Cutting device for semiconductor processing

Abstract

The utility model relates to the technical field of semiconductor processing equipment, in particular to a cutting device for semiconductor processing. A linear motor is mounted on the base, a collecting frame opposite to the linear motor is arranged at one end of the base, a protective cover is mounted on the base, a laser cutting structure is arranged at the top in the protective cover, a sliding block is arranged on the linear motor, a mounting block is mounted on the sliding block, and a movable block is mounted on the mounting block through a sliding assembly. A limiting block is arranged on the mounting block at the rear end of the movable block, a containing groove used for containing blanks is formed in the movable block, a scraping assembly is arranged in the movable block, a movable door is rotationally mounted at the front end of the protective cover, and door pushing assemblies are arranged on the two sides of the mounting block respectively. The device is provided with the protective cover, protection can be conducted in the cutting process, chippings generated in the cutting process are prevented from flying out, and laser is isolated while chipping splashing is reduced; the device is provided with the sliding assembly and the tension spring, so that a user can discharge materials by pulling a handle outwards, and the operation is simple.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing equipment, and particularly relates to a cutting device for semiconductor processing. Background Art

[0002] With the rapid development of the semiconductor industry, the sizes of integrated circuits and microelectronic devices are continuously shrinking, while the performance and efficiency requirements are constantly increasing. In the semiconductor manufacturing process, as a key step, the cutting technology plays a crucial role in the final quality and performance of products. With the improvement of the design complexity and integration degree of integrated circuits, the requirements for cutting accuracy, speed, quality, etc. are becoming increasingly stringent.

[0003] However, during the use of the laser cutting method, certain debris will splash. The fine debris will cause a certain degree of pollution to the surrounding area, and the splashing debris is very easy to enter the respiratory system of the surrounding personnel, posing a certain safety risk. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a reasonably designed cutting device for semiconductor processing in view of the defects and deficiencies of the prior art, which can solve the above-mentioned defects.

[0005] To achieve the above purpose, the utility model adopts the following technical solutions: It includes a base, a linear motor is installed on the base, a collection box opposite to the linear motor is provided at one end of the base, a protective cover is installed on the base, a laser cutting structure is provided at the inner top of the protective cover, a slider is arranged on the linear motor, a mounting block is installed on the slider, a movable block is installed on the mounting block through a sliding component, a limiting block is provided on the mounting block at the rear end of the movable block, a placement groove for placing a blank is opened in the movable block, a scraping component is arranged in the movable block, a movable door is rotatably installed at the front end of the protective cover, and pushing door components are respectively arranged on both sides of the mounting block.

[0006] Preferably, the sliding component includes several sliding grooves opened above the mounting block, and several sliding blocks are connected to the bottom of the movable block, and the sliding blocks are all slidably installed in the sliding grooves.

[0007] Preferably, several telescopic grooves are opened at the rear side of the movable block, a tension spring is arranged in each telescopic groove, and the two ends of the tension spring are respectively connected to the inner side wall of the telescopic groove and the limiting block.

[0008] Preferably, the scraping component includes a scraping strip arranged at the bottom of the movable block, a groove matching the shape of the scraping strip is opened at the bottom of the movable block, the scraping strip is arranged in the groove, and several compression springs are arranged above the scraping strip.

[0009] Preferably, the pushing door component includes a "U"-shaped pushing door piece connected to the side of the mounting block, and the opening of the pushing door piece faces backward.

[0010] Preferably, several second magnetic blocks are respectively embedded on both sides of the movable door, and first magnetic blocks are embedded at positions opposite to the second magnetic blocks in the protective cover, and the first magnetic blocks are magnetically connected to the second magnetic blocks.

[0011] Preferably, a handle is provided on the movable block.

[0012] Preferably, flexible pads are provided at the front ends of the door-pushing members.

[0013] After adopting the above structure, the beneficial effects of the present utility model are as follows:

[0014] The device is provided with a protective cover, which can provide protection during the cutting process, prevent the chips generated during the cutting process from flying out, reduce the chip splash and isolate the laser at the same time, and prevent the laser from causing harm to the outside due to accidental situations.

[0015] The device is provided with a sliding assembly and a tension spring, and the user can pull the handle outwards to perform the discharging operation, and the operation is simple.

[0016] The device is provided with a movable door and a door-pushing assembly, which can automatically open and close the movable door while feeding and discharging, without manual control, and is simple and convenient to use. Description of the Drawings

[0017] Figure 1 is the overall structural schematic diagram of the present utility model;

[0018] Figure 2 is the internal structural schematic diagram of the present utility model;

[0019] Figure 3 is the sectional view of the movable block at the sliding groove of the present utility model;

[0020] Figure 4 is the sectional view of the movable block at the tension spring of the present utility model;

[0021] Figure 5 is the sectional view of the movable block at the scraping strip of the present utility model;

[0022] Figure 6 is the partial sectional view at the edge of the movable door of the present utility model.

[0023] Description of the Reference Numerals:

[0024] 1. Base; 2. Linear motor; 3. Collection box; 4. Protective cover; 5. Laser cutting structure; 6. Slide block; 7. Mounting block; 8. Limit block; 9. Handle; 10. Movable block; 11. Door-pushing member; 12. Flexible pad; 13. Sliding groove; 14. Sliding block; 15. Telescopic groove; 16. Tension spring; 17. Scraping strip; 18. Compression spring; 19. Placing groove; 20. Movable door; 21. First magnetic block; 22. Second magnetic block. Detailed implementation mode

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0026] Refer to Figure 1 - Figure 2 As shown, it includes a base 1, a linear motor 2 is installed on the base 1, a collection box 3 opposite to the linear motor 2 is provided at one end of the base 1, a protective cover 4 is installed on the base 1, a laser cutting structure 5 is provided at the inner top of the protective cover 4, a slider 6 is arranged on the linear motor 2, a mounting block 7 is installed on the slider 6, a movable block 10 is installed on the mounting block 7 through a sliding assembly, a handle 9 is provided on the movable block 10, a limiting block 8 is provided on the mounting block 7 at the rear end of the movable block 10, a placement groove 19 for placing blanks is opened in the movable block 10, a scraping assembly is arranged in the movable block 10, a movable door 20 is rotatably installed at the front end of the protective cover 4, and pushing door assemblies are respectively arranged on both sides of the mounting block 7.

[0027] Refer to Figure 1 - Figure 5 As shown, the sliding assembly includes several sliding grooves 13 opened above the mounting block 7, several sliding blocks 14 are connected to the bottom of the movable block 10, and the sliding blocks 14 are all slidably installed in the sliding grooves 13;

[0028] Several telescopic grooves 15 are opened at the rear side of the movable block 10, tension springs 16 are arranged in the telescopic grooves 15, and both ends of the tension springs 16 are respectively connected to the inner side walls of the telescopic grooves 15 and the limiting block 8;

[0029] The scraping assembly includes a scraping strip 17 provided at the bottom of the movable block 10, a groove matching the shape of the scraping strip 17 is opened at the bottom of the movable block 10, the scraping strip 17 is arranged in the groove, and several compression springs 18 are arranged above the scraping strip 17.

[0030] As an optimized solution of the present utility model, the movable block 10 can slide on the mounting block 7 through the sliding grooves 13 and the sliding blocks 14. The operator can pull the movable block 10 forward through the handle 9, while stretching the tension spring 16. When the user releases the hand, the tension spring 16 rebounds to drive the movable block 10 to return to its position, and the scraping strip 17 can keep fitting with the surface of the mounting block 7 under the pressure of the compression spring 18, so as to scrape off the debris on the surface of the mounting block 7.

[0031] Refer to Figure 1 - Figure 6As shown in the figure, the door-pushing component includes a "U"-shaped door-pushing member 11 connected to the side of the mounting block 7. The opening of the door-pushing member 11 faces backward, and flexible pads 12 are provided at the front ends of the door-pushing member 11.

[0032] On both sides of the movable door 20, several second magnetic blocks 22 are respectively embedded. At positions opposite to the second magnetic blocks 22 in the shield 4, first magnetic blocks 21 are embedded, and the first magnetic blocks 21 are magnetically connected to the second magnetic blocks 22.

[0033] As an optimized solution of the present invention, the door-pushing member 11 is provided, which can automatically push the movable door 20 to rotate outward when the mounting block 7 moves outward, so that the first magnetic block 21 is separated from the second magnetic block 22. When the mounting block 7 enters the shield 4, the movable door 20 can automatically fall under the action of gravity, and the first magnetic block 21 and the second magnetic block 22 are automatically adsorbed under the action of magnetism to keep the movable door 20 closed and prevent debris from flying out.

[0034] The usage process of the present invention:

[0035] First, start the linear motor 2 to drive the slider 6 to move outward. Then, place the blank to be cut into the placement groove 19. Then, start the linear motor 2 to drive the blank into the shield 4 and move it to directly below the laser cutting structure 5. The movable door 20 automatically closes. Start the laser cutting structure 5 to start cutting. After cutting is completed, start the linear motor 2 to drive the slider 6 to push open the movable door 20 and then move to the front end of the linear motor 2. The operator can then pull the handle 9 forward, so that the movable block 10 moves forward. The movable block 10 drives the cut wafer forward through the placement groove 19 until the placement groove 19 is separated from the mounting block 7. At this time, the wafer and the cutting waste automatically fall into the collection box 3, and the movable block 10 automatically returns to its original position under the action of the tension spring 16. The operator can then place a new blank for processing again and sort out the cut wafers.

[0036] It should be understood that the above specific embodiments of the present invention are only used for exemplary illustration or explanation of the principle of the present invention, and do not constitute a limitation to the present invention. Therefore, any modifications, equivalent replacements, improvements, etc. made without departing from the spirit and scope of the present invention should be included within the protection scope of the present invention. In addition, the appended claims of the present invention are intended to cover all changes and modifications that fall within the scope and boundaries of the appended claims, or equivalent forms of such scope and boundaries.

Claims

1. A cutting device for semiconductor processing, which comprises a base (1), and is characterized in that: A linear motor (2) is installed on the base (1). A collection box (3) opposite to the linear motor (2) is provided at one end of the base (1). A protective cover (4) is installed on the base (1). A laser cutting structure (5) is provided at the inner top of the protective cover (4). A slider (6) is arranged on the linear motor (2). A mounting block (7) is installed on the slider (6). A movable block (10) is installed on the mounting block (7) through a sliding assembly. A limiting block (8) is provided on the mounting block (7) at the rear end of the movable block (10). A placement groove (19) for placing blanks is formed in the movable block (10). A scraping component is arranged in the movable block (10). A movable door (20) is rotatably installed at the front end of the protective cover (4). Pushing door assemblies are respectively arranged on both sides of the mounting block (7).

2. The cutting device for semiconductor processing according to claim 1, wherein: The sliding assembly includes several sliding grooves (13) formed above the mounting block (7). The bottom of the movable block (10) is connected with several sliding blocks (14). The sliding blocks (14) are all slidably installed in the sliding grooves (13).

3. A cutting device for semiconductor processing according to claim 2, characterized in that: Several telescopic grooves (15) are formed at the rear side of the movable block (10). Tensile springs (16) are arranged in the telescopic grooves (15). The two ends of the tensile springs (16) are respectively connected to the inner side walls of the telescopic grooves (15) and the limiting block (8).

4. A cutting device for semiconductor processing according to claim 3, characterized in that: The scraping component includes a scraping strip (17) arranged at the bottom of the movable block (10). A groove matching the shape of the scraping strip (17) is formed at the bottom of the movable block (10). The scraping strip (17) is arranged in the groove. Several compression springs (18) are arranged above the scraping strip (17).

5. A cutting device for semiconductor processing according to claim 4, characterized in that: The pushing door assembly includes a "U"-shaped pushing door member (11) connected to the side of the mounting block (7). The opening of the pushing door member (11) faces backward.

6. A cutting device for semiconductor processing according to claim 5, characterized in that: Several second magnetic blocks (22) are respectively embedded on both sides of the movable door (20). First magnetic blocks (21) are embedded at the positions opposite to the second magnetic blocks (22) in the protective cover (4). The first magnetic blocks (21) and the second magnetic blocks (22) are magnetically connected.

7. A cutting device for semiconductor processing according to claim 6, characterized in that: A handle (9) is provided on the movable block (10).

8. A cutting device for semiconductor processing according to claim 7, characterized in that: Flexible pads (12) are respectively arranged at the front ends of the pushing door members (11).

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