Inductor with integrated patch structure

Abstract

The utility model relates to the technical field of electric appliances, in particular to an inductor with an integrated patch structure. Comprising a magnetic core in a rectangular frame shape, a framework is sleeved along the lower edge of the magnetic core, the framework comprises an upper frame body and a lower frame body which are symmetrically spliced, and the framework rotates relative to the magnetic core and is wound with an enameled wire to form a winding; the lower frame body is integrally provided with pins in an injection molding mode, and the pins are in a downward flat shape and are suitable for patch packaging. According to the utility model, by changing the design structure and the technological process, the original skeleton and base separated pin type packaging is changed into integrated patch type packaging, and the pins are arranged on the skeleton through injection molding, so that the raw material of the base is reduced, and the production flow is optimized; single-sided mounting of the circuit board is changed into double-sided mounting, so that the assembly density of the circuit board is improved; the circuit board welding process is changed from wave soldering to reflow soldering, the circuit board welding efficiency is improved, and the welding cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of electrical appliances, and particularly relates to an inductor with an integrated patch structure. Background Art

[0002] In view of the problems of cumbersome processes and redundant materials caused by the separation of the skeleton and the base of existing common-mode inductor products, technicians have made innovations. As shown in the patent CN115985642A, its design integrates the pin patch part and the winding part on the skeleton, optimizes the structure, reduces the need for vias, and reduces the risk of solder ball intrusion. However, this solution still has limitations: it limits the flexibility of double-sided mounting on the circuit board and reduces the assembly density; and it still uses wave soldering and does not fully utilize the more cost-effective reflow soldering, which affects the processing efficiency and cost control. Therefore, further optimization should focus on improving the double-sided mounting ability and introducing a more efficient and economical inductor structure. Content of the Utility Model

[0003] The technical problem to be solved by the utility model is: to overcome the deficiencies of the prior art and provide an inductor with an integrated patch structure.

[0004] The technical solution adopted by the utility model is as follows:

[0005] An inductor with an integrated patch structure includes a magnetic core in the shape of a rectangular frame, a skeleton sleeved along the lower edge of the magnetic core, the skeleton is composed of an upper frame body and a lower frame body which are symmetrically spliced, the skeleton rotates relative to the magnetic core and is wound with enameled wire to form a winding; the lower frame body is integrally injection-molded with pins, and the pins are flat and arranged downward, suitable for patch packaging.

[0006] This technical solution realizes the patch packaging application of the inductor through an inductor with an integrated patch structure of a rectangular frame-shaped magnetic core, a rotatable spliced skeleton, and downward flat pins, which is convenient for the integration and manufacturing of electronic products. Specifically, the design of the flat pins integrally injection-molded on the lower frame body enables the inductor to be directly mounted on the circuit board, and this packaging method is called patch packaging; the pins are arranged at the bottom of the lower frame body and extend downward, enabling the inductor to support double-sided mounting, improving the space utilization rate of the circuit board, and being used to realize the miniaturization and high integration of electronic products; changing the original separate pin insertion packaging of the skeleton base to an integrated patch packaging, injecting the pins on the skeleton, reducing the base raw materials, and optimizing the production process; changing the circuit board soldering process from wave soldering to reflow soldering, improving the soldering efficiency of the circuit board and reducing the soldering cost.

[0007] In addition, the inductor with an integrated patch structure proposed by the utility model according to the above can also have the following additional technical features:

[0008] According to an embodiment of the present utility model, channels for winding enameled wires are provided on both the upper frame body and the lower frame body, and partitions are provided between adjacent channels.

[0009] In this technical solution, channels for winding enameled wires are provided on the upper frame body and the lower frame body, and partitions are provided to separate adjacent channels, so as to improve the accuracy and stability of the winding of the inductor winding, and further optimize the electrical performance of the inductor.

[0010] According to an embodiment of the present utility model, inclined guiding openings are formed on the partitions for guiding the lead wires of the winding to extend downward.

[0011] In this technical solution, inclined guiding openings are formed on the partitions to guide the lead wires of the inductor winding to extend smoothly downward, which is convenient for the subsequent processing and connection of the lead wires, reduces the assembly difficulty and improves the production efficiency.

[0012] According to an embodiment of the present utility model, the lead wires and the pins are fixed by spray welding process.

[0013] In this technical solution, the lead wires and the pins are fixed by spray welding process to achieve a high-strength and low-resistance connection between the lead wires and the inductor body, and ensure the stability of the inductor in a complex working environment.

[0014] According to an embodiment of the present utility model, the pins are arranged at the bottom of the lower frame body, extend downward and are double-sided surface-mounted with the circuit board.

[0015] In this technical solution, the pins are arranged at the bottom of the lower frame body, and are designed to extend downward to meet the requirements of double-sided surface mounting of the circuit board, improving the installation flexibility and space utilization rate of the inductor on the circuit board, and promoting the miniaturization and high integration of electronic products.

[0016] According to an embodiment of the present utility model, the pins and the circuit board are fixed by reflow soldering process.

[0017] In this technical solution, the pins and the circuit board are fixed by reflow soldering process to ensure the firmness of the connection between the inductor and the circuit board, and at the same time utilize the high efficiency of reflow soldering to improve the production efficiency and reduce the production cost.

[0018] Compared with the prior art, the present utility model has the following beneficial effects:

[0019] By changing the design structure and process flow, the original skeleton base separated pin type packaging is changed to an integrated surface mount type packaging. The pins are injection molded on the skeleton, reducing the base raw materials and optimizing the production process. And the circuit board is changed from single-sided mounting to double-sided mounting, improving the assembly density of the circuit board. The circuit board soldering process is changed from wave soldering to reflow soldering, improving the soldering efficiency of the circuit board and reducing the soldering cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a perspective view of the present utility model.

[0021] Figure 2 is a schematic structural view of the skeleton.

[0022] Figure 3 is a bottom view of the present utility model.

[0023] Figure 4 is a front view of the present utility model.

[0024] Figure 5 is a side view of the present utility model.

[0025] In the figure: 1, magnetic core; 2, skeleton; 21, upper frame body; 22, lower frame body; 3, winding; 4, pin. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0026] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0027] Embodiment 1

[0028] As Figures 1 to 5 shown, this embodiment provides an inductor with an integrated surface mount structure, including a magnetic core 1 in the shape of a rectangular frame, a skeleton 2 sleeved along the lower side of the magnetic core 1. The skeleton 2 is composed of a symmetrically spliced upper frame body 21 and a lower frame body 22. The skeleton 2 rotates relative to the magnetic core 1 and is wound with enameled wire to form a winding 3. The lower frame body 22 is integrally injection molded with pins 4. The pins 4 are in a flat shape facing downward and are suitable for surface mount packaging.

[0029] As Figures 1 to 5As shown in the figure, the technical solution realizes the surface mounting encapsulation application of the inductor through an integrated surface mounting structure inductor with a rectangular frame-shaped magnetic core 1, a rotatable splicing skeleton 2, and downward flat pins 4, which facilitates the integration and manufacturing of electronic products. Specifically, the design of the flat pins 4 integrally injection molded on the lower frame 22 enables the inductor to be directly surface mounted on the circuit board, and this encapsulation method is called surface mounting encapsulation; the pins 4 are arranged at the bottom of the lower frame and extend downward, enabling the inductor to support double-sided surface mounting, improving the space utilization rate of the circuit board, and being used to achieve miniaturization and high integration of electronic products; changing the original base separation pin encapsulation of the skeleton 2 to an integrated surface mounting encapsulation, and injecting the pins 4 onto the skeleton 2, reducing the base raw materials and optimizing the production process; changing the circuit board soldering process from wave soldering to reflow soldering, improving the circuit board soldering efficiency and reducing the soldering cost.

[0030] In addition, according to the above-mentioned inductor with an integrated surface mounting structure proposed by the present utility model, it may also have the following additional technical features:

[0031] According to an embodiment of the present utility model, channels for winding enameled wires are provided on both the upper frame 21 and the lower frame 22, and partitions are provided between adjacent channels.

[0032] The technical solution improves the accuracy and stability of the winding 3 winding of the inductor by providing channels for winding enameled wires on the upper frame 21 and the lower frame 22 and arranging partitions to separate adjacent channels, thereby optimizing the electrical performance of the inductor.

[0033] According to an embodiment of the present utility model, inclined guiding openings are provided on the partition for guiding the lead wires of the winding 3 to extend downward.

[0034] The technical solution guides the lead wires of the inductor winding 3 to smoothly extend downward by providing inclined guiding openings on the partition, facilitating the subsequent processing and connection of the lead wires, reducing the assembly difficulty and improving the production efficiency.

[0035] According to an embodiment of the present utility model, the lead wires and the pins 4 are welded and fixed by a jet soldering process.

[0036] The technical solution realizes a high-strength and low-resistance connection between the lead wires and the inductor body by welding and fixing the lead wires and the pins 4 by a jet soldering process, ensuring the stability of the inductor in a complex working environment.

[0037] According to an embodiment of the present utility model, the pins 4 are arranged at the bottom of the lower frame, extend downward and are double-sided surface mounted on the circuit board.

[0038] In this technical solution, the pin 4 is arranged at the bottom of the lower frame body and is designed to extend downward to meet the requirements of double-sided mounting of the circuit board, improving the installation flexibility and space utilization rate of the inductor on the circuit board and promoting the miniaturization and high integration of electronic products.

[0039] According to an embodiment of the present invention, the pin 4 and the circuit board are fixed by using a reflow soldering process.

[0040] In this technical solution, the pin 4 and the circuit board are fixed by using a reflow soldering process, ensuring the firmness of the connection between the inductor and the circuit board. At the same time, the high efficiency of reflow soldering is used to improve the production efficiency and reduce the production cost.

[0041] The usage process of the above embodiment is as follows:

[0042] As Figures 1 to 5 shown, with the lower side of the rectangular frame as the center, the upper frame body 21 and the lower frame body 22 are spliced left and right, and it is ensured that the spliced skeleton 2 can rotate freely along the lower side; the enameled wire is wound in the channel on the skeleton 2 to form a winding 3; the lead wire of the winding 3 is led out from the guiding port of the partition plate, and the lead wire is welded and fixed to the pin 4 through a jet soldering process; since the pin 4 is integrated with the lower frame body 22 through an injection molding process, the cost of the inductor base can be saved. The pin 4 is flat, which is convenient for direct double-sided mounting with the circuit board; in addition, the circuit board can be welded only by reflow soldering, improving the welding efficiency and reducing the welding cost. Therefore, the novel inductor can reduce the volume of electronic equipment and the cost.

[0043] Although the present invention has been described in detail by referring to the accompanying drawings and in combination with the preferred embodiments, the present invention is not limited thereto. Without departing from the spirit and essence of the present invention, those of ordinary skill in the art can make various equivalent modifications or substitutions to the embodiments of the present invention, and these modifications or substitutions should all be within the scope of the present invention. / Any person familiar with the technical field of the present invention can easily think of changes or substitutions within the technical scope disclosed by the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims

1. An inductor with an integrated patch structure, characterized in that, It includes a magnetic core (1) in the shape of a rectangular frame. A skeleton (2) is sleeved along the lower edge of the magnetic core (1). The skeleton (2) consists of an upper frame body (21) and a lower frame body (22) that are symmetrically spliced. The skeleton (2) rotates relative to the magnetic core (1) and an enameled wire is wound around it to form a winding (3). The lower frame body (22) is integrally injection-molded with pins (4). The pins (4) are flat and arranged downward, suitable for surface mounting.

2. The inductor with an integrated patch structure according to claim 1, wherein Channels for winding the enameled wire are provided on both the upper frame body (21) and the lower frame body (22), and partitions are arranged between adjacent channels.

3. The inductor with an integrated patch structure according to claim 2, characterized in that, An inclined guiding opening is formed on the partition for guiding the lead wire of the winding (3) to extend downward.

4. The inductor with an integrated patch structure according to claim 3, wherein The lead wire and the pins (4) are fixed by soldering using the jet soldering process.

5. The inductor with an integrated patch structure according to claim 1, characterized in that, The pins (4) are arranged at the bottom of the lower frame body, extend downward and are double-sided surface-mounted with the circuit board.

6. The inductor with an integrated patch structure according to claim 5, characterized in that, The pins (4) and the circuit board are fixed by using the reflow soldering process.

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