Flat plate type servo driver

Abstract

The utility model relates to a flat plate type servo driver comprising a substrate comprising a first PCB layer and a second PCB layer which are opposite to each other, the first PCB layer is provided with a high voltage signal port, and the second PCB layer is provided with a low voltage signal port; the capacitor is arranged on the first PCB layer and comprises a positive electrode pin and a negative electrode pin; the positive electrode and negative electrode switching piece is arranged on the positive electrode pin and the negative electrode pin in a sleeving mode, and the capacitor is connected with the first PCB layer through the positive electrode and negative electrode switching piece; and the transformer is arranged on the first PCB layer. The servo driver is small in size, does not occupy too much space in equipment, and is convenient to install, debug, transport and maintain.

Description

Technical Field

[0001] The utility model mainly relates to the technical field of industrial automation, and particularly relates to a flat servo driver. Background Art

[0002] In the field of modern industrial automation, a servo driver is a core component of a motion control system, and it is also known as a "servo controller" or a "servo amplifier". Servo drivers are widely used in industrial robots, semiconductor processing, and other precision automation equipment. With the continuous progress of technology and the increasingly refined development of industrial applications, the objects to be processed tend to be miniaturized and integrated, which poses new requirements for the miniaturized design of servo drivers.

[0003] The power supply voltage ranges applicable to traditional AC servo drivers are mainly AC220 V (volt) and AC380V. The overall size of the servo driver is relatively large and requires a large amount of space. For example, the volume of domestic servo drivers is generally greater than 960 cubic centimeters, and the volume of Japanese servo drivers is generally greater than 780 cubic centimeters. Such a volume not only occupies valuable space inside the equipment but also may cause many inconveniences during installation and commissioning, such as limited space layout. In addition, large servo drivers are not convenient for transportation and maintenance.

[0004] Existing servo drivers have the problem of being too large in volume, which not only limits their application in miniaturized and integrated equipment but also hinders the further improvement of the level of industrial automation. Summary of the Utility Model

[0005] The technical problem to be solved by this application is to provide a flat servo driver with a very small volume, which does not occupy too much space inside the equipment and is convenient for installation, commissioning, transportation, and maintenance.

[0006] The technical solution adopted by this application to solve the above technical problem is a flat servo driver, including: a substrate including opposite first and second PCB layers, a high-voltage signal port provided on the first PCB layer, and a low-voltage signal port provided on the second PCB layer; a capacitor provided on the first PCB layer, the capacitor including a positive electrode pin and a negative electrode pin; a positive and negative adapter piece sleeved on the positive and negative electrode pins, and the capacitor is connected to the first PCB layer through the positive and negative adapter piece; a transformer provided on the first PCB layer.

[0007] In an embodiment of this application, an insulating layer is provided between the first PCB layer and the second PCB layer, and the insulating layer is used to isolate the high-voltage signal traces on the first PCB layer and the low-voltage signal traces on the second PCB layer.

[0008] In one embodiment of the present application, the positive electrode pin and the negative electrode pin protrude outward from the first surface of the capacitor; the positive and negative adapter pieces include an adapter piece connection part and adapter piece pins. The adapter piece connection part is sleeved on the positive electrode pin and the negative electrode pin and is flush with the first surface, and the adapter piece pins are used to connect with the first PCB layer.

[0009] In one embodiment of the present application, the positive and negative adapter pieces further include an inclined surface. The adapter piece connection part is connected to the adapter piece pins through the inclined surface, and there is a height difference between the adapter piece connection part and the adapter piece pins.

[0010] In one embodiment of the present application, the capacitor includes a semi-closed housing, and a groove is formed between the housing and the first surface. The adapter piece connection part is arranged in the groove, and the adapter piece pins are attached to the surface of the housing.

[0011] In one embodiment of the present application, the number of the adapter piece pins is multiple, and the multiple adapter piece pins are evenly distributed around the adapter piece connection part.

[0012] In one embodiment of the present application, a first through hole and a second through hole are provided on the adapter piece connection part. The first through hole corresponds to the positive electrode pin, and the second through hole corresponds to the negative electrode pin. The adapter piece connection part is sleeved on the positive electrode pin and the negative electrode pin through the first through hole and the second through hole.

[0013] In one embodiment of the present application, the servo driver further includes a rectifier bridge, and the rectifier bridge and the transformer are stacked on the first PCB layer. The transformer is a planar transformer or a flyback transformer.

[0014] In one embodiment of the present application, capacitor pin pads are provided on the first PCB layer, and the capacitor is connected to the capacitor pin pads through the positive and negative adapter pieces.

[0015] In one embodiment of the present application, the servo driver further includes a chip, and chip pads are provided on the second PCB layer. The chip is connected to the second PCB layer through the chip pads.

[0016] The technical solution of the present application effectively isolates the electromagnetic interference between high-voltage signals and low-voltage signals by integrating components such as high-voltage signal ports, low-voltage signal ports, capacitors, and transformers on different PCB layers of the substrate, improves the electromagnetic compatibility of the servo driver, can ensure the stability and accuracy of signal transmission, and saves the space of the substrate; the capacitor is connected to the PCB board through the positive and negative adapter pieces, which simplifies the assembly process. The present application realizes the highly integrated design of the servo driver. This flat-panel design significantly saves space, makes the entire servo driver more compact, and is convenient for installation and use in a limited space, especially suitable for application scenarios with strict volume requirements.

[0017] This application is equivalent to a miniaturized AC servo drive with a single-layer planar design. The servo drive is very small in size, with a volume less than 430 cubic centimeters, saving approximately 55% of the space compared to existing domestic servo drives and approximately 45% of the space compared to existing Japanese servo drives, significantly optimizing the space occupation. Description of the Drawings

[0018] To make the above objects, features, and advantages of this application more obvious and understandable, the following provides a detailed description of the specific implementation manners of this application in conjunction with the accompanying drawings, where:

[0019] Figure 1 is the overall structural schematic diagram of a planar servo drive according to an embodiment of this application;

[0020] Figure 2 is the exploded view of a planar servo drive according to an embodiment of this application;

[0021] Figure 3 is the schematic diagram of a substrate according to an embodiment of this application;

[0022] Figure 4 is the schematic diagram of a capacitor and a positive-negative terminal adapter according to an embodiment of this application;

[0023] Figure 5 is the schematic diagram of a capacitor and a positive-negative terminal adapter according to another embodiment of this application;

[0024] Figure 6 is the schematic diagram of a positive-negative terminal adapter according to an embodiment of this application;

[0025] Figure 7 is the top view of a positive-negative terminal adapter according to an embodiment of this application;

[0026] Figure 8 is the front view of a positive-negative terminal adapter according to an embodiment of this application;

[0027] Figure 9 is the side view of a positive-negative terminal adapter according to an embodiment of this application.

[0028] Explanation of the reference numerals in the specific implementation manners:

[0029] 100. Servo driver; 101. Substrate; 1011. First PCB layer; 1012. Second PCB layer; 1013. High-voltage signal port; 1014. Low-voltage signal port; 1015. Insulation layer; 102. Capacitor; 1021. First surface; 1022. Positive electrode pin; 1023. Negative electrode pin; 1024. Outer shell; 1025. Groove; 103. Positive and negative adapter piece; 1031. Adapter piece connection part; 1032. Adapter piece pin; 1033. Inclined surface; 1034. First through hole; 1035. Second through hole; 104. Transformer; 105. Rectifier bridge; 106. Capacitor pin pad; 107. Chip pad. Detailed implementation manners

[0030] To make the above objects, features, and advantages of the present application more obvious and understandable, the following will describe the detailed implementation manners of the present application in conjunction with the accompanying drawings.

[0031] In the following description, many specific details are set forth in order to fully understand the present application. However, the present application may also be implemented in other ways different from those described herein. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0032] As shown in the present application and the claims, unless the context clearly indicates otherwise, words such as "a", "an", "one", and / or "the" are not specifically singular and may also include plural. Generally speaking, the terms "include" and "comprise" only indicate the inclusion of the steps and elements that have been clearly identified, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements.

[0033] In the description of the present application, it should be understood that the orientation or positional relationships indicated by orientation words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal", and "top, bottom" are usually based on the orientation or positional relationships shown in the drawings. This is only for the convenience of describing the present application and simplifying the description. Without contrary explanations, these orientation words do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation. Therefore, it should not be construed as limiting the protection scope of the present application; the orientation words "inside, outside" refer to the inside and outside relative to the contour of each component itself.

[0034] For ease of description, spatial relative terms such as "above", "over", "on the upper surface", "upper", etc. may be used herein to describe the spatial positional relationship of one device or feature to other devices or features as shown in the figures. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is inverted, a device described as "above" or "over" other devices or structures will then be positioned "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both the orientations of "above" and "below". The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the corresponding explanations for the spatial relative descriptions used herein will be made accordingly.

[0035] In addition, it should be noted that the use of terms such as "first", "second", etc. to limit components is merely for the convenience of differentiating the corresponding components. Without additional statements, the above terms have no special meanings, and thus should not be construed as limiting the scope of protection of this application. In addition, although the terms used in this application are selected from well-known and commonly used terms, some of the terms mentioned in the specification of this application may be selected by the applicant according to his or her judgment, and their detailed meanings are described in the relevant parts of this description. In addition, it is required to understand this application not only through the actual terms used, but also through the meanings implied by each term.

[0036] Hereinafter, embodiments of the present application will be described based on the drawings. However, the embodiments shown below are examples of a flat-type servo driver for embodying the technical idea of the present application, and the flat-type servo driver of the present application is not specifically limited to the following content. Furthermore, this specification assigns the numbers corresponding to the components shown in the embodiments to the components shown in the "claims" and "application content" columns in order to easily understand the scope of the claims. However, by no means is the component shown in the claims specified as the component of the embodiment. In particular, the dimensions, materials, shapes, and relative configurations of the components described in the embodiments, unless specifically stated, are not intended to limit the scope of the present application thereto, but are merely illustrative examples.

[0037] However, the dimensions, positional relationships, etc. of the components shown in the respective drawings are sometimes exaggerated for clarity. Further, in the following description, for the same names and symbols, components that are the same or of the same nature are appropriately described in detail. Further, each element constituting the present application may be configured such that a plurality of elements are formed of the same component, so that one component is used for multiple elements, or conversely, the functions of one component may be shared by a plurality of components. In addition, the content described in a part of the embodiments and implementation manners can also be used in other embodiments, implementation manners, etc. In addition, in this specification, "upper" is not limited to the case where it is formed in contact with the upper surface, but also includes the case where it is formed separately above, and is also used in the sense that there is an intervening layer between layers.

[0038] The present application provides a flat servo driver, which can be applied to controlled devices that require miniaturization and high-integration design.

[0039] Figure 1 is a schematic diagram of the overall structure of the flat servo driver according to an embodiment of the present application. Figure 2 is an exploded view of the flat servo driver according to an embodiment of the present application. Figure 3 is a schematic diagram of a substrate according to an embodiment of the present application. Figure 4 is a schematic diagram of a capacitor and a positive / negative terminal adapter in an embodiment of the present application. Refer to Figures 1 to 4 As shown, the flat servo driver 100 of the present application includes: a substrate 101, including opposite first PCB layer 1011 and second PCB layer 1012, a high-voltage signal port 1013 is provided on the first PCB layer 1011, and a low-voltage signal port 1014 is provided on the second PCB layer 1012; a capacitor 102, provided on the first PCB layer 1011, the capacitor 102 includes a positive electrode pin 1022 and a negative electrode pin 1023; a positive / negative terminal adapter 103, sleeved on the positive electrode pin 1022 and the negative electrode pin 1023, and the capacitor 102 is connected to the first PCB layer 1011 through the positive / negative terminal adapter 103; a transformer 104, provided on the first PCB layer 1011.

[0040] Refer to Figure 1 As shown, by way of example, the full name of PCB is Printed Circuit Board, that is, a printed circuit board. Figure 1On the first PCB layer 1011, two circular capacitors 102 are provided. The capacitors 102 can be ultra-thin electrolytic capacitors, and the height of the capacitors 102 is less than or equal to 20 mm (millimeters). Such a setting can extremely compress the height of the capacitors 102. The traditional assembly method requires perforating the PCB board, and then the electrolytic capacitors are set on the PCB board by means of through-hole soldering. In this application, a positive and negative terminal adapter 103 is designed, and the positive and negative terminal adapter 103 is soldered to the capacitor 102. The capacitor 102 is set on the PCB board through the positive and negative terminal adapter 103 by means of surface mount soldering, which is convenient for assembling the capacitor 102.

[0041] In practical applications, some miniaturized and low-height components can be installed on the second PCB layer 1012. The flat-panel servo driver 100 designed in this application can achieve the flattening of the entire micro servo driver 100.

[0042] The power supply module, control module, power output module, etc. of the servo driver 100 are not shown in the drawings of this application. In practical applications, these modules can be independently selected to be set on the first PCB layer 1011 or the second PCB layer 1012.

[0043] The technical solution of this application integrates components such as the high-voltage signal port 1013, low-voltage signal port 1014, capacitor 102, and transformer 104 on different PCB layers of the substrate 101 respectively, effectively isolating the electromagnetic interference between high- and low-voltage signals, improving the electromagnetic compatibility of the servo driver 100, ensuring the stability and accuracy of signal transmission, and saving the space of the substrate 101; connecting the capacitor 102 to the surface of the PCB board through the positive and negative terminal adapter 103 simplifies the assembly process.

[0044] This application realizes the highly integrated design of the servo driver 100. This flat-panel design significantly saves space, makes the entire servo driver 100 more compact, is convenient for installation and use in a limited space, and is especially suitable for application scenarios with strict volume requirements. This application is equivalent to a miniaturized AC servo driver with a single-layer flat-panel design. The volume of this servo driver 100 is very small, less than 430 cubic centimeters. Compared with the existing domestic servo drivers, the space is saved by about 55%, and compared with the existing Japanese servo drivers, the space is saved by about 45%, greatly optimizing the space occupation.

[0045] Reference Figure 3As shown, in some embodiments, an insulating layer 1015 is provided between the first PCB layer 1011 and the second PCB layer 1012. The insulating layer 1015 is used to isolate the high-voltage signal traces of the first PCB layer 1011 and the low-voltage signal traces of the second PCB layer 1012. Exemplarily, the first PCB layer 1011 is equivalent to the high-voltage signal trace layer, and the second PCB layer 1012 is equivalent to the low-voltage signal trace layer. In this application, the insulating layer 1015 isolates the high-voltage signal of the capacitor 102 from the low-voltage signals of other components such as chips, saving the insulation isolation distance between high and low voltage signals and further saving the space of the PCB.

[0046] Refer to Figure 2 and Figure 3 As shown, in some embodiments, capacitor pin pads 106 are provided on the first PCB layer 1011, and the capacitor 102 is connected to the capacitor pin pads 106 through the positive and negative terminal transfer piece 103. In some embodiments, the servo driver 100 further includes a chip (not shown), and chip pads 107 are provided on the second PCB layer 1012. The chip is connected to the second PCB layer 1012 through the chip pads 107.

[0047] Exemplarily, the capacitor pin pads 106 and the chip pads 107 can be set as metal contact points or metal contact parts for soldering components. In this application, the provision of pads can provide a reliable electrical connection to ensure the smooth transmission of signals and current between the electronic components and the PCB. By soldering the components to the substrate 101, the components can be prevented from loosening or falling off.

[0048] Figure 6 is a schematic diagram of the positive and negative terminal transfer piece in an embodiment of this application, Figure 7 is a top view of the positive and negative terminal transfer piece in an embodiment of this application. Refer to Figure 4 、 Figure 6 、 Figure 7 As shown, in some embodiments, the positive pin 1022 and the negative pin 1023 protrude outward from the first surface 1021 of the capacitor 102; the positive and negative terminal transfer piece 103 includes a transfer piece connection portion 1031 and transfer piece pins 1032. The transfer piece connection portion 1031 is sleeved on the positive pin 1022 and the negative pin 1023 and is flush with the first surface 1021, and the transfer piece pins 1032 are used to connect to the first PCB layer 1011.

[0049] Exemplarily, Figure 4 the positive and negative terminal transfer piece 103 and the capacitor 102 shown in Figure 4The adapter connection part 1031 sleeved on the positive electrode pin 1022 shown in the figure is not flat against the first surface 1021, while the adapter connection part 1031 sleeved on the negative electrode pin 1023 is flat against the first surface 1021. In practical applications, if the positive and negative adapter 103 and the capacitor 102 are fully assembled, all adapter connection parts 1031 need to be flat and welded to the first surface 1021. Such a setting can improve the connection stability between the capacitor 102 and the first PCB layer 1011.

[0050] Reference Figure 7 As shown, in some embodiments, the adapter connection part 1031 is provided with a first through hole 1034 and a second through hole 1035. The first through hole 1034 corresponds to the positive electrode pin 1022, and the second through hole 1035 corresponds to the negative electrode pin 1023. The adapter connection part 1031 is sleeved on the positive electrode pin 1022 and the negative electrode pin 1023 through the first through hole 1034 and the second through hole 1035. Exemplarily, Figure 7 The adapter connection part 1031 shown in the figure is in a circular ring shape, and the radius of the circular ring-shaped adapter connection part 1031 is R3. In practical applications, the adapter connection part 1031 can be set into other shapes, which is not limited in this application.

[0051] In some embodiments, the number of adapter pins 1032 is multiple, and the multiple adapter pins 1032 are evenly distributed around the adapter connection part 1031. Exemplarily, Figure 7 There are 6 adapter pins 1032 on the positive and negative adapter 103 in the figure. There are 3 adapter pins 1032 on the left and right adapter connection parts 1031 respectively. 6 welding points can be set on the capacitor pin pad 106, and the adapter pins 1032 and the welding points are in one-to-one correspondence during welding. Such a setting can improve the assembly stability of the capacitor 102.

[0052] Figure 8 is the front view of the positive and negative adapter in an embodiment of the present application, Figure 9 is the side view of the positive and negative adapter in an embodiment of the present application. Reference Figure 6 , Figure 8 , Figure 9 As shown, in some embodiments, the positive and negative adapter 103 further includes an inclined surface 1033. The adapter connection part 1031 is connected to the adapter pin 1032 through the inclined surface 1033, and there is a height difference between the adapter connection part 1031 and the adapter pin 1032. Exemplarily, the height difference is such as Figure 8 the distance H1 shown in the figure or Figure 9 the distance H2 shown in the figure.

[0053] Exemplarily, Figure 7Among them, the distance L1 can be set to 9.9 mm, the distance L2 can be set to 23.8 mm, the distance W1 can be set to 4.5 mm, and the distance W2 can be set to 13.8 mm. Figure 8 Among them, the distance L3 can be set to 2.2 mm, and the distance H1 can be set to 0.6 mm. Figure 9 Among them, the distance L4 can be set to 2.2 mm, the distance H2 can be set to 0.6 mm, and the distance H3 can be set to 0.6 mm. The present application does not limit the size of the positive and negative electrode connecting piece 103.

[0054] Figure 5 It is a schematic diagram of a capacitor and a positive and negative electrode connecting piece in another embodiment of the present application. Refer to Figure 4 and Figure 5 As shown, in some embodiments, the capacitor 102 includes a semi-closed housing 1024. A groove 1025 is formed between the housing 1024 and the first surface 1021. The connecting piece connecting portion 1031 is disposed in the groove 1025, and the connecting piece pin 1032 is attached to the surface of the housing 1024.

[0055] Exemplarily, as Figure 4 shown, after welding the positive and negative electrode connecting piece 103 to the capacitor 102, the connecting piece connecting portion 1031 is flat against the first surface 1021 of the capacitor 102, and the connecting piece pin 1032 is attached to the surface of the housing 1024. As Figure 5 shown, after welding the positive and negative electrode connecting piece 103 to the capacitor 102, the connection point between the two connecting piece connecting portions 1031 can be cut off, and the positive electrode pin 1022 and the negative electrode pin 1023 can also be cut short. Such a setting facilitates assembly and can prevent short circuits. As Figure 2 shown, when welding the capacitor 102 and the first PCB layer 1011, align the capacitor 102, the positive and negative electrode connecting piece 103, and the capacitor pin pad 106. It should be noted the corresponding relationship between the polarity of the first PCB layer 1011 and the capacitor 102.

[0056] Refer to Figure 1 As shown, in some embodiments, the servo driver 100 further includes a rectifier bridge 105. The rectifier bridge 105 and the transformer 104 are stacked on the first PCB layer 1011. The transformer 104 is a planar transformer or a flyback transformer. Exemplarily, a heat dissipation material and an electromagnetic shielding isolation device can be provided between the rectifier bridge 105 and the transformer 104, so as to improve the heat dissipation effect between the two components and ensure the electromagnetic compatibility between the components. By stacking the rectifier bridge 105 and the transformer 104, the present application can save the space inside the servo driver 100 and effectively improve the integration of the servo driver 100.

[0057] Exemplarily, in other embodiments, the transformer 104 (such as a planar transformer) can be embedded into the substrate 101. For example, after the embedded setting, both ends of the transformer 104 can protrude outward from the surfaces of the first PCB layer 1011 and the second PCB layer 1012 respectively. Through the unique design of the embedded transformer 104, the height of the transformer 104 can be compressed, making the overall design of the servo driver 100 more compact.

[0058] This application designs the servo driver by adopting a single-board type and a high-low voltage staggered layer isolation method. The AC servo driver 100 of this application has a compact structure, and its volume is less than 430 cubic centimeters. Compared with the existing domestic servo drivers, the space is saved by about 55%, and compared with the existing Japanese servo drivers, the space is saved by about 45%. The space occupation is greatly optimized, which is convenient for installation and use in the limited space of the equipment.

[0059] Although some currently useful utility model embodiments are discussed through various examples in the above disclosure, it should be understood that such details only serve the purpose of illustration. The appended claims are not limited to the disclosed embodiments. On the contrary, the claims are intended to cover all modifications and equivalent combinations that conform to the essence and scope of the embodiments of this application. For example, although the system components described above can be implemented by hardware devices, they can also be implemented only through software solutions, such as installing the described system on existing servers or mobile devices.

[0060] Similarly, it should be noted that, in order to simplify the expression of the disclosure of this application and thus help the understanding of one or more utility model embodiments, in the previous description of the embodiments of this application, sometimes multiple features are merged into one embodiment, drawing, or description thereof. However, this disclosure method does not mean that the features required by the object of this application are more than those mentioned in the claims. In fact, the features of the embodiments are less than all the features of the single embodiments disclosed above.

[0061] In some embodiments, numbers describing the composition and attribute quantity are used. It should be understood that such numbers used for the description of embodiments are modified by the modifiers "about", "approximately", or "substantially" in some examples. Unless otherwise stated, "about", "approximately", or "substantially" indicate that the said numbers allow a change of ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, and such approximate values can change according to the characteristics required by individual embodiments. In some embodiments, the numerical parameters should consider the specified significant digits and adopt the method of retaining the general number of digits. Although the numerical ranges and parameters used to confirm the breadth of the scope in some embodiments of this application are approximate values, in specific embodiments, such numerical settings are made as precise as possible within the feasible range.

[0062] Although this application has been described with reference to current specific embodiments, those of ordinary skill in the art should recognize that the above embodiments are only used to illustrate this application, and various equivalent changes or substitutions can be made without departing from the spirit of this application. Therefore, as long as the changes and modifications to the above embodiments are within the scope of the spirit of this application, they will fall within the scope of the claims of this application.

Claims

1. A flat servo driver, characterized in that: include: The substrate comprises a first PCB layer and a second PCB layer opposite to each other, wherein the first PCB layer is provided with a high-voltage signal port, and the second PCB layer is provided with a low-voltage signal port; A capacitor is arranged on the first PCB layer, and the capacitor includes a positive pin and a negative pin; A positive and negative electrode adapter sheet is sleeved on the positive electrode pin and the negative electrode pin, and the capacitor is connected to the first PCB layer through the positive and negative electrode adapter sheet; The transformer is arranged on the first PCB layer.

2. The flat servo driver according to claim 1, characterized in that: An insulating layer is disposed between the first PCB layer and the second PCB layer, and the insulating layer is used to isolate the high-voltage signal wiring of the first PCB layer from the low-voltage signal wiring of the second PCB layer.

3. The flat servo driver according to claim 1, characterized in that: The positive pin and the negative pin protrude outward from the first surface of the capacitor; the positive and negative adapters include an adapter connecting portion and an adapter pin, the adapter connecting portion is sleeved on the positive pin and the negative pin and is flat against the first surface, and the adapter pin is used to connect to the first PCB layer.

4. The flat servo driver according to claim 3, characterized in that: The positive and negative electrode adapter sheet further includes an inclined surface, the adapter sheet connection portion is connected to the adapter sheet pin via the inclined surface, and there is a height difference between the adapter sheet connection portion and the adapter sheet pin.

5. The flat servo driver according to claim 4, characterized in that: The capacitor comprises a semi-enclosed shell, a groove is formed between the shell and the first surface, the adapter connecting portion is arranged in the groove, and the adapter pins are in contact with the surface of the shell.

6. The flat servo driver according to claim 3, characterized in that: The number of the adapter pins is multiple, and the multiple adapter pins are evenly distributed around the adapter connecting portion.

7. The flat servo driver according to claim 3, characterized in that: The adapter connecting portion is provided with a first through hole and a second through hole, the first through hole corresponds to the positive electrode pin, and the second through hole corresponds to the negative electrode pin, and the adapter connecting portion is sleeved on the positive electrode pin and the negative electrode pin through the first through hole and the second through hole.

8. The flat servo driver according to claim 1, characterized in that: It also includes a rectifier bridge, wherein the rectifier bridge and the transformer are stacked on the first PCB layer, and the transformer is a planar transformer or a flyback transformer.

9. The flat servo driver according to claim 1, characterized in that: A capacitor pin pad is provided on the first PCB layer, and the capacitor is connected to the capacitor pin pad through the positive and negative electrode adapter sheet.

10. The flat servo driver according to claim 1, characterized in that: It also includes a chip, a chip pad is arranged on the second PCB layer, and the chip is connected to the second PCB layer through the chip pad.

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