Surface-mounted potentiometer

By using a combination of ceramic substrate and high-temperature resistant materials, the problem of unstable structure and poor heat dissipation at high temperatures is solved, and the stable resistance value adjustment and good hand feel in the patch process are achieved.

CN223051948UActive Publication Date: 2025-07-01WENZHOU TAIKANG INTELLIGENT ELECTRONICS CO LTD
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Patent Information

Application Number
CN202421877814.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-05
Publication Date
2025-07-01
Estimated Expiration
2034-08-05

AI Technical Summary

Technical Problem

Existing potentiometers cannot be used as patch components because of their poor heat dissipation, easy structure to deform, and cannot withstand the high temperature of reflow soldering, resulting in large errors in the adjustment of resistance value.

Method used

A ceramic substrate with composite resistor sheet is used to replace the PCB board, the pin sheet is thickened and fixed, combined with the slider movement method, high-temperature resistant materials such as brass silver-covered and ruthenium-containing resistors are used, and the shell is made of tin plates to ensure structural stability and heat dissipation.

Benefits of technology

It achieves the structure without deformation at high temperature, and the resistance value adjustment is accurate. It is suitable for patch technology, with smooth hand feel and stable operation.

✦ Generated by Eureka AI based on patent content.

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Abstract

A surface-mounted potentiometer comprises a shell and a sliding block arranged in the shell, a push handle is arranged on the upper portion of the sliding block and exposed out of the surface of the shell, a movable contact piece is connected to the bottom of the sliding block, a ceramic substrate is fixed in the shell, a plurality of resistor sheets are arranged on the upper surface of the ceramic substrate in a composite mode, and the lower portion of the movable contact piece is in corresponding contact with the resistor sheets. And a plurality of pin sheets made of metal thick plates are fixed on the ceramic substrate and are correspondingly conducted with the resistor sheets. According to the utility model, the structure is reasonable, the ceramic substrate of the composite resistor sheet is adopted to replace a PCB (Printed Circuit Board), the pin sheets are thickened, enlarged and fixed, the heat dissipation performance is good, the structure is stable, the ceramic substrate can keep not deformed when being heated violently, the temperature resistance is reliable, the resistance value adjusting performance is stable and accurate, and the ceramic substrate can be suitable for the surface mount technology. Moreover, the adjustment adopts a sliding block moving mode, the hand feeling is smooth, and the operation is stable.
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Description

Technical Field

[0001] The utility model relates to a potentiometer. Background Art

[0002] A potentiometer is a common electronic component, often used as a rheostat, and a smoothly continuously varying resistance value can be obtained within the entire adjustment stroke range. Ordinary potentiometers cannot be used as surface mount components because the needle-shaped pins of the potentiometer and the PCB board have poor heat dissipation, the structure is easily deformed, and they cannot withstand the temperature of reflow soldering in the surface mount process. After being heated and deformed, the dimensions are inaccurate, and the resistance value adjustment error is extremely large. Summary of the Invention

[0003] Aiming at the deficiencies of the prior art, the utility model provides a surface mount potentiometer with a reasonable structure and heat resistance.

[0004] The utility model includes a housing and a slider disposed therein. A push handle is provided on the upper part of the slider and exposed on the surface of the housing. A moving contact piece is connected to the bottom of the slider. A ceramic substrate is fixed in the housing. Several sections of resistance thin films are compositely provided on the upper surface of the ceramic substrate. The lower part of the moving contact piece is in corresponding contact with the resistance thin films. Several pin pieces made of thick metal plates are fixed on the ceramic substrate and are in corresponding conduction with the resistance thin films.

[0005] The structure of the utility model is reasonable. The ceramic substrate with composite resistance thin films is used to replace the PCB board. The pin pieces are thickened, enlarged and fixed, with good heat dissipation and stable structure. It can also remain undeformed when heated violently, has reliable heat resistance, stable and accurate resistance value adjustment performance, and can be applied to the surface mount process. Moreover, the adjustment adopts the method of slider movement, with smooth feel and stable operation.

[0006] The following further illustrates the utility model in conjunction with the drawings and specific embodiments. Description of the Drawings

[0007] Figure 1 is a perspective view of the embodiment.

[0008] Figure 2 is a perspective exploded view of the embodiment.

[0009] Figure 3 is another schematic view of the pin piece. Detailed Embodiments

[0010] As Figure 1 and Figure 2As shown, the slider 2 is placed in the housing 1 for sliding fit. A push handle 4 is provided on the upper part of the slider 2 and exposed on the surface of the housing 1. A moving contact piece 3 is connected to the bottom of the slider 2. A ceramic substrate 5 is fixed in the housing 1. Several resistor thin sheets 6 are compositely provided on the upper surface of the ceramic substrate 5. The lower part of the moving contact piece 3 is in corresponding contact with the resistor thin sheets 6. Several pin pieces 8 made of thick metal plates are fixed on the ceramic substrate 5 and are in corresponding conduction with the resistor thin sheets 6.

[0011] In this embodiment, several connecting holes 7 are provided on the ceramic substrate 5. A connecting column 9 is integrally provided at the top of the pin piece 8. The connecting column 9 is placed in the corresponding connecting hole 7 for fixation. Such a structure is more firm, easy to conduct heat dissipation, and temperature-resistant and reliable. In fact, according to needs, an outwardly extending convex foot 10 can be integrally provided on the outer side wall of the pin piece 8, as Figure 3 shown, with a larger contact surface and better conductivity.

[0012] During use, the push handle 4 is pushed to make the slider 2 slide together with the moving contact piece 3. The lower part of the moving contact piece 3 is in continuous moving contact with the resistor thin sheets 6. As the sliding distance changes, the output resistance also changes. The lower part of the moving contact piece 3 is bent and bifurcated, which can not only better elastically contact the resistor thin sheets 6, with fine resistance adjustment, but also have stronger heat dissipation. In fact, in order to make the potentiometer more suitable for the chip mounting process, the materials of each component can be further optimized. The pin piece 8 is made of brass coated with silver, the resistor thin sheet 6 uses ruthenium-containing resistors, the slider 2 is made of high-temperature resistant nylon, and the housing 1 uses tinned plates.

Claims

1. A chip potentiometer, comprising a housing and a slider placed therein, wherein a push handle is provided on the upper part of the slider and exposed from the housing surface, and a moving contact piece is connected to the bottom of the slider, and is characterized by: A ceramic substrate (5) is fixed in the housing (1), and a plurality of sections of resistor sheets (6) are provided on the upper surface of the ceramic substrate (5). The lower portion of the movable contact sheet (3) is in contact with the resistor sheets (6) respectively, and a plurality of lead sheets (8) made of thick metal plates are fixed on the ceramic substrate (5) and are in conduction with the resistor sheets (6) respectively.

2. The chip potentiometer according to claim 1, characterized in that: A plurality of connection holes (7) are provided on the ceramic substrate (5), and a connection column (9) is integrally provided on the top of the pin sheet (8), and the connection column (9) is placed in the corresponding connection hole (7) and fixed.

3. The chip potentiometer according to claim 1 or 2, characterized in that: An outwardly extending convex foot (10) is integrally provided on the outer side wall of the pin sheet (8).

4. The chip potentiometer according to claim 1 or 2, characterized in that: The lower part of the moving contact piece (3) is bent and forked.

5. The chip potentiometer according to claim 3, characterized in that: The lower part of the moving contact piece (3) is bent and forked.