Wafer alignment point measuring device

Abstract

The utility model relates to the technical field of semiconductor processing, in particular to a wafer alignment point measuring device which is characterized in that the wafer alignment point measuring device is provided with a support, a working platform is arranged on the support, the lower portion of the working platform is fixedly connected with a fixing block, a track and an air cylinder are arranged on the fixing block, and a marking head is installed on the track through a sliding block. The working platform can be driven by the air cylinder to ascend and descend along the track along with the sliding block, and a marking hole is formed in the position, corresponding to the marking head, of the working platform. According to the utility model, the wafer is firstly placed on the working platform, the defect on the back surface of the wafer is observed through the external microscope, the marking pen is used for marking on the front surface of the wafer through the foot switch, and the process can be automatically completed through the camera for automatic detection, so that the effect of marking the crystal grains with defects on the back surface can be achieved; therefore, the working efficiency of back detection is greatly improved, and the accuracy of rejecting bad crystal grains is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a wafer alignment measurement point device. Background Art

[0002] Wafer products are processed first Figure 5 As shown in the wafer, after processing, the wafer is cut into individual grains. Then, after the grains are processed, they need to be inspected for appearance to check for defects. Conventionally, only the more important front side of the grains is inspected by light, and the defective grains are marked, and the marked bad grains are removed in subsequent processing. However, in order to further improve product quality, the back defects of the grains are also simply inspected. In the prior art, when inspecting the back side, after visually inspecting the back side defects, marks are made at the corresponding positions on the front side. In the actual inspection process, it is impossible for personnel to quickly and accurately locate by counting the grains or relying on eyesight, and the efficiency is very low. Content of the Utility Model

[0003] Aiming at the above problems, the purpose of the utility model is to provide a wafer alignment measurement point device, which is convenient to use, can effectively mark damaged grains, and greatly improves the detection efficiency.

[0004] In order to solve the above technical problems, the technical scheme adopted by the utility model is as follows: A wafer alignment measurement point device has a bracket, a working platform is arranged on the bracket, a fixed block is fixedly connected to the lower part of the working platform, a track and a cylinder are arranged on the fixed block, a marking head is installed on the track through a slider and can rise and fall along the track with the slider under the drive of the cylinder, and a marking hole is arranged at the corresponding position of the working platform and the marking head.

[0005] In the above technical scheme, a foot switch is arranged on the cylinder.

[0006] In the above technical scheme, a fixing plate is arranged on the working platform, both ends of the fixing plate are fixedly connected to the working platform, and an observation hole is arranged at the corresponding position in the middle part and the marking hole.

[0007] In the above technical scheme, a transparent baffle is arranged at the observation hole.

[0008] In the above technical scheme, a limiting groove for accommodating the wafer is arranged in the middle part of the fixing plate.

[0009] In the above technical scheme, both ends of the fixing plate are fixedly connected to the working platform through bolts.

[0010] In the above technical scheme, the upper part of the fixed block is fixedly connected to the bottom surface of the working platform, and the cylinder is fixedly connected to the lower part of the fixed block.

[0011] In the above technical solution, two connecting blocks are provided on the marking head. The connecting blocks are fixedly connected to the slider, and the output shaft of the cylinder is installed on the lower connecting block.

[0012] In summary, the beneficial effects of adopting the technical solution of the present utility model compared with the traditional technical means are as follows: When using the present utility model, first place the wafer on the working platform, observe the defects on the back of the wafer through an external microscope and use a foot switch to mark on its front with a marker pen. Of course, this process can also be automatically completed by an automatic detection camera. In this way, the effect of marking the grains with defects on the back can be achieved, thereby greatly improving the working efficiency of back detection and increasing the accuracy of removing defective grains. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Through the following detailed description in conjunction with the drawings, the foregoing and other objects, features, and advantages of the present utility model will become apparent.

[0014] Figure 1 is a three-dimensional structural schematic diagram of the present utility model;

[0015] Figure 2 is a front view schematic diagram of the present utility model;

[0016] Figure 3 is a schematic diagram of the device under the working platform in the present utility model;

[0017] Figure 4 is Figure 3 front view schematic diagram of;

[0018] Figure 5 is a schematic diagram of the wafer;

[0019] The reference numerals are as follows: 100, bracket; 110, working platform; 120, fixing plate; 121, observation hole; 122, limiting groove; 200, fixing block; 300, track; 400, cylinder; 500, marking head; 510, connecting block; 600, slider; 700, wafer; 710, grain. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0020] The following is inspired by the ideal embodiments of the present utility model. Through the following description, relevant staff can make various changes and modifications completely within the scope of the technical idea of this utility model without deviation. The technical scope of this utility model is not limited to the content in the specification, and must be determined according to the scope of the claims.

[0021] With reference to the following drawings, the present utility model will be further described:

[0022] As Figures 1 to 5As shown in the figure, a wafer alignment measurement point device has a bracket 100. A working platform 110 is provided on the bracket 100. A fixing block 200 is fixedly connected to the lower part of the working platform 110. A track 300 and a cylinder 400 are provided on the fixing block 200. A marking head 500 is mounted on the track 300 through a slider 600 and can be lifted and lowered along the track 300 with the slider 600 under the drive of the cylinder 400. A marking hole is provided at the corresponding position of the working platform 110 and the marking head 500.

[0023] A foot switch is provided on the cylinder 400, and the start and stop of the cylinder 400 are controlled by the foot switch, which is very convenient.

[0024] A fixing plate 120 is provided on the working platform 110. Both ends of the fixing plate 120 are fixedly connected to the working platform 110, and an observation hole 121 is provided at the corresponding position of the middle part and the marking hole.

[0025] A transparent baffle is provided at the observation hole 121 to protect the wafer 700 from being contaminated on the premise of ensuring normal observation.

[0026] As Figure 1 shown, a limiting groove 122 for accommodating the wafer 700 is provided in the middle of the fixing plate 120. When in use, the wafer 700 is placed in the limiting groove 122, and the wafer 700 can be moved manually or by machine to observe different grains.

[0027] Both ends of the fixing plate 120 are fixedly connected to the working platform 110 through bolts, and the bolts can adjust the height of the limiting groove to adapt to different wafers 700.

[0028] The upper part of the fixing block 200 is fixedly connected to the bottom surface of the working platform 110, and the cylinder 400 is fixedly connected to the lower part of the fixing block 200.

[0029] As Figure 3 、 4 shown, two connecting blocks 510 are provided on the marking head 500. The connecting blocks 510 are fixedly connected to the slider 600, and the output shaft of the cylinder 400 is mounted on the lower connecting block 510.

[0030] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A wafer alignment point measuring device, characterized in that: It has a bracket, a working platform is arranged on the bracket, the lower part of the working platform is fixedly connected to a fixed block, the fixed block is provided with a track and a cylinder, a marking head is mounted on the track through a slider, and can be raised and lowered along the track with the slider under the drive of the cylinder, and a marking hole is arranged at the corresponding position of the working platform and the marking head.

2. The wafer alignment point measuring device according to claim 1, characterized in that: A foot switch is arranged on the cylinder.

3. The wafer alignment point measuring device according to claim 1, characterized in that: The working platform is provided with a fixing plate, both ends of the fixing plate are fixedly connected to the working platform, and an observation hole is provided at a position in the middle corresponding to the marking hole.

4. The wafer alignment point measuring device according to claim 3, characterized in that: A transparent baffle is provided at the observation hole.

5. The wafer alignment point measuring device according to claim 3, characterized in that: A limiting groove for accommodating a wafer is provided in the middle of the fixing plate.

6. The wafer alignment point measuring device according to claim 3, characterized in that: The two ends of the fixing plate are fixedly connected to the working platform by bolts.

7. The wafer alignment point measuring device according to claim 1, characterized in that: The upper part of the fixed block is fixedly connected to the bottom surface of the working platform, and the cylinder is fixedly connected to the lower part of the fixed block.

8. The wafer alignment point measuring device according to claim 1, characterized in that: The marking head is provided with two connecting blocks, the connecting blocks are fixedly connected to the sliding block, and the output shaft of the cylinder is mounted on the lower connecting block.

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