Heat dissipation structure and electronic equipment
By setting the base plate and heat pipe structure between the DDR component and the substrate, the heat dissipation problem of the DDR component is solved, and more efficient heat transfer and heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202422352546.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-25
- Publication Date
- 2025-07-04
- Estimated Expiration
- 2034-09-25
AI Technical Summary
In the prior art, the DDR components on the back of the OAM card of GPUs that are not packaged in HBM process have poor heat dissipation effects, and the metal heat dissipation plate cannot meet the heat dissipation needs.
The bottom plate and the heat pipe structure connected to the bottom plate are adopted, and the heat of the DDR unit is transferred through the bottom plate. The heat absorption section of the heat pipe is connected to the bottom plate and extends in a direction away from the bottom plate to achieve heat transfer and heat dissipation.
It improves the heat dissipation effect of DDR components, meets the heat dissipation needs of DDR components, and enhances the heat dissipation ability.
Smart Images
Figure CN223065717U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the technical field of heat dissipation, and particularly to a heat dissipation structure and an electronic device. Background Art
[0002] For GPUs (Graphics Processing Units) packaged by non-HBM processes, heat dissipation of the DDR components on the back of the OAM card is a great challenge. In order to optimize heat dissipation of the back DDR components, in related technologies, a metal heat dissipation plate (such as a steel plate) is provided between the back of the DDR components and the substrate to dissipate heat from the DDR components. Since the metal heat dissipation member is directly attached to the substrate, the heat dissipation area is limited and cannot meet the heat dissipation requirements of the DDR components. Summary of the Utility Model
[0003] The purpose of the present disclosure is to provide a heat dissipation structure and an electronic device. The heat dissipation structure realizes heat dissipation of the DDR unit through a bottom plate and a heat pipe connected to the bottom plate, improves the heat dissipation effect, and meets the heat dissipation requirements of the DDR components.
[0004] To achieve the above purpose, according to the first aspect of the present disclosure, a heat dissipation structure is provided, including:
[0005] A substrate;
[0006] A DDR component, including a circuit board and a DDR unit mounted on the circuit board, and the circuit board is connected to the substrate through a connector;
[0007] A bottom plate, disposed between the DDR component and the substrate, for transferring heat of the DDR unit; and
[0008] A heat dissipation component, including a heat pipe, an endothermic section of the heat pipe is connected to the bottom plate, and a heat dissipation section of the heat pipe extends laterally from the bottom plate and extends in a direction away from the bottom plate.
[0009] Optionally, the endothermic section is located between the bottom plate and the substrate.
[0010] Optionally, a groove is formed on a side surface of the bottom plate facing the substrate, and the endothermic section is disposed in the groove.
[0011] Optionally, a side surface of the endothermic section facing the substrate is within the groove or flush with a side surface of the bottom plate facing the substrate.
[0012] Optionally, the endothermic section includes a first section extending in a first direction and a second section extending in a second direction that are perpendicular to each other, wherein the first direction is perpendicular to the second direction; and / or
[0013] The heat dissipation section is perpendicular to the plane where the bottom plate is located.
[0014] Optionally, the number of the heat pipes is multiple, and at least part of the heat absorption sections of the heat pipes correspond to the DDR units in the third direction.
[0015] Optionally, the heat dissipation sections of the multiple heat pipes are located on the same side of the bottom plate.
[0016] Optionally, the heat dissipation assembly further includes heat dissipation fins, and the heat dissipation fins are arranged on the heat dissipation sections of the heat pipes.
[0017] Optionally, the number of the heat dissipation fins is multiple, and they are arranged at intervals along the extending direction of the heat dissipation section.
[0018] According to a second aspect of the present disclosure, an electronic device is further provided, and the electronic device includes the above heat dissipation structure.
[0019] Through the above technical solution, that is, the heat dissipation structure of the present disclosure, which includes a substrate, a DDR component, a bottom plate, and a heat dissipation assembly. Among them, the DDR component includes a DDR unit mounted on a circuit board, and the circuit board is connected to the substrate through a connector. The bottom plate is located between the DDR component and the substrate and is used to transfer the heat of the DDR unit. The heat dissipation assembly includes a heat pipe having a heat absorption section and a heat dissipation section. The heat absorption section is connected to the bottom plate, and the heat dissipation section extends out from the side surface of the bottom plate. The heat generated by the DDR unit can be transferred to the bottom plate and absorbed by the heat absorption section of the heat pipe, and then transferred to the outside through the heat dissipation section of the heat pipe to achieve heat dissipation. The heat dissipation structure of the present disclosure realizes the heat dissipation of the DDR unit through the bottom plate and the heat pipe connected to the bottom plate, improves the heat dissipation effect, and meets the heat dissipation requirements of the DDR component.
[0020] Other features and advantages of the present disclosure will be described in detail in the subsequent specific implementation section. Description of the Drawings
[0021] The drawings are used to provide a further understanding of the present disclosure, and constitute a part of the specification. Together with the following specific implementation, they are used to explain the present disclosure, but do not constitute a limitation to the present disclosure. In the drawings:
[0022] Figure 1 is a structural diagram of the heat dissipation structure provided by some embodiments of the present disclosure.
[0023] Figure 2 is a side view of the heat dissipation structure provided by some embodiments of the present disclosure.
[0024] Figure 3 is a lateral cross-sectional view of the heat dissipation structure provided by some embodiments of the present disclosure.
[0025] Figure 4It is an exploded view of a heat dissipation structure provided by some embodiments of the present disclosure.
[0026] Figure 5 It is a bottom view of the heat dissipation structure provided by some embodiments of the present disclosure, in which the substrate is hidden.
[0027] Figure 6 It is a bottom view of the heat dissipation structure provided by some embodiments of the present disclosure, in which the substrate and the heat dissipation component are hidden.
[0028] Description of Reference Numerals
[0029] 100 - Substrate; 200 - DDR Component; 210 - Circuit Board; 220 - DDR Unit; 300 - Bottom Plate; 310 - Groove; 311 - First Groove; 312 - Second Groove; 320 - Via Hole; 400 - Heat Dissipation Component; 410 - Heat Pipe; 411 - Heat Absorption Section; 4111 - First Section; 4112 - Second Section; 412 - Heat Dissipation Section; 413 - Intermediate Section; 420 - Heat Dissipation Fin; 500 - Connector. Detailed Embodiments
[0030] The following describes in detail the specific embodiments of the present disclosure with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only for the purpose of illustration and explanation of the present disclosure, and are not intended to limit the present disclosure.
[0031] In the present disclosure, unless otherwise stated, the orientation terms such as "upper, lower, left, right" generally refer to the upper, lower, left, and right in the corresponding drawings; "inner, outer" refer to the inside and outside of the contour of the corresponding component; "far, near" refer to the corresponding structure or component being far from or close to another structure or component. In the accompanying drawings of the present disclosure, X represents the first direction; Y represents the second direction; Z represents the third direction. In addition, the terms "first", "second", etc. used in the present disclosure are for distinguishing one element from another, and do not have sequentiality and importance. Furthermore, in the following description, when referring to the drawings, unless otherwise explained, the same reference numerals in different drawings represent the same or similar elements. The above definitions are only for the purpose of explaining and illustrating the present disclosure, and should not be construed as a limitation to the present disclosure.
[0032] To achieve the above object, as Figures 1 to 6As shown, according to the first aspect of the present disclosure, a heat dissipation structure is provided. The heat dissipation structure includes a substrate 100, a DDR component 200, a bottom plate 300, and a heat dissipation component 400. The DDR component 200 includes a circuit board 210 and a DDR unit 220 mounted on the circuit board 210. The circuit board 210 is connected to the substrate 100 through a connector 500. The bottom plate 300 is disposed between the DDR component 200 and the substrate 100 and is used to transfer the heat of the DDR unit 220. The heat dissipation component 400 may include a heat pipe 410. The heat absorption section 411 of the heat pipe 410 is connected to the bottom plate 300, and the heat dissipation section 412 of the heat pipe 410 extends laterally from the bottom plate 300 and extends in a direction away from the bottom plate 300.
[0033] Through the above technical solution, that is, the heat dissipation structure of the present disclosure, which includes a substrate 100, a DDR component 200, a bottom plate 300, and a heat dissipation component 400. Among them, the DDR component 200 includes a circuit board 210 and a DDR unit 220 mounted on the circuit board 210, and the circuit board 210 is connected to the substrate 100 through a connector 500. The bottom plate 300 is located between the DDR component 200 and the substrate 100 and is used to transfer the heat of the DDR unit 220. The heat dissipation component 400 includes a heat pipe 410 having a heat absorption section 411 and a heat dissipation section 412. The heat absorption section 411 is connected to the bottom plate 300, and the heat dissipation section 412 extends from the side of the bottom plate 300 and extends. The heat generated by the DDR unit 220 can be transferred to the bottom plate 300 and absorbed by the heat absorption section 411 of the heat pipe 410, and then transferred to the outside through the heat dissipation section 412 of the heat pipe 410 to achieve heat dissipation. The heat dissipation structure of the present disclosure realizes the heat dissipation of the DDR unit 220 through the bottom plate 300 and the heat pipe 410 connected to the bottom plate 300, improves the heat dissipation effect, and meets the heat dissipation requirements of the DDR component 200.
[0034] It should be noted that the heat pipe 410 may be a structural member known in the related art. Among them, the heat pipe 410 may include a heat absorption section 411, an intermediate section 413, and a heat dissipation section 412. The two ends of the intermediate section 413 are respectively connected to the heat absorption section 411 and the heat dissipation section 412, so that the liquid medium in the heat pipe 410 can be vaporized after absorbing heat in the heat absorption section 411, and then reach the heat dissipation section 412 through the intermediate section 413. After condensing and dissipating heat in the heat dissipation section 412, it is converted back into a liquid state and flows back to the heat absorption section 411 again, repeating the above process, thereby realizing the continuous transfer of the heat of the bottom plate 300 to the outside and achieving heat dissipation.
[0035] It can be understood that the heat dissipation section 412 extends from the side of the bottom plate 300 and extends upward or upward and laterally, that is, the horizontal height of the heat dissipation section 412 is greater than that of the heat absorption section 411. When the medium inside the heat pipe 410 condenses, it can automatically flow back to the heat absorption section 411 under the action of gravity, thereby realizing the circulation of the medium.
[0036] The substrate 100 and the DDR component 200 are respectively located on opposite sides of the bottom plate 300 in the third direction. The substrate 100 needs to be electrically connected to the DDR component 200 on the other side of the bottom plate 300. Generally, the connection between the two needs to be realized by a connector 500. In some embodiments, a via 320 for the connector 500 to pass through may be formed on the bottom plate 300. Wherein, the size of the via 320 may be adapted to the size of the connector 500. For example, the via 320 may be one or two. When there are two vias 320, the two vias 320 may be arranged at intervals in the first direction for the two connectors 500 to pass through respectively.
[0037] It should be noted that the bottom plate 300 can be manufactured in any suitable manner. In some embodiments, the bottom plate 300 can be integrally formed. Among them, the bottom plate 300 can be integrally stamped or integrally cast. Under the condition of meeting the use requirements, the manufacturing process should be simplified as much as possible to reduce costs.
[0038] In the related art, the bottom plate 300 is made of ordinary cold-rolled steel plate, and its heat conduction coefficient is only 16.2W / m.k. In order to further improve the heat dissipation capacity. In some embodiments, the bottom plate 300 can be made of aluminum or aluminum alloy. Among them, the bottom plate 300 can be made of die-cast aluminum or aluminum alloy, and its heat conduction coefficient can reach 90W / m.k, which is much better than the heat dissipation part 10 made of cold-rolled steel plate in the related art, and further improves the heat dissipation effect.
[0039] The heat absorption section 411 of the heat pipe 410 can be arranged at any suitable position on the bottom plate 300, such as Figure 3 shown. In some embodiments, the heat absorption section 411 can be located between the bottom plate 300 and the substrate 100. Among them, the heat absorption section 411 can be arranged on the side of the bottom plate 300 facing the substrate 100, that is, the heat absorption section 411 is located on the side of the bottom plate 300 away from the DDR unit 220. Of course, the heat absorption section 411 can also be arranged on the side of the bottom plate 300 facing the DDR unit 220, or the heat absorption section 411 can also be arranged inside the bottom plate 300, as long as it can meet the requirement of dissipating the heat of the DDR unit 220 transferred on the bottom plate 300 to the outside.
[0040] Such as Figure 5 and Figure 6As shown, in some embodiments, a groove 310 is formed on the side surface of the bottom plate 300 facing the substrate 100, and the heat absorption section 411 is disposed in the groove 310. With such an arrangement, it is applicable to the working condition where the space between the substrate 100 and the circuit board 210 of the DDR component 200 is relatively narrow. The heat absorption section 411 of the heat pipe 410 is arranged by making the best use of the dimension in the thickness direction (the third direction) of the bottom plate 300. At the same time, the contact area between the heat pipe 410 and the bottom plate 300 can also be increased, improving the heat transfer efficiency between the bottom plate 300 and the heat pipe 410.
[0041] In order to avoid the heat pipe 410 occupying a large space and also to avoid damage to the heat pipe 410, in some embodiments, the side surface of the heat absorption section 411 facing the substrate 100 is within the groove 310 or flush with the side surface of the bottom plate 300 facing the substrate 100, that is, the height of the heat absorption section 411 is less than or equal to the depth of the groove 310. Among them, the bottom surface of the heat absorption section 411 of the heat pipe 410 is within the groove 310 or flush with the notch of the groove 310, that is, it does not protrude from the side surface of the bottom plate 300 facing the substrate 100. On the one hand, the space occupation in the third direction is saved, and on the other hand, the purpose of protecting the heat absorption section 411 can also be achieved.
[0042] The heat absorption section 411 can be arranged in any shape or structure, such as Figure 5 and Figure 6 As shown, in some embodiments, the heat absorption section 411 includes a first section 4111 extending in the first direction and a second section 4112 extending in the second direction that are perpendicular to each other, where the first direction is perpendicular to the second direction. For example, a first groove 311 extending in the first direction and a second groove 312 extending in the second direction can be provided on the bottom plate 300, and the first groove 311 and the second groove 312 are connected. The first section 4111 is arranged in the first groove 311, and the second section 4112 is arranged in the second groove 312, where the first direction and the second direction can be two mutually perpendicular directions in the horizontal plane. In order to better transfer heat, at least part of the first section 4111 and / or the second section 4112 is arranged corresponding to the DDR unit 220, thereby reducing the heat transfer distance and facilitating the faster absorption and transfer by the heat absorption section 411.
[0043] Such as Figure 3 As shown, in some embodiments, the heat dissipation section 412 is perpendicular to the plane where the bottom plate 300 is located. Among them, the plane where the bottom plate 300 is located can be parallel to the horizontal plane, and the heat dissipation section 412 is arranged in the vertical direction, facilitating the internal medium of the heat pipe 410 to flow back to the heat absorption section 411 after condensing in the heat dissipation section 412. It can be understood that the heat dissipation section 412 can also be arranged obliquely with respect to the plane where the bottom plate 300 is located, that is, when the heat dissipation structure is in the electronic device, the heat dissipation section 412 can be above the heat absorption section 411 to facilitate the medium to flow back.
[0044] As Figure 4 shown, in some embodiments, the number of heat pipes 410 is plural, and at least a part of the heat absorption sections 411 of the heat pipes 410 correspond to the DDR units 220 in the third direction. For example, the number of heat pipes 410 can be two, and the heat absorption sections 411 of the two heat pipes 410 are both arranged on the side of the base plate 300 facing the substrate 100 and are installed inside the groove 310 formed on this side. And at least a part of the heat absorption sections 411 of the heat pipes 410 correspond to the DDR units 220 in the third direction, which is convenient for better absorbing heat and transferring it to the heat dissipation section 412.
[0045] Optionally, the heat dissipation sections 412 of the plural heat pipes 410 are located on the same side of the base plate 300. Among them, for each of the plural heat pipes 410, the heat dissipation section 412 of each heat pipe 410 extends outward in a direction away from the base plate 300. For example, the plural heat dissipation sections 412 can all extend outward from the same side of the base plate 300. Since the substrate 100 and the circuit board 210 of the DDR assembly 200 need to be electrically connected through the connector 500, corresponding vias 320 need to be arranged on the base plate 300 for the connector 500 to pass through. And when the number of connectors 500 is two, the advantage of the above setting is that only the size of one of the connectors 500 needs to be changed to adapt to the passage of the heat pipe 410, reducing the manufacturing cost. For example, when there are two heat pipes 410, the heat dissipation sections 412 of the two heat pipes 410 can both be arranged on one side of the base plate 300 in the first direction, and the heat pipes 410 are respectively arranged on the opposite sides in the second direction of one via 320 on the base plate 300.
[0046] To further improve the heat dissipation effect, in some embodiments, the heat dissipation assembly 400 further includes heat dissipation fins 420, and the heat dissipation fins 420 are arranged on the heat dissipation sections 412 of the heat pipes 410. Among them, the heat dissipation fins 420 can be connected to the heat dissipation sections 412 of the heat pipes 410 by welding, which can increase the heat dissipation area. When the system wind blows towards the heat dissipation sections 412 and the heat dissipation fins 420, the convective heat transfer is strengthened.
[0047] Optionally, the number of heat dissipation fins 420 is plural, and they are arranged at intervals along the extending direction of the heat dissipation section 412. Among them, a plurality of heat dissipation fins 420 can be arranged on the heat dissipation section 412. For example, the heat dissipation fins 420 can be respectively connected to the heat dissipation sections 412 of the plural heat pipes 410, further increasing the heat dissipation area and improving the heat dissipation efficiency. It should be noted that the heat dissipation fins 420 can be of any suitable structure and shape, and specific references can be made to related technologies, which are not specifically limited here.
[0048] According to the second aspect of the present disclosure, an electronic device is further provided. The electronic device includes the above heat dissipation structure. Therefore, the electronic device also has all the advantages of the above heat dissipation structure, which will not be elaborated here one by one.
[0049] It should be noted that the electronic device can be a computer, a server, a service station or other devices that require the above heat dissipation structure, and the present disclosure does not make specific limitations.
[0050] For the heat dissipation structure and the electronic device of the present disclosure, the heat dissipation structure includes a substrate 100, a DDR component 200, a bottom plate 300 and a heat dissipation component 400. Among them, the DDR component 200 includes a DDR unit 220 mounted on a circuit board 210, and the circuit board 210 is connected to the substrate 100 through a connector 500. The bottom plate 300 is located between the DDR component 200 and the substrate 100 and is used to transfer the heat of the DDR unit 220. The heat dissipation component 400 includes a heat pipe 410 having a heat absorption section 411 and a heat dissipation section 412. The heat absorption section 411 is connected to the bottom plate 300, and the heat dissipation section 412 extends from the side surface of the bottom plate 300. The heat generated by the DDR unit 220 can be transferred to the bottom plate 300 and absorbed by the heat absorption section 411 of the heat pipe 410, and then transferred to the outside through the heat dissipation section 412 of the heat pipe 410 to achieve heat dissipation. For the heat dissipation structure of the present disclosure, by providing the heat pipe 410 on the bottom plate 300 and using the heat pipe 410, the heat of the back DDR component 200 is conducted to other places through the heat pipe 410; in addition, by welding heat dissipation fins 420 on the heat pipe 410, on the one hand, the heat dissipation area can be increased, and on the other hand, when there is a system wind blowing, the heat dissipation effect can be further improved. The heat dissipation structure of the present disclosure is used for an electronic device and can solve the heat dissipation problem of the back DDR component 200 compared with the related art.
[0051] The preferred embodiments of the present disclosure have been described in detail above with reference to the accompanying drawings. However, the present disclosure is not limited to the specific details in the above embodiments. Within the scope of the technical concept of the present disclosure, various simple modifications can be made to the technical solutions of the present disclosure, and these simple modifications all fall within the protection scope of the present disclosure.
[0052] In addition, it should be noted that, among the various specific technical features described in the above specific embodiments, they can be combined in any suitable manner without conflict. To avoid unnecessary repetition, the present disclosure will not separately describe various possible combination methods.
[0053] In addition, any combination can be made between various different embodiments of the present disclosure, as long as it does not violate the idea of the present disclosure, it should also be regarded as the content disclosed by the present disclosure.
Claims
1. A heat dissipation structure, characterized in that, Comprising: A substrate; A DDR component, including a circuit board and DDR units mounted on the circuit board, the circuit board being connected to the substrate through a connector; A base plate, disposed between the DDR component and the substrate, for transferring heat of the DDR units; And A heat dissipation component, including a heat pipe, an endothermic section of the heat pipe being connected to the base plate, and a heat dissipation section of the heat pipe extending laterally from the base plate and extending in a direction away from the base plate.
2. The heat dissipation structure according to claim 1, wherein, The endothermic section is located between the base plate and the substrate.
3. The heat dissipation structure according to claim 2, wherein, A groove is formed on a side surface of the base plate facing the substrate, and the endothermic section is disposed in the groove.
4. The heat dissipation structure according to claim 3, characterized in that, A side surface of the endothermic section facing the substrate is within the groove or flush with the side surface of the base plate facing the substrate.
5. The heat dissipation structure according to claim 1, wherein The endothermic section includes a first section extending in a first direction and a second section extending in a second direction that are perpendicular to each other, wherein the first direction is perpendicular to the second direction; and / or The heat dissipation section is perpendicular to the plane where the base plate is located.
6. The heat dissipation structure according to claim 1, wherein, The number of the heat pipes is multiple, and the endothermic sections of at least some of the heat pipes correspond to the DDR units in a third direction.
7. The heat dissipation structure according to claim 6, wherein The heat dissipation sections of the multiple heat pipes are located on the same side of the base plate.
8. The heat dissipation structure according to any one of claims 1-7, characterized in that, The heat dissipation component further includes heat dissipation fins, and the heat dissipation fins are disposed on the heat dissipation sections of the heat pipes.
9. The heat dissipation structure according to claim 8, wherein, The number of the heat dissipation fins is multiple, and they are arranged at intervals along the extending direction of the heat dissipation section.
10. An electronic device, characterized in that, The electronic device includes the heat dissipation structure according to any one of claims 1-9.