High-frequency impedance detection device

Abstract

The utility model discloses a high-frequency impedance detection device which comprises a circuit board, a conductive assembly, an insulating substrate and a vector network analyzer. A containing groove and a through hole are formed in the insulating substrate, the circuit board is located in the containing groove, the through hole is communicated with the containing groove, the through hole is filled with conductive metal paste, the conductive metal paste is connected with the circuit board, and the conductive assembly is connected with the conductive metal paste to the vector network analyzer. The circuit board is connected with the conductive metal paste, and the conductive metal paste and the vector network analyzer are connected through the wire assembly. Then the vector network analyzer is started, the vector network analyzer sends complex and accurate signals to the circuit board, the signals cover a wide range from low frequency to high frequency, response characteristics of the conductive metal paste under different frequency bands can be fully excited, and the problem that a traditional large-size hole-filling insulation substrate cannot detect high-frequency impedance is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of insulating substrates, and specifically relates to a high-frequency impedance detection device. Background Art

[0002] In the fields of electronic technology and semiconductor manufacturing, high-frequency impedance testing is one of the key links for evaluating the performance of materials, circuit boards, and components, and is particularly important in high-speed signal transmission and radio frequency (RF) applications.

[0003] Since the physical size of the large-size via-filled insulating substrate exceeds the adaptation range of traditional testing devices, traditional fixtures may not be able to firmly hold it, resulting in unstable contact during the testing process, which in turn affects the accuracy and reliability of the test results. In addition, the complex metal paste layout inside the large-size substrate may not be comprehensively and evenly tested due to the limitations of the fixture design, thus missing potential impedance abnormal areas. Summary of the Utility Model

[0004] Aiming at the above defects, the utility model proposes a high-frequency impedance detection device. The circuit board is connected to the conductive metal paste, and the wire metal paste and the vector network analyzer are connected through a wire assembly. Then, the vector network analyzer is started. The vector network analyzer sends complex and precise signals to the circuit board. These signals cover a wide range from low frequency to high frequency and can fully stimulate the response characteristics of the conductive metal paste at different frequency bands, solving the problem that traditional large-size via-filled insulating substrates cannot detect high-frequency impedance.

[0005] To achieve this purpose, the utility model adopts the following technical solutions:

[0006] A high-frequency impedance detection device includes a circuit board, a conductive component, an insulating substrate, and a vector network analyzer;

[0007] The insulating substrate is provided with a receiving groove and a through hole. The circuit board is located in the receiving groove. The through hole is communicated with the receiving groove. The through hole is filled with conductive metal paste. The conductive metal paste is connected to the circuit board. The conductive component connects the conductive metal paste to the vector network analyzer.

[0008] The top of the insulating substrate is provided with a first sub-through hole, and the bottom of the insulating substrate is provided with a second sub-through hole. The receiving groove is respectively communicated with the first sub-through hole and the second sub-through hole. Both the first sub-through hole and the second sub-through hole are filled with the conductive metal paste;

[0009] The conductive component includes a first conductive line and a second conductive line. The head end of the first conductive line passes through the first sub-through hole and is connected to the conductive metal paste. The tail end of the first conductive line is connected to the vector network analyzer. The head end of the second conductive line passes through the second sub-through hole and is connected to the conductive metal paste. The tail end of the second conductive line is connected to the vector network analyzer;

[0010] The first conductive line, the second conductive line, the circuit board, and the vector network analyzer form a closed circuit.

[0011] It further includes a first SMA connection line and a second SMA connection line. The first SMA connection line connects the first conductive wire to a port of the vector network analyzer; the second SMA connection line connects the second conductive wire to another port of the vector network analyzer.

[0012] There are two first conductive lines. The head ends of the two first conductive lines are both connected to the conductive metal paste located at the top. The tail ends of the two first conductive lines are respectively located at the opposite side edges of the insulating substrate. The first SMA connection line is connected to the tail end of one of the first conductive lines;

[0013] There are two second conductive lines. The head ends of the two second conductive lines are both connected to the conductive metal paste located at the bottom. The tail ends of the second conductive lines are located at the edge of the insulating substrate. The second SMA connection line is connected to the tail end of one of the second conductive lines.

[0014] Adhesive layers are provided on both the top and bottom of the insulating substrate. The first conductive line and the second conductive line are both fixedly installed on the insulating substrate through the adhesive layers.

[0015] The adhesive layer is a lead-free solder containing tin, copper, silver, bismuth, indium, and zinc.

[0016] The insulating substrate is one of a flexible substrate, a polyimide substrate, an FR-4 substrate, a glass substrate, and a ceramic substrate.

[0017] The technical solution of the present utility model may include the following beneficial effects:

[0018] 1. The circuit board is connected to the conductive metal paste, and the conductive metal paste and the vector network analyzer are connected through the wire component. Then, the vector network analyzer is started. The vector network analyzer sends complex and precise signals to the circuit board. These signals cover a wide range from low frequency to high frequency and can fully stimulate the response characteristics of the conductive metal paste at different frequency bands, solving the problem that traditional large-size via-filled insulating substrates cannot detect high-frequency impedance.

[0019] 2. In a high-frequency impedance detection device, the use of an SMA connector can ensure that high-frequency signals maintain low return loss and high transmission efficiency during transmission, thus meeting the requirements of high-frequency impedance measurement. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a schematic diagram of a high-frequency impedance detection device according to an embodiment of the present invention;

[0021] Figure 2 is a schematic diagram of an insulating substrate according to an embodiment of the present invention;

[0022] Figure 3 is a cross-sectional view of an insulating substrate according to an embodiment of the present invention;

[0023] Wherein, 1. Circuit board; 2. Conductive component; 21. First conductive line; 22. Second conductive line; 23. First SMA connection line; 24. Second SMA connection line; 3. Insulating substrate; 31. Accommodating groove; 4. Vector network analyzer; 5. Conductive metal paste. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0024] The technical solutions of the present invention will be further described below with reference to the drawings and through specific embodiments.

[0025] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "length", "middle", "upper", "lower", "left", "right", "top", "bottom", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0026] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, the meaning of "plurality" is more than two.

[0027] In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, the terms "installation", "splicing", "connection" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be directly connected, or indirectly connected through an intermediate medium, and may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0028] The following combines with Figures 1 to 3 , and describes a high-frequency impedance detection device according to an embodiment of the present invention.

[0029] A high-frequency impedance detection device includes a circuit board 1, a conductive component 2, an insulating substrate 3, and a vector network analyzer 4;

[0030] The insulating substrate 3 is provided with a receiving groove 31 and a through hole. The circuit board 1 is located in the receiving groove 31. The through hole is communicated with the receiving groove 31. The through hole is filled with a conductive metal paste 5. The conductive metal paste 5 is connected to the circuit board 1. The conductive component 2 connects the conductive metal paste 5 to the vector network analyzer 4.

[0031] The operation process is as follows. A through hole is formed on the insulating substrate 3, and the through hole is filled with the conductive metal paste 5. After the hole filling is completed, the insulating substrate 3 forms a test sample for detecting high-frequency impedance in this solution.

[0032] A receiving groove 31 is formed on the insulating substrate 3 after the hole filling is completed, and the receiving groove 31 is communicated with the through hole. Before detection, the circuit board 1 is pushed so that the circuit board 1 actively extends into the receiving groove 31 of the insulating substrate 3 until the side wall of the circuit board 1 abuts against the side wall of the receiving groove 31, and then the pushing of the circuit board 1 is stopped. At this time, the circuit board 1 is connected to the conductive metal paste 5, and the conductive metal paste and the vector network analyzer 4 are connected through a wire component. Then the vector network analyzer 4 is started. The vector network analyzer 4 sends complex and precise signals to the circuit board 1. These signals cover a wide range from low frequency to high frequency and can fully stimulate the response characteristics of the conductive metal paste 5 at different frequency bands.

[0033] During the measurement process, the vector network analyzer 4 can not only capture the part of the signal directly transmitted back from the circuit board 1, but also accurately identify and record complex phenomena such as reflection, scattering, and possible mode conversion of the signal on the pattern or circuit of the conductive metal paste 5. These subtle signal changes directly reflect the key parameters of the conductive metal paste 5 at high frequencies, such as impedance, phase, attenuation, etc., providing rich data support for evaluating its high-frequency performance.

[0034] A first sub-through hole is provided at the top of the insulating substrate 3, and a second sub-through hole is provided at the bottom of the insulating substrate 3. The receiving groove 31 is respectively communicated with the first sub-through hole and the second sub-through hole. Both the first sub-through hole and the second sub-through hole are filled with the conductive metal paste 5;

[0035] The conductive component 2 includes a first conductive line 21 and a second conductive line 22. The head end of the first conductive line 21 passes through the first sub-through hole and is connected to the conductive metal paste 5. The tail end of the first conductive line 21 is connected to the vector network analyzer 4. The head end of the second conductive line 22 passes through the second sub-through hole and is connected to the conductive metal paste 5. The tail end of the second conductive line 22 is connected to the vector network analyzer 4.

[0036] The first conductive line 21, the second conductive line 22, the circuit board 1 and the vector network analyzer 4 form a closed circuit.

[0037] Due to the limitations of size and electromagnetic interference, etc., traditional insulating substrates 3 are generally difficult to cooperate with the vector network analyzer 4 for testing. Therefore, on the insulating substrate 3 of this solution, there are a first sub-through hole and a second sub-through hole, and the accommodating groove 31 is respectively communicated with the first sub-through hole and the second sub-through hole. This through-hole method can be used for testing samples of insulating substrates 3 with a large surface area, requiring high-frequency impedance detection, and containing metal paste on the market. The head end of the first conductive line 21 passes through the first sub-through hole and is connected to the conductive metal paste 5, and its tail end is connected to the vector network analyzer 4; the head end of the second conductive line 22 passes through the second sub-through hole and is connected to the conductive metal paste 5, and the tail end is also connected to the vector network analyzer 4, where the conductive metal paste 5 is connected to the circuit board 1, enabling current to form a closed loop inside the insulating substrate 3 through the conductive component 2 and being connected to the external vector network analyzer 4 at the same time to realize the detection of high-frequency impedance. This closed circuit is the core part of high-frequency impedance detection, which allows current to flow in the conductive metal paste 5 and measures and analyzes its impedance characteristics through the vector network analyzer 4.

[0038] The first sub-through hole, the second sub-through hole and the accommodating groove 31 on the insulating substrate 3 are communicated with each other, which not only ensures the stable connection of the conductive component 2, but also facilitates installation and debugging. At the same time, the filling of the conductive metal paste 5 improves the contact conductivity and reduces the contact resistance.

[0039] It further includes a first SMA connection line 23 and a second SMA connection line 24. The first SMA connection line 23 connects the first conductive wire to a port of the vector network analyzer 4; the second SMA connection line 24 connects the second conductive wire to another port of the vector network analyzer 4.

[0040] It should be noted that both the first SMA connection line 23 and the second SMA connection line 24 are preferably SMA connectors. In a high-frequency impedance detection device, using SMA connectors can ensure that high-frequency signals maintain low return loss and high transmission efficiency during transmission, thus meeting the requirements of high-frequency impedance measurement.

[0041] There are two of the first conductive lines 21. The leading ends of the two first conductive lines 21 are both connected to the conductive metal paste 5 located at the top. The trailing ends of the two first conductive lines 21 are respectively located at the opposite side edges of the insulating substrate 3. The first SMA connection line 23 is connected to the trailing end of one of the first conductive lines 21.

[0042] There are two of the second conductive lines 22. The leading ends of the two second conductive lines 22 are both connected to the conductive metal paste 5 located at the bottom. The trailing end of the second conductive line 22 is located at the edge of the insulating substrate 3. The second SMA connection line 24 is connected to the trailing end of one of the second conductive lines 22.

[0043] Among them, the leading ends of the first conductive line 21 and the second conductive line 22 are both connected to the conductive metal paste 5, and the trailing ends are respectively located at the opposite side edges of the insulating substrate 3. Such a layout helps to optimize the transmission path of high-frequency signals, reduce the attenuation and distortion of signals during transmission, and thus improve the efficiency and accuracy of signal transmission.

[0044] Since the trailing ends of the first conductive line 21 and the second conductive line 22 are respectively located on both sides of the insulating substrate 3, the device can be flexibly configured according to different test requirements during testing. For example, different trailing ends can be selected to access the test equipment to adapt to different test environments and conditions, enhancing the versatility and flexibility of the device.

[0045] The connection positions of the first SMA connection line 23 and the second SMA connection line 24 can be selected according to the test environment of the test device, making full use of the limited space of the insulating substrate 3, ensuring the smooth transmission of signals and avoiding the waste of space.

[0046] Adhesive layers are provided on both the top and bottom of the insulating substrate 3. The first conductive line 21 and the second conductive line 22 are both fixedly installed on the insulating substrate 3 through the adhesive layers.

[0047] The adhesive layer can firmly fix the conductive lines on the insulating substrate 3, preventing the displacement or detachment of the lines due to vibration or external force during high-frequency testing, thus ensuring the stability and reliability of the test, reducing signal interference and errors, and improving the test accuracy.

[0048] Moreover, the adhesive layer closely adheres the conductive lines to the insulating substrate 3, which can reduce the air gap between the lines and the substrate, thereby reducing the capacitance effect and inductance effect caused by the air gap, reducing the loss and distortion during high-frequency signal transmission, and improving the electrical performance of the test.

[0049] The adhesion layer is a lead-free solder containing tin, copper, silver, bismuth, indium and zinc.

[0050] The combination of various metal elements in the lead-free solder can form a welding joint with high strength and good toughness, so that the first conductive circuit 21 and the second conductive circuit 22 can be firmly fixed on the insulating substrate 3, resisting vibration and external force impact, and ensuring the stability and reliability of the test device in complex environments.

[0051] Moreover, the use of lead-free solder meets modern environmental protection requirements and avoids the potential harm of traditional lead-containing solder to the environment and human health.

[0052] The insulating substrate 3 is one of a flexible substrate, a polyimide substrate, a FR-4 substrate, a glass substrate and a ceramic substrate.

[0053] These substrate materials usually have lower dielectric constants and dielectric losses, which help reduce the loss and distortion of high-frequency signals during transmission, thereby improving the precision and accuracy of testing.

[0054] The technical principle of the present invention is described above in combination with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the protection scope of the present invention in any way. Based on the explanations here, technicians in this field can think of other specific implementation methods of the present invention without creative work, and these methods will fall within the protection scope of the present invention.

Claims

1. A high-frequency impedance detection device, characterized in that, It includes a circuit board, a conductive component, an insulating substrate, and a vector network analyzer; The insulating substrate is provided with a receiving groove and a through hole. The circuit board is located in the receiving groove. The through hole is communicated with the receiving groove. The through hole is filled with a conductive metal paste. The conductive metal paste is connected to the circuit board. The conductive component connects the conductive metal paste to the vector network analyzer.

2. The high-frequency impedance detection device according to claim 1, wherein A first sub-through hole is provided at the top of the insulating substrate, and a second sub-through hole is provided at the bottom of the insulating substrate. The receiving groove is respectively communicated with the first sub-through hole and the second sub-through hole. Both the first sub-through hole and the second sub-through hole are filled with the conductive metal paste; The conductive component includes a first conductive line and a second conductive line. The head end of the first conductive line passes through the first sub-through hole and is connected to the conductive metal paste. The tail end of the first conductive line is connected to the vector network analyzer. The head end of the second conductive line passes through the second sub-through hole and is connected to the conductive metal paste. The tail end of the second conductive line is connected to the vector network analyzer; The first conductive line, the second conductive line, the circuit board, and the vector network analyzer form a closed circuit.

3. The high-frequency impedance detection device according to claim 2, wherein It further includes a first SMA connection line and a second SMA connection line. The first SMA connection line connects the first conductive wire to a port of the vector network analyzer; the second SMA connection line connects the second conductive wire to another port of the vector network analyzer.

4. The high-frequency impedance detection device according to claim 3, characterized in that, There are two first conductive lines. The head ends of the two first conductive lines are both connected to the conductive metal paste located at the top. The tail ends of the two first conductive lines are respectively located at the opposite side edges of the insulating substrate. The first SMA connection line is connected to the tail end of one of the first conductive lines; There are two second conductive lines. The head ends of the two second conductive lines are both connected to the conductive metal paste located at the bottom. The tail end of the second conductive line is located at the edge of the insulating substrate. The second SMA connection line is connected to the tail end of one of the second conductive lines.

5. The high-frequency impedance detection device according to claim 2, characterized in that, Adhesive layers are provided on both the top and the bottom of the insulating substrate. The first conductive line and the second conductive line are both fixedly installed on the insulating substrate through the adhesive layers.

6. The high-frequency impedance detection device according to claim 5, characterized in that, The adhesive layer is a lead-free solder containing tin, copper, silver, bismuth, indium, and zinc.

7. A high-frequency impedance detection device according to claim 1, characterized in that The insulating substrate is one of a flexible substrate, a polyimide substrate, an FR-4 substrate, a glass substrate, and a ceramic substrate.

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