Flexible die-cutting copper-based circuit terminal

Abstract

The utility model relates to the technical field of line terminals, and particularly discloses a flexible die-cutting copper-based line terminal, which comprises a terminal body. The terminal body is provided with an ultrasonic bonding pad, a terminal bonding pad, a PI breakpoint, a fusing fuse and two profiling positioning holes. The profiling positioning hole is used for being matched with a positioning column on an FCC welding jig and plays an auxiliary welding positioning role. A first tin penetrating hole is formed in the middle of the terminal body; the terminal bonding pad is provided with a second tin penetrating hole, and the two profiling positioning holes are located between the ultrasonic bonding pad and the terminal bonding pad; the flexible die-cutting copper-based circuit terminal can effectively avoid the conditions of subsequent laser welding processing failure and low yield caused by inaccurate positioning of the main board and the auxiliary board and inaccurate positioning of the FFC patch during FCC (fluid catalytic cracking) welding.

Description

Technical Field

[0001] The utility model relates to the technical field of flexible printed circuit boards, and particularly relates to a flexible die-cut copper-based circuit terminal. Background Art

[0002] At present, new energy power batteries are developing rapidly. In order to reduce costs, FCC appears as a substitute for the wire harness and FPC in CCS.

[0003] However, the welding process flow of conventional FCC is as follows: first, automatic tin spotting operation is carried out at the PI window of the FFC product through a tin spotting machine device, then automatic patch copper terminal operation is carried out through a mounter device, then glue dispensing operation is carried out on the non-pad position of the copper terminal through a glue dispensing machine device to fix the copper terminal and avoid deviation, and finally tin soldering operation is carried out on the tin soldering point of the terminal through a soldering machine device; in this process, the accuracy of the main and auxiliary board positioning requires a high precision of the mounter, and the copper terminal after patching is prone to deviation or warping, resulting in poor soldering and having a great impact on the product quality. At the same time, since the soldering part of the conventional FCC is located in the non-visible area between the main and auxiliary pads, the conventional AOI device is not convenient for detecting the soldering effect, which also has a great impact on the judgment of the product yield.

[0004] Therefore, it is necessary to improve the existing terminals to solve the above problems. Summary of the Utility Model

[0005] The utility model provides a flexible die-cut copper-based circuit terminal, which can effectively prevent the subsequent laser welding processing failure and low yield rate caused by the inaccurate positioning of the main and auxiliary boards and the inaccurate FFC patch positioning during FCC welding. And it reduces the tin-penetrating holes, adopts waist-shaped holes, increases the visible area of the solder joints, reduces the difficulty of product quality detection and improves the accuracy, and further reduces the cost.

[0006] To solve the above problems, the utility model adopts the following technical solutions:

[0007] A flexible die-cut copper-based circuit terminal includes a terminal body.

[0008] The terminal body has ultrasonic pads, terminal pads, PI breakpoints, fusing fuses and two profiling positioning holes.

[0009] The profiling positioning holes are used to match with the positioning posts on the FCC welding fixture and play an auxiliary welding positioning role.

[0010] The two profiling positioning holes are located between the ultrasonic pads and the terminal pads.

[0011] A first tin-penetrating hole is arranged in the middle of the terminal body.

[0012] A second solder penetration hole is provided on the terminal pad.

[0013] In the flexible die-cut copper-based circuit terminal provided by at least one embodiment of the present disclosure, the terminal body includes a PI upper film layer, a PI lower film layer, and a rolled copper foil layer.

[0014] The rolled copper foil layer is located between the PI upper film layer and the PI lower film layer, and both the PI upper film layer and the PI lower film layer are adhered to the rolled copper foil layer.

[0015] In the flexible die-cut copper-based circuit terminal provided by at least one embodiment of the present disclosure, the fuse is located between the two profiling positioning holes.

[0016] In the flexible die-cut copper-based circuit terminal provided by at least one embodiment of the present disclosure, at least a part of the rolled copper foil layer is not covered by the PI upper film layer and the PI lower film layer to form the ultrasonic pad.

[0017] In the flexible die-cut copper-based circuit terminal provided by at least one embodiment of the present disclosure, first openings are provided on both the PI upper film layer and the PI lower film layer to expose a part of the rolled copper foil layer to form the terminal pad.

[0018] A second opening is provided on the rolled copper foil layer, and the second opening communicates with the first opening.

[0019] In the flexible die-cut copper-based circuit terminal provided by at least one embodiment of the present disclosure, the fuse and the rolled copper foil layer are integrally provided.

[0020] The fuse is located between the ultrasonic pad and the terminal pad.

[0021] In the flexible die-cut copper-based circuit terminal provided by at least one embodiment of the present disclosure, there are two PI breakpoints, and the two PI breakpoints are respectively located on both sides of the terminal body, and the two PI breakpoints are respectively located on the sides of the two profiling positioning holes.

[0022] In the flexible die-cut copper-based circuit terminal provided by at least one embodiment of the present disclosure, a plurality of terminal pads are provided.

[0023] The plurality of terminal pads are located on the same vertical plane and are arranged horizontally in parallel.

[0024] In the flexible die-cut copper-based circuit terminal provided by at least one embodiment of the present disclosure, the second solder penetration hole is an oval hole.

[0025] The oval hole has an opening, and the opening communicates with the second opening.

[0026] In the flexible die-cut copper-based circuit terminal provided by at least one embodiment of the present disclosure, each of the terminal pads has two of the second tin-penetrating holes.

[0027] The two second tin-penetrating holes on the same terminal pad are symmetrically distributed.

[0028] The beneficial effects of the present utility model are as follows:

[0029] Compared with traditional copper terminals, on both sides of each terminal pad, there are provided areas for exposing the FFC tinned copper wire pads and having a rectangular-like opening for carrying solder paste. During welding, by using the capillary phenomenon of solder paste melting, the solder paste can penetrate between the main and auxiliary pads and cover the entire pad to complete the welding work.

[0030] By being equipped with two profiling positioning holes, it is possible to achieve the process of first pasting the copper terminal and then dotting tin for welding, effectively preventing the subsequent laser welding process from failing and the low yield rate caused by inaccurate positioning of the main and auxiliary plates and inaccurate FFC chip placement during FCC welding.

[0031] Different from the traditional FCC where tin is applied in the non-visible area between the main and auxiliary pads, the new type of terminal applies tin on the surfaces of the main and auxiliary pads, greatly increasing the visible welding area, which is beneficial for using AOI or AVI equipment to judge the welding quality and further improving the accuracy of the product yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0033] Figure 1 It is a view of a flexible die-cut copper-based circuit terminal of the present utility model.

[0034] Figure 2 It is a partial structural schematic diagram of a flexible die-cut copper-based circuit terminal of the present utility model.

[0035] Figure 3 It is a sectional view of a flexible die-cut copper-based circuit terminal of the present utility model.

[0036] Figure 4 It is a view of the rolled copper foil layer.

[0037] In the figure:

[0038] 10. Terminal body; 11. Ultrasonic pad; 12. Terminal pad; 13. PI breakpoint; 14. Fusing fuse; 15. Profiled positioning hole; 16. First tin-penetrating hole; 17. Second tin-penetrating hole; 101. PI upper film layer; 102. PI lower film layer; 103. Rolled copper foil layer; 104. First adhesive layer; 105. Second adhesive layer; 106. First opening window; 107. Second opening window; 108. Hollowed-out groove. Detailed implementation mode

[0039] Next, the technical solutions in the embodiments will be clearly and completely described in conjunction with the accompanying drawings in the embodiments. Obviously, the described embodiments are only a part of the embodiments, rather than all the embodiments.

[0040] Embodiment

[0041] As Figures 1 to 4 shown, a flexible die-cut copper-based circuit terminal includes a terminal body 10, and the terminal body 10 is in a long strip shape.

[0042] Specifically, the terminal body 10 has an ultrasonic pad 11, a terminal pad 12, a PI breakpoint 13, a fusing fuse 14, and two profiled positioning holes 15.

[0043] Specifically, the profiled positioning holes 15 are used to match the positioning posts on the FCC welding fixture and play an auxiliary role in welding positioning; the two profiled positioning holes 15 are located between the ultrasonic pad 11 and the terminal pad 12; the two profiled positioning holes 15 are both arranged in an L shape.

[0044] Specifically, a first tin-penetrating hole 16 is arranged in the middle of the terminal body 10; a second tin-penetrating hole 17 is arranged on the terminal pad 12.

[0045] In this embodiment, the terminal body 10 includes a PI upper film layer 101, a PI lower film layer 102, and a rolled copper foil layer 103. The PI upper film layer 101 and the rolled copper foil layer 103 are adhered through a first adhesive layer 104, and the PI lower film layer 102 and the rolled copper foil layer 103 are adhered through a second adhesive layer 105.

[0046] The first tin-penetrating hole 16 is a through hole and is set to penetrate through the rolled copper foil layer 103.

[0047] Exemplarily, both the first adhesive layer 104 and the second adhesive layer 105 adopt hot-pressing glue.

[0048] Furthermore, the fusing fuse 14 is located between the two profiled positioning holes 15; the fusing fuse 14 and the rolled copper foil layer 103 are integrally arranged; the fusing fuse 14 is located between the ultrasonic pad 11 and the terminal pad 12.

[0049] Further, one end of the rolled copper foil layer 103 is not covered by the PI upper film layer 101, the PI lower film layer 102, the first adhesive layer 104, and the second adhesive layer 105, thereby forming an ultrasonic pad 11.

[0050] Both sides of the ultrasonic pad are copper-exposed. After the FCC finished product is made, ultrasonic welding operation is performed on the corresponding ultrasonic pads through an ultrasonic welding device to form a weld with the bar piece, so as to make a CCS finished product.

[0051] Further, first openings 106 are provided on both the PI upper film layer 101 and the PI lower film layer 102 to expose a part of the rolled copper foil layer 103, thereby forming terminal pads 12, and the terminal pads are not covered by the first adhesive layer 104 and the second adhesive layer 105.

[0052] Further, a second opening 107 is provided on the rolled copper foil layer 103. The second opening 107 communicates with the first opening 106, and the size of the second opening 107 is smaller than that of the first opening 106. Both the first opening 106 and the second opening 107 are rectangular openings.

[0053] Further, the second solder-penetrating hole 17 is a waist-shaped hole; the waist-shaped hole is open, and the opening communicates with the second opening 107. Each terminal pad 12 has two second solder-penetrating holes 17, and the two second solder-penetrating holes 17 on the same terminal pad 12 are symmetrically distributed.

[0054] The number of terminal pads 12 is the same as the number of tin-plated copper wire rows of the corresponding FFC bare board. Each terminal pad 12 has 1 solder-penetrating hole and 2 waist-shaped holes. Both sides of the terminal pad are copper-exposed for welding with the tin-plated copper wires exposed by the PI opening on the FFC product.

[0055] During use, the tin-plated copper wires exposed by the PI opening of the FFC are the main board pads, and the corresponding terminal pads are the sub-board pads. Solder paste is applied to the waist-shaped holes on both sides of the main board pads and the FFC tin-plated copper wires exposed by the copper foil opening. During welding, the solder paste melts at high temperature and exhibits capillary action, drilling into the space between the main and sub-board pads from the joint between the copper foil and the FFC tin-plated copper wires and covering the entire pad to complete the welding work.

[0056] In this embodiment, two PI breakpoints 13 are provided. The two PI breakpoints 13 are respectively located on both sides of the terminal body 10, and the two PI breakpoints 13 are respectively located on the sides of the two profiling positioning holes 15.

[0057] In this embodiment, a plurality of terminal pads 12 are provided. The plurality of terminal pads 12 are located on the same vertical plane and are arranged horizontally and in parallel.

[0058] In this embodiment, two hollow grooves 108 are formed in the rolled copper foil layer 103, and there is a gap between the two hollow grooves, so that the remaining rolled copper foil between the two hollow grooves forms a wavy fuse 14; two profiling positioning holes are respectively formed at the positions of the two hollow grooves. Therefore, there is no rolled copper foil layer 103 at the profiling positioning hole 15.

[0059] Although the embodiments of the present application have been shown and described above, the protection scope of the present utility model is not limited thereto. Any changes or substitutions that can be thought of without creative efforts should be covered within the protection scope of the present utility model; unless explicitly stated, any element, action or instruction used in this article should not be construed as critical or necessary.

Claims

1. A flexible die-cut copper-based circuit terminal, comprising: Terminal body; The terminal body has an ultrasonic pad, a terminal pad, a PI break point, a fusing fuse, and two profiling positioning holes; It is characterized in that the profiling positioning holes are used to match the positioning posts on the FCC welding fixture and play an auxiliary role in welding positioning; The two profiling positioning holes are located between the ultrasonic pad and the terminal pad; A first solder penetration hole is provided in the middle of the terminal body; A second solder penetration hole is provided on the terminal pad.

2. The flexible die-cut copper-based circuit terminal according to claim 1, wherein The terminal body includes a PI upper film layer, a PI lower film layer, and a rolled copper foil layer; The rolled copper foil layer is located between the PI upper film layer and the PI lower film layer, and both the PI upper film layer and the PI lower film layer are adhered to the rolled copper foil layer.

3. A flexible die-cut copper-based circuit terminal according to claim 2, wherein, The fusing fuse is located between the two profiling positioning holes.

4. A flexible die-cut copper-based circuit terminal according to claim 2, wherein, At least part of the rolled copper foil layer is not covered by the PI upper film layer and the PI lower film layer to form the ultrasonic pad; 5. A flexible die-cut copper-based circuit terminal according to claim 2, characterized in that, First openings are provided on both the PI upper film layer and the PI lower film layer to expose a part of the rolled copper foil layer to form the terminal pad; A second opening is provided on the rolled copper foil layer, and the second opening communicates with the first opening.

6. A flexible die-cut copper-based circuit terminal according to claim 3, wherein, The fusing fuse and the rolled copper foil layer are integrally provided; The fusing fuse is located between the ultrasonic pad and the terminal pad.

7. A flexible die-cut copper-based circuit terminal according to claim 1, characterized in that, There are two PI break points, and the two PI break points are respectively located on both sides of the terminal body, and the two PI break points are respectively located on the sides of the two profiling positioning holes.

8. A flexible die-cut copper-based circuit terminal according to claim 5, wherein, A plurality of the terminal pads are provided; The plurality of terminal pads are located on the same vertical plane and are arranged horizontally and parallelly.

9. A flexible die-cut copper-based circuit terminal according to claim 5, characterized in that, The second solder penetration hole is a waist-shaped hole; The waist-shaped hole has an opening, and the opening communicates with the second opening.

10. A flexible die-cut copper-based circuit terminal according to claim 9, characterized in that, Each terminal pad has two of the second solder penetration holes; The two second solder penetration holes on the same terminal pad are symmetrically distributed.

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