Semiconductor chip testing device

Abstract

The utility model provides a semiconductor chip testing device, comprising a connecting plate, the top of which is provided with a heating resistance wire and a cooling pipeline, and the connecting plate is used for being electrically connected with an external testing machine; a connecting port of the cooling liquid circulating machine is communicated with the cooling pipeline, and a cooling flow channel is formed between the cooling liquid circulating machine and the cooling pipeline; the output end of the power supply module is electrically connected to the heating resistance wire; the chip testing seat is electrically connected to the connecting plate and located on one side of the heating resistance wire and the cooling pipeline, and the chip testing seat is used for installing a tested device; and the detection control module is electrically connected to the control end of the power supply module and the control end of the cooling liquid circulation machine, and the detection control module is used for detecting and adjusting the current temperature of the chip testing seat. According to the utility model, the test temperature of the tested device can be rapidly adjusted, and the convenience of testers in the test process is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, and particularly relates to a test device for semiconductor chips. Background Art

[0002] For the qualification test of semiconductor chips in a wafer fab, it is carried out by a semiconductor final test (FT) tester on test samples on a chip test socket. Usually, test samples need to be verified at different test temperatures at multiple nodes (FT0, FT1, FT2) of the tester. In the prior art, heating and cooling are carried out by a Thermojet with a temperature hood. After reaching the preset temperature, the device under test (DUT) is tested. After testing one DUT, the Thermojet needs to be cooled to room temperature, and the operator manually lifts the temperature hood, takes out the DUT, then inserts the next DUT, covers the temperature hood, and waits for the temperature to return to the set temperature before testing. The process of adjusting the temperature by the Thermojet wastes a lot of time, resulting in low test efficiency. Therefore, there is room for improvement. Summary of the Utility Model

[0003] The utility model provides a test device for semiconductor chips to solve the technical problem that the process of adjusting the temperature by the Thermojet in the prior art wastes a lot of time and results in low test efficiency.

[0004] A test device for semiconductor chips provided by the utility model includes:

[0005] A connecting plate, on the top of which a heating resistance wire and a cooling pipe are arranged, and the connecting plate is used for being electrically connected to an external tester;

[0006] A coolant circulation machine, the connection port of which is communicated with the cooling pipe, and a cooling flow path is formed between the coolant circulation machine and the cooling pipe;

[0007] A power supply module, the output end of which is electrically connected to the heating resistance wire;

[0008] A chip test socket, which is electrically connected to the connecting plate and is located on one side of the heating resistance wire and the cooling pipe, and the chip test socket is used for installing a DUT; and

[0009] A detection and control module, which is electrically connected to the control end of the power supply module and the control end of the coolant circulation machine, and the detection and control module is used for detecting and adjusting the current temperature at the chip test socket.

[0010] In an embodiment of the invention, the heating resistance wire surrounds the chip test socket.

[0011] In one embodiment of the present invention, at the top of the connecting plate, the cooling pipeline includes a first-section pipeline and a second-section pipeline. One end of the first-section pipeline is communicated with one end of the second-section pipeline, and the other end of the first-section pipeline and the other end of the second-section pipeline are respectively connected to the connection ports of the coolant circulation machine.

[0012] The heating resistance wire is located between the first-section pipeline and the second-section pipeline.

[0013] In one embodiment of the present invention, a test signal terminal is provided at the top of the connecting plate, and the test signal terminal is used for electrically connecting to an external testing machine.

[0014] The test signal terminal is located between the first-section pipeline and the second-section pipeline.

[0015] In one embodiment of the present invention, the detection and control module includes:

[0016] A temperature sensor, located on the chip test socket;

[0017] A micro control unit, electrically connected to the temperature sensor, the control end of the power supply module, and the control end of the coolant circulation machine; and

[0018] A display screen, electrically connected to the micro control unit.

[0019] In one embodiment of the present invention, the control end of the power supply module and the control end of the coolant circulation machine respectively form a conductive circuit with the micro control unit.

[0020] In one embodiment of the present invention, the device under test is detachably installed on the chip test socket.

[0021] In one embodiment of the present invention, a storage tank is provided in the coolant circulation machine, a coolant is provided in the storage tank, and the storage tank is connected to the cooling pipeline.

[0022] In one embodiment of the present invention, an insulating layer and a heat-insulating and heat-preserving glue layer are sequentially covered outside the chip test socket, and an insulating layer and a heat-insulating and heat-preserving glue layer are sequentially covered outside the heating resistance wire.

[0023] In one embodiment of the present invention, a sealing cover is further included, and the sealing cover is sleeved outside the chip test socket.

[0024] Advantages of the present utility model: A testing device for semiconductor chips proposed by the present utility model can quickly adjust the testing temperature of a device under test by controlling a heating resistance wire and a coolant circulation machine, saving testing time and improving the convenience of testers during the testing process. Description of the Drawings

[0025] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0026] Figure 1 It is a schematic structural diagram of a testing device for semiconductor chips provided by an embodiment of the present utility model.

[0027] Figure 2 It is a schematic working diagram of a testing device for semiconductor chips provided by an embodiment of the present utility model.

[0028] Figure 3 It is a schematic connection diagram of a detection and control module in a testing device for semiconductor chips provided by an embodiment of the present utility model.

[0029] Figure 4 It is a schematic connection diagram of a chip testing socket in a testing device for semiconductor chips provided by an embodiment of the present utility model.

[0030] Explanation of the Reference Numerals in the Drawings

[0031] 10. Connection plate; 110. Heating resistance wire; 120. Cooling pipeline; 121. First section of pipeline; 122. Second section of pipeline; 20. Coolant circulation machine; 30. Power supply module; 40. Chip testing socket; 410. Pin hole; 50. Detection and control module; 510. Temperature sensor; 520. Display screen; 530. Micro control unit; 60. Testing machine; 61. Testing wire; 70. Device under test. Specific Embodiments

[0032] The following illustrates the embodiments of the present utility model through specific specific examples. Those skilled in the art can easily understand other advantages and effects of the present utility model from the content disclosed in this specification. The present utility model can also be implemented or applied through other different specific embodiments. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present utility model. It should be noted that, without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0033] It should be noted that the illustrations provided in the following embodiments only schematically illustrate the basic concept of the present invention. Therefore, only the components related to the present invention are shown in the drawings, rather than being drawn according to the number, shape, and size of the components in actual implementation. The type, quantity, and proportion of each component in actual implementation can be arbitrarily changed, and the component layout type may also be more complex.

[0034] In the following description, a large number of details are explored to provide a more thorough explanation of the embodiments of the present invention. However, it is obvious to those skilled in the art that the embodiments of the present invention can be implemented without these specific details. In other embodiments, well-known structures and devices are shown in the form of block diagrams rather than in detail to avoid making the embodiments of the present invention difficult to understand.

[0035] Please refer to Figures 1 to 4 , the present invention provides a test device for semiconductor chips, which can be applied in the field of qualification testing of semiconductor devices, for example, in the final test (FT) of semiconductor products. During the process of the tester 60 testing the device under test (DUT) 70 on the chip test socket. The present invention controls the heating resistance wire 120 and the coolant circulation machine 20 through the detection and control module 50 at multiple nodes (FT0, FT1, FT2) of the tester, and can quickly adjust the test temperature of the device under test 70. The present invention conducts verification tests at different test temperatures, saving test time and improving the convenience of testers during the test process. The following will be described in detail through specific embodiments.

[0036] Please refer to Figure 1 , Figure 2 and Figure 3 As shown in, in an embodiment of the present invention, the test device for semiconductor chips may include a connection board 10, a coolant circulation machine 20, a power supply module 30, a chip test socket 40, and a detection and control module 50.

[0037] Specifically, the connection board 10 serves as the installation main body for testing the device under test 70. The connection board 10 can be electrically connected to an external tester 60. The tester 60 tests the device under test 70, and the connection board 10 can transmit the test signal of the device under test 70 to the tester 60. The connection board 10 is a printed circuit board (PCB) used to verify the circuit design, check the manufacturing quality, or diagnose faults of the device under test 70. The connection board 10 may include various electronic components and interfaces, and is designed for functional testing of the device under test 70, such as signal transmission, power management, data processing, and other functions.

[0038] Please refer to Figure 1 、 Figure 2 and Figure 3 As shown, in an embodiment of the present invention, heating resistance wires 110 and cooling pipes 120 are provided on the top of the connection plate 10. When the heating resistance wires 110 generate a thermal effect under the power supply of an external power source, it can play a role in heating up. When the external power source does not supply power to the heating resistance wires 110, it will not play a role in heating up. When there is coolant flowing in the cooling pipes 120, it can play a role in cooling down. When there is no coolant flowing in the cooling pipes 120, it will not play a role in cooling down.

[0039] Please refer to Figure 1 、 Figure 2 and Figure 3 As shown, in an embodiment of the present invention, the coolant circulation machine 20 can be located on one side of the connection plate 10. The connection port of the coolant circulation machine 20 is communicated with the cooling pipes 120, and a cooling flow path is formed between the coolant circulation machine 20 and the cooling pipes 120.

[0040] Specifically, as Figure 1 and Figure 3 shown, the connection port of the coolant circulation machine 20 is communicated with the cooling pipes 120, but it does not mean that the coolant circulation machine 20 needs to circulate coolant in the cooling pipes 120 at any time. That is, when the device under test 70 needs to be tested at low temperature, the coolant circulation machine 20 needs to circulate coolant in the cooling pipes 120 to play a role in cooling down. When the device under test 70 needs to be tested at normal temperature or high temperature, the coolant circulation machine 20 does not need to circulate coolant in the cooling pipes 120, and the cooling pipes 120 do not need to accommodate coolant either.

[0041] Please refer to Figure 1 、 Figure 2 and Figure 3 As shown, in an embodiment of the present invention, the output end of the power module 30 is electrically connected to the heating resistance wires 110.

[0042] Specifically, when the heating resistance wires 110 generate a thermal effect under the power supply of the power module 30, it can play a role in heating up. When the power module 30 does not supply power to the heating resistance wires 110, it will not play a role in heating up.

[0043] Please refer to Figure 1 、 Figure 2 and Figure 3 As shown, in an embodiment of the present invention, the chip test socket (Socket) 40 is electrically connected to the connection plate 10, and the chip test socket 40 is located on one side of the heating resistance wires 110 and the cooling pipes 120. The chip test socket 40 is used to mount the device under test 70.

[0044] Specifically, the chip test socket (Socket) 40 is a device specifically designed for testing the device under test 70. The main function of the chip test socket 40 is to provide an environment where the pins of the device under test 70 can be precisely contacted without permanently installing the device under test 70, thereby allowing the test engineer to evaluate the functionality, electrical characteristics, performance, and reliability of the device under test 70.

[0045] Please refer to Figure 1 、 Figure 2 and Figure 3 As shown, in an embodiment of the present invention, the detection control module 50 is electrically connected to the control end of the power supply module 30 and the control end of the coolant circulation machine 20. The detection control module 50 is used to detect and adjust the current temperature of the chip test socket 40.

[0046] Specifically, a temperature detection unit may be provided in the detection control module 50, which can be used to detect the current temperature of the chip test socket 40. In addition, a control unit may also be provided in the detection control module 50. The control unit is electrically connected to the control end of the power supply module 30 and the control end of the coolant circulation machine 20. The control unit can control whether the power supply module 30 supplies power to the heating resistance wire 110, and the control unit can also control whether the coolant circulation machine 20 circulates the coolant in the cooling pipe 120, so as to realize that the detection control module 50 is used to adjust the current temperature of the chip test socket 40.

[0047] Specifically, when testing the device under test 70 in this embodiment, it is not necessary to lift and lower the temperature cover and adjust the temperature multiple times. In this embodiment, by providing a heating resistance wire 110 and a cooling pipe 120 on one side of the chip test socket 40, the temperature at the chip test socket 40 can be maintained at a set temperature through the setting of the heating resistance wire 110 or the cooling pipe 120, so as to realize the sequential testing of multiple devices under test 70. The operation of this embodiment is simple, saving test time and improving the convenience and flexibility of the test personnel during testing.

[0048] It can be seen that, compared with the existing high and low temperature equipment of the Thermojet for heating and cooling, using the heating resistance wire 110 for heating and the water cooling pipe 120 for cooling, the heating and cooling of the device under test 70 is more sufficient and accurate, the heat loss is lower, and for the test parameters related to temperature factors, the test results of this embodiment are more accurate and reliable, and it can reduce energy consumption, meeting the energy-saving benefits. This embodiment uses the heating resistance wire 110 and the water cooling pipe 120. Compared with the high and low temperature equipment of the Thermojet, its operation is simple. At the corresponding test temperature, only need to input the preset temperature once on the detection control module 50, without repeatedly lifting and lowering the temperature cover of the Thermojet and setting the temperature. This embodiment saves the test time, improves the convenience of the tester during the test, and also greatly improves the flexibility.

[0049] In addition, compared with the high and low temperature equipment of the Thermojet, the volume of the connecting plate 10 with the heating resistance wire 110 and the water cooling pipe 120 is negligible, hardly occupying extra laboratory space, and has unexpected effects on the rationality, variability and utilization rate of the laboratory space planning. When the temperature cover of the existing high and low temperature equipment of the Thermojet drops, it is easy to accidentally touch the test wire 61, causing the test wire 61 to fall off and the connection to be interrupted, delaying the test, and even damaging the pins of the connecting plate 10, increasing the cost of the test time and the cost of repairing the connecting plate 10. However, using the connecting plate 10 with the heating resistance wire 110 and the water cooling pipe 120 in this embodiment can effectively avoid these problems. When heating and cooling in this embodiment, using the heating resistance wire 110 and the water cooling pipe 120, the time for the test environment to reach the preset temperature is more accurate and faster compared with the heating and cooling of the Thermojet, saving the adjustment time of the test temperature of the device under test 70.

[0050] Please refer to Figure 1 、 Figure 2 and Figure 3 As shown, in an embodiment of the present invention, the heating resistance wire 110 surrounds the chip test socket 40.

[0051] Specifically, as Figure 1 and Figure 3 shown, the heating resistance wire 110 can be in the shape of a polygonal ring, a circular ring or an oval ring, etc. The heating resistance wire 110 surrounds the chip test socket 40. After the power supply module 30 supplies power to the heating resistance wire 110, the chip test socket 40 can quickly reach the set temperature for testing the device under test 70. And considering that during the heating process of the chip test socket 40, the temperature on its outer side can be kept consistent, the center of the chip test socket 40 can be set to coincide with the center of the heating resistance wire 110.

[0052] Please refer to Figure 1 、 Figure 2 and Figure 3 As shown, in an embodiment of the present invention, at the top of the connection plate 10, the cooling pipeline 120 includes a first-section pipeline 121 and a second-section pipeline 122. One end of the first-section pipeline 121 communicates with one end of the second-section pipeline 122, and the other end of the first-section pipeline 121 and the other end of the second-section pipeline 122 are respectively connected to the connection ports of the coolant circulation machine 20. The heating resistance wire 110 is located between the first-section pipeline 121 and the second-section pipeline 122.

[0053] Specifically, the first-section pipeline 121 and the second-section pipeline 122 of the cooling pipeline 120 can be arranged in parallel, and between the first-section pipeline 121 and the second-section pipeline 122 of the cooling pipeline 120, the heating resistance wire 110 and the chip test socket 40 can be surrounded. By arranging the heating resistance wire 110 and the chip test socket 40 between the first-section pipeline 121 and the second-section pipeline 122 of the cooling pipeline 120, during the cooling process of the chip test socket 40, the temperature on its outer side can be kept consistent.

[0054] Please refer to Figure 1 、 Figure 2 and Figure 3 As shown, in an embodiment of the present invention, a test signal terminal is provided at the top of the connection plate 10, and the test signal terminal is used for electrically connecting to an external test machine 60. The test signal terminal is located between the first-section pipeline 121 and the second-section pipeline 122.

[0055] Specifically, as Figure 3 shown, in order to ensure the efficiency of the heating resistance wire 110 and the cooling pipeline 120 in adjusting the temperature of the chip test socket 40, between the first-section pipeline 121 and the second-section pipeline 122 of the cooling pipeline 120, the heating resistance wire 110 and the chip test socket 40 can be surrounded. In addition, in order to avoid interference of the heating resistance wire 110 and the cooling pipeline 120 with the position of the test signal terminal on the connection plate 10, as Figure 3 shown, the test signal terminal connected by the test wire 61 can be arranged on one side of the chip test socket 40 and located between the first-section pipeline 121 and the second-section pipeline 122.

[0056] Please refer to Figure 1 、 Figure 2 and Figure 3 As shown, in an embodiment of the present invention, the detection and control module 50 includes a temperature sensor 510, a display screen 520, and a micro control unit 530.

[0057] Specifically, the temperature sensor 510 can be arranged on one side of the chip test socket 40. The temperature sensor 40 can be used to detect the current temperature of the chip test socket 40. The micro control unit 530 is electrically connected to the temperature sensor 510, and the micro control unit 530 can obtain the current temperature detected by the micro control unit 510. The display screen 520 is electrically connected to the micro control unit 530 and is used to display the current temperature and the set temperature of the chip test socket 40. The micro control unit 530 is electrically connected to the control end of the power supply module 30 and the control end of the coolant circulation machine 20. When the difference between the current temperature detected by the temperature sensor 510 and the set temperature of the chip test socket 10 is within -0.5°C to 0.5°C, the micro control unit 530 can send a control instruction to the control end of the power supply module 30 or the control end of the coolant circulation machine 20 to make the current temperature of the chip test socket 10 the same as the set temperature, so as to complete the test of the device under test 70.

[0058] Please refer to Figure 1 、 Figure 2 and Figure 3 As shown, in an embodiment of the present invention, the control end of the power supply module 30 and the control end of the coolant circulation machine 20 respectively form a conductive loop with the micro control unit 530 to adjust the current temperature of the chip test socket 40.

[0059] Specifically, the device under test 70 installed on the chip test socket 40 needs to be subjected to low-temperature, normal-temperature, and high-temperature detections. When the chip test socket 40 is at normal temperature and a normal-temperature test is required, the heating resistance wire 110 does not need to be heated, and the cooling pipe 120 does not need to be cooled either. When the chip test socket 40 is at normal temperature and a low-temperature test is required, the heating resistance wire 110 does not need to be heated, and the cooling pipe 120 needs to be cooled. When the chip test socket 40 is at normal temperature and a high-temperature test is required, the heating resistance wire 110 needs to be heated, and the cooling pipe 120 does not need to be cooled.

[0060] It can be seen that when adjusting the temperature at the chip test socket 40, at the same moment, only one of the control end of the power supply module 30 and the control end of the coolant circulation machine 20 forms a conductive loop with the micro control unit 530 to adjust the current temperature of the chip test socket 40.

[0061] Please refer to Figure 1 、 Figure 3 and Figure 4As shown in the figure, in an embodiment of the present invention, a device under test 70 is detachably mounted on a chip test socket 40. By detachably mounting the device under test 70 on the chip test socket 40, the test efficiency of the device under test 70 can be improved. For example, the pins of the device under test 70 are inserted into the pin holes 410 of the chip test socket 40 to complete the connection between the device under test 70 and the chip test socket 40.

[0062] Specifically, by heating the heating resistance wire 110 or cooling the cooling pipe 120, the chip test socket 40 is maintained at a set temperature, and one device under test 70 is tested. After that, without adjusting the temperature at the chip test socket 40, the previous device under test 70 can be removed from the chip test socket 40, and then the next device under test 70 can be installed on the chip test socket 40 for testing. This embodiment improves the test efficiency of the device under test 70.

[0063] Please refer to Figure 1 、 Figure 2 and Figure 3 As shown in the figure, in an embodiment of the present invention, a coolant circulation machine 20 is provided with a storage tank inside. The storage tank is filled with coolant, and the storage tank is connected to the cooling pipe 120.

[0064] Specifically, the storage tank serves to store the coolant. When the device under test 70 needs to be tested at a low temperature, the coolant circulation machine 20 needs to circulate the coolant in the cooling pipe 120, so that the coolant in the storage tank and the coolant in the cooling pipe 120 form a continuous closed flow path to achieve the function of cooling and temperature reduction. When the device under test 70 needs to be tested at room temperature or high temperature, the coolant circulation machine 20 does not need to circulate the coolant in the cooling pipe 120, and the cooling pipe 120 does not need to accommodate the coolant.

[0065] Please refer to Figure 1 、 Figure 2 and Figure 3 As shown in the figure, in an embodiment of the present invention, an insulating layer and a heat-insulating and heat-preserving adhesive layer are sequentially covered outside the chip test socket 10, and an insulating layer and a heat-insulating and heat-preserving adhesive layer are sequentially covered outside the heating resistance wire 110. This prevents the heating resistance wire 110 from causing accidental contact injuries to the test personnel when it is energized and heated.

[0066] Please refer to Figure 1 、 Figure 2 and Figure 3 As shown in the figure, in an embodiment of the present invention, the test device for a semiconductor chip further includes a sealing cover. The sealing cover is sleeved outside the chip test socket 10, and the sealing cover is located outside the device under test 70. This prevents the device under test 70 from being damaged due to frosting on the sample surface during low-temperature testing, which may cause damage to the chip test socket 10 and the device under test 70.

[0067] In summary, the present utility model provides a test device for semiconductor chips. By controlling the heating resistance wire and the coolant circulation machine, the present utility model can quickly adjust the test temperature of the device under test, saving test time and improving the convenience of the test personnel during the test process.

[0068] The flowcharts and block diagrams in the accompanying drawings illustrate the possible architectures, functions, and operations of methods and computer program products according to various embodiments of the present disclosure. In this regard, each block in the flowchart or block diagram may represent a module, a program segment, or a part of code that contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than that marked in the accompanying drawings. For example, two consecutive blocks shown may actually be executed substantially in parallel, and they may sometimes be executed in the reverse order, depending on the functions involved. It should also be noted that each block in the block diagram and / or flowchart, and combinations of blocks in the block diagram and / or flowchart, can be implemented by a dedicated hardware-based system that performs the specified functions or operations, or can be implemented by a combination of dedicated hardware and computer instructions.

Claims

1. A test device for a semiconductor chip, characterized in that, Comprising: A connecting plate, on the top of which there are heating resistance wires and cooling pipes, and the connecting plate is used for electrically connecting to an external testing machine; A coolant circulation machine, whose connection port is communicated with the cooling pipe, and between the coolant circulation machine and the cooling pipe, a cooling flow path is formed; A power supply module, whose output end is electrically connected to the heating resistance wires; A chip test socket, electrically connected to the connecting plate and located on one side of the heating resistance wires and the cooling pipe, and the chip test socket is used for installing a device under test; and A detection and control module, electrically connected to the control end of the power supply module and the control end of the coolant circulation machine, and the detection and control module is used for detecting and adjusting the current temperature at the chip test socket.

2. The test device for a semiconductor chip according to claim 1, wherein The heating resistance wires surround the chip test socket.

3. The test apparatus for a semiconductor chip according to claim 2, characterized in that, On the top of the connecting plate, the cooling pipe includes a first section pipe and a second section pipe, one end of the first section pipe is communicated with one end of the second section pipe, and the other end of the first section pipe and the other end of the second section pipe are respectively connected to the connection port of the coolant circulation machine; The heating resistance wires are located between the first section pipe and the second section pipe.

4. The test device for a semiconductor chip according to claim 3, characterized in that, On the top of the connecting plate, there is a test signal terminal, and the test signal terminal is used for electrically connecting to an external testing machine; The test signal terminal is located between the first section pipe and the second section pipe.

5. The test device for a semiconductor chip according to claim 1, characterized in that, The detection and control module includes: A temperature sensor, located on the chip test socket; A micro control unit, electrically connected to the temperature sensor, the control end of the power supply module and the control end of the coolant circulation machine; and A display screen, electrically connected to the micro control unit.

6. The test device for a semiconductor chip according to claim 5, characterized in that, The control end of the power supply module and the control end of the coolant circulation machine respectively form a conductive loop with the micro control unit.

7. The test device for a semiconductor chip according to claim 1, characterized in that, The device under test is detachably installed on the chip test socket.

8. The test apparatus for a semiconductor chip according to claim 1, characterized in that, In the coolant circulation machine, there is a storage tank, in the storage tank there is coolant, and the storage tank is connected to the cooling pipe.

9. The test apparatus for a semiconductor chip according to claim 1, wherein, Outside the chip test socket, there are successively covered an insulating layer and a heat insulating and heat preserving glue layer, and outside the heating resistance wires, there are successively covered an insulating layer and a heat insulating and heat preserving glue layer.

10. The test device for a semiconductor chip according to claim 1, characterized in that, It further includes a sealing cover, and the sealing cover is sleeved outside the chip test socket.

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