Notebook computer backboard heat dissipation structure

Abstract

The utility model discloses a notebook computer backboard heat dissipation structure which comprises a shell, a groove is formed in the shell, a heat dissipation plate is detachably arranged in the groove, a heat dissipation groove is formed in the heat dissipation plate, an installation groove is formed in the shell, a clamping rod is arranged in the installation groove in a sliding mode, and the clamping rod is arranged in the installation groove in a sliding mode. At least part of the clamping rod can extend into the groove, the clamping rod can be clamped in the heat dissipation plate by sliding the clamping rod so as to fix the heat dissipation plate in the groove, and when the heat dissipation plate is disassembled, the rotating rod needs to be rotated firstly, so that the rotating rod drives the baffle to move the limiting plate; according to the heat dissipation device, the limiting plate drives the connecting rod to move in the displacement process, the connecting rod drives the clamping rod on the connecting rod to be separated from the heat dissipation plate in the displacement process, then the heat dissipation plate is taken out, through the simple structure, heat dissipation holes are conveniently cleaned through the device, and the heat dissipation plate is conveniently disassembled through the device.

Description

Technical Field

[0001] The utility model relates to the field of notebooks, and specifically, to a heat dissipation structure for the back panel of a notebook. Background Art

[0002] With the large-scale popularization of notebook computers, the update and replacement of notebook computers are becoming more and more frequent, and people's requirements for the quality of notebook computers are also getting higher and higher. The market has put forward new requirements for the efficient and high-quality production and assembly of notebook computers. When a notebook computer is used for a long time or runs large software, it may generate more heat. In order to ensure the performance of the notebook computer and extend its service life, effective heat dissipation is very important. For example, a heat dissipation structure for the lower shell of a notebook computer provided by a patent document with the publication number of CN213581923U includes an integrally formed lower shell body, an installation cavity opened in the lower shell body, a heat conduction area installed in the installation cavity, heat dissipation grooves opened in the lower shell body and located on both sides of the heat conduction area, and a heat dissipation area arranged in the heat conduction area; the heat conduction area includes an aluminum substrate installed in the installation cavity, a heat transfer copper plate integrally die-cast inside the aluminum substrate, and a heat conduction copper layer formed on the surface of the heat transfer copper plate by cold spraying. The heat dissipation area includes a plurality of heat dissipation grooves opened on the side of the aluminum substrate facing away from the heat conduction copper layer. However, the heat dissipation holes of this device are integrated with the shell, which is not convenient for disassembling and cleaning. Summary of the Utility Model

[0003] The purpose of the utility model is to provide a heat dissipation structure for the back panel of a notebook, which solves the problem that the heat dissipation holes of this device are integrated with the shell and are not convenient for disassembling and cleaning.

[0004] To achieve the above purpose, the utility model provides a heat dissipation structure for the back panel of a notebook. The heat dissipation structure for the back panel of a notebook includes a shell, a groove is provided on the shell, a heat dissipation plate is detachably arranged in the groove, heat dissipation grooves are provided on the heat dissipation plate, an installation groove is provided on the shell, a clamping rod is slidably arranged in the installation groove, at least part of the clamping rod can extend into the groove, and sliding the clamping rod can make it clamp on the heat dissipation plate to fix the heat dissipation plate in the groove.

[0005] Preferably, a connecting rod is slidably arranged in the installation groove, the connecting rod is connected with the clamping rod, and a spring is arranged in the installation groove and abuts against the connecting rod.

[0006] Preferably, a limiting plate is arranged on the connecting rod, a rotating rod is rotatably arranged on the shell, a baffle is arranged on the rotating rod, and at least part of the baffle extends into the installation groove and abuts against the limiting plate.

[0007] Preferably, a rotating handle is arranged on the rotating rod.

[0008] Preferably, a keyway is provided in the installation groove, a key is provided on the limiting plate, and the key is slidably arranged in the keyway.

[0009] Preferably, a placement cavity is provided on the housing, and an aluminum substrate is provided on the placement cavity.

[0010] The utility model provides a heat dissipation structure for a notebook backplane. The heat dissipation structure for the notebook backplane includes a housing. A groove is provided on the housing, and a heat dissipation plate is detachably arranged in the groove. Heat dissipation grooves are provided on the heat dissipation plate. An installation groove is provided on the housing, and a clamping rod is slidably arranged in the installation groove. At least a part of the clamping rod can extend into the groove. Sliding the clamping rod can make it engage with the heat dissipation plate to fix the heat dissipation plate in the groove. When disassembling the heat dissipation plate, it is necessary to first rotate the rotating rod, so that the rotating rod drives the baffle to displace the limiting plate. During the displacement of the limiting plate, the connecting rod is driven to displace. During the displacement of the connecting rod, the clamping rod on the connecting rod is driven to separate from the heat dissipation plate. Then, the heat dissipation plate is taken out. Through a simple structure, the device is convenient for cleaning the heat dissipation holes.

[0011] Beneficial effects: By rotating the rotating rod, the rotating rod drives the baffle to displace the limiting plate. During the displacement of the limiting plate, the connecting rod is driven to displace. During the displacement of the connecting rod, the clamping rod on the connecting rod is driven to separate from the heat dissipation plate, so that the device is convenient for cleaning the heat dissipation holes.

[0012] Other features and advantages of the utility model will be described in detail in the subsequent specific implementation part. Description of the Drawings

[0013] The drawings are used to provide a further understanding of the utility model, and constitute a part of the specification. Together with the following specific implementation, they are used to explain the utility model, but do not constitute a limitation to the utility model. In the drawings:

[0014] Figure 1 is the first perspective structure diagram of the heat dissipation structure provided by the utility model;

[0015] Figure 2 is the second perspective structure diagram of the heat dissipation structure provided by the utility model;

[0016] Figure 3 is Figure 2 the enlarged structure diagram at A in

[0017] Description of the Reference Numerals

[0018] 1. Housing; 2. Heat dissipation plate; 3. Heat dissipation groove; 4. Installation groove; 5. Latching rod; 6. Connecting rod; 7. Spring; 8. Rotating rod; 9. Baffle; 10. Placement cavity; 11. Aluminum substrate. Detailed implementation manners

[0019] The following will describe in detail the detailed implementation manners of the present utility model with reference to the accompanying drawings. It should be understood that the detailed implementation manners described herein are only used to illustrate and explain the present utility model, and are not used to limit the present utility model.

[0020] As Figures 1-3 shown: The present utility model provides a heat dissipation structure for a notebook backplane. The heat dissipation structure includes a housing 1. A groove is provided on the housing 1. A heat dissipation plate 2 is detachably provided in the groove. Heat dissipation grooves 3 are provided on the heat dissipation plate 2. An installation groove 4 is provided on the housing 1. A latching rod 5 is slidably provided in the installation groove 4. At least part of the latching rod 5 can extend into the groove. Sliding the latching rod 5 can make it latch on the heat dissipation plate 2 to fix the heat dissipation plate 2 in the groove.

[0021] The working principle of the present utility model: When disassembling the heat dissipation plate, it is necessary to first rotate the rotating rod so that the rotating rod drives the baffle to displace the limiting plate. During the displacement of the limiting plate, the connecting rod is driven to displace. During the displacement of the connecting rod, the latching rod on the connecting rod is separated from the heat dissipation plate. Then, take out the heat dissipation plate. Through a simple structure, the device is convenient for cleaning the heat dissipation holes.

[0022] In a preferred implementation manner of the present utility model, a connecting rod 6 is slidably provided in the installation groove 4. The connecting rod 6 is connected to the latching rod 5. A spring 7 is provided in the installation groove 4. The spring 7 abuts against the connecting rod 6. This is to facilitate the latching rod to firmly latch on the heat dissipation plate through the elastic force of the spring.

[0023] In a preferred implementation manner of the present utility model, a limiting plate is provided on the connecting rod 6. A rotating rod 8 is rotatably provided on the housing 1. A baffle 9 is provided on the rotating rod 8. And at least part of the baffle 9 extends into the installation groove 4 and abuts against the limiting plate. This is to facilitate rotating the rotating rod so that the rotating rod drives the baffle to displace the limiting plate, causing the latching rod to displace from the heat dissipation plate.

[0024] In a preferred implementation manner of the present utility model, a rotating handle is provided on the rotating rod 8. This is to facilitate rotating the rotating rod.

[0025] In a preferred embodiment of the present utility model, a keyway is provided in the installation groove 4, and a key is provided on the limiting plate. The key is slidably disposed in the keyway, which is to facilitate the limitation of the limiting plate so that it is not prone to position deviation during displacement.

[0026] In a preferred embodiment of the present utility model, a placement cavity 10 is provided on the housing 1, and an aluminum substrate 11 is provided on the placement cavity 10, which is to further dissipate heat from the housing. The preferred embodiments of the present utility model have been described in detail above in conjunction with the accompanying drawings. However, the present utility model is not limited to the specific details in the above embodiments. Within the technical concept of the present utility model, various simple modifications can be made to the technical solution of the present utility model, and these simple modifications all fall within the protection scope of the present utility model.

[0027] In addition, it should be noted that, in the case of no contradiction, the various specific technical features described in the above specific embodiments can be combined in any suitable manner. To avoid unnecessary repetition, the present utility model will not separately describe various possible combination methods.

[0028] In addition, any combination can be made between various different embodiments of the present utility model, as long as it does not violate the idea of the present utility model, it should also be regarded as the content disclosed by the present utility model.

Claims

1. A heat dissipation structure for the back panel of a notebook, characterized in that, The notebook backplane heat dissipation structure includes a housing (1). A groove is provided on the housing (1), and a heat dissipation plate (2) is detachably arranged in the groove. Heat dissipation grooves (3) are provided on the heat dissipation plate (2). An installation groove (4) is provided on the housing (1), and a clamping rod (5) is slidably arranged in the installation groove (4). At least part of the clamping rod (5) can extend into the groove, and sliding the clamping rod (5) can make it engage with the heat dissipation plate (2) to fix the heat dissipation plate (2) in the groove.

2. The notebook backplane heat dissipation structure according to claim 1, characterized in that, A connecting rod (6) is slidably arranged in the installation groove (4). The connecting rod (6) is connected to the clamping rod (5). A spring (7) is arranged in the installation groove (4), and the spring (7) abuts against the connecting rod (6).

3. The notebook backplane heat dissipation structure according to claim 2, wherein A limiting plate is provided on the connecting rod (6). A rotating rod (8) is rotatably arranged on the housing (1). A baffle (9) is provided on the rotating rod (8), and at least part of the baffle (9) extends into the installation groove (4) and abuts against the limiting plate.

4. The notebook backplane heat dissipation structure according to claim 3, wherein, A rotating handle is provided on the rotating rod (8).

5. The notebook backplane heat dissipation structure according to claim 4, characterized in that, A key groove is provided in the installation groove (4). A key bar is provided on the limiting plate, and the key bar is slidably arranged in the key groove.

6. The notebook backplane heat dissipation structure according to claim 5, characterized in that, A placement cavity (10) is provided on the housing (1), and an aluminum substrate (11) is provided on the placement cavity (10).

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