Temperature pressure sensor

Abstract

A temperature and pressure sensor comprises a housing which is provided with a mounting cavity with an upper opening and a lower opening; the pressure measuring ceramic body comprises a conductive part penetrating through the ceramic body, and the pressure measuring ceramic body is arranged in the mounting cavity and is in sealed connection with the inner wall of the mounting cavity so as to divide the mounting cavity into an upper cavity and a medium channel; the circuit board is arranged at the upper end of the ceramic piece and is electrically connected with the ceramic piece; the heat-sensitive element is electrically connected with the conductive part at the lower end of the ceramic body, the pin connecting part extends to the lower end of the conductive part of the ceramic body, and the upper end of the heat-sensitive element is provided with a rubber coating material, and the temperature sensor part which is subjected to rubber coating processing and is separated and fixed by a buckle can be directly arranged in a medium, so that the heat transfer is more timely; the temperature sensing part is more sensitive and accurate, and the performance of the sensor is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of sensors, and in particular to a temperature and pressure sensor. Background Art

[0002] A temperature and pressure sensor generally consists of a pressure-sensitive element, a temperature-sensitive element, a signal processing circuit, a housing, and an interface. The signal processing circuit amplifies, filters, and performs A / D conversion on the electrical signals collected by the pressure-sensitive element and the temperature-sensitive element to obtain digital temperature and pressure signals. In the prior art, there are some deficiencies in the structure and manufacturing process of temperature and pressure sensors. For example, the NTC part is enclosed by a sealed cavity from the temperature sensing element to the pins, with a complex manufacturing process and a problem of untimely heat transfer, which affects the performance of the sensor.

[0003] CN112611504A discloses a temperature and pressure sensor, which arranges the temperature-sensitive element on an insulating seat and realizes electrical connection with a circuit board through conductive elastic pieces and conductive elements, and separates the temperature-sensitive element from the medium to be measured through a sealed chamber and a protective sleeve. The connection process at both ends of the conductive elastic piece is complex, and a complex via metallization process is required to pass through the substrate for sealing to achieve the coefficient of thermal expansion to avoid the adverse effect of temperature on the measurement accuracy. Utility Model Content

[0004] The present invention aims to provide a temperature and pressure sensor to at least solve the problems of untimely heat transfer and complex manufacturing process existing in the prior art.

[0005] Specifically, a temperature and pressure sensor is characterized by comprising:

[0006] A housing having an installation cavity with upper and lower openings;

[0007] A pressure measurement ceramic body including a conductive member penetrating through the ceramic body. The pressure measurement ceramic body is arranged in the installation cavity and is hermetically connected to the inner wall of the installation cavity to divide the installation cavity into an upper cavity and a medium channel;

[0008] A circuit board installed at the upper end of the ceramic body and electrically connected to the ceramic body;

[0009] A heat-sensitive element electrically connected to the conductive member at the lower end of the ceramic body.

[0010] Preferably, the heat-sensitive element is integrally funnel-shaped, and the two pin ends away from the heat-sensitive sensing element are connected to the two conductive members protruding from the lower end of the ceramic body.

[0011] Furthermore, encapsulating materials are provided at the lower end of the conductive member of the ceramic body and the upper end of the heat-sensitive sensing element where the pin connection extends.

[0012] Preferably, the encapsulating material is one of insulating materials such as epoxy resin and silicone rubber.

[0013] Furthermore, a heat-sensitive element connected to the conductive member at the lower end of the ceramic body is provided with a buckle outside to separate and fix the two pins to prevent adhesion.

[0014] After being encapsulated with the encapsulating material and adding a buckle to separate and fix the pins, the temperature sensor part can be directly placed in the medium without enclosing the temperature sensor part through a sealed chamber. The heat transfer is more timely, the temperature sensing part is more sensitive and accurate, and the performance of the sensor is improved.

[0015] The utility model has at least the following beneficial effects:

[0016] 1. More timely heat transfer: Since the temperature sensor part is directly placed in the medium, the heat transfer hindrance brought by the sealed chamber is avoided, making the heat transfer more rapid and the temperature sensing more sensitive and accurate.

[0017] 2. Stable and firm connection: The heat-sensitive element and the ceramic body conductive member are welded, encapsulated, and fixed by a buckle, enhancing the connection stability, preventing the connection from loosening due to factors such as vibration, and preventing the pins from adhering.

[0018] 3. High integration: The heat-sensitive element is connected to the conductive member passing through the ceramic body and is connected to the circuit board through the pins at the upper end of the ceramic body. The overall structure is compact, occupies a small space, and is convenient for installation and use. Description of the Drawings

[0019] Figure 1 , is a schematic structural diagram of the connection between the ceramic body and the temperature sensor in an embodiment;

[0020] Figure 2 , is a schematic external structure diagram of the heat-sensitive element in an embodiment;

[0021] Figure 3 , is a schematic structural diagram of the temperature sensor part with a buckle in an embodiment. Detailed Embodiment

[0022] The technical solutions of the present application will be clearly and completely described below with reference to the drawings. The following embodiments are exemplary and are only used to explain the present application and should not be construed as a limitation to the present application. In the following description, the same reference numerals are used to represent the same or equivalent elements, and repeated descriptions are omitted.

[0023] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "inner", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the products of the present application are habitually placed during use, or the orientation or positional relationship commonly understood by those skilled in the art. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0024] Combined with Figure 1 , a schematic diagram of the connection between the temperature sensor part and the pressure measurement ceramic body provided by the present invention is shown. The pressure measurement ceramic body 1 includes a conductive member 11 penetrating through the ceramic body. The pressure measurement ceramic body is disposed in the installation cavity of the housing and is hermetically connected to the inner wall of the installation cavity, dividing the installation cavity into an upper cavity and a medium channel; the heat-sensitive element 2 is electrically connected to the lower end 11 of the ceramic body conductive member; the circuit board is installed at the upper end of the ceramic body and is electrically connected to the pins at the upper end of the ceramic body. To make the sensor more compact and delicate and reduce the length of the pins 12, it is preferably to make the pins 12 flush with or close to the upper surface of the circuit board pads.

[0025] When pressure acts on the ceramic body, the crystal structure inside the ceramic material will undergo a slight deformation. Due to the piezoelectric effect, a certain potential difference will be generated on the surface of the ceramic body, and the magnitude of the pressure acting on the ceramic body is determined by measuring the potential difference through the circuit board. In addition, the ceramic body is hermetically connected to the inner wall of the installation cavity, dividing the installation cavity into different parts, enabling the pressure to act on the ceramic body concentratedly, improving the accuracy and stability of the measurement.

[0026] In the present invention, the temperature-sensitive element can be a thermistor. The thermistor collects the temperature signal and transmits it to the MCU after passing through the conditioning circuit and A / D conversion circuit on the circuit board. The MCU processes the temperature and pressure signals and then controls the output circuit to output to the display unit.

[0027] Such as Figure 2 , in an embodiment, the heat-sensitive element is integrally funnel-shaped, and the two pin 23 ends far from the heat-sensitive sensing element are welded to the two conductive members 11 extending from the lower end of the ceramic body, improving the overall production and manufacturing efficiency through modern automatic welding technology.

[0028] The extension of the welding joint between the heat-sensitive element and the ceramic body pins to the lower end of the ceramic body and the upper end of the heat-sensitive sensing element 22 is subjected to encapsulation treatment. The encapsulation material is coated on the pins and the welding joints and a part is reserved without coating to adapt to the thermal expansion and contraction effect. Preferably, the encapsulation material is an insulating material such as epoxy resin or silicone rubber that has insulation and certain heat resistance and sealing properties.

[0029] Such as Figure 3, there is a buckle 3 outside the heat-sensitive component. The temperature sensor part fixed by separating the pins through the buckle can be directly placed in the gaseous medium without enclosing the temperature sensor part in a sealed chamber. Heat transfer is more timely, the temperature sensing part is more sensitive and accurate, improving the performance of the sensor. At the same time, the connection stability is enhanced, preventing connection loosening caused by factors such as vibration and preventing pin adhesion.

[0030] The scope of the present disclosure is not limited by the detailed description, but by the claims and their equivalents, and all variations within the scope of the claims and their equivalents are construed as being included in the present disclosure.

Claims

1. A temperature and pressure sensor, characterized in that, Comprising: A housing having an installation cavity with upper and lower openings; A pressure measurement ceramic body including a conductive member penetrating through the ceramic body. The pressure measurement ceramic body is disposed in the installation cavity and is hermetically connected to the inner wall of the installation cavity to divide the installation cavity into an upper cavity and a medium channel; A circuit board installed at the upper end of the ceramic body and electrically connected to the ceramic body; A heat-sensitive element electrically connected to the conductive member at the lower end of the ceramic body.

2. The temperature and pressure sensor according to claim 1, characterized in that, The heat-sensitive element is integrally funnel-shaped.

3. The temperature and pressure sensor according to claim 1, characterized in that There is a coating material provided at the lower end of the conductive member of the ceramic body and the upper end of the heat-sensitive sensing element.

4. The temperature and pressure sensor according to claim 3, wherein The coating material is one of epoxy resin and silicone rubber insulating material.

5. The temperature and pressure sensor according to claim 1, wherein There are buckles provided outside the heat-sensitive element to separate and fix two pins to prevent adhesion.

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