Heat dissipation block

Abstract

The utility model discloses a heat dissipation block, which belongs to the technical field of heat dissipation, and adopts the specific scheme that a thicker first block body, extension parts symmetrically extending from the first block body and free edges connected with the extension parts and extending outwards are adopted, a plurality of through holes are formed in the first block body at intervals, heat dissipation fans are arranged in the through holes, and the free edges are connected with the extension parts. The first block body and the extending part form a groove. A liquid cooling hole can be formed in the first block body, the heat dissipation efficiency of the heat dissipation block is effectively improved, and the heat dissipation effect is guaranteed.

Description

Technical Field

[0001] The utility model relates to a heat sink, in particular to a metal heat sink. Background Art

[0002] Copper bars (copper strips, copper blocks) are widely used inside or between components such as batteries or motors due to their good thermal conductivity. When current flows through, a contact resistance is formed at the contact interface between the copper bar and the component, generating Joule heat. When the temperature is too high, it is easy to cause the component parts to age or be damaged more quickly.

[0003] The forms of electrical connection include crimp connection, mechanical connection, wedge connection, make-break disconnect connection, and fuse connection. In electrical equipment, copper bars and other electrical components are mainly fixedly connected by bolts and soldering.

[0004] The power density of the PCB is increasing continuously, and an effective heat dissipation structure is required to ensure its stable operation. Content of the Utility Model

[0005] The main purpose of the utility model is to solve the technical problems of large heat generation and heat concentration of heat-generating devices on the integrated circuit board.

[0006] According to the utility model, a heat sink is proposed, which includes a first block body, extension parts symmetrically extending from the first block body, and free edges connected to the extension parts and extending outwards. Among them, a plurality of through holes are arranged at intervals on the first block body, a heat dissipation fan is arranged in the through holes, and a groove is formed between the first block body and the extension parts.

[0007] Preferably, the thickness of the first block body is greater than the thickness of the free edge.

[0008] Preferably, a recess is formed on the free edge.

[0009] Preferably, a round hole is formed on the free edge.

[0010] Preferably, streamlined heat dissipation fins are arranged on one side of the first block body far from the groove, and the streamlined heat dissipation fins are arranged at intervals along the width direction of the first block body.

[0011] The utility model proposes another heat sink, which includes a first block body, extension parts symmetrically extending from the first block body, and free edges connected to the extension parts and extending outwards. Among them, a groove is formed between the first block body and the extension parts, and the thickness of the first block body is greater than the thickness of the free edge.

[0012] Preferably, a recess is formed on the free edge.

[0013] Preferably, streamlined heat sinks are provided on one side of the first block away from the groove, and the streamlined heat sinks are arranged at intervals in the width direction of the first block.

[0014] Preferably, liquid cooling holes are formed on the side of the first block, and the liquid cooling holes extend along the length direction of the first block. A fixing plate is arranged on the side of the liquid cooling holes. A liquid cooling joint is provided on the fixing plate corresponding to the liquid cooling holes. The liquid cooling joint includes a first end and a second end of the liquid cooling joint. The first end of the liquid cooling joint faces the outside of the fixing plate, and the second end of the liquid cooling joint faces the inside of the fixing plate. The first ends of adjacent liquid cooling joints are connected through elbows. The second end of the liquid cooling joint is correspondingly connected to the liquid cooling hole. The first ends of the liquid cooling joints on one side of the fixing plate respectively form an inlet and an outlet.

[0015] Preferably, the first block, the extension part, the free edge and the streamlined heat sink are integrally formed, and the material is copper, aluminum or graphite.

[0016] The technical solution of the present utility model adopts a first block with a relatively large thickness, an extension part symmetrically extends from the first block, and a free edge connected to the extension part and extending outwards. Among them, a plurality of through holes are arranged at intervals on the first block, and heat dissipation fans are arranged in the through holes. A groove is formed between the first block and the extension part. A liquid cooling hole can also be arranged on the first block, which effectively improves the heat dissipation efficiency of the heat dissipation block and ensures the heat dissipation effect. Description of the Drawings

[0017] Referring to the drawings, the drawings required for use in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings are only for illustrative purposes and do not limit the protection scope of the present utility model.

[0018] Figure 1 It is a schematic structural diagram of a heat dissipation block according to an embodiment of the present utility model.

[0019] Figure 2 It is a schematic structural diagram of another heat dissipation block according to an embodiment of the present utility model.

[0020] Figure 3 It is a schematic structural diagram of another heat dissipation block according to an embodiment of the present utility model.

[0021] Figure 4 It is a schematic structural diagram of a liquid cooling joint according to an embodiment of the present utility model.

[0022] Explanation of the Reference Numerals in the Drawings

[0023] 10, 20, 30, heat sink; 11, first block; 11a, streamlined heat sink fin; 11b, liquid cooling hole; 11c, fixing plate; 11c1, first end of the liquid cooling joint; 11c11, inlet; 11c2, second end of the liquid cooling joint; 11c22, outlet; 111, through hole; 112, cooling fan; 12, extension; 121, free edge; 1211, recess; 122, groove.

[0024] The realization, functional features and advantages of the present utility model will be further described in conjunction with the embodiments and with reference to the accompanying drawings. Detailed implementation manners

[0025] To make the objectives, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present disclosure. Apparently, the described embodiments are some but not all of the embodiments of the present disclosure. All other embodiments obtained by those of ordinary skill in the art based on the described embodiments of the present disclosure without creative efforts shall fall within the scope of protection of the present disclosure.

[0026] It should be noted that if there are directional indications (such as up, down, left, right, front, back,...) involved in the embodiments of the present utility model, the directional indications are only used to explain the relative positional relationship and movement conditions between components in a specific posture (as shown in the drawings). If the specific posture changes, the directional indications will also change accordingly.

[0027] The present utility model provides a heat sink, the material of which is high thermal conductivity metals such as copper and aluminum, and high thermal conductivity non-metallic materials such as graphite, thermal conductive silica gel and thermal conductive silicone grease. Refer to Figure 1 , which discloses a heat sink 10, specifically including: a first block 11, an extension 12 symmetrically extending from the first block 11, and a free edge 121 extending outward and connected to the extension 12. Among them, through holes 111 are arranged at intervals along the length direction on the first block 11, and cooling fans 112 are arranged in the through holes 111. A groove 122 is formed between the first block 11 and the extension 12. The thickness of the first block 11 is greater than the thickness of the free edge 121.

[0028] The structure of the above heat sink can be fixed on the integrated circuit board through thermal conductive glue. Resistors, inductors, transistors and other high-power devices are integrated on the integrated circuit board, which generate a large amount of heat. The heat sink is attached above or near the above devices or on the back of the integrated circuit board. The free edge conducts the heat on the integrated circuit board to the first block through the extension part. The first block has a large surface, which is beneficial to heat dissipation. In addition, the first block has a large thickness, which is beneficial to improving the heat conduction efficiency and heat dissipation efficiency. A cooling fan is arranged in the through hole on the first block to assist in improving the heat dissipation effect.

[0029] It can be known that the free edge can extend outwards to ensure a large contact surface to contact the integrated circuit board through thermal conductive glue.

[0030] The present utility model proposes another heat sink 20, which is generally very similar to the heat sink 10. Therefore, the same reference numerals are used for the structures with the same functions. Figure 1 The difference lies in that a recess 1211 is formed on the free edge 121. Refer to Figure 2 , the recess 1211 is used to fix the free edge 121, and a convex part (not shown in the figure) is arranged at the corresponding position to match the recess 1211, so as to realize the snap-fitting fixation of the heat sink 20, improve the stability of the heat sink 20, and is easy to replace. It can be known that the recess 1211 can be replaced by a round hole.

[0031] On one side of the first block 11 of the heat sink 20 away from the groove 122, streamlined heat dissipation fins 11a are arranged, and the streamlined heat dissipation fins 11a are arranged at intervals along the width direction of the first block 11. This structure further improves the heat dissipation efficiency of the first block 11.

[0032] The present utility model proposes another heat sink 30, which is generally very similar to the heat sink 10. Therefore, the same reference numerals are used for the structures with the same functions. Figure 1 The difference lies in that a recess 1211 is formed on the free edge 121. Refer to Figure 3 , the recess 1211 is used to fix the free edge 121, and a convex part (not shown in the figure) is arranged at the corresponding position to match the recess 1211, so as to realize the snap-fitting fixation of the heat sink 20, improve the stability of the heat sink 20, and is easy to replace. It can be known that the recess 1211 can be replaced by a round hole.

[0033] The through hole and the cooling fan are cancelled on the heat sink 30. On one side of the first block 11 of the heat sink 30 away from the groove 122, streamlined heat dissipation fins 11a are arranged, and the streamlined heat dissipation fins 11a are arranged at intervals along the width direction of the first block 11. This structure further improves the heat dissipation efficiency of the first block 11.

[0034] A liquid cooling hole 11b is formed in the length direction of the first block 11. The liquid cooling hole 11b extends along the length direction of the first block 11 to form a through hole. A fixing plate 11c is arranged on the side of the liquid cooling hole 11b of the first block 11. A liquid cooling joint is arranged on the fixing plate 11c corresponding to the liquid cooling hole 11b. The liquid cooling joint includes a first end 11c1 and a second end 11c2 of the liquid cooling joint. The first end 11c1 of the liquid cooling joint faces the outside of the fixing plate( Figure 4 ), the second end 11c2 of the liquid cooling joint faces the inside of the fixing plate, the second end 11c2 of the liquid cooling joint is connected to the liquid cooling hole 11b, and the first end 11c1 of the liquid cooling joint communicates with the first end 11c1 of the adjacent liquid cooling joint through an elbow. An inlet 11c11 and an outlet 11c22 are arranged on one side of the fixing plate 11c.

[0035] Cooling medium is introduced into the inlet of the above structure, and the cooling medium is discharged through the pipeline. The cooling medium passes through the first block, transfers the heat in the first block to the cooling medium, and is discharged along with the cooling medium, so as to reduce the temperature of the first block to achieve the heat dissipation effect. This structure eliminates the cooling fan, effectively reduces the noise, and the heat dissipation effect is related to the temperature and thermal conductivity of the cooling medium. When water is selected as the cooling medium, due to the large specific heat capacity of water, it can take away the heat in the first block to the greatest extent. It can be known that cold gas can also be selected as the cooling medium to avoid leakage caused by poor sealing of the liquid cooling joint and affect the conductivity of the integrated circuit board.

[0036] Furthermore, the cooling medium can be restricted in a soft sealing tube. The soft sealing tube is made of silicone material with good thermal conductivity and is sequentially inserted into the liquid cooling holes in the first block to form a complete loop. One end of the soft sealing tube is the inlet and the other end is the outlet. To improve the thermal conductivity efficiency, after the soft sealing tube is inserted, a thermal conductive sealing material such as thermal conductive glue can be filled in the gap between the soft sealing tube and the liquid cooling hole.

[0037] The flow rate and flow velocity of the cooling medium can be realized through a control system. The control system can obtain the real-time power of the power device of the integrated circuit board, and can control the flow rate and flow velocity of the cooling medium according to the power size data signal of the power device obtained by the control system.

[0038] It should be noted that the first block, the extension part, the free edge and the streamlined heat sink in the above embodiments are integrally formed to avoid excessive thermal resistance during the heat transfer process.

Claims

1. A heat dissipation block, comprising a first block (11), an extension portion (12) symmetrically extending from the first block (11), and a free edge (121) connected to the extension portion (12) and extending outward, characterized in that: A plurality of through holes (111) are arranged at intervals on the first block (11), a heat dissipation fan (112) is arranged in the through hole (111), and the first block (11) and the extension portion (12) form a groove (122).

2. The heat sink according to claim 1, characterized in that: The thickness of the first block (11) is greater than the thickness of the free edge (121).

3. The heat sink according to claim 2, characterized in that: A recess (1211) is provided on the free edge.

4. The heat sink according to claim 2, characterized in that: A circular hole is provided on the free edge.

5. The heat sink according to claim 3, characterized in that: Streamlined heat sinks (11a) are provided on a side of the first block (11) away from the groove (122), and the streamlined heat sinks (11a) are arranged at intervals along the width direction of the first block (11).

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