High multilayer mechanical blind buried hole circuit board

Abstract

The utility model relates to the technical field of circuit boards, and discloses a high multilayer mechanical blind buried hole circuit board, which comprises a filling assembly and a circuit board assembly, the filling assembly comprises a filling plate, a limiting corner is fixed at the side part of the filling plate, a bonding layer is fixed at the side part of the limiting corner, and the circuit board assembly is arranged on the circuit board assembly. The limiting corners higher than the board body are arranged on the four corners of the filling board, when the circuit board body is installed on the filling board, the corners of the circuit board body are located on the inner sides of the limiting corners, meanwhile, the bottom is used for resisting resistance generated between the contact faces of the protruding buttons, and during compression molding, the stability of the circuit board is effectively guaranteed; according to the technical scheme of the utility model, the calibration rod is arranged between the installation notch and the calibration notch, so that the side edges of the plurality of filling plates are flush, and the uniformity of the compression molding of the whole side surfaces of the circuit board is further ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a high multi-layer mechanical blind buried via circuit board. Background Art

[0002] The high multi-layer mechanical blind buried via circuit board generally refers to a complex multi-layer printed circuit board (PCB), which is composed of multiple circuit layers, and each layer may contain signal layers, power layers, ground layers, etc. to meet the wiring requirements of complex electronic devices. The blind vias on the circuit board refer to the holes that are only on one or both sides of the PCB and do not penetrate the entire board thickness. They are usually used for signal transmission or electrical connection of internal circuit layers, while the buried vias are the holes that completely penetrate the PCB, connecting all layers for signal transmission or electrical connection, but do not expose on the surface of the PCB. It has high-density wiring, requires fine manufacturing technology and precise process control, and the complexity is also reflected in the requirements of signal integrity, electromagnetic compatibility and thermal management, etc.

[0003] Currently, for the existing high multi-layer mechanical blind buried via circuit boards, during the production and preparation process, the copper-clad core board is first laminated to make a sub-board correspondingly, and then holes are drilled in the copper foil layer on the upper surface of the laminated sub-board to form the buried via sub-board of L1 - Ln layers. Finally, the sub-boards are laminated with each other or the sub-board is laminated with the Ln copper foil layer in sequence to make a multi-layer circuit board with mechanical buried vias. However, during the lamination and forming process, it is easy to cause offset between the circuit board and the filling layer, resulting in misalignment of the circuit pattern, low yield rate and high production cost, and there are certain defects. Summary of the Utility Model

[0004] Aiming at the deficiencies of the prior art, the utility model provides a high multi-layer mechanical blind buried via circuit board, which has the advantages of being able to ensure the stability of the multi-layer circuit board during lamination and avoiding the offset of the circuit board, etc., and solves the problems that the circuit board is easy to generate offset during lamination and forming at the present stage, resulting in low yield rate and high cost.

[0005] To achieve the above object, the utility model provides the following technical solution: A high multi-layer mechanical blind buried via circuit board, including a filling component and a circuit board component. The filling component includes a filling board, with a limiting corner fixed on the side of the filling board, and an adhesive layer fixed on the side of the limiting corner. The filling board is filled between two circuit board bodies. By connecting the circuit paths of different layers, the electrical connection inside the multi-layer circuit board is made more reliable and stable. At the same time, it can help conduct heat inside the circuit board, and the filling board can also enhance the mechanical strength and stability of the circuit board. At the same time, it can be used to control the impedance of the signal transmission line and reduce the influence of electromagnetic interference (EMI).

[0006] The circuit board assembly includes a circuit board body mounted on a filling plate. The side of the circuit board body is fitted inside a limiting corner, and at the same time, an adhesive layer is fitted on the side of the circuit board body. Limiting corners are fixed at the four corners on the upper and lower surfaces of the filling plate. The limiting corners are fitted on the side of the circuit board body, improving the installation stability of the circuit board body and avoiding the offset and dislocation of the circuit board body during the pressing and forming process. Through the adhesive layer, the filling plate filled between multiple circuit board bodies and the intermediate layer is adhesively fixed.

[0007] When assembling a high-multi-layer mechanical blind buried via circuit board, by providing multiple circuit board bodies, a filling plate is installed at the bottom of each circuit board body, and it is ensured that the corners of the circuit board body are fitted inside the corners of the limiting corner. At the same time, the bottom of the circuit board body is fitted on the filling plate and the resistance bump, realizing the assembly of a single-layer circuit board. By stacking multiple assembled single circuit boards, the docking convex block provided at the bottom of the upper limiting corner is inserted into the docking notch opened in the lower limiting corner, and it is ensured that the circuit board with buried vias is in the middle layer, while the circuit board with blind vias is in the outermost layer. Then, an adhesive layer is bonded to the side of the stacked circuit boards. At the same time, it is ensured that the calibration rod is between the calibration notch and the installation notch, and then it can be pressed and formed by a machine.

[0008] As a further improvement of the above solution, connection holes are opened on the filling plate, and resistance bumps are fixed in the connection holes. The resistance bumps are flush with the surface of the filling plate, and at the same time, the resistance bumps are fitted on the bottom of the circuit board body.

[0009] Through the above technical solution, connection holes are opened at the corresponding positions of the four corner positions on the top and bottom surfaces of the filling plate, and resistance bumps are installed in the connection holes. The diameter of the resistance bump matches the diameter in the connection hole, and a grid-like stripe is provided on the top surface of the resistance bump, increasing the frictional resistance between the contact surfaces with the circuit board body.

[0010] As a further improvement of the above solution, docking notches are opened on the limiting corner, and at the same time, docking convex blocks are provided at the bottom. The positions of the docking convex blocks correspond to the docking notches.

[0011] Through the above technical solution, the limiting corner is in a right-angled shape to wrap the corner of the filling plate. When multiple filling plates are stacked, the docking convex block provided at the bottom of the limiting corner is inserted into the docking notch opened in the lower limiting corner, increasing the stacking stability of the circuit boards, ensuring the neatness of the side edges during the pressing and forming process, and at the same time enabling the circuit boards to be aligned.

[0012] As a further improvement of the above solution, calibration notches are provided on the sides of the limiting corners. At the same time, installation notches are provided in the adhesive layer. The positions of the calibration notches and the installation notches correspond to each other. At the same time, calibration rods are fixed in the installation notches, and the calibration rods are fitted in the calibration notches.

[0013] Through the above technical solution, calibration notches are vertically provided at both ends outside the limiting corners. At the same time, on the inner side of the adhesive layer, at a position corresponding to the calibration notch, there is a calibration rod with a diameter that matches. The length of the calibration rod matches the overall length of the multi-layer circuit board stack. During the pressing and forming process, the calibration rod is used for limiting to ensure the neatness of the side of the circuit board after pressing and forming.

[0014] As a further improvement of the above solution, the height of the limiting corner is half of the thickness of the circuit board body.

[0015] Through the above technical solution, when multi-layer filling plates are stacked, the limiting corners at the bottom of the upper filling plate are fitted on the upper end of half of the overall thickness of the circuit board body, while there is no reservation between the lower half of the circuit board body and the limiting corners on the top surface of the lower filling plate, so as to fully clamp and fix the circuit board body, improve the stability of bonding after stacking, and avoid the offset of the circuit board body.

[0016] Compared with the prior art, the present utility model provides a high multi-layer mechanical blind buried via circuit board, which has the following beneficial effects:

[0017] 1. For this high multi-layer mechanical blind buried via circuit board, by providing limiting corners higher than the board body at the four corners of the filling plate, when the circuit board body is installed on the filling plate, the corners of the circuit board body are located inside the limiting corners, and at the same time, resistance is generated between the contact surfaces of the bottom resistance convex buttons. During the pressing and forming process, the stability of the circuit board is effectively ensured, the phenomenon of offset is avoided, the yield is improved, and the manufacturing cost is reduced.

[0018] 2. For this high multi-layer mechanical blind buried via circuit board, during the stacking and pressing and forming process, the docking convex blocks of the upper filling plate are inserted into the docking recesses of the lower filling plate to ensure the stability between the filling plates. At the same time, calibration notches are provided on the side of the filling plate, and installation notches are provided on the inner side of the adhesive layer. During the stacking and pressing and forming of the multi-layer circuit board, by installing calibration rods between the installation notches and the calibration notches, the sides of multiple filling plates are ensured to be flush, and further the neatness of the overall side of the circuit board during pressing and forming is ensured. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall external structure of the device of the present utility model;

[0020] Figure 2 It is a schematic diagram of the overall structure of the filling component of the present utility model;

[0021] Figure 3 For the present utility model Figure 1 Schematic diagram of the structure at position A in it;

[0022] Figure 4 For the present utility model Figure 2 Schematic diagram of the structure at position B in it.

[0023] In the attached drawings, the list of components represented by each reference numeral is as follows:

[0024] 1. Filling component; 101. Filling plate; 102. Connecting hole; 103. Resistance convex button; 104. Limiting corner; 105. Docking notch; 106. Docking convex block; 107. Calibration notch; 108. Adhesive layer; 109. Installation notch; 110. Calibration rod;

[0025] 2. Circuit board component; 201. Circuit board body. Specific implementation manners

[0026] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the attached drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model. Embodiment 1

[0027] Please refer to Figures 1-4 As shown, the high-multi-layer mechanical blind buried via circuit board proposed in this embodiment includes a filling component 1 and a circuit board component 2. The filling component 1 includes a filling plate 101. A limiting corner 104 is fixed to the side of the filling plate 101, and an adhesive layer 108 is fixed to the side of the limiting corner 104. The filling plate 101 is filled between two layers of circuit board bodies 201. By connecting circuit paths of different layers, the electrical connection inside the multi-layer circuit board becomes more reliable and stable. At the same time, it can help conduct heat inside the circuit board, and the filling plate 101 can also enhance the mechanical strength and stability of the circuit board. At the same time, it can be used to control the impedance of signal transmission lines and reduce the influence of electromagnetic interference (EMI).

[0028] The circuit board assembly 2 includes a circuit board body 201 mounted on a filling board 101. The side portion of the circuit board body 201 is fitted within the limiting corner 104, and at the same time, the adhesive layer 108 is fitted to the side portion of the circuit board body 201. The limiting corners 104 are fixed at the four corners on the upper and lower surfaces of the filling board 101. The limiting corners 104 are fitted to the side portion of the circuit board body 201, improving the installation stability of the circuit board body 201 and avoiding the offset and dislocation of the circuit board body 201 during the pressing and forming process. Through the adhesive layer 108, the filling board 101 filled between the multi-layer circuit board bodies 201 is adhesively fixed.

[0029] The working principle of the high multi-layer mechanical blind buried via circuit board proposed in this embodiment is as follows: By providing multi-layer circuit board bodies 201, a filling board 101 is installed at the bottom of each layer of the circuit board body 201, and it is ensured that the corners of the circuit board body 201 are fitted within the corners of the limiting corner 104. At the same time, the bottom of the circuit board body 201 is fitted on the filling board 101 and the resistance bump 103, realizing the assembly of a single-layer circuit board. By stacking multiple assembled single circuit boards, the docking bump 106 provided at the bottom of the upper limiting corner 104 is inserted into the docking notch 105 opened in the lower limiting corner 104, and it is ensured that the circuit board with buried vias is in the middle layer, while the circuit board with blind vias is in the outermost layer. Then, an adhesive layer 108 is bonded to the side of the stacked circuit boards. At the same time, it is ensured that the calibration rod 110 is between the calibration notch 107 and the installation notch 109, and then it can be formed by machine pressing. Embodiment 2

[0030] Please refer to Figures 1-4 As shown, for the high multi-layer mechanical blind buried via circuit board proposed in this embodiment, on the basis of Embodiment 1, this embodiment further includes that a connection hole 102 is opened on the filling board 101, and a resistance bump 103 is fixed in the connection hole 102. The resistance bump 103 is flush with the surface of the filling board 101, and at the same time, the resistance bump 103 is fitted to the bottom of the circuit board body 201. The docking notch 105 is opened on the limiting corner 104, and at the same time, a docking bump 106 is provided at the bottom. The position of the docking bump 106 corresponds to that of the docking notch 105. The calibration notch 107 is opened on the side of the limiting corner 104, and at the same time, an installation notch 109 is opened in the adhesive layer 108. The position of the calibration notch 107 corresponds to that of the installation notch 109. At the same time, a calibration rod 110 is fixed in the installation notch 109, and the calibration rod 110 is fitted within the calibration notch 107. The height of the limiting corner 104 is half of the thickness of the circuit board body 201.

[0031] In this solution, connection holes 102 are provided at corresponding positions of the top surface of the filling plate 101 and the four corner positions of the ground. Resistance convex buttons 103 are installed in the connection holes 102. The diameter of the resistance convex button 103 matches the diameter in the connection hole 102. And the top surface of the resistance convex button 103 is provided with grid-like stripes to increase the frictional resistance between the contact surface with the circuit board body 201. The limiting corner 104 is in a right-angled shape to wrap the corner of the filling plate 101. When multiple filling plates 101 are stacked, the docking convex block 106 provided at the bottom of the limiting corner 104 is inserted into the docking notch 105 opened in the lower limiting corner 104, increasing the stability of the circuit board stacking, ensuring the neatness of the side during pressing and forming, and at the same time enabling the circuit boards to be aligned. At both ends outside the limiting corner 104, calibration notches 107 are vertically provided. At the same time, at the position corresponding to the calibration notch 107 on the inner side of the adhesive layer 108, a calibration rod 110 with a matching diameter is provided. The length of the calibration rod 110 matches the overall length of the multi-layer circuit board stacking. During pressing and forming, it is limited by the calibration rod 110 to ensure the neatness of the side of the circuit board after pressing and forming. When multiple filling plates 101 are stacked, the limiting corner 104 at the bottom of the upper filling plate 101 fits on the upper end of half of the overall thickness of the circuit board body 201, and there is no overlap between the lower half of the circuit board body 201 and the limiting corner 104 on the top surface of the lower filling plate 101, so as to fully clamp and fix the circuit board body 201, improve the stability of the bonding after stacking, and prevent the circuit board body 201 from shifting.

[0032] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high-layer mechanical blind buried via circuit board, comprising a filling component and a circuit board component, characterized in that: The filling assembly comprises a filling plate, a limiting edge corner is fixed on the side of the filling plate, and an adhesive layer is fixed on the side of the limiting edge corner; The circuit board assembly comprises a circuit board body mounted on a filling plate, the side of the circuit board body is attached to the limiting corner, and the adhesive layer is attached to the side of the circuit board body.

2. A high-layer mechanical blind buried via circuit board according to claim 1, characterized in that: The filling plate is provided with a connection hole, in which a resistance convex button is fixed. The resistance convex button is flush with the surface of the filling plate and is fitted to the bottom of the circuit board body.

3. A high-layer mechanical blind buried via circuit board according to claim 1, characterized in that: A docking notch is provided on the limiting corner, and a docking protrusion is provided at the bottom, and the position of the docking protrusion corresponds to the position of the docking notch.

4. A high-layer mechanical blind buried via circuit board according to claim 3, characterized in that: A calibration notch is provided on the side of the limiting corner, and a mounting notch is provided in the adhesive layer. The calibration notch corresponds to the mounting notch in position, and a calibration rod is fixed in the mounting notch, and the calibration rod fits in the calibration notch.

5. A high-layer mechanical blind buried via circuit board according to claim 4, characterized in that: The height of the limiting corner is half of the thickness of the circuit board body.

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