Vacuum glue filling stator device

Abstract

The utility model discloses a vacuum glue filling stator device, which belongs to the technical field of vacuum glue filling, and comprises a sealing support mechanism, the sealing support mechanism comprises a vacuum assembly, a glue filling mold is arranged above the vacuum assembly, the vacuum assembly comprises a sealing frame, the sealing frame is sealed and wrapped at four corners of the glue filling mold through adjustment, and the glue filling mold is arranged above the sealing frame. A hollow pump is arranged in the sealing frame and corresponds to the glue pouring mold. The sealing frame is matched with the hollow pump to vacuumize the interior of the glue pouring mold, bubbles generated during glue curing are reduced, a semiconductor chilling plate is made to cool (or heat) the mold top cover according to the situation, the curing speed is adjusted, and the four corners of the mold top cover can be tightly wrapped with the sealing frame through a first electric push rod, a double-piston air cylinder and a second electric push rod; and vacuumizing is carried out through the hollow pump, so that bubbles generated during curing are reduced, the generation of the bubbles is reduced, and the curing efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the field of vacuum potting, and particularly to a vacuum potting stator device. Background Art

[0002] Compared with the structure of a servo motor plus a ball screw, a linear motor has more advantages in terms of moving speed and positioning accuracy. At the same time, due to less mechanical contact, the linear motor has high responsiveness and long-term stability.

[0003] The manufacturing difficulty of the secondary of a permanent magnet linear motor comes from the following aspects: the working environment inside the machine is filled with water vapor, which has an erosive effect on the secondary; the secondary components must be thin enough to compress the overall installation height; the air gap between the secondary and the primary components is usually small, meaning it is difficult to arrange other mechanisms above the permanent magnet to protect the permanent magnet; the use of the general potting and encapsulation process is not convenient for achieving a bubble-free colloid. At the same time, the generation of bubbles is related to too fast curing speed, high heat release temperature, large shrinkage rate of the glue during curing, excessive addition of solvents and plasticizers in the glue, and the curing speed is related to temperature. How to invent a vacuum potting stator device to improve these problems has become an urgent problem for those skilled in the art. Summary of the Utility Model

[0004] To make up for the above deficiencies, the utility model provides a vacuum potting stator device, aiming to improve the problem that the potting and encapsulation process is not convenient for achieving a bubble-free colloid.

[0005] The utility model is implemented as follows: a vacuum potting stator device includes a potting mold for potting the stator, and also includes

[0006] a sealing and supporting mechanism. The sealing and supporting mechanism includes a vacuum assembly. The potting mold is placed above the vacuum assembly. The vacuum assembly includes a sealing frame. The sealing frame is adjusted to hermetically wrap the four corners of the potting mold. A hollow pump is arranged inside the sealing frame, and the hollow pump is correspondingly arranged with the potting mold;

[0007] The auxiliary mechanism includes an auxiliary vacuum assembly. The auxiliary vacuum assembly is installed above the vacuum assembly. The auxiliary vacuum assembly includes a pressing plate. The pressing plate is located on both sides of the potting mold, and the pressing plate clamps the top of the potting mold.

[0008] In a preferred technical solution of the utility model, the potting mold includes a mold top cover, a potting glue layer, a magnetic conductive mounting plate, a permanent magnet, and a mold base. The mold base is respectively provided with a magnetic conductive mounting plate. The surface of the magnetic conductive mounting plate is equally divided and provided with a plurality of permanent magnets. A potting glue layer is arranged above the magnetic conductive mounting plate. The permanent magnet is located inside the potting glue layer. The mold top cover is arranged on the top of the potting glue layer.

[0009] In a preferred technical solution of the present utility model, the mold top cover, the potting glue layer, the magnetic conductive mounting plate, the permanent magnet and the mold base are closely attached by bolts, etc., and return channels are provided at the four corners of the mold top cover.

[0010] In a preferred technical solution of the present utility model, the vacuum assembly further includes a support plate, support legs are respectively fixedly connected to the four corners of the bottom of the support plate, multiple groups of sealing frames are provided, each group of sealing frames has 4 and are respectively located on both sides of the support plate, and the potting molds are respectively arranged corresponding to the multiple groups of sealing frames.

[0011] In a preferred technical solution of the present utility model, extension plates are respectively arranged on both sides of the support plate in a limit sliding manner, a first electric push rod is fixedly connected to one side of each extension plate, the first electric push rod is fixedly installed at the bottom of the support plate, adjustment plates are connected in a limit sliding manner above both sides of one end of each extension plate, a double piston cylinder is connected between the two adjustment plates, second electric push rods are respectively fixedly connected above the two adjustment plates, and the sealing frames are fixedly installed on the second electric push rods.

[0012] In a preferred technical solution of the present utility model, a limit bump is fixedly connected above one end of each extension plate close to the support plate, a slide rail matching the limit bump is correspondingly provided at the bottom of the support plate, a slide rail is provided above the other end of each extension plate at the bottom of the adjustment plate, and corresponding limit bumps are fixedly connected to the bottom of the adjustment plates.

[0013] In a preferred technical solution of the present utility model, the sealing frames are arranged on three sides, a sealing gasket is provided at the corresponding position of the inner wall of the sealing frame and the return channel of the mold top cover, the hollow pump is located inside the sealing frame, and the output end of the hollow pump penetrates through the sealing frame at the sealing gasket of the sealing frame.

[0014] In a preferred technical solution of the present utility model, the auxiliary vacuum assembly further includes a top plate, connection columns are fixedly connected to the four corners of the bottom of the top plate, the bottom ends of the connection columns are respectively fixedly connected to the top of the support plate, multiple groups of extrusion plates are provided, each group of extrusion plates has two, the two extrusion plates are respectively located on both sides of the mold top cover, and a semiconductor refrigerating sheet is arranged between the two extrusion plates.

[0015] In a preferred technical solution of the present utility model, transverse strip-shaped through holes are opened on both sides of the top of the top plate, the extrusion plate is horizontally arranged below the top plate, an adjustment frame is arranged above the extrusion plate, the adjustment frame is located above the top plate, and the two ends of the adjustment frame and the extrusion plate are respectively fixedly connected with a third electric push rod, and the two ends of one side of the adjustment frame are fixedly connected with a fourth electric push rod, the fourth electric push rod is fixedly installed on the positioning plate, and the positioning plate is installed at the strip-shaped through hole of the top plate.

[0016] In a preferred technical solution of the utility model, a non-slip pad is fixedly connected to one side of the extrusion plate close to the mold top cover, and the semiconductor cooling plate is fixedly installed on the bottom of the top plate.

[0017] The beneficial effects of the utility model are as follows: the utility model obtains a vacuum glue pouring stator device through the above design. When in use, the fourth electric push rod and the third electric push rod cooperate to lift the extrusion plate and fit it with the semiconductor refrigeration plate, so that the semiconductor refrigeration plate can cool (or heat) the mold top cover according to the situation. The cooling prevents the curing speed from being too fast. At the same time, adjusting the temperature can assist the curing speed. At the same time, controlling the first electric push rod, the double-piston cylinder and the second electric push rod can make the sealing frame tightly wrapped around the four corners of the mold top cover, and vacuuming is performed through a hollow pump to reduce the generation of bubbles during curing, reduce the generation of bubbles, and improve the curing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solution of the implementation mode of the utility model, the drawings required for use in the implementation mode will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 It is a structural schematic diagram provided by an embodiment of the utility model;

[0020] Figure 2 A schematic diagram of the structure of the glue-filling mold provided by the embodiment of the utility model;

[0021] Figure 3 A schematic diagram of the exploded structure of the auxiliary mechanism provided in the embodiment of the utility model;

[0022] Figure 4 A schematic diagram of the exploded structure of the sealing support mechanism provided in the embodiment of the utility model;

[0023] Figure 5 This is a partial structural schematic diagram of the sealing support mechanism provided in an embodiment of the utility model.

[0024] In the figure: 110 - potting mold; 111 - mold top cover; 112 - potting glue layer; 113 - magnetic conductive mounting plate; 114 - permanent magnet; 115 - mold base; 200 - sealing and supporting mechanism; 210 - vacuum assembly; 211 - support plate; 212 - support leg; 213 - extension plate; 214 - sealing frame; 215 - first electric push rod; 216 - adjusting plate; 217 - second electric push rod; 218 - double piston cylinder; 219 - hollow pump; 300 - auxiliary mechanism; 310 - auxiliary vacuum assembly; 311 - top plate; 312 - connecting column; 313 - semiconductor refrigeration sheet; 314 - adjusting frame; 315 - third electric push rod; 316 - positioning plate; 317 - fourth electric push rod; 318 - extrusion plate. Detailed implementation mode

[0025] To make the purpose, technical solution and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present utility model.

[0026] Please refer to Figure 1 and Figure 2 , the present utility model provides a technical solution: a vacuum potting stator device, including a potting mold 110 for potting the stator, and also including

[0027] a sealing and supporting mechanism 200. The sealing and supporting mechanism 200 includes a vacuum assembly 210. The potting mold 110 is placed above the vacuum assembly 210. The vacuum assembly 210 includes a sealing frame 214. The sealing frame 214 is adjusted to hermetically wrap the four corners of the potting mold 110. A hollow pump 219 is arranged inside the sealing frame 214. The hollow pump 219 is correspondingly arranged with the potting mold 110. The sealing frame 214 cooperates with the hollow pump 219 to evacuate the inside of the potting mold 110, reducing the generation of bubbles during the curing of the glue.

[0028] The auxiliary mechanism 300 includes an auxiliary vacuum assembly 310. The auxiliary vacuum assembly 310 is installed above the vacuum assembly 210. The auxiliary vacuum assembly 310 includes an extrusion plate 318. The extrusion plate 318 is located on both sides of the potting mold 110. The extrusion plate 318 clamps the top of the potting mold 110. The extrusion plate 318 drives the potting mold 110 to change the temperature at the top of the potting mold 110 and adjust the curing speed.

[0029] Please refer to Figure 2, the potting mold 110 includes a mold top cover 111, a potting glue layer 112, a magnetic conductive mounting plate 113, a permanent magnet 114, and a mold base 115. The magnetic conductive mounting plate 113 is respectively arranged on the mold base 115. A plurality of permanent magnets 114 are equally divided and arranged on the surface of the magnetic conductive mounting plate 113. A potting glue layer 112 is arranged above the magnetic conductive mounting plate 113. The permanent magnet 114 is located inside the potting glue layer 112. A mold top cover 111 is arranged on the top of the potting glue layer 112. The mold top cover 111, the potting glue layer 112, the magnetic conductive mounting plate 113, the permanent magnet 114, and the mold base 115 are closely fitted through bolts, etc. The four corners of the mold top cover 111 are provided with reflux grooves.

[0030] Please refer to Figure 4 and Figure 5 , the vacuum assembly 210 further includes a support plate 211. The four corners of the bottom of the support plate 211 are respectively fixedly connected with support legs 212. A plurality of groups of sealing frames 214 are provided. Each group of sealing frames 214 has 4 and is respectively located on both sides of the support plate 211. The potting mold 110 is correspondingly arranged with a plurality of groups of sealing frames 214. Extension plates 213 are respectively arranged on both sides of the support plate 211 in a limited sliding manner. A first electric push rod 215 is fixedly connected to one side of the extension plate 213. The first electric push rod 215 is fixedly installed at the bottom of the support plate 211. The two sides above one end of the extension plate 213 are connected with an adjusting plate 216 in a limited sliding manner. A double piston cylinder 218 is connected between the two adjusting plates 216. Second electric push rods 217 are respectively fixedly connected above the two adjusting plates 216. The sealing frame 214 is fixedly installed on the second electric push rod 217. The first electric push rod 215 drives the extension plate 213 to expand and contract towards both sides of the support plate 211. At the same time, the double piston cylinder 218 is used to drive the sealing frame 214 to expand and contract, and the second electric push rod 217 is used to drive the sealing frame 214 to adjust up and down, and cooperate with an infrared sensor, etc. to make the sealing frame 214 correspond to the mold top cover 111.

[0031] A limiting convex block is fixedly connected above one end of the extension plate 213 close to the support plate 211. A slide rail matching the limiting convex block is correspondingly opened at the bottom of the support plate 211. Slide rails are opened at the bottom above the other end of the extension plate 213 and at the bottom of the adjusting plate 216. A corresponding limiting convex block is fixedly connected to the bottom of the adjusting plate 216. The sealing frame 214 is arranged on three sides. A sealing gasket is arranged at the corresponding position of the inner wall of the sealing frame 214 and the reflux groove of the mold top cover 111. A hollow pump 219 is located inside the sealing frame 214. The output end of the hollow pump 219 penetrates through the sealing frame 214 and is located at the sealing gasket of the sealing frame 214. The hollow pump 219 is used to evacuate the inside of the mold top cover 111.

[0032] Please refer to Figure 2 and Figure 3The auxiliary vacuum assembly 310 also includes a top plate 311, and the four bottom corners of the top plate 311 are fixedly connected with connecting columns 312, and the bottoms of the connecting columns 312 are respectively fixedly connected to the top of the support plate 211. There are multiple groups of extrusion plates 318, and each group of extrusion plates 318 is provided with two extrusion plates 318. The two extrusion plates 318 are respectively located on both sides of the mold top cover 111, and a semiconductor cooling plate 313 is arranged between the two extrusion plates 318.

[0033] The semiconductor refrigeration chip 313 has a heat sink installed on one side and a cooling system installed on the other side. The flatness of the installation surface should not be greater than 0.03mm, and burrs and dirt should be removed. The refrigeration chip should have good contact with the heat sink and the cooling block, and the contact surface should be coated with a thin layer of thermal conductive silicone grease. When fixing the refrigeration chip, the force on the refrigeration chip should be even, and care should be taken not to overload it to prevent the ceramic chip from cracking. Correct use conditions: The DC power supply voltage should not exceed the rated voltage, and the power supply ripple factor should be less than 10%. The current should not exceed the rated current of the component. The reverse voltage should not be applied instantaneously when the refrigeration chip is working (it must be after 5 minutes). Water should not enter the refrigeration chip. The humidity around the refrigeration chip should not exceed 80%.

[0034] Semiconductor refrigerator drive circuit design: The working state of semiconductor refrigerator is determined by the direction and size of the current flowing through the semiconductor (the direction of the current determines cooling or heating, and the size of the current determines the degree and effect of cooling or heating). In order for the semiconductor refrigerator to automatically perform constant temperature control, its drive circuit and control circuit must be designed. PID control system is a relatively high-precision technology that can be used to control the current of semiconductor refrigerator to achieve high-precision temperature control effect.

[0035] Horizontal strip through holes are opened on both sides of the top of the top plate 311, the extrusion plate 318 is horizontally arranged below the top plate 311, and an adjustment frame 314 is arranged above the extrusion plate 318, and the adjustment frame 314 is located above the top plate 311, and the two ends of the adjustment frame 314 and the extrusion plate 318 are respectively fixedly connected with the third electric push rod 315, and the two ends of one side of the adjustment frame 314 are fixedly connected with the fourth electric push rod 317, and the fourth electric push rod 317 is fixedly installed on the positioning plate 316, and the positioning plate 316 is installed at the strip through hole of the top plate 311. A non-slip pad is fixedly connected to one side of the extrusion plate 318 close to the mold top cover 111, and the semiconductor refrigeration plate 313 is fixedly installed on the bottom of the top plate 311. The fourth electric push rod 317 drives the adjustment frame 314 to move so that the extrusion plate 318 can clamp the mold top cover 111 conveniently. At the same time, the third electric push rod 315 is used to drive the mold top cover 111 to move up and down, so that the mold top cover 111 is in close contact with the semiconductor refrigeration plate 313, and the temperature of the semiconductor refrigeration plate 313 is adjusted. After the temperature adjustment is completed, it needs to be moved down to cover the glue and cooperate with the vacuum component 210 to evacuate the air to reduce the generation of bubbles and improve the curing efficiency.

[0036] Working principle: When pouring glue between the inside of the potting glue layer 112 and the magnetic conductive mounting plate 113, the fourth electric push rod 317 and the third electric push rod 315 cooperate to lift the extrusion plate 318 and make it fit with the semiconductor refrigeration sheet 313, so that the semiconductor refrigeration sheet 313 cools (or heats) the mold top cover 111, which is adjusted according to the situation. Cooling can prevent the curing speed from being too fast, and at the same time, adjusting the temperature can assist the curing speed. At the same time, controlling the first electric push rod 215, the double piston cylinder 218 and the second electric push rod 217 can make the sealing frame 214 tightly wrap around the four corners of the mold top cover 111, and vacuum pumping is carried out through the hollow pump 219 to reduce the generation of bubbles during curing.

[0037] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A vacuum potting stator device, comprising a potting mold for potting a stator, characterized in that, Further included is a sealing and supporting mechanism, the sealing and supporting mechanism including a vacuum assembly, with the potting mold placed above the vacuum assembly. The vacuum assembly includes a sealing frame, which is adjusted to hermetically wrap around the four corners of the potting mold. A hollow pump is arranged inside the sealing frame and is correspondingly arranged with the potting mold; an auxiliary mechanism including an auxiliary vacuum assembly, the auxiliary vacuum assembly being installed above the vacuum assembly. The auxiliary vacuum assembly includes a pressing plate, the pressing plate being located on both sides of the potting mold, and the pressing plate clamps the top of the potting mold.

2. The vacuum potting stator device according to claim 1, characterized in that: The potting mold includes a mold top cover, a potting glue layer, a magnetic conductive mounting plate, a permanent magnet, and a mold base. The magnetic conductive mounting plate is respectively arranged on the mold base, and a plurality of permanent magnets are equally divided and arranged on the surface of the magnetic conductive mounting plate. A potting glue layer is arranged above the magnetic conductive mounting plate, the permanent magnet is located inside the potting glue layer, and a mold top cover is arranged on the top of the potting glue layer.

3. A vacuum potting stator device as claimed in claim 2, wherein: The mold top cover, the potting glue layer, the magnetic conductive mounting plate, the permanent magnet, and the mold base are tightly fitted through bolts, and reflux grooves are formed at the four corners of the mold top cover.

4. The vacuum potting stator device according to claim 3, characterized in that: The vacuum assembly further includes a support plate, and support legs are respectively fixedly connected to the four corners of the bottom of the support plate. There are multiple groups of the sealing frames, and each group of the sealing frames has 4 and is respectively located on both sides of the support plate, and the potting mold is correspondingly arranged with multiple groups of the sealing frames.

5. The vacuum potting stator device according to claim 4, characterized in that: Extension plates are respectively arranged on both sides of the support plate in a limited sliding manner. One side of the extension plate is fixedly connected with a first electric push rod, and the first electric push rod is fixedly installed at the bottom of the support plate. The two sides above one end of the extension plate are connected with adjusting plates in a limited sliding manner. A double piston cylinder is connected between the two adjusting plates, and second electric push rods are respectively fixedly connected above the two adjusting plates, and the sealing frame is fixedly installed on the second electric push rod.

6. The vacuum potting stator device according to claim 5, wherein: A limiting convex block is fixedly connected above one end of the extension plate close to the support plate, a slide rail matching the limiting convex block is correspondingly formed at the bottom of the support plate, a slide rail is formed above the other end of the extension plate and at the bottom of the adjusting plate, and a corresponding limiting convex block is fixedly connected to the bottom of the adjusting plate.

7. The vacuum potting stator device according to claim 5, wherein: The sealing frame is arranged on three sides, a sealing gasket is arranged at the corresponding position between the inner wall of the sealing frame and the reflux groove of the mold top cover, the hollow pump is located inside the sealing frame, and the output end of the hollow pump penetrates through the sealing frame and is located at the sealing gasket of the sealing frame.

8. The vacuum potting stator device according to claim 5, characterized in that: The auxiliary vacuum assembly further includes a top plate, connection columns are fixedly connected to the four corners of the bottom of the top plate, and the bottom of the connection columns are respectively fixedly connected to the top of the support plate. There are multiple groups of the pressing plates, each group of the pressing plates has two, the two pressing plates are respectively located on both sides of the mold top cover, and a semiconductor refrigerating sheet is arranged between the two pressing plates.

9. The vacuum potting stator device according to claim 8, wherein: On both sides of the top of the top plate, there are horizontally strip-shaped through holes. The extrusion plate is horizontally arranged below the top plate. An adjustment frame is arranged above the extrusion plate. The adjustment frame is located above the top plate. Third electric push rods are fixedly connected to both ends of the adjustment frame and the extrusion plate respectively. At both ends of one side of the adjustment frame, fourth electric push rods are fixedly connected. The fourth electric push rods are fixedly installed on the positioning plate, and the positioning plate is installed at the strip-shaped through hole of the top plate.

10. A vacuum potting stator device according to claim 8, characterized in that: On the side of the extrusion plate close to the mold top cover, an anti-slip pad is fixedly connected. The semiconductor refrigeration sheet is fixedly installed at the bottom of the top plate.

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