One-time encapsulated planar optocoupler lead frame

Abstract

The utility model belongs to the technical field of switch cabinets, and discloses a one-time encapsulated planar optocoupler lead frame, which comprises a light-emitting chip base island, a light-receiving chip base island and a plurality of inner pins which are arranged on a lead frame body, and structural unit gaps are reserved between structural units; the light-emitting chip base islands, the light-receiving chip base islands, the inner pins and the gaps of the structural units jointly form a rectangular light guide glue coverage area, and in the rectangular light guide glue coverage area, the gold bonding wires are completely wrapped by light guide glue. The pulling and shearing effects on the gold bonding wire are obviously weakened, and the fracture phenomenon of the gold bonding wire caused by repeated stress is effectively avoided, so that the production yield and the product quality of an integrated circuit are improved; the lead frame is simple in structure and principle, convenient to manufacture and implement and good in popularization and application value.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor packaging, specifically relates to the field of planar optocoupler structures, and particularly relates to a one-time encapsulated planar optocoupler lead frame. Background Art

[0002] Plastic encapsulated optocouplers can be divided into three-dimensional optocoupler structures and planar optocoupler structures according to their structures, and can be divided into one-time encapsulated optocouplers and two-time encapsulated optocouplers according to the encapsulation times; one-time planar optocouplers can better be compatible with the existing molds for integrated circuit packaging, and the development and research costs are lower. The technological process of one-time planar optocouplers mainly includes chip bonding, wire bonding, optical conductive glue dispensing, reflective glue coating, encapsulation, electroplating, marking and forming, etc.

[0003] As one of the main basic materials for the plastic encapsulation production of integrated circuits, the structural design of the lead frame is directly related to the performance and quality of the entire integrated circuit plastic encapsulated product; currently, as Figure 1 shown, due to the reason of the structural layout of the existing lead frame body, the optical conductive glue is only concentrated at the two chip base islands, and the optical conductive glue can only cover a part of the bonding wire, resulting in the bonding wire being continuously pulled or sheared and broken under the influence of the alternating stress of temperature change, reducing the production yield and affecting the product quality of the integrated circuit.

[0004] It can be seen that in the existing lead frame structure, since the optical conductive glue on the lead frame body is only concentrated at the two chip base islands and can only cover a part of the bonding wire, the bonding wire is continuously pulled or sheared and broken under the influence of the alternating stress of temperature change. Summary of the Utility Model

[0005] The utility model provides a one-time encapsulated planar optocoupler lead frame to solve the technical problem that in the existing lead frame structure, since the optical conductive glue on the lead frame body is only concentrated at the two chip base islands and can only cover a part of the bonding wire, the bonding wire is continuously pulled or sheared and broken under the influence of the alternating stress of temperature change.

[0006] To achieve the above purpose, the utility model adopts the following technical content:

[0007] A one-time encapsulated planar optocoupler lead frame includes a lead frame body;

[0008] The lead frame body is provided with a light-emitting chip base island for carrying a light-emitting chip, a light-receiving chip base island for carrying a light-receiving chip, and several inner leads;

[0009] The light-emitting chip and the light-receiving chip are respectively wire-bonded to at least one of the inner leads through bonding wires;

[0010] A structural unit gap is reserved between the light-emitting chip base island and the light-receiving chip base island, between the light-emitting chip base island and the adjacent inner lead, between the light-receiving chip base island and the adjacent inner lead, and between two adjacent inner leads.

[0011] The light-emitting chip base island, the light-receiving chip base island, the inner leads, and the reserved structural unit gaps form a rectangular light guide adhesive covering area.

[0012] The rectangular light guide adhesive covering area is covered with light guide adhesive, and the bonding wires are completely wrapped in the light guide adhesive.

[0013] Further, a plurality of current-limiting structures are provided on the lead frame body, and each current-limiting structure is correspondingly connected to each inner lead, the light-emitting chip base island, and the light-receiving chip base island; the current-limiting structure is located at the edge of the rectangular light guide adhesive covering area and is used to limit the outward flow of the light guide adhesive along the surface of the lead frame body.

[0014] Further, the width of the current-limiting structure is smaller than the width of the inner lead connected thereto.

[0015] Further, the width of the current-limiting structure is 0.15 - 0.3 mm.

[0016] Further, the width of the structural unit gap is 0.15 - 0.6 mm.

[0017] Further, the width of the structural unit gap between the light-emitting chip base island and the light-receiving chip base island is 0.3 - 0.6 mm.

[0018] Further, the width of the structural unit gap between the light-emitting chip base island and the adjacent inner lead, and between the light-receiving chip base island and the adjacent inner lead is 0.15 - 0.3 mm.

[0019] Further, the width of the structural unit gap between two adjacent inner leads is 0.15 - 0.3 mm.

[0020] Further, the inner leads include a first lead, a second lead, a third lead, and a fourth lead; the first lead is connected to the light-emitting chip by a bonding wire; the second lead, the third lead, and the fourth lead are respectively connected to the light-receiving chip by bonding wires.

[0021] Further, the third pin and the fourth pin are arranged in alignment along the horizontal axis; the second pin and the light-receiving chip base island are arranged in alignment along the horizontal axis; the first pin and the light-emitting chip base island are arranged in alignment along the horizontal axis; the light-emitting chip base island and the light-receiving chip base island are arranged in alignment along the vertical axis; the first pin and the second pin are arranged in alignment along the vertical axis.

[0022] Compared with the prior art, the utility model has the following beneficial effects:

[0023] The utility model provides a one-time encapsulated planar optocoupler lead frame. The lead frame includes a light-emitting chip base island, a light-receiving chip base island and a plurality of inner pins arranged on the lead frame body, and structural unit gaps are reserved between the respective structural units; the light-emitting chip base island, the light-receiving chip base island, the inner pins and the structural unit gaps together form a rectangular light guide adhesive covering area. In the rectangular light guide adhesive covering area, the bonding wire is completely wrapped by the light guide adhesive. With the above structural design, under the influence of the alternating stress of temperature change, the pulling and shearing actions on the bonding wire are significantly weakened, effectively avoiding the fracture phenomenon of the bonding wire caused by repeated stress, thereby improving the production yield and product quality of the integrated circuit; the structure and principle of the lead frame are simple, facilitating production and implementation, and having good popularization and application value.

[0024] Preferably, in the utility model, a current-limiting structure is arranged on the lead frame body to limit the flowing range of the light guide adhesive and ensure the uniform distribution of the light guide adhesive within a predetermined rectangular area; through the arrangement of the current-limiting structure, the excessive flowing of the light guide adhesive is effectively avoided, ensuring the normal progress of the subsequent process.

[0025] Preferably, in the utility model, the width of the current-limiting structure is smaller than the width of the inner pin, ensuring the control effect on the flowing of the light guide adhesive.

[0026] Preferably, in the utility model, the inner pins include a first pin, a second pin, a third pin and a fourth pin, and the first pin is bonded and connected to the light-emitting chip, and the other three inner pins are connected to the light-receiving chip through bonding wires, providing a clear layout scheme for the design of the integrated circuit and ensuring the stable and reliable connection of the light-emitting chip and the light-receiving chip to the inner pins.

[0027] Further preferably, in the present utility model, the third pin and the fourth pin are arranged in alignment along the horizontal axis; the second pin and the light-receiving chip base island are arranged in alignment along the horizontal axis; the first pin and the light-emitting chip base island are arranged in alignment along the horizontal axis; the light-emitting chip base island and the light-receiving chip base island are arranged in alignment along the vertical axis; the first pin and the second pin are arranged in alignment along the vertical axis; by adopting the above design method, it can ensure that the outer boundary of the rectangular light guide adhesive covering area is aligned, which is beneficial to the formation of the arc surface of the light guide colloid, effectively avoiding the decrease in the optoelectronic transmission efficiency caused by insufficient radian and improving the product performance. Description of the Drawings

[0028] Figure 1 It is a schematic structural diagram of an existing one-time encapsulated planar optocoupler lead frame provided by an embodiment of the present utility model;

[0029] Figure 2 It is a cross-sectional view of an optocoupler product using an existing one-time encapsulated planar optocoupler lead frame provided by an embodiment of the present utility model;

[0030] Figure 3 It is a schematic diagram showing that the bonding wire is broken at different material interfaces in an optocoupler product using an existing one-time encapsulated planar optocoupler lead frame provided by an embodiment of the present utility model;

[0031] Figure 4 It is a schematic structural diagram of a one-time encapsulated planar optocoupler lead frame provided by an embodiment of the present utility model;

[0032] Figure 5 It is a schematic structural diagram of the lead frame body of a one-time encapsulated planar optocoupler lead frame provided by an embodiment of the present utility model;

[0033] Figure 6 It is a schematic diagram of the connection structure between the inner pin and the base island of a one-time encapsulated planar optocoupler lead frame provided by an embodiment of the present utility model;

[0034] Figure 7 It is a cross-sectional view of an optocoupler product using a one-time encapsulated planar optocoupler lead frame provided by an embodiment of the present utility model.

[0035] Reference Numerals:

[0036] 1 - Light-emitting chip; 2 - Light-receiving chip; 3 - Lead frame body; 3-1 - Light-emitting side of the lead frame; 3-2 - Light-receiving side of the lead frame; 4 - Bonding wire; 5 - Light guide adhesive; 6 - Plastic encapsulant: 7 - Current-limiting structure: 8-1 - Light-emitting chip base island; 8-2 - Light-receiving chip base island; 9 - Structure unit gap; 10 - Inner pin; 11 - First pin; 12 - Second pin; 13 - Third pin; 14 - Fourth pin. Detailed Embodiments

[0037] In order to make the technical problems, technical solutions and beneficial effects solved by the present utility model clearer and more understandable, the following specific embodiments are used to further elaborate on the present utility model in detail. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0038] To make the objectives, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. Generally, the components of the embodiments of the present utility model described and illustrated in the accompanying drawings herein can be arranged and designed in various different configurations.

[0039] Therefore, the following detailed description of the embodiments of the present utility model provided in the accompanying drawings is not intended to limit the scope of the present utility model claimed, but merely represents selected embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts fall within the scope of protection of the present utility model.

[0040] It should be noted that: similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0041] In the description of the embodiments of the present utility model, it should be noted that if terms such as "upper", "lower", "horizontal", "inner", etc. are used to indicate the orientation or positional relationship, it is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of the present utility model is usually placed during use. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation of the present utility model. In addition, terms such as "first", "second", etc. are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance.

[0042] In addition, if the term "horizontal" appears, it does not mean that the component is required to be absolutely horizontal, but it can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but it can be slightly inclined.

[0043] In the description of the embodiments of the present utility model, it should also be noted that unless otherwise clearly specified and defined, if the terms "set", "installed", "connected", "connected" are used, they should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0044] The following further describes the present utility model in detail with reference to the accompanying drawings:

[0045] Embodiment 1

[0046] Combined with what is mentioned in the background art, due to the structural layout of the existing lead frame body, the optical conductive adhesive is only concentrated at the two chip base islands, and the optical conductive adhesive can only cover a part of the bonding wire. As a result, under the influence of the alternating stress of temperature change, the bonding wire is continuously pulled or sheared and breaks, reducing the production yield and affecting the product quality of the integrated circuit.

[0047] As Figure 1 shown, Figure 1 is the structure of the existing single - encapsulation planar optocoupler lead frame. In this structure, the bonding wire is not completely wrapped; as Figure 2 and Figure 3 shown, it causes the bonding wire 4 to be continuously pulled or sheared and break under the influence of the alternating stress of temperature change; in the existing lead frame, due to the lack of the optical conductive adhesive current - limiting structure for the inner pins and the alignment structure for each part, there are problems such as the optical conductive adhesive flowing excessively along the inner pins or the height of the optical conductive adhesive between the inner pins and between the inner pins and the chip base island gradually decreasing and disconnecting due to the influence of the colloid tension, resulting in difficulty in completely wrapping the bonding wire with the optical conductive adhesive.

[0048] To solve the above problems, this embodiment provides a single - encapsulation planar optocoupler lead frame. The structure of the plastic - encapsulated optocoupler lead frame is improved. Through the improved structural design, the optocoupler lead frame can meet the requirement of completely wrapping the bonding wire directly through the optical conductive adhesive dispensing process, and finally solve the problem that the bonding wire is continuously pulled or sheared and breaks under the influence of the alternating stress of temperature change.

[0049] As Figure 4As shown in the figure, this embodiment provides a one - time encapsulated planar optocoupler lead frame. This lead frame mainly includes a lead frame body 3, and multiple functional areas and connection points are arranged on the lead frame body 3. Specifically, on the lead frame body 3, there are a light - emitting chip base island 8 - 1 for supporting the light - emitting element 1 and a light - receiving chip base island 8 - 2 for carrying the light - receiving element 2. At the same time, a plurality of inner leads 10 are configured for connecting with the light - emitting element 1 and the light - receiving element 2.

[0050] The light - emitting chip 1 and the light - receiving chip 2 are respectively electrically connected to at least one inner lead 10 through fine bonding wires 4. To ensure the stability and durability of these key connection points, structural unit gaps 9 are specifically reserved between and around the light - emitting chip base island 8 - 1, the light - receiving chip base island 8 - 2, and the inner leads 10. These structural unit gaps 9 not only optimize the layout but also provide the necessary space for the subsequent covering of the optical conductive adhesive 5, ensuring the covering effect of the optical conductive adhesive 5.

[0051] As Figure 5 shown in the figure, the light - emitting chip base island 8 - 1, the light - receiving chip base island 8 - 2, and the inner leads 10, combined with the above - mentioned reserved structural unit gaps 9, form a regular rectangular optical conductive adhesive covering area. In the rectangular optical conductive adhesive covering area, the optical conductive adhesive 5 is evenly coated to ensure that all bonding wires 4 are completely wrapped therein. Adopting this design effectively prevents the bonding wires from breaking due to pulling or shearing under stress conditions such as temperature changes, thus significantly improving the quality and reliability of the product.

[0052] In this embodiment, to further ensure the precise covering of the optical conductive adhesive and prevent it from overflowing the predetermined area, a plurality of current - limiting structures 7 are also provided on the lead frame body 3. The current - limiting structures 7 are located at the edges of the optical conductive adhesive covering area and are respectively connected to each inner lead 10, the light - emitting chip base island 8 - 1, and the light - receiving chip base island 8 - 2. The current - limiting structures 7 restrict the flowing path of the optical conductive adhesive 5, ensuring that the optical conductive adhesive can be evenly and precisely covered on the target area.

[0053] This embodiment provides a one - time encapsulated planar optocoupler lead frame structure with the following characteristics:

[0054] First, each optical conductive adhesive covering unit has a positional correlation, that is, between the inner lead 10 and the chip base island (including the light - emitting chip base island 8 - 1 and the light - receiving chip base island 8 - 2), between the inner leads 10, and between the light - emitting chip base island 8 - 1 and the light - receiving chip base island 8 - 2 are in a relationship of facing each other across the gap. After crossing the gap, the lead frame can be effectively spliced into a whole, and the outer areas of the lead frame of the facing units on both sides of the gap are in an aligned relationship.

[0055] Second, the size of each optical conductive adhesive covering unit is appropriate.

[0056] Third, the gap between each optical conductive adhesive covering unit is narrow, and a certain margin is reserved for the minimum gap of the lead frame processing technology between the inner lead 10 and the chip base island and between each inner lead 10; to meet the safety requirements of isolation voltage, a certain margin is reserved for the minimum gap between the light-emitting chip base island 8-1 and the light-receiving chip base island 8-2.

[0057] Fourth, a current-limiting structure 7 of the optical conductive adhesive is provided on the periphery of the optical conductive adhesive covering area of the lead frame body 3, and a narrow strip structure is included in the support structure on the periphery of the optical conductive adhesive covering area.

[0058] The positions of the optical conductive adhesive covering units with correlation, the moderate size of the optical conductive adhesive covering units, the narrow gap between the optical conductive adhesive covering units, the narrow strip optical conductive adhesive current-limiting structure on the periphery of the optical conductive adhesive covering area and the corresponding matching support structure constitute an improved one-time encapsulation planar optocoupler lead frame.

[0059] As Figure 6 shown, Figure 6 In it, the inner lead 10 includes a first lead 11, a second lead 12, a third lead 13 and a fourth lead 14; among them, the light-emitting chip base island 8-1 and the light-receiving chip base island 8-2 are aligned left and right, the first lead 11 (pin2) is aligned up and down with the light-emitting chip lead frame base island 8-1, the third lead 13 (pin7) is aligned up and down with the fourth lead 14 (pin6), the fourth lead 14 (pin6) is aligned right with the light-receiving chip lead frame base island 8-2, the third lead 13 (pin7) is aligned left with the second lead 12 (pin8), the second lead 12 (pin8) is aligned up and down with the light-receiving chip lead frame base island 8-2, and the first lead 11 (pin2) is aligned left and right with the second lead 12 (pin8). Here, the outer boundaries of the lead frames in each dispensing area are aligned, which is beneficial to the formation of the arc surface of the optical conductive colloid. When the radian is insufficient, the photoelectric transmission efficiency will decrease.

[0060] In this embodiment, the width of the inner lead 10 is between 0.3 mm and 0.4 mm, and the length is above 0.6 mm. When the size is too small, the surface tension of the optical conductive adhesive and the supporting force of the lead frame are not enough to resist gravity, and the optical conductive adhesive cannot be well attached to the surface of the structural unit, but is disconnected along the gaps between the structural units, ultimately resulting in the inability to completely wrap the bonding wire. When the size is too large, it will cause the covering area of the optical conductive adhesive to be too large, the radian of the optical conductive colloid to be insufficient, and the photoelectric transmission efficiency to be too low.

[0061] In this embodiment, the gap between different structural units of the lead frame to be encapsulated with optical conductive adhesive is between 0.15 mm and 0.6 mm. Among them, the gap between the inner lead 10 and the chip base island is between 0.15 mm and 0.3 mm. Except for the inner leads 10 belonging to the light-emitting unit and the light-receiving unit, the gap between two adjacent inner leads 10 is between 0.15 mm and 0.3 mm. The gap between the light-emitting chip base island 8-1 and the light-receiving chip base island 8-2 is between 0.3 mm and 0.6 mm. The smaller the gap, the less likely the optical conductive adhesive is to break from the gap.

[0062] In this embodiment, the width of the peripheral narrow strip-shaped current-limiting structure 7 is between 0.15 mm and 0.3 mm. This structure can play a role in restricting the flow of the optical conductive adhesive. The current-limiting structure 7 can control the excessive flow of the optical conductive adhesive along the surface of the lead frame. The excessive flow of the optical conductive adhesive may cause the optical conductive adhesive to break along the gap or cover non-target areas, affecting the normal progress of subsequent processes. The lead frames of conventional integrated circuit plastic packaging devices do not consider the overall encapsulation requirement of the optical conductive adhesive 5 for the bonding wire 4 and do not design an optical conductive adhesive current-limiting structure on the inner leads for bonding.

[0063] In this embodiment, the above lead frame is implemented and applied as follows:

[0064] The size of the light-emitting chip is 0.35 mm * 0.35 mm, the size of the light-receiving chip is 1.3 mm * 1.1 mm, and the product packaging form is DIP8L. The specific features include:

[0065] First, each optical conductive adhesive covering unit has a positional correlation. Each optical conductive adhesive covering unit can be spliced into a rectangle. The base island of the lead frame of the light-receiving chip is aligned left and right with the base island of the lead frame of the light-emitting chip. Pin2 is aligned vertically and horizontally with the base island of the lead frame of the light-emitting chip. Pin6 is aligned vertically with pin7. Pin6 is aligned right with the base island of the lead frame of the light-receiving chip. Pin7 is aligned left with pin8. Pin8 is aligned vertically and horizontally with the base island of the lead frame of the light-receiving chip. Pin2 is aligned left and right with pin8.

[0066] Second, the sizes of the respective optical conductive adhesive covering units are appropriate. Among them, the size of the base island of the lead frame of the light-emitting chip is 1.44 mm * 0.7 mm, the size of the base island of the lead frame of the light-receiving chip is 1.44 mm * 1.6 mm, the size of pin2 is 0.35 mm * 0.7 mm, the sizes of pin6 and pin7 are 0.85 mm * 0.3 mm, and the size of pin8 is 0.35 mm * 1.6 mm.

[0067] Third, narrow gaps between each optical conductive adhesive covering unit. The gap between the base island of the lead frame of the light-receiving chip and the base island of the lead frame of the light-emitting chip is 0.5 mm, the gap between pin2 and the base island of the lead frame of the light-emitting chip is 0.21 mm, the gap between pin6 and pin7 is 0.21 mm, the gap between pin6, pin7 and the base island of the lead frame of the light-receiving chip is 0.21 mm, the gap between pin7 and pin8 is 0.21 mm, the gap between pin8 and the base island of the lead frame of the light-receiving chip is 0.21 mm, and the gap between pin2 and pin8 is 0.5 mm.

[0068] Fourth, the periphery of the optical conductive adhesive covering area of the lead frame includes a narrow strip-shaped optical conductive adhesive current-limiting structure. The width of the optical conductive adhesive current-limiting structure on the periphery of the optical conductive adhesive covering area of the base island of the lead frame of the light-emitting chip is 0.25 mm, the width of the optical conductive adhesive current-limiting structure on the periphery of the optical conductive adhesive covering area of the base island of the lead frame of the light-receiving chip is 0.25 mm, the width of the optical conductive adhesive current-limiting structure on the periphery of the optical conductive adhesive covering area of pin2 is 0.15 mm, the width of the optical conductive adhesive current-limiting structure on the periphery of the optical conductive adhesive covering area of pin6 is 0.15 mm, the width of the optical conductive adhesive current-limiting structure on the periphery of the optical conductive adhesive covering area of pin7 is 0.15 mm, and the width of the optical conductive adhesive current-limiting structure on the periphery of the optical conductive adhesive covering area of pin8 is 0.25 mm.

[0069] As Figure 7 shown, the product is processed based on an improved lead frame. The entire lead frame 3 is divided into a light-emitting side 3-1 and a light-receiving side 3-2 of the lead frame; the optical conductive adhesive 5 completely wraps the bonding wire 4, and the outermost layer of the product is encapsulated with a molding compound 6; the process steps for product processing are die bonding, lead frame, optical conductive adhesive dispensing, coating with a reflective adhesive (optional), encapsulation, electroplating, marking, and forming and separation. The optical conductive adhesive dispensing is carried out in a way of drawing the adhesive. The adhesive is dispensed on the non-chip surface of the lead frame, and the drawing path of the adhesive passes through each area that the optical conductive adhesive needs to cover. After the dispensing is completed, under the action of gravity, colloid tension, etc., a suitable arc surface of the optical conductive adhesive is formed. The chip bonding, wire bonding, and optical conductive adhesive covering area are as Figure 4 shown.

[0070] The above embodiments are only one of the implementation manners that can realize the technical solution of the present invention. The scope of protection required by the present invention is not only limited by this embodiment, but also includes any changes, substitutions, and other implementation manners that are easily conceivable by those skilled in the art within the technical scope disclosed by the present invention.

Claims

1. A one-time encapsulated planar optocoupler lead frame, characterized in that: It includes a lead frame body (3); The lead frame body (3) is provided with a light-emitting chip base island (8-1) for carrying the light-emitting chip (1), a light-receiving chip base island (8-2) for carrying the light-receiving chip (2), and a plurality of inner pins (10); The light-emitting chip (1) and the light-receiving chip (2) are respectively bonded and connected to at least one inner lead (10) via a bonding gold wire (4); Structural unit gaps (9) are reserved between the light-emitting chip base island (8-1) and the light-receiving chip base island (8-2), between the light-emitting chip base island (8-1) and an adjacent inner pin (10), between the light-receiving chip base island (8-2) and an adjacent inner pin (10), and between two adjacent inner pins (10); The light-emitting chip base island (8-1), the light-receiving chip base island (8-2), the inner pins (10), and the reserved structural unit gap (9) form a rectangular light-conducting adhesive covering area; The rectangular optically conductive adhesive coverage area is covered with optically conductive adhesive (5), and the bonding gold wire (4) is completely wrapped in the optically conductive adhesive (5).

2. The one-time encapsulated planar optocoupler lead frame according to claim 1, characterized in that: A plurality of current limiting structures (7) are provided on the lead frame body (3), each of the current limiting structures (7) being connected to each of the inner pins (10) and the light emitting chip base island (8-1) and the light receiving chip base island (8-2) respectively; the current limiting structures (7) are located at the edge of the rectangular photoconductive adhesive coverage area and are used to limit the photoconductive adhesive (5) from flowing toward the periphery along the surface of the lead frame body (3).

3. The one-time encapsulated planar optocoupler lead frame according to claim 2, characterized in that: The width of the current limiting structure (7) is smaller than the width of the inner pin (10) connected thereto.

4. The one-time encapsulated planar optical coupler lead frame according to claim 2, characterized in that: The width of the current limiting structure (7) is 0.15-0.3 mm.

5. The one-time encapsulated planar optical coupler lead frame according to claim 1, characterized in that: The width of the structural unit gap (9) is 0.15-0.6 mm.

6. The one-time encapsulated planar optical coupler lead frame according to claim 5, characterized in that: The width of the structural unit gap (9) between the light-emitting chip base island (8-1) and the light-receiving chip base island (8-2) is 0.3-0.6 mm.

7. The one-time encapsulated planar optical coupler lead frame according to claim 5, characterized in that: The width of the structural unit gap (9) between the light-emitting chip base island (8-1) and the adjacent inner pin (10), and between the light-receiving chip base island (8-2) and the adjacent inner pin (10) is 0.15-0.3 mm.

8. The one-time encapsulated planar optical coupler lead frame according to claim 5, characterized in that: The width of the structural unit gap (9) between two adjacent inner pins (10) is 0.15-0.3 mm.

9. The one-time encapsulated planar optocoupler lead frame according to claim 1, characterized in that: The inner pins (10) comprise a first pin (11), a second pin (12), a third pin (13), and a fourth pin (14); the first pin (11) is connected to the light-emitting chip (1) via a bonding gold wire (4); and the second pin (12), the third pin (13), and the fourth pin (14) are respectively connected to the light-receiving chip (2) via a bonding gold wire (4).

10. The one-time encapsulated planar optocoupler lead frame according to claim 9, characterized in that: The third pin (13) and the fourth pin (14) are aligned along the horizontal axis; the second pin (12) and the light receiving chip base island (8-2) are aligned along the horizontal axis; the first pin (11) and the light emitting chip base island (8-1) are aligned along the horizontal axis; the light emitting chip base island (8-1) and the light receiving chip base island (8-2) are aligned along the vertical axis; and the first pin (11) and the second pin (12) are aligned along the vertical axis.

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