Etching production lead frame product size measuring device

Abstract

The utility model relates to the field of etching production, and discloses an etching production lead frame product size measuring device which comprises an etching machine table, a fixed inner cavity is formed in the middle of the top end of the etching machine table, a plurality of supporting rollers are movably installed in the fixed inner cavity, and a lead frame body is placed on the upper surfaces of the supporting rollers. An irradiation light source is installed in the middle of the bottom end of the inner wall of the fixed inner cavity, a fixed frame is fixedly installed in the middle of the upper surface of the etching machine table, fixed guide rails are symmetrically welded to the two side edges of the inner wall of the fixed frame, a movable plate is movably installed in the fixed frame and located on the outer surfaces of the fixed guide rails, and a color CCD device is installed in the middle of the bottom end of the movable plate; the etched lead frame main body is monitored through cooperation of the color CCD device and the high-power lens, so that the effect of reducing the overall error of a finished product during processing of the lead frame main body is achieved, the problem that the rejection rate is increased due to the fact that the size of the product is abnormal during etching production is solved, and the overall etching production processing efficiency of the lead frame main body is improved.

Description

Technical Field

[0001] The present application relates to the field of etching production, and in particular to a device for measuring the dimensions of lead frame products in etching production. Background Art

[0002] Etching production generally refers to the use of etching technology to process the surface of materials to achieve specific patterns, structures or textures. Etching production has a wide range of applications in fields such as semiconductor manufacturing, microelectronics industry, optical element manufacturing, and micro-machining. When producing lead frame products, etching processing is usually required to form lead structures on devices such as conductive plates or semiconductor chips.

[0003] During etching production, due to the continuous redox reaction between copper materials and etching chemicals, the parameters of the etching chemicals in the etching chamber constantly change, which affects the dimensions of the lead frame products. However, since the etching production process is for the production of whole rolls of materials and there is no dimension measurement during the production process, it is impossible to timely detect the dimension problems of the lead frame products during the etching production process, resulting in the scrapping of a large number of lead frame products, increasing the overall processing cost of the lead frame products, and also having a certain impact on the processing efficiency of the lead frame products.

[0004] Regarding the above related technologies, the inventor believes that there are defects in the dimensions of the lead frame products affected by the etching chemicals during the etching process. Therefore, a device for measuring the dimensions of lead frame products in etching production is proposed to solve the above problems. Summary of the Utility Model

[0005] In order to solve the problem that the dimensions of the lead frame products are affected by the etching chemicals during the etching process, the present application provides a device for measuring the dimensions of lead frame products in etching production.

[0006] The device for measuring the dimensions of lead frame products in etching production provided by the present application adopts the following technical solutions:

[0007] A device for measuring the dimensions of lead frame products in etching production includes an etching machine table. A fixed inner cavity is provided in the middle of the top end of the etching machine table. A number of support rollers are movably installed inside the fixed inner cavity. A lead frame main body is placed on the upper surface of the support rollers. An illumination light source is installed in the middle of the bottom end of the inner wall of the fixed inner cavity. A fixed frame is fixedly installed at the middle position of the upper surface of the etching machine table. Fixed guide rails are symmetrically welded on both side edges of the inner wall of the fixed frame. A movable plate is movably installed on the outer surface of the fixed guide rails inside the fixed frame. A color CCD device is installed in the middle of the bottom end of the movable plate. A high-power lens is fixedly installed on the bottom surface of the color CCD device. A sliding mechanism is also provided inside the fixed frame for adjusting the placement position of the movable plate in the fixed frame.

[0008] Preferably, the sliding mechanism includes a bidirectional lead screw rotatably installed at the top of one side of the inner wall of the fixed frame. One side of the bidirectional lead screw extends outside the fixed frame and is installed with a servo motor. Both sides of the outer surface of the bidirectional lead screw are movably installed with movable parts. The middle of the bottom end of the movable part is rotatably installed with a connecting rotating plate. One side of the bottom of the connecting rotating plate is rotatably connected to the middle position of the upper surface of the movable plate.

[0009] Preferably, symmetrically arranged card slots are formed on both sides of the movable plate. One side of the outer surface of the fixed guide rail is located in the card slot, and the fixed guide rail and the card slot are mutually engaged.

[0010] Preferably, a guiding support rod is fixedly installed at the inner top of the fixed frame near the upper side of the bidirectional lead screw. A through hole is formed through the top of one side of the movable part. One side of the outer surface of the guiding support rod is located inside the through hole, and the guiding support rod and the through hole are mutually coupled.

[0011] Preferably, a threaded hole is formed through the middle of one side of the movable part. External threads with opposite thread patterns are respectively formed on both sides of the outer surface of the bidirectional lead screw, and the bidirectional lead screw and the threaded hole are mutually adapted.

[0012] In summary, the present application includes the following beneficial technical effects:

[0013] By placing the lead frame body on the upper surface of the etching machine table, conveying it through multiple support rollers and performing etching processing, the color CCD device cooperates with the high-power lens to measure the contour of the lead frame body product passing by. At the same time, the bidirectional lead screw rotates to adjust the distance between the two movable parts, and then the connecting rotating plate rotates to drive the movable plate to move up and down, adjusting the distance between the high-power lens and the lead frame body; compared with the prior art, this solution has the effect of facilitating real-time monitoring of the lead frame body during etching processing, reducing the overall error of the finished product during the processing of the lead frame body, solving the problem of increased scrap rate caused by abnormal product dimensions during etching production, and improving the overall etching production and processing efficiency of the lead frame body. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is the overall structural schematic diagram of the application embodiment;

[0015] Figure 2 is the structural schematic diagram of the high-power lens in the application embodiment;

[0016] Figure 3 is the structural schematic diagram of the bidirectional lead screw in the application embodiment;

[0017] Figure 4 is the structural schematic diagram of the movable plate in the application embodiment;

[0018] Description of reference numerals: 1. Etching machine; 2. Fixed inner cavity; 3. Support roller; 4. Lead frame body; 5. Irradiation light source; 6. Fixed frame; 7. Bi-directional lead screw; 8. Servo motor; 9. Movable part; 10. Connecting rotating plate; 11. Movable plate; 12. Color CCD device; 13. High-power lens; 14. Guide support rod; 15. Fixed guide rail. Detailed implementation manners

[0019] The following further elaborates on this application in conjunction with Figures 1-4 the attached drawings.

[0020] The embodiment of this application discloses a device for measuring the dimensions of a lead frame product in etching production. Referring to Figures 1-4 , a device for measuring the dimensions of a lead frame product in etching production includes an etching machine 1. In the middle of the top end of the etching machine 1, a fixed inner cavity 2 is opened. A number of support rollers 3 are movably installed inside the fixed inner cavity 2. The lead frame body 4 is placed on the upper surface of the support rollers 3. In the middle of the bottom end inner wall of the fixed inner cavity 2, an irradiation light source 5 is installed. At the middle position of the upper surface of the etching machine 1, a fixed frame 6 is fixedly installed. On both side edges of the inner wall of the fixed frame 6, fixed guide rails 15 are symmetrically welded. Inside the fixed frame 6, a movable plate 11 is movably installed on the outer surface of the fixed guide rails 15. On both side edges of the movable plate 11, card slots are symmetrically opened. On one side of the outer surface of the fixed guide rail 15, it is located in the card slot, and the fixed guide rail 15 and the card slot are mutually engaged. At the middle of the bottom end of the movable plate 11, a color CCD device 12 is installed. The color CCD device 12 refers to a charge-coupled device, which is a semiconductor device used for optical imaging and signal acquisition. The color CCD device 12 is composed of many charge-coupled devices. The color CCD device 12 uses the energy of photons to excite electrons on the semiconductor surface and convert them into charges, and then transmits these charges to one end of the chip for signal reading. This device can convert optical signals into electrical signals and store or transmit them in digital form. On the bottom surface of the color CCD device 12, a high-power lens 13 is fixedly installed. Inside the fixed frame 6, there is also a sliding mechanism for adjusting the placement position of the movable plate 11 in the fixed frame 6.

[0021] The lead frame body 4 is placed on the upper surface of the etching machine 1, transported by a plurality of support rollers 3 and etched, so that the lead frame body 4 moves through the fixing frame 6, and the color CCD device 12 cooperates with the high-power lens 13 to measure the contour of the lead frame body 4 passing through. The contour image of the lead frame product photographed by the color CCD device 12 is processed by a measurement program to obtain the size data of the specified position of the product, and the size data is transmitted to the independently developed computer software, and a communication connection is established between the computer software and the PLC controller of the etching machine 1. When the computer software records the received size data, it also reads and records the relevant production parameters of the etching machine 1. Finally, the computer software The software integrates the received and read data, and presents the trend of dimensional data changes in the form of Excel charts. When the computer software finds that the measured product dimensional data is abnormal, it can output instructions to the PLC controller of the etching machine 1. The computer software calculates the measured product dimensional data. If ten consecutive measured values ​​exceed the control range, it is judged as NG, triggering the etching machine 1 alarm; if the calculated average value of the product dimensional data differs from the set target value by more than 0.001mm, the production speed of the etching machine 1 is adjusted by 0.02m / min; if the calculated average value of the product dimensional data differs from the set target value by more than 0.003mm, the production speed of the etching machine 1 is adjusted by 0.03m / min.

[0022] Reference Figure 2 and Figure 3 The sliding mechanism includes a bidirectional screw rod 7, which is rotatably installed at the top of one side of the inner wall of the fixed frame 6, and a servo motor 8 is installed at one side of the bidirectional screw rod 7 extending to the outside of the fixed frame 6. Moving parts 9 are movably installed on both sides of the outer surface of the bidirectional screw rod 7. A threaded hole is opened through the middle of one side of the moving part 9, and external threads with opposite thread patterns are opened on both sides of the outer surface of the bidirectional screw rod 7. The bidirectional screw rod 7 and the threaded hole are adapted to each other. A connecting rotating plate 10 is rotatably installed at the middle of the bottom end of the moving part 9, and the bottom of one side of the connecting rotating plate 10 is rotatably connected to the middle position of the upper surface of the moving plate 11. A guide support rod 14 is fixedly installed at the top of the fixed frame 6 near the top of the bidirectional screw rod 7, and a through hole is opened through the top of one side of the moving part 9. One side of the outer surface of the guide support rod 14 is located inside the through hole, and the guide support rod 14 and the through hole are coupled to each other.

[0023] By starting the servo motor 8 to drive the bidirectional lead screw 7 to rotate, the bidirectional lead screw 7 rotates to adjust the distance between the two movable parts 9, and then the movable part 9 drives the connecting rotating plate 10 to rotate, and the connecting rotating plate 10 rotates to drive the movable plate 11 to move up and down, thereby adjusting the distance between the high-power lens 13 and the lead frame body 4, and obtaining a clear lead frame product outline by adjusting the high-power lens 13 magnification, the height of the color CCD device 12, the brightness of the irradiation light source 5, etc., which reflects the position adjustment effect of the color CCD device 12 and the high-power lens 13.

[0024] The implementation principle of the device for measuring the dimensions of the lead frame product in the etching production in the embodiment of the present application is as follows: The lead frame body 4 is placed on the upper surface of the etching machine table 1, conveyed by multiple support rollers 3 and subjected to etching processing. The lead frame body 4 moves through the fixed frame 6. The color CCD device 12 cooperates with the high-power lens 13 to measure the product contour of the passing lead frame body 4. At the same time, the servo motor 8 is started to drive the bidirectional lead screw 7 to rotate. The input end of the power supply of the servo motor 8 is electrically connected to the output end of the external power supply, so that the bidirectional lead screw 7 rotates to adjust the distance between the two moving parts 9. At the same time, the guiding support rod 14 guides and supports the moving part 9, keeping the moving part 9 in a stable state during adjustment. Furthermore, the moving part 9 drives the connecting rotating plate 10 to rotate, and the rotation of the connecting rotating plate 10 drives the moving plate 11 to move up and down. The fixed guide rail 15 guides and supports the moving plate 11, keeping the moving plate 11 in a stable lifting state, and then adjusting the distance between the high-power lens 13 and the lead frame body 4. Compared with the prior art, this solution has the effect of facilitating the real-time monitoring of the lead frame body 4 during etching processing, reducing the overall error of the finished product during the processing of the lead frame body 4, solving the problem of increased scrap rate caused by abnormal product dimensions during etching production, and improving the overall etching production and processing efficiency of the lead frame body 4.

[0025] Finally, several points should be noted: First, in the description of the present application, it should be noted that unless otherwise specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. It can be a mechanical connection or an electrical connection, or the communication inside two components. It can be directly connected. "Up", "down", "left", "right", etc. are only used to represent the relative position relationship. When the absolute position of the described object changes, the relative position relationship may change;

[0026] Second: In the attached drawings of the disclosed embodiment of the present utility model, only the structures related to the disclosed embodiment of the present disclosure are involved. Other structures can refer to the general design. Without conflict, the same embodiment and different embodiments of the present utility model can be combined with each other;

[0027] Finally: The above are only the preferred embodiments of the present utility model and are not used to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

[0028] The above are all the preferred embodiments of the present application, and do not limit the protection scope of the present application accordingly. Therefore, all equivalent changes made according to the structure, shape, and principle of the present application shall be covered within the protection scope of the present application.

Claims

1. An etching production lead frame product size measuring device, comprising an etching machine table (1), a fixed inner cavity (2) is opened in the middle of the top of the etching machine table (1), a number of support rollers (3) are movably installed inside the fixed inner cavity (2), a lead frame body (4) is placed on the upper surface of the support rollers (3), and it is characterized in that: At the middle of the bottom end of the inner wall of the fixed inner cavity (2), an irradiation light source (5) is installed. At the middle position of the upper surface of the etching machine table (1), a fixing frame (6) is fixedly installed. On both side edges of the inner wall of the fixing frame (6), fixing guide rails (15) are symmetrically welded. Inside the fixing frame (6) and on the outer surface of the fixing guide rails (15), a movable plate (11) is movably installed. At the middle of the bottom end of the movable plate (11), a color CCD device (12) is installed. At the bottom surface of the color CCD device (12), a high-power lens (13) is fixedly installed. Inside the fixing frame (6), a sliding mechanism is further provided for adjusting the placement position of the movable plate (11) in the fixing frame (6).

2. The dimension measuring device for an etched lead frame product according to claim 1, wherein: The sliding mechanism includes a bidirectional lead screw (7). The bidirectional lead screw (7) is rotatably installed at the top of one side of the inner wall of the fixing frame (6). One side of the bidirectional lead screw (7) extends outside the fixing frame (6) and is installed with a servo motor (8). On both side edges of the outer surface of the bidirectional lead screw (7), movable parts (9) are movably installed. At the middle of the bottom end of the movable part (9), a connecting rotating plate (10) is rotatably installed. One side bottom of the connecting rotating plate (10) is rotatably connected to the middle position of the upper surface of the movable plate (11).

3. The dimension measuring device for an etched lead frame product according to claim 1, wherein: On both side edges of the movable plate (11), clamping grooves are symmetrically opened. One side of the outer surface of the fixing guide rail (15) is located in the clamping groove, and the fixing guide rail (15) and the clamping groove are mutually engaged.

4. An etching production lead frame product size measuring device according to claim 2, characterized in that: At the inner top of the fixing frame (6) and near the upper side of the bidirectional lead screw (7), a guiding support rod (14) is fixedly installed. One side of the top of the movable part (9) is penetrated and opened with a through hole. One side of the outer surface of the guiding support rod (14) is located inside the through hole, and the guiding support rod (14) and the through hole are mutually coupled.

5. The dimension measuring device for etching and producing lead frame products according to claim 2, wherein: One side of the middle of the movable part (9) is penetrated and opened with a threaded hole. On both sides of the outer surface of the bidirectional lead screw (7), external threads with opposite thread patterns are respectively opened, and the bidirectional lead screw (7) and the threaded hole are mutually adapted.

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