating disk and arc-shaped convex block in the present utility model;

[0024] Figure 5 For Figure 3 the enlarged structural diagram at A in

[0025] Figure 6 For Figure 4 The enlarged structural schematic diagram at position B in

[0026] Figure 7 For Figure 4 The enlarged structural schematic diagram at position C in

[0027] In the figure: 1, test bench; 2, placement table; 3, rotating table; 4, driving motor; 5, bearing frame; 6, telescopic device; 7, fixing plate; 8, test plate; 9, test probe; 10, positioning unit; 11, clamping plate; 12, guide post; 13, first opening groove; 14, first spring; 15, installation cavity; 16, rotating shaft; 17, rotating disk; 18, arc-shaped convex block; 19, driving unit; 20, pulling rod; 21, rack plate; 22, tooth groove; 23, pulling plate; 24, second opening groove; 25, second spring; 26, inserting shaft; 27, mounting plate. Specific embodiments

[0028] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0029] Embodiment 1

[0030] Please refer to Figures 1-7 , a test tool for integrated circuit chips, including a test bench 1, a rotating table 3 is rotatably connected to the middle of the test bench 1, a plurality of placement tables 2 are arranged on the upper surface of the test bench 1 in an array centered on the rotating table 3, a driving motor 4 for driving the rotating table 3 to rotate is arranged on the lower surface of the rotating table 3, a bearing frame 5 in an L shape is fixedly installed in the middle of the upper surface of the rotating table 3, a telescopic device 6 is fixedly installed on the lower side of the end of the bearing frame 5 away from the rotating table 3, a fixing plate 7 is fixedly installed at the telescopic lower end of the telescopic device 6, a test plate 8 is fixedly installed on the lower surface of the fixing plate 7, a plurality of test probes 9 are arranged on the lower surface of the test plate 8, and a positioning unit 10 for positioning is arranged on multiple sides of each placement table 2.

[0031] Specific implementation method in this embodiment: The test board 8 and the test probe 9 in this embodiment are used to test the integrated circuit chip. When it is necessary to test the integrated circuit chip, place the integrated circuit chip on the placement table 2 and fix its position through the positioning unit 10. By starting the drive motor 4, the output end of the drive motor 4 drives the rotating table 3 to rotate. The rotating table 3 drives the carrier 5 to rotate, and the carrier 5 drives the test board 8 to move directly above the already placed integrated circuit chip. Then start the telescopic device 6, and the telescopic end of the telescopic device 6 drives the test board 8 to move downward. The test probe 9 contacts the contacts of the integrated circuit chip and tests the integrated circuit chip. During the test process, the tester places the integrated circuit chip to be tested on another placement table 2 and limits its position through the positioning unit 10. After the previous integrated circuit chip is tested, the telescopic end of the telescopic device 6 drives the test board 8 to move upward. At the same time, the drive motor 4 is started again to drive the test board 8 to move above the next integrated circuit chip that has been limited in position, and test it again. Then the tester takes out the integrated circuit chip that has been tested before and puts in the integrated circuit chip to be tested again. The number of placement tables 2 is at least two, which can be determined according to the actual test speed. Through the above settings, the waiting time required for testing is reduced, thereby improving the efficiency of testing the integrated circuit chip. At the same time, the above-mentioned test board 8 is installed on the lower surface of the fixed plate 7 through fasteners and can be replaced according to different integrated circuit chips.

[0032] Among them, both the above-mentioned drive motor 4 and the telescopic device 6 can be purchased on the market. They belong to mature technologies and have been fully disclosed, so they will not be repeated in the specification. Both the drive motor 4 and the telescopic device 6 are equipped with power connection lines, and they are electrically connected to the external main controller and 220V phase voltage (or 380V line voltage) through the power lines. And the main controller can be a conventional known device such as a computer that plays a control role.

[0033] Embodiment Two

[0034] Please refer to Figures 3-7, This embodiment includes the above-mentioned embodiment. Among them, the positioning unit 10 includes clamping plates 11 provided on multiple sides of each placement table 2. On one side of each clamping plate 11 close to the placement table 2, a guiding column 12 with one end passing through the side of the placement table 2 is fixedly connected. A first opening groove 13 is formed on the side of the placement table 2. A first spring 14 sleeved on the side of the guiding column 12 is fixedly connected between the inner side wall of the first opening groove 13 and the clamping plate 11. Installation cavities 15 are provided on the upper surface of the test bench 1 and the lower side of each placement table 2. A rotating shaft 16 is rotatably connected to the bottom of the installation cavity 15. On the side of the upper end of the rotating shaft 16, there is a rotating disk 17 adapted to the position of one end of the guiding column 12. A number of arc-shaped convex blocks 18 adapted to the guiding column 12 are fixedly connected to the side of the rotating disk 17. A driving unit 19 for driving the rotation of the rotating shaft 16 is provided in the installation cavity 15. The driving unit 19 includes a number of pulling rods 20 passing through the side of the test bench 1 and with one end extending into the installation cavity 15. At the end of the pulling rod 20 located in the installation cavity 15, a rack plate 21 is fixedly connected. A tooth groove 22 adapted to the rack plate 21 is formed on the side of the rotating shaft 16. The end of the pulling rod 20 away from the rack plate 21 extends to the outside. A pulling plate 23 is fixedly connected to the end of the pulling rod 20 extending to the outside. A second opening groove 24 is formed on the side of the test bench 1. A second spring 25 sleeved on the side of the pulling rod 20 is fixedly connected between the inner side wall of the second opening groove 24 and one side of the pulling plate 23.

[0035] Specific implementation method in this embodiment: When it is necessary to place the integrated circuit chip on the placement table 2, move the pulling plate 23 in the direction away from the test bench 1. The pulling plate 23 drives the pulling rod 20 to move. At this time, the second spring 25 is stretched. The pulling rod 20 drives the rack plate 21 to move. The rack plate 21 drives the rotation of the rotating shaft 16 through meshing with the tooth groove 22. The rotating shaft 16 drives the rotating disk 17 to rotate. The rotating disk 17 drives the arc-shaped convex blocks 18 to move. The arc-shaped convex blocks 18 squeeze and push a number of guiding columns 12 to move away from each other, thereby driving a number of clamping plates 11 to move away from each other. At this time, the first spring 14 is stretched. The tester places the integrated circuit chip on the placement table 2 and releases the pulling plate 23. The contraction force of the second spring 25 drives the pulling rod 20 to reset. At the same time, the rack plate 21 drives the rotating shaft 16 to rotate in the reverse direction. The arc-shaped convex blocks 18 are separated from one end of the guiding column 12. At this time, the contraction force of the first spring 14 drives the clamping plates 11 to move towards each other. A number of clamping plates 11 center and clamp the integrated circuit chip on the placement table 2, facilitating the centering and limit fixation of the integrated circuit chip, and improving the stability during the test of the integrated circuit chip.

[0036] Embodiment Three

[0037] Please refer to Figure 3 、 Figure 4 and Figure 5, this embodiment includes all of the above embodiments, and further includes: a polygonal plug shaft 26 is fixedly connected to the upper end of the rotating shaft 16, the rotating disk 17 is sleeved on the side surface of the plug shaft 26, a mounting plate 27 is fixedly connected to the side of each placement table 2, the mounting plate 27 is fixedly installed on the upper surface of the test bench 1 through fasteners, and the cross-section of the guide post 12 is polygonal.

[0038] Specific implementation manner in this embodiment: The placement table 2 is installed by threading the fasteners through the mounting plate 27 and connecting it to the upper surface of the test bench 1 in a threaded manner. The placement table 2 can be replaced according to the size of the integrated circuit chip to be tested. At the same time, the rotating disk 17 can be replaced. The rotating disk 17 with the adapted arc-shaped convex block 18 is sleeved on the side surface of the plug shaft 26 to improve the applicable range of the overall test tooling. The polygonal cross-section of the guide post 12 can prevent the first spring 14 from deforming radially, and at the same time, the clamping plate 11 can be limited.

[0039] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A test tool for integrated circuit chips, comprising a test bench (1), characterized in that: The middle part of the test table (1) is rotatably connected to a rotating table (3); the upper surface of the test table (1) is provided with a plurality of placement tables (2) arranged in an axial array along the rotating table (3); the lower surface of the rotating table (3) is provided with a driving motor (4) for driving the rotating table (3) to rotate; an L-shaped support frame (5) is fixedly installed in the middle part of the upper surface of the rotating table (3); a telescopic device (6) is fixedly installed on the lower side surface of one end of the support frame (5) away from the rotating table (3); a fixed plate (7) is fixedly installed on the telescopic lower end of the telescopic device (6); a test board (8) is fixedly installed on the lower surface of the fixed plate (7); a plurality of test probes (9) are provided on the lower surface of the test board (8); and each of the placement tables (2) is provided with a positioning unit (10) for positioning on multiple side surfaces.

2. The integrated circuit chip testing tool according to claim 1, characterized in that: The positioning unit (10) comprises a clamping plate (11) arranged on multiple sides of each placement platform (2), and a side of each clamping plate (11) close to the placement platform (2) is fixedly connected to a guide column (12) having one end passing through the side of the placement platform (2), and a first opening groove (13) is opened on the side of the placement platform (2), and a first spring (14) sleeved on the side of the guide column (12) is fixedly connected between the inner side wall of the first opening groove (13) and the clamping plate (11), and the test platform ( 1) An installation cavity (15) is provided on the upper surface and the lower side of each placement platform (2); a rotating shaft (16) is rotatably connected to the bottom of the installation cavity (15); a rotating disk (17) adapted to the position of one end of the guide column (12) is provided on the upper side of the rotating shaft (16); a plurality of arc-shaped protrusions (18) adapted to the guide column (12) are fixedly connected to the side of the rotating disk (17); and a driving unit (19) for driving the rotating shaft (16) to rotate is provided in the installation cavity (15).

3. The integrated circuit chip testing tool according to claim 2, characterized in that: The driving unit (19) comprises a plurality of pulling rods (20) penetrating the side of the test bench (1) and one end of which extends into the installation cavity (15); the end of the pulling rod (20) located in the installation cavity (15) is fixedly connected to a rack plate (21); a tooth groove (22) adapted to the rack plate (21) is provided on the side of the rotating shaft (16); and one end of the pulling rod (20) away from the rack plate (21) extends to the outside.

4. The integrated circuit chip testing tool according to claim 3, characterized in that: One end of the pulling rod (20) extending to the outside is fixedly connected to a pulling plate (23), a second opening groove (24) is opened on the side of the test bench (1), and a second spring (25) sleeved on the side of the pulling rod (20) is fixedly connected between the inner side wall of the second opening groove (24) and one side of the pulling plate (23).

5. The integrated circuit chip testing tool according to claim 2, characterized in that: The upper end of the rotating shaft (16) is fixedly connected to a polygonal plug-in shaft (26), and the rotating disk (17) is sleeved on the side of the plug-in shaft (26).

6. The integrated circuit chip testing tool according to claim 1, characterized in that: A mounting plate (27) is fixedly connected to the side of each placement table (2), and the mounting plate (27) is fixedly mounted to the upper surface of the test table (1) via fasteners.

7. The integrated circuit chip testing tool according to claim 2, characterized in that: The cross section of the guide column (12) is polygonal.

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