Light emitter, distance sensor and electronic equipment
By using substrates, wafer modules and electrostatic protection modules in the light emitter, the arrangement and spacing of wafer luminous holes is solved, and the screen dark spots and cost increase caused by excessive light energy of the under-screen distance sensor is solved, which improves the screen display effect.
Patent Information
- Application Number
- CN202422092895.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-27
- Publication Date
- 2025-07-04
- Estimated Expiration
- 2034-08-27
AI Technical Summary
Due to the low screen transmittance, the under-screen distance sensor requires high power to emit light to be accepted by the receiver. However, when the power is too high, it will cause dark spots on the screen, affecting the display effect, and using multiple light transmitters increases the cost.
A light emitter including a substrate, a wafer module and an electrostatic protection module is adopted. The wafer module includes multiple wafer light emitting holes arranged at intervals. The electrostatic protection module is electrically connected to it. By adjusting the arrangement of the wafer main body and the spacing distance, the light spot formation is controlled to ensure that the intensity of the light radiation is within the threshold range of the display energy of the screen.
This avoids the problem of screen dark spots and multiple light emitters increasing costs caused by individual wafer luminous holes, improves the screen display effect, and realizes the function of distance sensors.
Smart Images
Figure CN223066628U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of electronic technologies, and particularly to a light emitter, a distance sensor, and an electronic device. Background Art
[0002] The distance sensor used in an electronic device can measure the distance by detecting the light intensity. For a conventional under-screen distance sensor, both the emission and reception are below the screen. The receiver can determine whether an object is approaching the screen based on the intensity of the emission signal from the emitter by using the light transmissivity of the screen.
[0003] However, due to the low transmittance of the screen itself, the under-screen light sensor requires a sufficiently large emission power to be received by the receiver. If the power is too large, dark spots will appear on the screen due to the intrinsic absorption of light by the screen, which will further affect the display effect. Summary of the Utility Model
[0004] The present disclosure provides a light emitter, a distance sensor, and an electronic device to solve the related technical problems.
[0005] The first aspect of the present disclosure provides a light emitter applied to a distance sensor. The light emitter includes:
[0006] A substrate;
[0007] A wafer module disposed on the substrate. The wafer module includes a plurality of wafer light-emitting holes which are spaced apart.
[0008] An electrostatic protection module disposed on the substrate. The wafer module is electrically connected to the electrostatic protection module.
[0009] Optionally, the wafer module includes a plurality of wafer bodies, and each wafer body is provided with a wafer light-emitting hole.
[0010] Optionally, the electrostatic protection module includes a Zener diode, and each wafer body is electrically connected to the Zener diode;
[0011] Or, the electrostatic protection module includes a plurality of Zener diodes, and the wafer bodies are electrically connected to the Zener diodes in a one-to-one correspondence.
[0012] Optionally, the center-to-center distance of the wafer bodies is greater than or equal to 200 um and less than or equal to 800 um.
[0013] Optionally, the wafer module includes a single wafer body, and a plurality of the wafer light-emitting holes are disposed on the same wafer body.
[0014] Optionally, the electrostatic protection module includes a Zener diode, and the wafer body is electrically connected to the Zener diode.
[0015] Optionally, the spacing distance between the centers of the wafer light-emitting holes is greater than or equal to 160 um and less than or equal to 250 um.
[0016] Optionally, the plurality of wafer light-emitting holes are arranged in one of a linear arrangement, an L-shaped arrangement, and a square arrangement.
[0017] According to a second aspect of the present disclosure, a distance sensor is provided. The distance sensor includes a light receiver and any one of the light emitters described in the first aspect.
[0018] According to a third aspect of the present disclosure, an electronic device is provided. The electronic device includes any one of the light emitters described in the first aspect; or, any one of the distance sensors described in the second aspect.
[0019] The technical solutions provided by the present disclosure can at least achieve the following beneficial effects:
[0020] The wafer module of the light emitter of the present disclosure includes a plurality of wafer light-emitting holes. The light spots formed by the plurality of wafer light-emitting holes arranged at intervals on the screen can be multiple semi-overlapping or non-overlapping light-emitting peaks. The light radiation intensity of the wafer light-emitting holes is within the range of the energy threshold affecting the screen display, avoiding the screen dark spots caused by excessive light energy of a single wafer light-emitting hole and the cost increase caused by using multiple light emitters, and helping to improve the screen display effect when the distance sensor function is realized.
[0021] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit this specification. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] The accompanying drawings herein are incorporated into the specification and constitute a part of this specification, showing embodiments consistent with this specification and used together with the specification to explain the principles of this specification.
[0023] Figure 1 is a schematic structural diagram of a light emitter in an exemplary embodiment of the present disclosure;
[0024] Figure 2 is a schematic structural diagram of a light emitter in another exemplary embodiment of the present disclosure;
[0025] Figure 3 is a schematic structural diagram of a distance sensor cooperating with a screen in an exemplary embodiment of the present disclosure. DETAILED DESCRIPTION
[0026] Exemplary embodiments will be described in detail herein, and examples thereof are shown in the accompanying drawings. When the following description refers to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this specification. On the contrary, they are merely examples of devices and methods consistent with some aspects of this specification as detailed in the appended claims.
[0027] The terms used in this disclosure are for the purpose of describing particular embodiments only and are not intended to limit the disclosure. Unless otherwise defined, the technical terms or scientific terms used in this specification shall have the ordinary meanings as understood by those of ordinary skill in the art to which this disclosure pertains. The terms "first", "second", and similar terms used in this specification and the appended claims do not denote any order, quantity, or importance, but are only used to distinguish different components. Similarly, terms such as "a" or "an" do not denote a limitation of quantity, but rather denote the presence of at least one. "Plurality" or "several" means two or more. Unless otherwise indicated, terms such as "front", "rear", "lower", and / or "upper" are for convenience of description only and are not limited to a particular position or spatial orientation. The terms "comprising" or "including" and similar terms mean that the elements or items appearing before "comprising" or "including" encompass the elements or items listed after "comprising" or "including" and their equivalents, and do not exclude other elements or items. The terms "connected" or "coupled" and similar terms are not limited to physical or mechanical connections, and may include electrical connections, whether direct or indirect.
[0028] The terms used in this specification are for the purpose of describing particular embodiments only and are not intended to limit the disclosure. The singular forms "a", "the", and "said" used in this specification and the appended claims are also intended to include the plural forms unless the context clearly dictates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
[0029] The distance sensor used in an electronic device can measure distance by detecting light intensity. For a conventional under-screen distance sensor, both the transmitter and the receiver are located under the screen. The receiver can determine whether an object is approaching the screen based on the intensity of the transmitted signal from the transmitter by utilizing the light transmissivity of the screen. However, due to the relatively low transmittance of the screen itself, the under-screen light sensor requires a sufficiently large power emission to be received by the receiver. If the power is too large, it will cause dark spots on the screen due to the intrinsic absorption of light by the screen, thereby affecting the display effect.
[0030] The present disclosure provides a light emitter for use in a distance sensor. Figure 1is a schematic structural diagram of a light emitter in an exemplary embodiment of the present disclosure. As Figure 1 shown, the light emitter 1 includes a substrate 13, a wafer module 11, and an electrostatic protection module 12. The wafer module 11 is disposed on the substrate 13. The wafer module 11 includes a plurality of wafer light-emitting holes 112, and the wafer light-emitting holes 112 are spaced apart. The electrostatic protection module 12 is disposed on the substrate 13, and the wafer module 11 is electrically connected to the electrostatic protection module 12.
[0031] Since the wafer module 11 of the light emitter 1 includes a plurality of wafer light-emitting holes 112, the light spots formed by the plurality of spaced-apart wafer light-emitting holes 112 on the screen 3 can be a plurality of semi-overlapping or non-overlapping light-emitting peaks. The light radiation intensity of the wafer light-emitting holes 112 is within the range of the display energy threshold that affects the screen 3, avoiding the dark spots on the screen 3 caused by excessive light energy of a single wafer light-emitting hole 112 and the cost increase caused by using a plurality of light emitters 1, which helps to improve the display effect of the screen 3 when the distance sensor function is realized.
[0032] In some embodiments, the wafer module 11 includes a plurality of wafer bodies 111, and each wafer body 111 is provided with a wafer light-emitting hole 112. By providing a plurality of wafer bodies 111 for the wafer module 11 to obtain a plurality of wafer light-emitting holes 112 by using the wafer light-emitting holes 112 on each wafer body 111, it helps to reduce the process difficulty and can also adjust the distribution of the wafer light-emitting holes 112 by adjusting the setting positions of the wafer bodies 111, improving the layout flexibility of the wafer light-emitting holes 112.
[0033] The above-mentioned wafer bodies 111 can be arranged in a linear arrangement, an L-shaped arrangement, a square arrangement, or other arrangements. Each wafer body 111 can be provided with a wafer light-emitting hole 112 to obtain a linear arrangement, an L-shaped arrangement, a square arrangement, or other arrangement effects for the wafer light-emitting holes 112. Among them, the wafer bodies 111 can be circular, rectangular, polygonal, or other shapes, and the arrangement manner of the wafer bodies 111 can be based on the distribution manner of the centers of the wafer bodies 111. For example Figure 1 shown, the wafer module 11 can include four wafer bodies 111 arranged in a linear arrangement, and each wafer body 111 is provided with a wafer light-emitting hole 112.
[0034] In the above embodiment, the electrostatic protection module 12 can include a Zener diode, and each wafer body 111 is electrically connected to the Zener diode. Since the positive and negative poles of each wafer body 111 are the same, that is, common cathode and common anode, one Zener diode can be used for electrostatic protection.
[0035] When the electrostatic protection module 12 includes multiple Zener diodes, the multiple wafer bodies 111 can be connected to the Zener diodes in a common cathode, common anode, or separate manner. For example, the electrostatic protection module 12 includes multiple Zener diodes, and the wafer bodies 111 are conductively connected to the Zener diodes one by one.
[0036] In the above embodiment, the spacing distance at the center of the wafer body 111 can be greater than or equal to 200 um and less than or equal to 800 um. Through the above spacing, the space occupied by the wafer body 111 can be controlled, and the light spots formed by the multiple spaced wafer light-emitting holes 112 on the screen 3 can be multiple semi-overlapping or non-overlapping light-emitting peaks, and the light radiation intensity of the wafer light-emitting holes 112 is within the range of the energy threshold affecting the display of the screen 3.
[0037] It should be noted that there can be one or multiple wafer light-emitting holes 112 provided on each wafer body 111, based on the wafer light-emitting holes 112 obtained after the arrangement of the wafer bodies 111 showing an expected morphological distribution. The wafer light-emitting holes 112 can be provided in the central region or the edge region of the wafer body 111, and the present disclosure does not limit this.
[0038] In some other embodiments, as Figure 2 shown, the wafer module 11 can include one wafer body 111, and multiple wafer light-emitting holes 112 are provided on the same wafer body 111. Providing multiple wafer light-emitting holes 112 on the same wafer body 111 can reduce the space occupied by providing multiple wafer bodies 111 and improve space utilization.
[0039] In the above embodiment, the electrostatic protection module 12 includes one Zener diode, and the wafer body 111 is conductively connected to the Zener diode. Since multiple wafer light-emitting holes 112 are provided on the same wafer body 111, electrostatic protection can be achieved through one Zener diode.
[0040] The above wafer light-emitting holes 112 can be arranged in a linear arrangement, an L-shaped arrangement, a square-shaped arrangement, or other arrangement manners. Among them, the wafer body 111 can be circular, rectangular, polygonal, or other shapes, and the arrangement manner of the wafer light-emitting holes 112 can be based on the distribution manner of the centers of the wafer light-emitting holes 112.
[0041] In some embodiments, the spacing distance between the centers of the wafer light-emitting holes 112 can be greater than or equal to 160 um and less than or equal to 250 um. Through the above spacing, the space occupied by the wafer body 111 can be controlled, and the light spots formed by the multiple spaced wafer light-emitting holes 112 on the screen 3 can be multiple semi-overlapping or non-overlapping light-emitting peaks, and the light radiation intensity of the wafer light-emitting holes 112 is within the range of the energy threshold affecting the display of the screen 3.
[0042] It should be noted that the above light emitter 1 can be a VCSEL (Vertical-Cavity Surface-Emitting Laser), or other types of light emitters 1. In addition, the central wavelength of the wafer module 11 can be less than 1130 nm to reduce the interference of the light spot formed by the wafer light-emitting holes 112 on the screen 3 with the screen 3.
[0043] The present disclosure further provides a distance sensor, as Figure 3 shown, the distance sensor includes a light receiver 21 and the above light emitter 1.
[0044] Since the wafer module 11 of the light emitter 1 includes a plurality of wafer light-emitting holes 112, the light spots formed by the plurality of wafer light-emitting holes 112 arranged at intervals on the screen 3 can be a plurality of semi-overlapping or non-overlapping light-emitting peaks. The light radiation intensity of the wafer light-emitting holes 112 is within the range of the energy threshold affecting the display of the screen 3, avoiding the dark spots on the screen 3 caused by excessive light energy of a single wafer light-emitting hole 112 and the increased cost caused by using a plurality of light emitters 1, and helping to improve the display effect of the screen 3 when the function of the distance sensor is realized.
[0045] Furthermore, the light receiver 21 and the light emitter 1 can be arranged on the circuit board 23, and a partition wall 22 can be provided between the light receiver 21 and the light emitter 1 to avoid mutual interference between the emitted light and the received light.
[0046] The present disclosure further provides an electronic device, and the electronic device includes the above light emitter 1 or the above distance sensor.
[0047] In some embodiments, the electronic device may include a screen 3, and the distance sensor is arranged below the screen 3. Since the wafer module 11 of the light emitter 1 includes a plurality of wafer light-emitting holes 112, the light spots formed by the plurality of wafer light-emitting holes 112 arranged at intervals on the screen 3 can be a plurality of semi-overlapping or non-overlapping light-emitting peaks. The light radiation intensity of the wafer light-emitting holes 112 is within the range of the energy threshold affecting the display of the screen 3, avoiding the dark spots on the screen 3 caused by excessive light energy of a single wafer light-emitting hole 112 and the increased cost caused by using a plurality of light emitters 1, and helping to improve the display effect of the screen 3 when the function of the distance sensor is realized.
[0048] Among them, the above screen 3 can be an OLED (Organic Light-Emitting Diode) screen 3.
[0049] It should be noted that the above electronic device can be a mobile phone, a tablet computer, a wearable device, a vehicle-mounted terminal, a medical terminal, etc.
[0050] The above are only the preferred embodiments of the present disclosure, and do not impose any form of limitation on the present disclosure. Although the present disclosure has been disclosed above in the preferred embodiments, it is not intended to limit the present disclosure. Any person skilled in the art can make some changes or modifications to equivalent embodiments with equivalent changes within the scope of the technical solutions of the present disclosure. However, as long as it does not depart from the content of the technical solutions of the present disclosure, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present disclosure still fall within the scope of the technical solutions of the present disclosure.
Claims
1. A light emitter, characterized in that, Applied to a distance sensor; the light emitter includes: A substrate; A wafer module disposed on the substrate; the wafer module includes a plurality of wafer light-emitting holes, and the wafer light-emitting holes are spaced apart; An electrostatic protection module disposed on the substrate; the wafer module is electrically connected to the electrostatic protection module.
2. The light emitter according to claim 1, characterized in that, The wafer module includes a plurality of wafer bodies, and each wafer body is provided with a wafer light-emitting hole.
3. The light emitter according to claim 2, characterized in that, The electrostatic protection module includes a Zener diode, and each wafer body is electrically connected to the Zener diode; Or, the electrostatic protection module includes a plurality of Zener diodes, and the wafer bodies are electrically connected to the Zener diodes in a one-to-one correspondence.
4. The light emitter according to claim 2, characterized in that, The center-to-center distance of the wafer bodies is greater than or equal to 200 um and less than or equal to 800 um.
5. The light emitter according to claim 1, characterized in that, The wafer module includes one wafer body, and a plurality of the wafer light-emitting holes are disposed on the same wafer body.
6. The light emitter according to claim 5, characterized in that, The electrostatic protection module includes a Zener diode, and the wafer body is electrically connected to the Zener diode.
7. The light emitter according to claim 5, characterized in that, The center-to-center distance of the wafer light-emitting holes is greater than or equal to 160 um and less than or equal to 250 um.
8. The light emitter according to claim 1, characterized in that, The plurality of wafer light-emitting holes are arranged in one of a linear arrangement, an L-shaped arrangement, and a square arrangement.
9. A distance sensor, characterized in that, Including a light receiver and the light emitter according to any one of claims 1-8.
10. An electronic device, characterized in that, Including the light emitter according to any one of claims 1-8; or, the distance sensor according to claim 9.