Clamping type semiconductor electronic component heat dissipation assembly

Abstract

The utility model provides a clamping type semiconductor electronic component heat dissipation assembly, which relates to the technical field of heat dissipation assemblies, and comprises a main fin heat dissipation piece, a fin heat dissipation expansion piece and a heat dissipation fan frame, the top of the main fin heat dissipation piece is provided with the fin heat dissipation expansion piece, the top of the fin heat dissipation expansion piece is provided with the heat dissipation fan frame, and the fin heat dissipation expansion piece is provided with the heat dissipation fan frame. Four upper threaded pipe connecting pieces and upper connecting penetrating connecting pieces are fixed to the outer side of the fin heat dissipation expansion piece in an annular array mode, a lower connecting inserting block is fixed to the center of the bottom of the fin heat dissipation expansion piece, and an upper expansion connecting inserting groove is formed in the center of the upper portion of the fin heat dissipation expansion piece. The main fin heat dissipation piece and the fin heat dissipation expansion piece are combined, the requirement for the semiconductor electronic element with the higher heat productivity is met, the main fin heat dissipation piece does not need to be replaced, the main fin heat dissipation piece is reserved for continuous use, and the problem that after the semiconductor electronic element with the higher specification is replaced, the semiconductor electronic element needs to be detached and replaced with a heat dissipation mechanism with larger fins, and the heat dissipation efficiency is high is solved. And the existing metal fin type heat dissipation is idle and wasted.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation components, in particular to a clamping type semiconductor electronic component heat dissipation component. Background Art

[0002] A clamping type semiconductor electronic component is installed and fixed through a socket or a slot on a PCB circuit board. The clamping type semiconductor electronic component can be installed and replaced without soldering, improving the convenience and flexibility of maintenance. In order to reduce the working temperature of the semiconductor electronic component, the semiconductor electronic component is also equipped with a heat dissipation component.

[0003] In the existing semiconductor electronic component, a metal fin type heat dissipation mechanism is attached to the top. The semiconductor electronic component transfers heat to the metal fin type heat dissipation mechanism. The size of the metal fin type heat dissipation mechanism is fixed. When the semiconductor electronic component is replaced with a higher specification, the heat generation of the semiconductor electronic component will also increase. The existing metal fin type heat dissipation mechanism cannot meet the heat dissipation requirements of the semiconductor electronic component. The metal fin type heat dissipation mechanism can only be disassembled and replaced with a heat dissipation mechanism with larger fins, and the existing metal fin type heat dissipation mechanism can only be left idle. Summary of the Invention

[0004] The embodiments of the present disclosure relate to a clamping type semiconductor electronic component heat dissipation component. After the heat generation of the semiconductor electronic component increases when replaced, the main fin heat dissipation member and the fin heat dissipation expansion member are combined to expand the heat dissipation area, meeting the semiconductor electronic component with higher heat generation, without the operation of replacing the main fin heat dissipation member. The main fin heat dissipation member is retained and continued to be used, reducing the additional purchase cost of the new heat dissipation component.

[0005] In the first aspect of the present disclosure, a clamping type semiconductor electronic component heat dissipation component is provided, specifically including: a main fin heat dissipation member, a fin heat dissipation expansion member, and a heat dissipation fan frame. A fin heat dissipation expansion member is arranged on the top of the main fin heat dissipation member, and a heat dissipation fan frame is arranged on the top of the fin heat dissipation expansion member. A central connection slot is concavely arranged in the upper center of the main fin heat dissipation member. Four lower connection through pipes and side threaded pipe connectors are annularly and arrayed on the outside of the main fin heat dissipation member, and the lower connection through pipes and connection studs are connected through penetration.

[0006] In at least some embodiments, the lower connection through pipes and the side threaded pipe connectors are fixedly connected adjacent to each other, and the side threaded pipe connectors and the connection studs are screwed.

[0007] In at least some embodiments, four upper threaded pipe connectors and upper connection through connectors are fixedly and annularly arrayed on the outside of the fin heat dissipation expansion member. A lower connection plug is fixedly arranged at the center of the bottom of the fin heat dissipation expansion member, and an upper expansion connection slot is arranged at the center of the upper part of the fin heat dissipation expansion member.

[0008] In at least some embodiments, the lower connecting plug and the central connecting slot are slidably inserted and connected. A connecting stud passes through the center of the upper connecting through-connector. The lower end of the connecting stud passing through the center of the upper connecting through-connector is screwed to the side threaded pipe connector. The lower connecting plug of the fin heat dissipation expansion part and the central connecting slot at the top of the main fin heat dissipation part are slidably inserted, realizing the vertical combination and fixation of the main fin heat dissipation part and the fin heat dissipation expansion part. After the combination of the main fin heat dissipation part and the fin heat dissipation expansion part, heat conduction is carried out, and the combination of the main fin heat dissipation part and the fin heat dissipation expansion part expands the heat dissipation area.

[0009] In at least some embodiments, four outer through-connection holes are annularly arrayed on the outer side of the heat dissipation fan frame, and an electric heat dissipation fan is arranged in the middle of the heat dissipation fan frame.

[0010] In at least some embodiments, a connecting stud passes through the inner side of the outer through-connection hole. The lower end of the connecting stud on the inner side of the outer through-connection hole is screwed to the upper threaded pipe connector. The rotation of the electric heat dissipation fan promotes air flow, and the air flow drives the heat of the main fin heat dissipation part.

[0011] In at least some embodiments, the lower end of the connecting stud passing through the center of the upper connecting through-connector is screwed to the upper threaded pipe connector of another fin heat dissipation expansion part. The upper expansion connecting slot at the center of the upper part of the fin heat dissipation expansion part and the lower connecting plug of another fin heat dissipation expansion part are slidably inserted, and the fin heat dissipation expansion part combines with another fin heat dissipation expansion part.

[0012] The present utility model provides a clamping type semiconductor electronic component heat dissipation assembly, which has the following beneficial effects:

[0013] After the heat generation of the semiconductor electronic component increases when the main fin heat dissipation part is replaced, the combination of the main fin heat dissipation part and the fin heat dissipation expansion part expands the heat dissipation area, meeting the semiconductor electronic components with higher heat generation. There is no need to operate on replacing the main fin heat dissipation part, and the main fin heat dissipation part is retained for continued use, reducing the cost of the new heat dissipation assembly.

[0014] The fin heat dissipation expansion part can also continue to combine with another fin heat dissipation expansion part, further expanding the overall heat dissipation area, realizing the heat dissipation compatibility for semiconductor electronic components with higher heat generation, and improving the compatibility of different heat dissipation assemblies. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings of the embodiments will be briefly introduced below.

[0016] The drawings in the following description only relate to some embodiments of the present utility model and do not limit the present utility model.

[0017] In the drawings:

[0018] Figure 1A schematic diagram showing the overall structure of the present application;

[0019] Figure 2 A schematic diagram showing the structure of the main fin heat dissipation member of the present application;

[0020] Figure 3 A schematic diagram showing the structure of the fin heat dissipation extension member of the present application;

[0021] Figure 4 A schematic diagram showing the structure of the upper extension connection slot of the present application;

[0022] Figure 5 A schematic diagram showing the structure of the heat dissipation fan frame of the present application;

[0023] Figure 6 A schematic diagram showing the structure of the disassembled state of the present application.

[0024] List of reference numerals

[0025] 1. Main fin heat dissipation member; 101. Central connection slot; 102. Lower connection through pipe fitting; 103. Side threaded pipe connector; 104. Connection stud;

[0026] 2. Fin heat dissipation extension member; 201. Lower connection plug; 202. Upper connection through connector; 203. Upper threaded pipe connector; 204. Upper extension connection slot;

[0027] 3. Heat dissipation fan frame; 301. Outer through connection hole; 302. Electric heat dissipation fan. Detailed implementation manners

[0028] To make the objectives, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are some but not all of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the described embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0029] Embodiment 1: Please refer to Figures 1 to 6 :

[0030] The present utility model proposes a clamping type semiconductor electronic component heat dissipation assembly, including: a main fin heat dissipation member 1, a fin heat dissipation expansion member 2, and a heat dissipation fan frame 3. An inner concave center connection slot 101 is provided in the upper center of the main fin heat dissipation member 1. Four lower connection through pipes 102 and side threaded pipe connectors 103 are annularly arrayed on the outside of the main fin heat dissipation member 1. The lower connection through pipes 102 and connection studs 104 are connected through. The lower connection through pipes 102 and side threaded pipe connectors 103 are fixedly connected adjacent to each other. The side threaded pipe connectors 103 and connection studs 104 are screwed. A fin heat dissipation expansion member 2 is provided on the top of the main fin heat dissipation member 1. Four upper threaded pipe connectors 203 and upper connection through connectors 202 are fixedly annularly arrayed on the outside of the fin heat dissipation expansion member 2. A lower connection plug 201 is fixedly provided at the center of the bottom of the fin heat dissipation expansion member 2. An upper expansion connection slot 204 is provided in the upper center of the fin heat dissipation expansion member 2. A heat dissipation fan frame 3 is provided on the top of the fin heat dissipation expansion member 2. Four outer through connection holes 301 are annularly arrayed on the outside of the heat dissipation fan frame 3. An electric heat dissipation fan 302 is provided in the middle of the heat dissipation fan frame 3. The connection stud 104 penetrates through the inside of the outer through connection hole 301. The lower end of the connection stud 104 inside the outer through connection hole 301 and the upper threaded pipe connector 203 are screwed. The rotation of the electric heat dissipation fan 302 promotes air flow, and the air flow drives the heat of the main fin heat dissipation member 1.

[0031] In the embodiment of the present disclosure, the lower connection plug 201 and the center connection slot 101 are slidably inserted and connected. The connection stud 104 penetrates through the center of the upper connection through connector 202. The lower end of the connection stud 104 at the center of the upper connection through connector 202 and the side threaded pipe connector 103 are screwed. The lower connection plug 201 of the fin heat dissipation expansion member 2 and the center connection slot 101 at the top of the main fin heat dissipation member 1 are slidably inserted, realizing the vertical combination and fixation of the main fin heat dissipation member 1 and the fin heat dissipation expansion member 2. After the combination of the main fin heat dissipation member 1 and the fin heat dissipation expansion member 2, heat conduction is carried out. The combination of the main fin heat dissipation member 1 and the fin heat dissipation expansion member 2 expands the heat dissipation area, meeting the heat dissipation requirements of semiconductor electronic components with higher heat generation.

[0032] In the embodiment of the present disclosure, the lower end of the connection stud 104 at the center of the upper connection through connector 202 and the upper threaded pipe connector 203 of another fin heat dissipation expansion member 2 are screwed. The upper expansion connection slot 204 at the upper center of the fin heat dissipation expansion member 2 and the lower connection plug 201 of another fin heat dissipation expansion member 2 are slidably inserted. The fin heat dissipation expansion member 2 is combined with another fin heat dissipation expansion member 2, further expanding the overall heat dissipation area and meeting the heat dissipation requirements of semiconductor electronic components with higher heat generation.

[0033] Embodiment 2: On the basis of Embodiment 1, a heat dissipation copper tube is arranged inside the lower connecting insert block 201 connected to the bottom of the fin heat dissipation extension part 2. The lower connecting insert block 201 accelerates the heat conduction speed of the fin heat dissipation extension part 2 and the external fins through the copper tube, improves the heat conduction efficiency, and enhances the heat conduction speed between the main fin heat dissipation part 1 and the fin heat dissipation extension part 2.

[0034] The working principle of this embodiment: Silicone grease is applied to the center of the bottom of the main fin heat dissipation part 1 to fit with the semiconductor electronic component. The lower connecting through pipe fitting 102 of the main fin heat dissipation part 1 penetrates through the connecting stud 104 and is screwed and fixed to the threaded pipe of the main board. The heat of the semiconductor electronic component is transferred to the main fin heat dissipation part 1 and conducted to the fin structure outside the main fin heat dissipation part 1. The outer through connection hole 301 of the heat dissipation fan frame 3 is screwed through the connecting stud 104 and the side threaded pipe connecting part 103. The electric heat dissipation fan 302 rotates to promote air flow, and the air flow drives the heat of the main fin heat dissipation part 1. After replacing the semiconductor electronic component with a higher specification, the heat generation of the semiconductor electronic component will also increase. The lower connecting insert block 201 of the fin heat dissipation extension part 2 and the center connection slot 101 at the top of the main fin heat dissipation part 1 are slidably inserted, and thermal conductive silicone grease is applied between the lower connecting insert block 201 and the center connection slot 101 to accelerate the heat transfer efficiency. The side threaded pipe connecting part 103 is connected and fixed to the upper connecting through connecting part 202 through the connecting stud 104, realizing the vertical combination and fixation of the main fin heat dissipation part 1 and the fin heat dissipation extension part 2. After the combination of the main fin heat dissipation part 1 and the fin heat dissipation extension part 2, heat conduction is carried out. The combination of the main fin heat dissipation part 1 and the fin heat dissipation extension part 2 expands the heat dissipation area, meets the heat dissipation requirements of semiconductor electronic components with higher heat generation, and eliminates the need to replace the main fin heat dissipation part 1. The main fin heat dissipation part 1 is retained and continues to be used. Only the fin heat dissipation extension part 2 needs to be added, reducing the cost of the new heat dissipation component;

[0035] The upper extension connection slot 204 of the fin heat dissipation extension part 2 and the lower connecting insert block 201 of another fin heat dissipation extension part 2 are slidably inserted. The fin heat dissipation extension part 2 can continue to be combined with another fin heat dissipation extension part 2. After the two fin heat dissipation extension parts 2 are combined, the overall heat dissipation area is further expanded. The larger heat dissipation area realizes the heat dissipation compatibility and satisfaction of semiconductor electronic components with higher heat generation, improves the compatibility of different heat dissipation components, and enables the heat dissipation component to have an expansion performance.

[0036] In this article, the following points need to be noted:

[0037] 1. The drawings of the embodiments of the present disclosure only relate to the structures involved in the embodiments of the present disclosure. Other structures can refer to the general design.

[0038] 2. Without conflict, the embodiments of the present disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0039] The above are only specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present disclosure can easily think of changes or substitutions, which should all be covered within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims

1. A card-mounted semiconductor electronic component heat dissipation assembly, comprising: A main fin heat sink (1), a fin heat sink extension (2) and a heat sink fan frame (3); characterized in that a fin heat sink extension (2) is arranged on the top of the main fin heat sink (1), a heat sink fan frame (3) is arranged on the top of the fin heat sink extension (2), four upper threaded pipe connectors (203) and an upper connecting through connector (202) are fixed in an annular array on the outer side of the fin heat sink extension (2), a lower connecting plug (201) is fixed at the bottom center of the fin heat sink extension (2), and an upper extension connecting slot (204) is arranged at the upper center of the fin heat sink extension (2).

2. The card-mounted semiconductor electronic component heat dissipation assembly according to claim 1, characterized in that: The main fin heat sink (1) is provided with a central connection slot (101) in the concave upper center portion, and the main fin heat sink (1) has four lower connection through-tube fittings (102) and side threaded tube connectors (103) in an annular array on the outer side, and the lower connection through-tube fittings (102) and the connection studs (104) are through-connected.

3. The card-mounted semiconductor electronic component heat dissipation assembly according to claim 2, characterized in that: The lower connecting through-tube fitting (102) and the side threaded pipe connector (103) are adjacently fixedly connected, and the side threaded pipe connector (103) and the connecting stud (104) are threadedly connected.

4. The card-mounted semiconductor electronic component heat dissipation assembly according to claim 2, characterized in that: The lower connection plug block (201) and the central connection slot (101) are connected by sliding insertion, a connection stud (104) is passed through the center of the upper connection through-connector (202), and the lower end of the connection stud (104) in the center of the upper connection through-connector (202) is threadedly connected to the side threaded pipe connector (103).

5. The card-mounted semiconductor electronic component heat dissipation assembly according to claim 2, characterized in that: The outer annular array of the heat dissipation fan frame (3) has four external through-connection holes (301), and the middle of the heat dissipation fan frame (3) is provided with an electric heat dissipation fan (302).

6. The card-mounted semiconductor electronic component heat dissipation assembly according to claim 5, characterized in that: A connecting stud (104) penetrates the inner side of the outer through-connecting hole (301), and the lower end of the connecting stud (104) inside the outer through-connecting hole (301) is threadedly connected to the upper threaded pipe connector (203).

7. The card-mounted semiconductor electronic component heat dissipation assembly according to claim 2, characterized in that: The lower end of the connecting stud (104) at the center of the upper connecting through-connecting piece (202) is threadedly connected to the upper threaded tube connecting piece (203) of another fin heat dissipation extension piece (2), and the upper extension connecting slot (204) at the center of the upper part of the fin heat dissipation extension piece (2) is slidably inserted into the lower connecting plug block (201) of another fin heat dissipation extension piece (2).

Images