Forming die for conducting film

Abstract

The utility model discloses a forming mould for conducting film relates to mould field, including lower mould plate and upper mould plate, the top of upper mould plate is fixedly equipped with the heat dissipation subassembly, the heat dissipation subassembly includes the air blowing mouth, the air blowing mouth is opened in the left and right both sides of upper mould plate, the top of upper mould plate is fixedly equipped with the air supply channel, the air supply channel is opened in the left and right both sides of upper mould plate. The rear side of the air supply channel fixedly communicates with a cooling assembly, and the rear side of the cooling assembly fixedly communicates with a connecting hose. According to the utility model, the air supply channel arranged on the upper part of the upper template is communicated with the air blowing port, and external air extracted by the air suction machine is fed into the cooling assembly through the connecting hose, then enters the air supply channel, is shunted to the air blowing port and is blown out of the conductive film on the lower template; and therefore, after secondary shaping is carried out on the conductive film, air blowing is carried out on the conductive film to accelerate heat dissipation of the conductive film, a worker can collect the conductive film conveniently, and the processing efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the field of molds, and particularly relates to a forming mold for a conductive film. Background Art

[0002] A conductive film is a thin film with conductive function. When the existing conductive films are shaped, most of them are formed into flat thin films. When in use, a large space is required, and they are not applicable to some products with small spaces. Moreover, since electronic components are welded on the conductive film, it is very difficult to perform secondary shaping, and they can only be applied to the installation spaces that match them, with poor versatility and a narrow applicable range, unable to meet the market demand.

[0003] For the existing forming mold for conductive films, the patent number CN219748890U discloses a forming mold for conductive films. Through the closing and heating of the upper template and the lower template, the lower template drives the lower die core to move upward, the air blowing holes are communicated with the mold cavity, and gas is blown towards the conductive film to shape the conductive film from a flat thin film into a three-dimensional shape. The air blowing baffle can prevent the electronic components on the conductive film from being directly blown and falling off. The vacuum pumping pipeline pumps the mold cavity to form a vacuum environment to prevent deformation under the self-weight and gravity of the conductive film, and the conductive film can be effectively subjected to secondary shaping. However, when the conductive film is formed and taken out, it is not convenient to cool it, thus making it inconvenient for the staff to take it out, affecting the shaping efficiency. Summary of the Utility Model

[0004] In order to solve the above technical problems, the technical solution adopted by the utility model is:

[0005] A forming mold for a conductive film, comprising a lower template and an upper template. A heat dissipation component is fixedly installed at the top of the upper template. The heat dissipation component includes an air blowing port, and the air blowing ports are opened on the left and right sides inside the upper template. A air supply channel is fixedly installed at the top of the upper template. A cooling component is fixedly communicated with the rear side of the air supply channel. A connecting hose is fixedly communicated with the rear side of the cooling component, and the other end of the connecting hose is fixedly connected to an air suction machine. A lower die core is movably installed inside the lower template.

[0006] The further improvement of the technical solution of the utility model lies in that: the cooling component includes a housing body. Installation grooves are opened on both the left and right sides of the housing body. Two semiconductor refrigeration plates are fixedly installed inside the installation grooves. A heat dissipation plate that fits the outer side of the semiconductor refrigeration plate is fixedly installed on the outer side of the housing body, and heat dissipation fins are fixedly connected to the outer side of the heat dissipation plate.

[0007] The further improvement of the technical solution of the utility model lies in that: the air blowing port penetrates through the bottom of the upper template, and the lower side of the air blowing port is inclined inward.

[0008] A further improvement of the technical solution of the present utility model lies in that the air blowing ports are symmetrically arranged front and back within the upper template.

[0009] A further improvement of the technical solution of the present utility model lies in that the air supply channel is arranged in a "C" shape, and the air supply channel is respectively communicated with the air blowing ports.

[0010] A further improvement of the technical solution of the present utility model lies in that the two semiconductor refrigeration plates are arranged in a "V" shape.

[0011] A further improvement of the technical solution of the present utility model lies in that a baffle is fixedly installed inside the outer shell, and the baffle is arranged in an inverted "V" shape corresponding to the semiconductor refrigeration plate.

[0012] A further improvement of the technical solution of the present utility model lies in that a dust-proof mesh cover is fixedly installed outside the air suction machine.

[0013] Due to the adoption of the above technical solution, the technical progress achieved by the present utility model compared with the prior art is:

[0014] The present utility model provides a forming mold for a conductive film. The air supply channel arranged above the upper template is communicated with the air blowing ports. The external air is extracted by the air suction machine, sent through the connecting hose into the cooling component and then enters the air supply channel to be branched to the air blowing ports to blow air onto the conductive film located on the lower template, so that after the conductive film is secondarily shaped, it can be blown to accelerate its heat dissipation, and then it is convenient for the staff to collect, improving the processing efficiency.

[0015] The present utility model provides a forming mold for a conductive film. Through the cooling component arranged between the connecting hose and the air supply channel, after the semiconductor refrigeration plate is powered on, its inner side is refrigerated, and the baffle is used to guide the incoming air to contact the semiconductor refrigeration plate to carry cold, so as to cool the air and then blow it onto the conductive film, thereby further improving its cooling effect on the conductive film. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a schematic structural diagram of the forming mold for a conductive film of the present utility model;

[0017] Figure 2 is a schematic structural diagram of the heat dissipation component of the present utility model;

[0018] Figure 3 is a schematic diagram of the position of the air blowing port of the present utility model;

[0019] Figure 4 is a schematic structural diagram of the air blowing port of the present utility model;

[0020] Figure 5This is a schematic structural diagram of the cooling component of the present utility model.

[0021] In the figure: 1, lower template; 2, upper template; 3, heat dissipation component; 31, air blowing port; 32, air supply channel; 33, connecting hose; 34, air suction machine; 35, dust-proof net cover; 4, cooling component; 41, outer shell; 42, installation groove; 43, semiconductor refrigeration plate; 44, baffle; 45, heat dissipation plate; 46, heat dissipation fins; 5, lower die core. Specific embodiments

[0022] The following further details the present utility model:

[0023] As Figures 1 to 5 shown, the present utility model provides a forming die for a conductive film, including a lower template 1 and an upper template 2. A heat dissipation component 3 is fixedly installed at the top of the upper template 2. The heat dissipation component 3 includes an air blowing port 31, and the air blowing port 31 is opened on the left and right sides inside the upper template 2. An air supply channel 32 is fixedly installed at the top of the upper template 2. The rear side of the air supply channel 32 is fixedly communicated with a cooling component 4. The rear side of the cooling component 4 is fixedly communicated with a connecting hose 33. The other end of the connecting hose 33 is fixedly connected with an air suction machine 34. A lower die core 5 is movably installed inside the lower template 1.

[0024] By providing that the air supply channel 32 on the upper part of the upper template 2 is communicated with the air blowing port 31, and the external air is extracted by the air suction machine 34 and sent into the cooling component 4 through the connecting hose 33 and then enters the air supply channel 32 and is split to the air blowing port 31 to blow out to the conductive film located on the lower template 1, the conductive film can be blown to accelerate its heat dissipation after secondary shaping, which is convenient for the staff to collect and improves the processing efficiency. By providing the cooling component 4 between the connecting hose 33 and the air supply channel 32, after the semiconductor refrigeration plate 43 is powered on, its inner side is refrigerated, and the baffle 44 is used to guide the incoming air to contact the semiconductor refrigeration plate 43 to carry the cold quantity, so as to cool the air and then blow it to the conductive film, thereby further improving its cooling effect on the conductive film.

[0025] As Figure 5 shown, the cooling component 4 includes an outer shell 41. Installation grooves 42 are opened on both the left and right sides of the outer shell 41. Two semiconductor refrigeration plates 43 are fixedly installed inside the installation grooves 42. A heat dissipation plate 45 that fits the outer side of the semiconductor refrigeration plate 43 is fixedly installed on the outer side of the outer shell 41. Heat dissipation fins 46 are fixedly connected to the outer side of the heat dissipation plate 45.

[0026] The semiconductor refrigeration plate 43 is connected in series and is connected and energized externally. The semiconductor refrigeration plate 43 is turned on externally, and refrigeration is performed through the inner side of the semiconductor refrigeration plate 43, so that the air entering the outer housing 41 through the connecting hose 33 is dispersed by the baffle 44 and blown onto the semiconductor refrigeration plate 43. After the air contacts the semiconductor refrigeration plate 43 and carries the cold quantity, it is sent into the air supply channel 32, so that the air with reduced temperature is blown onto the conductive film, thereby improving the cooling effect on the conductive film.

[0027] As Figure 3 and Figure 4 shown, the air blowing port 31 penetrates through the bottom of the upper template 2, and the lower part of the air blowing port 31 is inclined inward.

[0028] The air blowing ports 31 are symmetrically arranged front and back in the upper template 2.

[0029] By arranging the air blowing ports 31 symmetrically front and back and inclining their lower parts inward towards the inside of the lower template 1, it is convenient to blow air onto the conductive film to accelerate its cooling rate.

[0030] As Figure 2 shown, the air supply channel 32 is arranged in a "C" shape, and the air supply channel 32 is respectively connected to the air blowing ports 31.

[0031] By connecting the "C"-shaped air supply channel 32 with the air blowing ports 31, air can be sent into the air blowing ports 31 through the air supply channel 32 to blow onto the conductive film for cooling it.

[0032] As Figure 5 shown, the two semiconductor refrigeration plates 43 are arranged in a "V" shape.

[0033] A baffle 44 is fixedly installed inside the outer housing 41, and the baffle 44 is arranged in an inverted "V" shape corresponding to the semiconductor refrigeration plate 43.

[0034] Since both the baffle 44 and the semiconductor refrigeration plate 43 are arranged in a "V" shape, the baffle 44 guides the air entering from the connecting hose 33 to both sides and blows it onto the semiconductor refrigeration plate 43. Through the contact between the air and the semiconductor refrigeration plate 43, heat exchange is carried out to carry the cold quantity, thereby reducing the air temperature and improving the cooling effect on the conductive film.

[0035] As Figure 2 shown, a dust-proof net cover 35 is fixedly installed outside the air suction machine 34.

[0036] By providing the dust-proof net cover 35, external dust is blocked to prevent dust from entering.

[0037] Next, the working principle of the forming die for the conductive film will be specifically described.

[0038] AsFigures 1 to 5 As shown, during use, the conductive film with electronic components welded thereon is placed into the mold. The lower template 1 and the upper template 2 are closed for heating. The gas from the air blowing holes provided on the upper template 2 enters the mold cavity to shape the conductive film. After shaping, the lower template 1 and the upper template 2 are separated, and the external dust is filtered through the dust-proof mesh cover 35. The external air is sucked in by the suction machine 34 and conveyed through the connecting hose 33 into the air supply channel 32. Subsequently, it is sent into the air blowing port 31 through the air supply channel 32 and blown out from the air blowing port 31 located above the conductive film to the conductive film, thereby accelerating the cooling of the conductive film. At the same time, through the semiconductor refrigeration plate 43 connected to the external wiring, the semiconductor refrigeration plate 43 is externally turned on to refrigerate through the inner side of the semiconductor refrigeration plate 43, so that the air entering the outer housing 41 through the connecting hose 33 is dispersed by the baffle 44 and blown onto the semiconductor refrigeration plate 43. After the air contacts the semiconductor refrigeration plate 43 and carries the cold quantity, it is sent into the air supply channel 32, so that the cooled air is blown onto the conductive film to accelerate its cooling speed.

[0039] The above text generally describes the present invention in detail. However, based on the present invention, some modifications or improvements can be made, which are obvious to those of ordinary skill in the technical field. Therefore, the modifications or improvements made without departing from the spirit and idea of the present invention are all within the protection scope of the present invention.

Claims

1. A forming die for a conductive film, comprising a lower template (1) and an upper template (2), characterized in that: A heat dissipation component (3) is fixedly installed at the top of the upper template (2). The heat dissipation component (3) includes a blowing port (31). The blowing ports (31) are opened on the left and right sides inside the upper template (2). A air supply channel (32) is fixedly installed at the top of the upper template (2). A cooling component (4) is fixedly communicated with the rear side of the air supply channel (32). A connecting hose (33) is fixedly communicated with the rear side of the cooling component (4). The other end of the connecting hose (33) is fixedly connected to an air suction machine (34). A lower die core (5) is movably installed inside the lower template (1).

2. The forming die for a conductive film according to claim 1, characterized in that: The cooling component (4) includes a housing (41). Installation grooves (42) are opened on both the left and right sides of the housing (41). Two semiconductor refrigeration plates (43) are fixedly installed inside the installation grooves (42). A heat dissipation plate (45) that fits the outside of the semiconductor refrigeration plate (43) is fixedly installed on the outside of the housing (41). Heat dissipation fins (46) are fixedly connected to the outside of the heat dissipation plate (45).

3. The forming die for a conductive film according to claim 1, wherein: The blowing port (31) penetrates through the bottom of the upper template (2). The lower part of the blowing port (31) is inclined inward.

4. The forming die for a conductive film according to claim 3, characterized in that: The blowing ports (31) are symmetrically arranged in the front and back inside the upper template (2).

5. The forming die for a conductive film according to claim 3, characterized in that: The air supply channel (32) is arranged in a "C" shape and is respectively communicated with the blowing ports (31).

6. The forming die for a conductive film according to claim 2, wherein: The two semiconductor refrigeration plates (43) are arranged in a "V" shape.

7. The forming die for a conductive film according to claim 2, characterized in that: A baffle (44) is fixedly installed inside the housing (41). The baffle (44) is arranged in an inverted "V" shape corresponding to the semiconductor refrigeration plate (43).

8. The forming die for a conductive film according to claim 7, wherein: A dust-proof net cover (35) is fixedly installed outside the air suction machine (34).

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