Wafer bonding device and bonding machine
By setting a plurality of separation parts and free pins in the wafer bonding device, and cooperating with the driving unit and the visual unit, the problem of wafer mark point alignment offset is solved, and a higher bonding accuracy and effect is achieved.
Patent Information
- Application Number
- CN202421818634.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-29
- Publication Date
- 2025-07-04
- Estimated Expiration
- 2034-07-29
AI Technical Summary
During the bonding process of existing wafer bonding devices, wafer mark point alignment is prone to offset, resulting in a decrease in bonding accuracy.
A wafer bonding device is designed, a second stage is arranged into a plurality of separation parts, and a gap is formed between adjacent separation parts, and a free pin is added, and the movement of the free pin and the central pin is controlled by the driving unit, and aligned with the vision unit to the wafer marking point, and appropriate pressure is applied to prevent deviation.
It effectively prevents offset due to the influence of surface flatness during wafer bonding, and improves bonding accuracy and effect.
Smart Images
Figure CN223066124U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor manufacturing, and more specifically, to a wafer bonding device and a bonding machine provided with the wafer bonding device. Background Art
[0002] In the existing wafer bonding machine, the wafer bonding device 9 is as Figure 1 shown, and includes a loading stage 91, a stage module 92 and a vision unit; a plurality of adsorption holes 911 are provided on the loading stage 91 so that the loading stage 91 can grasp or release the upper wafer; the stage module 92 includes a downloading stage 921, a central pin 922 and a pin group 923. The central pin 922 is arranged at the center position of the downloading stage 921, and the central pin 922 can slide relative to the downloading stage 921 in the height direction of the bonding device. The central pin 922 can generate suction force to fix the lower wafer on the downloading stage 921; the pin group 923 includes a plurality of side pins 9231, and the plurality of side pins 9231 are distributed around the central pin 922, and each side pin 9231 can slide relative to the downloading stage 921 in the height direction. In addition, each side pin 9231 can also generate suction force so that the plurality of side pins 9231 cooperate with each other to grasp the bonded wafer pair; the vision unit is used to identify and align the marking points of the upper and lower wafers; in the initial state, the top of the central pin 922 is preferably flush with the top of the downloading stage 921, and the top of each side pin 9231 is preferably flush with the top of the downloading stage 921.
[0003] The working process of the wafer bonding device 9 is as follows:
[0004] Before bonding, the loading stage 91 grasps and fixes the upper wafer through a plurality of adsorption holes 911 on itself; the central pin 922 adsorbs the lower wafer so that the lower wafer is fixed on the downloading stage; the vision unit identifies and aligns the marking points of the upper and lower wafers;
[0005] During bonding, the downloading stage and the central pin 922 lift the lower wafer to move towards the upper wafer. When the downloading stage and the central pin 922 lift the lower wafer to move to a specified position, the downloading stage stops moving up; then, the central pin 922 continues to lift the lower wafer to move up until the lower wafer contacts the upper wafer, and applies a certain pressure to the lower wafer to bond the upper and lower wafers;
[0006] After the bonding is completed, the central pin 922 releases the adsorption and fixation of the lower wafer and falls back to the download stage 921 (at this time, the top of the central pin 922 is flush with the top of the download stage 921). Subsequently, the central pin 922 and the download stage 921 together return to the initial position. Then, the wafer pair after bonding is picked up by the pin group 923. Subsequently, the upper loading stage 91 releases the grasping and fixation of the upper wafer. Finally, the pin group 923 transfers the wafer pair to a specified position to wait for the wafer pair after bonding to be transported out of the bonding chamber.
[0007] It can be seen that when bonding the upper and lower wafers, the upper loading stage 91 provides a wedge error compensation (WEC) function, and the stage module 92 mainly provides pressure for the bonding of the upper and lower wafers (providing pressure to the middle part of the wafer through the central pin 922 at the middle of the download stage 921). However, because only the central pin 922 applies pressure to the wafer during the bonding of the upper and lower wafers, and the rest is bonded together by the outward diffusion and van der Waals force after the wafers come into contact, combined with the process problems in wafer preparation (the stress causes a large change in the curvature of the wafer surface), when the upper and lower wafers come into contact and fit together, it will be affected by the overall bending degree of the wafers, resulting in the misalignment of the marking points on the upper and lower wafers. Summary of the Invention
[0008] To solve the above problems, the main object of the present utility model is to provide a wafer bonding device that can prevent the misalignment of the wafer marking points during the bonding process.
[0009] Another object of the present utility model is to provide a bonding machine provided with the above wafer bonding device.
[0010] To achieve the main object of the present utility model, the present utility model provides a wafer bonding device, including a vision unit, a first stage, and a stage module. The first stage is provided with a first adsorption portion. The first stage and the stage module are distributed along a first direction. Among them, the stage module includes a central pin, a second stage, and free pins. The central pin is provided with a second adsorption portion. The second stage includes two or more separation portions. The two or more separation portions are distributed around the central pin, and a gap can be formed between adjacent two separation portions. The central pin can move relative to the separation portion in the first direction. The number of free pins is two or more, and the free pins can move into the gap and move relative to the first stage in the first direction. At least some of the two or more separation portions are provided with a third adsorption portion, and / or the stage module further includes a pin group. The pin group can move relative to the separation portion in the first direction, and the pin group is provided with a fourth adsorption portion.
[0011] As can be seen from the above, by setting the second carrier stage into two or more separate parts, and forming a gap for freely inserting pins between adjacent separate parts; at the same time, adding freely insertable pins, so that when two wafers are bonded, the freely insertable pins can move into the correspondingly arranged gap and move relative to the separate parts in the first direction, enabling the freely insertable pins to cooperate with the central pins to apply appropriate pressure to the middle part of the wafer and each marking point of the wafer, thereby effectively preventing the offset caused by the surface flatness during wafer bonding and ensuring the accuracy of the bonding of the two wafers.
[0012] A further solution is that the separate part is also provided with an avoidance position, the avoidance position penetrates the separate part in the first direction, two or more separate parts can expand or contract relative to the central pin, and the avoidance positions between two or more separate parts enclose an avoidance hole, and the central pin is inserted into the avoidance hole.
[0013] As can be seen from the above, an avoidance position is provided on the separate part, and two or more separate parts can expand or contract relative to the central pin, so that before bonding the wafers, multiple separate parts can contract towards the central pin, enabling the central pin and the second carrier stage to better and more stably hold the lower wafer and move it upwards to the specified position, and preventing the lower wafer from shifting; it also enables the pin group and the second carrier stage to better hold the bonded wafers and move them to the specified position after the wafers are bonded; in addition, before and during wafer bonding, multiple separate parts expand away from the central pin, so as to generate a gap for freely inserting pins between adjacent separate parts, enabling the freely insertable pins to stably cooperate with the central pins to bond the two wafers, ensuring the bonding effect and bonding accuracy of the two wafers.
[0014] An even further solution is that the wafer bonding device further includes a driving unit, the driving unit can drive two or more separate parts to expand or contract relative to the central pin, the driving unit can also drive the central pin to move in the first direction, the driving unit can also drive the pin group to move in the first direction, and the driving unit can also drive the freely insertable pins to move into the correspondingly arranged gap and can drive the freely insertable pins to move in the first direction.
[0015] As can be seen from the above, the driving unit is used to control each separate part, the central pin, each pin group and each freely insertable pin to perform corresponding actions, so as to realize the bonding of two wafers and move the bonded wafer pair to the specified position, etc., thereby ensuring the bonding effect and bonding accuracy of the two wafers.
[0016] A preferred solution is that the driving unit includes a first driving mechanism, and the first driving mechanism can drive two or more separate parts to expand or contract relative to the central pin; or the driving unit includes two or more second driving mechanisms, and two or more second driving mechanisms correspond to two or more separate parts one by one, and the second driving mechanism can drive the correspondingly arranged separate part to move relative to the central pin.
[0017] As can be seen from the above, a single driving mechanism (such as the first driving mechanism) can be used to control the diffusion or retraction of multiple separation parts simultaneously according to the space environment; alternatively, a single second driving mechanism can independently control one separation part, and multiple second driving mechanisms can cooperate with each other to make multiple separation parts diffuse or retract.
[0018] Another preferred solution is that the driving unit further includes a third driving mechanism, and the third driving mechanism can drive the central pin to move in the first direction; the wafer bonding device includes a first pressure sensor, the first pressure sensor is arranged between the central pin and the third driving mechanism, or a first current detection sensor is arranged at the execution end of the third driving mechanism.
[0019] As can be seen from the above, by independently controlling the movement of the central pin through the third driving mechanism, the structure of the driving unit is more reasonable, the structure of a single mechanism is simpler and easier to control; and by setting the first pressure sensor or the first current detection sensor, the pressure applied by the central pin to the wafer can be detected to avoid damage to the wafer caused by excessive pressure or affecting the wafer bonding effect due to too small pressure.
[0020] Another preferred solution is that the driving unit further includes a fourth driving mechanism, and the fourth driving mechanism can drive the pin group to move in the first direction; the number of pin groups is more than two, and the pin groups of more than two are in one-to-one correspondence with more than two separation parts, and the pin group can pass through the through-hole group arranged on the relatively adapted separation part.
[0021] As can be seen from the above, by independently controlling the movement of the central pin through the fourth driving mechanism, the structure of the driving unit is more reasonable, the structure of a single mechanism is simpler and easier to control.
[0022] Another preferred solution is that the driving unit further includes a fifth driving mechanism, and the fifth driving mechanism can drive more than two free pins to move into the correspondingly arranged gap, and the fifth driving mechanism can also drive the correspondingly arranged free pins to move in the first direction; the wafer bonding device includes a second pressure sensor, the second pressure sensor is arranged between the free pin and the fifth driving mechanism, or a second current detection sensor is arranged at the execution end of the fifth driving mechanism; at least some of the more than two free pins are provided with a fifth adsorption part.
[0023] As can be seen from the above, by independently controlling the movement of the center pin through the fifth driving mechanism, the structure of the driving unit is made more reasonable, the structure of a single mechanism is simpler and easier to control; and by setting the second pressure sensor or the second current detection sensor, the pressure exerted by the free pin on the wafer can be detected to avoid damage to the wafer caused by excessive pressure or affecting the wafer bonding effect due to too small pressure; the fifth adsorption part is set on the free pin to adsorb and fix the corresponding wafer during the wafer bonding process, so as to better ensure the relative position between the two bonded wafers.
[0024] A further solution is that the wafer bonding device further includes a negative pressure generating unit, and the first adsorption part, the second adsorption part, the third adsorption part and the fourth adsorption part are connected to the negative pressure generating unit; the vision unit includes more than two vision cameras and a sixth driving mechanism, and the more than two vision cameras correspond to more than two free pins one by one, and the sixth driving mechanism can drive the vision cameras to move between the first stage and the second stage.
[0025] As can be seen from the above, the negative pressure generating unit is used to coordinate the negative pressure generating timing of the first stage, the center pin, the pin group and the free pin, etc., so as to perform corresponding grasping or releasing on the corresponding wafers during the bonding process of two wafers.
[0026] In order to achieve the main purpose of the present invention, the present invention provides a bonding machine, which includes the above-mentioned wafer bonding device.
[0027] As can be seen from the above, by setting the above-mentioned wafer bonding device, the bonding machine effectively improves the bonding accuracy and bonding effect of two wafers.
[0028] A further solution is that the bonding machine further includes a bonding chamber, a heating unit and a temperature sensor. The vision unit, the first stage and the stage module are all arranged in the bonding chamber, the heating unit is arranged in the bonding chamber, and the temperature sensor is arranged in the bonding chamber.
[0029] As can be seen from the above, the bonding chamber can prevent the wafer from being contaminated during the bonding process; the heating unit can ensure the environmental temperature in the bonding chamber to ensure the bonding effect of the wafer; the temperature sensor is used to detect the environmental temperature in the bonding chamber in real time to avoid affecting the bonding effect due to too high or too low environmental temperature in the bonding chamber. Description of the Drawings
[0030] Figure 1 is a schematic structural diagram of an existing wafer bonding device.
[0031] Figure 2 is a schematic structural diagram of an embodiment of the wafer bonding device of the present invention.
[0032] Figure 3It is the first reference diagram of the usage state of the embodiment of the wafer bonding device of the present utility model.
[0033] Figure 4 It is the second reference diagram of the usage state of the embodiment of the wafer bonding device of the present utility model.
[0034] Figure 5 It is the third reference diagram of the usage state of the embodiment of the wafer bonding device of the present utility model.
[0035] Figure 6 It is the fourth reference diagram of the usage state of the embodiment of the wafer bonding device of the present utility model after omitting some components.
[0036] Figure 7 It is the fifth reference diagram of the usage state of the embodiment of the wafer bonding device of the present utility model after omitting some components.
[0037] Figure 8 It is the sixth reference diagram of the usage state of the embodiment of the wafer bonding device of the present utility model after omitting some components.
[0038] Figure 9 It is the seventh reference diagram of the usage state of the embodiment of the wafer bonding device of the present utility model after omitting some components.
[0039] The present utility model will be further described below in conjunction with the accompanying drawings and embodiments. Specific embodiments
[0040] Embodiment of the wafer bonding device
[0041] Refer to Figure 2 , the wafer bonding device 100 includes a vision unit 1, a first carrier 2, a carrier module 3, a driving unit, a negative pressure generating unit, and a control unit. The control unit is electrically connected to the vision unit 1, the driving unit, and the negative pressure generating unit respectively to coordinately control the operation of each functional unit.
[0042] The vision unit 1 is used to identify the position of the alignment mark points for aligning the wafers, record the identified positions of the alignment mark points and synchronously send the data to the control unit, so that the control unit can control the stage module 3 according to the acquired data. Among them, the vision unit 1 includes vision cameras 11 and a sixth driving mechanism 12. The number of vision cameras 11 is more than two, and the number of vision cameras 11 is equal to the number of alignment mark points to be identified on the wafer. The sixth driving mechanism 12 is used to drive each vision camera 11 to move. For example, the sixth driving mechanism 12 can drive each vision camera 11 to move between the first stage 2 and the stage module 3; preferably, the number of the sixth driving mechanisms 12 is equal to the number of vision cameras 11, and more than two sixth driving mechanisms 12 correspond to more than two vision cameras 11 one by one, so that a sixth driving mechanism 12 can independently drive a vision camera 11 to move; in this embodiment, the number of both the vision cameras 11 and the sixth driving mechanisms 12 is two.
[0043] The first stage 2 is provided with a first adsorption part 21. The first adsorption part 21 preferably includes a plurality of first adsorption holes, and the first adsorption holes penetrate through the first stage 2 in the first direction. The first adsorption holes can be connected to the negative pressure generating unit through a first pipeline, so that the negative pressure generating unit can control the generation of negative pressure at the first adsorption holes, so that the first stage 2 can adsorb and fix the first wafer through the first adsorption part 21. Among them, the first adsorption part 21 can also be other adsorption components or adsorption structures.
[0044] The stage module 3 and the first stage are distributed in the first direction. Preferably, the first direction is parallel to the height direction of the wafer bonding device 100; and in this embodiment, the stage module 3 is located below the first stage 2. The stage module 3 includes a central pin 31, a second stage 32, a pin group 33 and a free pin 34. The top of the central pin 31 is provided with a second adsorption part. The second adsorption part preferably includes a plurality of second adsorption holes. The second adsorption part can be connected to the negative pressure generating unit through a second pipeline, so that the negative pressure generating unit can control the generation of negative pressure at the second adsorption part, so that the central pin 31 can adsorb and fix the second wafer through the second adsorption part. Among them, the second adsorption part can also be other adsorption components or adsorption structures.
[0045] The second stage 32 includes more than two separation parts 321, and more than two separation parts 321 are distributed around the central pin 31; among them, the number of separation parts 321 is preferably equal to the number of alignment mark points of the wafer, and the axial direction of the central pin 31 is parallel to the first direction. The separation part 321 is provided with a through-hole group 3211. The through-hole group 3211 preferably includes more than two through-holes, and the through-holes penetrate through the separation part 321 in the first direction. In this embodiment, the through-hole group 3211 includes two through-holes.
[0046] A gap 320 may be formed between two adjacent separation parts 321 (see Figures 5 to 8 ). The central pin 31 can move relative to the separation part 321 in the first direction. Preferably, the separation part 321 is further provided with an avoidance position 3212. The avoidance position 3212 penetrates the separation part 321 in the first direction, and two or more separation parts 321 can expand or contract relative to the central pin 31. When two or more separation parts 321 contract, the avoidance positions 3212 on each separation part 321 enclose an avoidance hole, so that the central pin 31 is inserted into the avoidance hole.
[0047] By providing the avoidance position 3212 on the separation part 321 and enabling two or more separation parts 321 to expand or contract relative to the central pin 31, before bonding the first wafer and the second wafer, multiple separation parts 321 can contract towards the central pin 31 to form a second carrier 32 without a gap 320, so that the second carrier 32 can cooperate with the central pin 31 to better and more stably hold the second wafer and move it towards the first wafer to a specified position, and prevent the second wafer from shifting in position. In addition, when the second wafer moves to the specified position, multiple separation parts 321 can expand away from the central pin 31, so as to generate a gap 320 between adjacent separation parts 321 that can accommodate the free pin 34, so that the free pin 34 can stably cooperate with the central pin 31 to bond the two wafers, ensuring the bonding effect and bonding accuracy of the two wafers.
[0048] The number of the pin groups 33 is preferably two or more; among them, the number of the pin groups 33 is equal to the number of the separation parts 321, and two or more pin groups 33 correspond to two or more separation parts 321 one by one. The pin group 33 includes two or more side pins 331, and the number of the side pins 331 in the pin group 33 is equal to the number of through holes in the through hole group 3211 of the correspondingly arranged separation part 321, so that two or more side pins 331 correspond to two or more through holes of the correspondingly arranged through hole group 3211 one by one. The side pin 331 is inserted into a correspondingly arranged through hole, and the side pin 331 can move relative to the separation part 321 in the first direction. The top of each side pin 331 is provided with a fourth adsorption part. The fourth adsorption part preferably includes two or more third adsorption holes. The fourth adsorption part is connected to the negative pressure generating unit through a third pipeline, so that the negative pressure generating unit can control the generation of negative pressure at the fourth adsorption part, so that the side pin 331 can adsorb and fix the second wafer through the fourth adsorption part. Of course, the fourth adsorption part can also be other adsorption components or adsorption structures. In addition, as another alternative solution, in another embodiment, the setting of the pin group 33 can be cancelled and a third adsorption part can be provided on at least part of the separation parts 321; and as still another alternative solution, in still another embodiment, on the basis of providing the pin group 33, a third adsorption part can be provided on the separation part 321.
[0049] The number of the free pins 34 is more than two, and the number of the free pins 34 is equal to the number of the gaps 320. More than two free pins 34 and more than two gaps 320 correspond one by one, so that a free pin 34 can move into a correspondingly arranged gap 320, thereby enabling the free pin 34 to align with the alignment mark points of the wafer. In addition, the free pin 34 can move in a three-dimensional space and can move relative to the separation part 321 in the first direction. At least the tops of some of the free pins 34 are provided with a fifth adsorption part. The fifth adsorption part preferably includes a plurality of fourth adsorption holes. The fifth adsorption part can be connected to the negative pressure generating unit through a fourth pipeline, so that the negative pressure generating unit can control the generation of negative pressure at the fifth adsorption part, thereby enabling the free pin 34 to adsorb and fix the second wafer through the fifth adsorption part. Among them, the fifth adsorption part can also be other adsorption components or adsorption structures.
[0050] The driving unit is used to drive more than two separation parts 321 to diffuse or converge relative to the central pin 31. The driving unit is also used to drive the central pin 31 to move in the first direction. The driving unit is also used to drive the pin group 33 to move in the first direction. The driving unit is also used to drive the free pin 34 to move into the correspondingly arranged gap 320 and can drive the free pin 34 to move in the first direction. By coordinately controlling the respective separation parts 321, the central pin 31, the respective pin groups 33 and the respective free pins 34 by the driving unit to perform corresponding actions, the bonding of two wafers and the movement of the bonded wafer pair to a designated position are realized, etc., thereby ensuring the bonding effect and bonding accuracy of the two wafers.
[0051] Preferably, in this embodiment, the driving unit includes more than two second driving mechanisms 41. The number of the second driving mechanisms 41 is equal to the number of the separation parts 321. More than two second driving mechanisms 41 and more than two separation parts 321 correspond one by one, so that the second driving mechanism 41 can drive a correspondingly arranged separation part 321 to move relative to the central pin 31. For example, driving the separation part 321 to move relative to the central pin 31 in the radial direction of the central pin 31 and driving the separation part 321 to move in the first direction. Preferably, the second driving mechanism 41 can adopt a multi-axis robot. Of course, as another alternative solution, in other embodiments, one first driving mechanism can be used to replace more than two second driving mechanisms 41. The first driving mechanism can simultaneously drive a plurality of separation parts 321 to converge towards the central pin 31 or drive a plurality of the separation parts 321 to simultaneously diverge relative to the central pin 31, and the first driving mechanism can also simultaneously control a plurality of separation parts 321 to move relative to the central pin 31 in the first direction.
[0052] Secondly, the driving unit further includes a third driving mechanism 42, which is used to drive the center pin 31 to move in the first direction. By independently controlling the movement of the center pin 31 through the third driving mechanism 42, the structure of the driving unit is made more reasonable and optimized, and the structure of a single driving mechanism is made simpler and easier to control. Preferably, a first pressure sensor can be provided between the center pin 31 and the execution end of the third driving mechanism 42 to detect the change in the pressure value between the center pin 31 and the execution end of the third driving mechanism 42; or a first current detection sensor can be provided at the execution end of the third driving mechanism 42 to detect the change in the current value at the execution end of the third driving mechanism 42, so as to monitor the pressure exerted by the center pin 31 on the wafer in real time, so as to avoid damage to the wafer caused by excessive pressure or affect the wafer bonding effect due to too small pressure; further, the driving mechanism can be a telescopic rod, such as an electric telescopic rod, a cylinder or a hydraulic cylinder, etc.
[0053] In addition, the driving unit further includes more than two fourth driving mechanisms 43. The number of the fourth driving mechanisms 43 is equal to the number of the pin groups 33, and more than two fourth driving mechanisms 43 correspond to more than two groups of pin groups 33 one by one, so that the fourth driving mechanism 43 can drive a corresponding set of pin groups 33 to move in the first direction. Preferably, the fourth driving mechanism 43 is installed on the separation part 321, so that the fourth driving mechanism 43 and the pin group 33 can move along with a corresponding separation part 321, so that the side pins 331 of the pin group 33 can be more accurately aligned and inserted into the corresponding through holes, and the fourth driving mechanism 43 can be a telescopic rod.
[0054] Furthermore, the driving unit further includes more than two fifth driving mechanisms 44. The number of the fifth driving mechanisms 44 is equal to the number of the free pins 34, and more than two fifth driving mechanisms 44 correspond to more than two free pins 34 one by one. The fifth driving mechanism 44 is used to drive the corresponding free pin 34 to move in a three-dimensional space, such as moving the free pin 34 into the corresponding gap 320, moving the free pin 34 relative to the second stage 32 in the first direction, moving the free pin 34 in the horizontal direction, etc. Preferably, the fifth driving mechanism 44 can adopt a multi-axis robot. Further, a second pressure sensor is provided between the free pin 34 and the execution end of the fifth driving mechanism 44 to detect the change in the pressure value between the free pin 34 and the execution end of the fifth driving mechanism 44; or a second current detection sensor can be provided at the execution end of the fifth driving mechanism 44 to detect the change in the current value at the execution end of the fifth driving mechanism 44, so as to avoid damage to the wafer caused by excessive pressure or affect the wafer bonding effect due to too small pressure.
[0055] Next, the working process of the wafer bonding device 100 will be briefly described:
[0056] Combination Figure 3 Initially, each separation part 321 is retracted relative to the center pin 31, and there is no gap 320 or a small gap 320 between two adjacent separation parts 321. When two wafers need to be bonded, the first stage 2 adsorbs and fixes the first wafer on the lower part of the first stage 2, and the center pin 31 adsorbs and fixes the second wafer on the upper part of the second stage 32. Then, the visual unit 1 controls each visual camera 11 to move between the first stage 2 and the second stage 32 to identify the position of the alignment mark point of the wafer, record and send the position data of the identified alignment mark point to the control unit.
[0057] Next, combine Figure 4 , each second driving mechanism 41 (or first driving mechanism) drives each separation part 321 to move toward the first wafer in the first direction, and at the same time, the third driving mechanism 42 drives the center pin 31 to move toward the first wafer in the first direction in synchronization with each separation part 321. When each separation part 321 and the center pin 31 move to a specified position, each second driving mechanism 41 (or first driving mechanism) drives each separation part 321 to stop moving, and at the same time, the third driving mechanism 42 drives the center pin 31 to stop moving in synchronization with each separation part 321.
[0058] Next, the third driving mechanism 42 drives the central pin 31 to absorb the second wafer and slowly move it closer to the first wafer; Figure 5 , each second driving mechanism 41 (or first driving mechanism) drives each separation portion 321 to spread relative to the central pin 31, so that two adjacent separation portions 321 form a gap 320 that can accommodate the free pin 34. Subsequently, each fifth driving mechanism 44 drives each free pin 34 to move into the gap 320, and moves and aligns the free pin 34 to the corresponding alignment mark point (that is, the free pin 34 is located directly below the corresponding unmarked point).
[0059] Next, combine Figure 6 , each fifth driving mechanism 44 drives each free pin 34 to move and contact the second wafer and adsorb and fix the second wafer; then, the center pin 31 releases the adsorption and fixation of the second wafer. Next, each fifth driving mechanism 44 drives each free pin 34 to move and push the second wafer to move to contact the first wafer, and applies a set pressure to the second wafer.
[0060] Next, combine Figure 7, the third driving mechanism 42 drives the central pin 31 to move towards the second wafer and applies a set pressure to the wafer with the central pin 31. Through the cooperation of the free pin 34 and the central pin 31, when the two wafers deform without contact, it is first ensured that the positions of the alignment mark points of the two wafers do not shift, and it is guaranteed that the wafers at the center can contact each other, thereby completing the bonding between the two wafers.
[0061] Bond Figure 8 , when the bonding of the two wafers is completed, the free pin 34 releases the adsorption and fixation of the second wafer, and each fifth driving mechanism 44 drives each free pin 34 to move to the initial position (refer to the position of the free pin 34 in Figure 8 . Of course, this position is only one of the multiple possible positions, rather than the only one).
[0062] Next, bond Figure 9 , the third driving mechanism 42 drives the central pin 31 back to the designated position; and, each second driving mechanism 41 (or the first driving mechanism) drives each separating part 321 to close towards the central pin 31, so that there is no gap 320 or a small gap 320 between adjacent two separating parts 321. Subsequently, each fourth driving mechanism 43 drives the side pins 331 of each pin group 33 to move towards the second wafer so that the side pins 331 protrude from the top of the separating part 321.
[0063] Next, each second driving mechanism 41 drives each separating part 321 to move towards the second wafer to drive each fourth driving mechanism 43 and each pin group 33 to move to the second wafer, and the side pins 331 of the pin group 33 adsorb and fix the second wafer. Subsequently, the first stage 2 releases the adsorption and fixation of the first wafer.
[0064] Next, each second driving mechanism 41 drives each separating part 321 to move to the initial position (refer to the position of each separating part 321 in Figure 2 . Of course, this position is only one of the multiple possible positions, rather than the only one), and at the same time each fourth driving mechanism 43 drives each pin group 33 to move to the initial position (refer to the position of each pin group 33 in Figure 2 . Of course, this position is only one of the multiple possible positions, rather than the only one), to wait for the subsequent device to transport the bonded wafer pair out of the bonding chamber.
[0065] In summary, by setting the second stage 32 into two or more separate parts 321 and forming a gap 320 for accommodating the free insertion pins 34 between adjacent separate parts 321; at the same time, adding free insertion pins 34 so that when two wafers are bonded, the free insertion pins 34 can move into the correspondingly arranged gap 320 and move relative to the separate parts 321 in the first direction, enabling the free insertion pins 34 to cooperate with the central insertion pins 31 to apply appropriate pressure to the middle part of the wafer and each marking point of the wafer, thereby effectively preventing the deviation caused by the surface flatness during wafer bonding and ensuring the accuracy of the bonding of the two wafers.
[0066] Bonding machine embodiment
[0067] The bonding machine includes the wafer bonding device embodiment described in the above wafer bonding device embodiment; preferably, the bonding machine further includes a bonding chamber, a heating unit and a temperature sensor. The vision unit, the first stage and the stage module are all arranged in the bonding chamber to avoid contamination of the wafer during the bonding process; the heating unit is arranged in the bonding chamber, and the heating unit can ensure the ambient temperature in the bonding chamber to ensure the bonding effect of the wafer; the temperature sensor is arranged in the bonding chamber, and the temperature sensor is used to detect the ambient temperature in the bonding chamber in real time to avoid affecting the bonding effect due to too high or too low ambient temperature in the bonding chamber. By setting the above wafer bonding device, the bonding machine effectively improves the accuracy and bonding effect of the bonding of two wafers.
[0068] Finally, it should be emphasized that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.
Claims
1. A wafer bonding device, comprising a vision unit, a first stage and a stage module, wherein a first adsorption portion is provided on the first stage, and the first stage and the stage module are distributed along a first direction, and is characterized in that: The stage module includes a central pin, a second stage and free pins, the central pin is provided with a second adsorption portion, the second stage includes two or more separating portions, the two or more separating portions are distributed around the central pin, a gap can be formed between two adjacent separating portions, the central pin can move relative to the separating portions in the first direction, the number of the free pins is two or more, and the free pins can move into the gap and move relative to the first stage in the first direction; At least some of the two or more separating portions are provided with a third adsorption portion, and / or The stage module further includes a pin group, the pin group can move relative to the separating portions in the first direction, and the pin group is provided with a fourth adsorption portion.
2. The wafer bonding device according to claim 1, wherein: The separating portion is further provided with an avoidance position, the avoidance position penetrates the separating portion in the first direction, the two or more separating portions can expand or contract relative to the central pin, and an avoidance hole can be formed by the avoidance positions of the two or more separating portions, and the central pin is inserted into the avoidance hole.
3. The wafer bonding device according to claim 2, wherein: The wafer bonding device further includes a driving unit, the driving unit can drive the two or more separating portions to expand or contract relative to the central pin, the driving unit can also drive the central pin to move in the first direction, the driving unit can also drive the pin group to move in the first direction, and the driving unit can also drive the free pins to move into the correspondingly arranged gap and can drive the free pins to move in the first direction.
4. The wafer bonding device according to claim 3, wherein: The driving unit includes a first driving mechanism, and the first driving mechanism can drive the two or more separating portions to expand or contract relative to the central pin.
5. The wafer bonding device according to claim 3, wherein: The driving unit further includes a third driving mechanism, and the third driving mechanism can drive the central pin to move in the first direction; The wafer bonding device includes a first pressure sensor, and the first pressure sensor is arranged between the central pin and the third driving mechanism, or A first current detection sensor is provided at the execution end of the third driving mechanism.
6. The wafer bonding device according to claim 3, wherein: The driving unit further includes a fourth driving mechanism, and the fourth driving mechanism can drive the pin group to move in the first direction; The number of the pin groups is two or more, the two or more pin groups correspond to the two or more separating portions one by one, and the pin groups can pass through a through-hole group provided on the correspondingly arranged separating portions.
7. The wafer bonding device according to claim 3, wherein: The driving unit further includes a fifth driving mechanism, which can drive more than two of the free pins to move into the correspondingly arranged gaps, and the fifth driving mechanism can also drive the correspondingly arranged free pins to move in the first direction; The wafer bonding device includes a second pressure sensor, which is arranged between the free pin and the fifth driving mechanism, or A second current detection sensor is provided at the execution end of the fifth driving mechanism; At least some of the more than two free pins are provided with a fifth adsorption portion.
8. The wafer bonding device according to any one of claims 1 to 7, characterized in that: The wafer bonding device further includes a negative pressure generating unit, and the first adsorption portion, the second adsorption portion, the third adsorption portion and the fourth adsorption portion are connected to the negative pressure generating unit; The vision unit includes more than two vision cameras and a sixth driving mechanism. More than two of the vision cameras correspond to more than two of the free pins one by one, and the sixth driving mechanism can drive the vision cameras to move between the first stage and the second stage.
9. Bonding machine, characterized in that, It includes the wafer bonding device according to any one of claims 1 to 8.
10. The bonding machine according to claim 9, characterized in that: The bonding machine further includes: A bonding chamber, in which the vision unit, the first stage and the stage module are all arranged; A heating unit, which is arranged in the bonding chamber; A temperature sensor, which is arranged in the bonding chamber.