Driving VCC power supply circuit

Abstract

The utility model provides a driving VCC power supply circuit. The driving VCC power supply circuit comprises an NPN triode integrated in a sealed chip; a collector electrode of the NPN triode serves as a voltage input end to be connected with a power supply end of the sealing chip, and an emitter electrode of the NPN triode serves as a VCC output end to supply power to a post-stage driver and / or an LDO; the base electrode of the NPN triode is connected with the power supply end of the sealing chip, a power supply resistor is connected between the base electrode and the power supply end, and a voltage stabilizing diode is arranged for voltage stabilization. According to the driving VCC power supply circuit, the system integration is improved, the NPN triode is integrated into the sealed chip, the packaging cost of the NPN triode is saved, the overall BOM cost of the system is reduced, and due to the fact that the NPN triode is integrated into the sealed chip, heat dissipation of the NPN triode can be achieved through a copper frame of the sealed chip.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic power, and particularly relates to a driving VCC power supply circuit. Background Art

[0002] In electrical equipment, especially in a motor control system with an input voltage lower than 48V, a linear voltage regulator (LDO) is required to output 12V or 15V to supply power to a dual-N drive IC.

[0003] In the prior art, the following methods are mainly adopted:

[0004] 1. Using discrete devices to build a VCC power supply circuit, such as Figure 1 , although this method can supply power to the dual-N drive IC, there are many peripheral devices, which occupy a large PCB area, are not conducive to miniaturized products, and the heat dissipation problem of Q1 needs to be considered.

[0005] 2. Using a linear voltage regulator (LDO) to output power to the VCC power supply circuit, such as Figure 2 shown, although this method can supply power to the dual-N drive IC, the cost is high, and due to the power consumption problem of the LDO, a small package cannot be used, so the PCB board area occupied is also large, which is not conducive to miniaturized products. Content of the Utility Model

[0006] In order to overcome the defects existing in the above prior art, the purpose of the utility model is to provide a driving VCC power supply circuit.

[0007] In order to achieve the above object of the utility model, the utility model provides a driving VCC power supply circuit, which includes an NPN triode integrated inside a co-packaged chip;

[0008] The collector of the NPN triode is connected to the power supply terminal of the co-packaged chip as a voltage input terminal, and the emitter of the NPN triode is used as a VCC output terminal to supply power to the subsequent stage drive and / or LDO;

[0009] A voltage source signal is input to the base of the NPN triode.

[0010] This driving VCC power supply circuit improves the system integration, integrates the NPN triode inside the co-packaged chip, saves the packaging cost of the NPN triode, thereby reducing the overall BOM cost of the system, and since the NPN is integrated inside the co-packaged chip, the NPN triode can dissipate heat through the copper frame of the co-packaged chip.

[0011] In an optional scheme of this driving VCC power supply circuit, the base of the NPN triode is connected to the power supply terminal of the co-packaged chip, a power supply resistor is connected between the two, and a zener diode is set for voltage regulation.

[0012] In an alternative solution of the driving VCC power supply circuit, the base of the NPN transistor is electrically connected to the driving IC or an external power supply circuit, and the driving IC or the external power supply circuit provides a voltage source signal to the base of the NPN transistor.

[0013] In an alternative solution of the driving VCC power supply circuit, one end of the power supply resistor is connected to the power supply terminal of the co-packaged chip, and the other end is connected to the base of the NPN transistor. The base of the NPN transistor is also connected to the negative electrode of the voltage stabilizing diode, and the positive electrode of the voltage stabilizing diode is grounded.

[0014] In an alternative solution of the driving VCC power supply circuit, the power supply resistor and the voltage stabilizing diode are integrated inside the co-packaged chip.

[0015] In an alternative solution of the driving VCC power supply circuit, the power supply resistor and the voltage stabilizing diode are integrated inside the NPN transistor. The NPN transistor integrated with the power supply resistor and the voltage stabilizing diode in this alternative solution can be customized, making it more rapid and convenient to build the driving VCC power supply circuit.

[0016] In an alternative solution of the driving VCC power supply circuit, the NPN transistor is disposed on an independent base island of the co-packaged chip.

[0017] In an alternative solution of the driving VCC power supply circuit, the NPN transistor wafer is pasted on the independent base island through a conductive adhesive, and the Pad pads on the NPN transistor wafer are respectively connected to the pins of the co-packaged chip through metal wires. This alternative solution integrates the NPN transistor wafer into the co-packaged chip, saving the packaging cost of the NPN transistor and using the copper frame of the co-packaged chip to solve the heat dissipation problem of the NPN transistor.

[0018] The beneficial effects of the present utility model are as follows:

[0019] The present utility model improves the product integration degree, reduces the peripheral devices, and enhances the product reliability; by utilizing the heat dissipation ability of the copper frame of the co-packaged chip, the heat dissipation problem of the NPN transistor is solved, and at the same time, the BOM cost of the system application end is reduced; in an application scenario with a compact space, it is beneficial to the layout and wiring of the PCB board, and the layout is more flexible.

[0020] The additional aspects and advantages of the present utility model will be partially given in the following description, partially will become obvious from the following description, or will be understood through the practice of the present utility model. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The above and / or additional aspects and advantages of the present utility model will become obvious and easy to understand from the description of the embodiments in conjunction with the following drawings, wherein:

[0022] Figure 1 It is a schematic diagram of a VCC power supply circuit built with discrete devices in the prior art;

[0023] Figure 2 It is a schematic diagram of a VCC power supply circuit output by a linear voltage regulator in the prior art;

[0024] Figure 3 It is a schematic diagram of the circuit of Embodiment 1, where the inside of the black square is a co-packaged chip;

[0025] Figure 4 It is a schematic diagram of the circuit of Embodiment 2, where the inside of the large black square is a co-packaged chip;

[0026] Figure 5 It is a schematic diagram of the copper frame structure inside the co-packaged chip in Embodiment 1 and Embodiment 2. Detailed implementation manners

[0027] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions from beginning to end. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present invention and should not be construed as a limitation to the present invention.

[0028] In the description of the present invention, unless otherwise specified and limited, it should be noted that the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a mechanical connection or an electrical connection, or it can be the communication inside two elements. It can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms can be understood according to specific situations.

[0029] Embodiment 1

[0030] As Figure 3 and Figure 5 shown, this embodiment provides a driving VCC power supply circuit, which specifically includes an NPN transistor Q integrated inside the co-packaged chip. In this embodiment, the NPN transistor Q is disposed on the independent base island 2 of the co-packaged chip. Specifically, the wafer 1 of the NPN transistor Q is pasted on an independent base island 2 through a conductive adhesive, and the Pad pads on the wafer 1 of the NPN transistor Q are respectively connected to the co-packaged chip pins 3 through metal wires.

[0031] Based on the common collector amplification characteristic of the triode, in this embodiment, the collector of the NPN triode Q is connected as the voltage input end to the power supply terminal VIN of the co-packaged chip, and a protection resistor R2 is connected in series between them. The emitter of the NPN triode Q serves as the VCC output end to supply power to the subsequent stage driver and / or LDO. A capacitor C is also electrically connected between the emitter of the NPN triode Q and the ground. The base of the NPN triode Q is connected to the power supply terminal VN of the co-packaged chip, a power supply resistor R1 is connected between them, and a zener diode D is set for voltage stabilization. Specifically, one end of the power supply resistor R1 is connected to the power supply terminal VIN of the co-packaged chip, the other end of the power supply resistor R1 is connected to the base of the NPN triode Q, the base of the NPN triode Q is also connected to the negative electrode of the zener diode D, and the positive electrode of the zener diode D is grounded.

[0032] This embodiment utilizes the heat conductivity of the copper frame of the co-packaged chip to dissipate heat from the NPN triode Q. Both the power supply resistor R1 and the zener diode D are arranged outside the co-packaged chip.

[0033] Embodiment Two

[0034] As Figure 4 and Figure 5 shown, this embodiment provides a driving VCC power supply circuit. This Embodiment Two is substantially the same as Embodiment One, and the difference lies in that both the power supply resistor R1 and the zener diode D are integrated inside the co-packaged chip. Or directly customize the NPN triode Q, and integrate the power supply resistor R1 and the zener diode D inside the base of the NPN triode. This embodiment can also utilize the heat conductivity of the copper frame of the co-packaged chip to dissipate heat from the NPN triode Q.

[0035] Embodiment Three

[0036] This embodiment is substantially the same as Embodiment One or Embodiment Two, and the difference lies in that the base of the NPN triode is electrically connected to the driving IC or the external power supply circuit, and the driving IC or the external power supply circuit provides a voltage source signal to the base of the NPN triode.

[0037] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0038] Although embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the claims and their equivalents.

Claims

1. A driving VCC power supply circuit, characterized in that, Including an NPN transistor integrated inside a co-packaged chip; The collector of the NPN transistor is connected to the power supply terminal of the co-packaged chip as a voltage input terminal, and the emitter of the NPN transistor is used as a VCC output terminal to supply power to the subsequent stage drive and / or LDO; A voltage source signal is input to the base of the NPN transistor.

2. The driving VCC power supply circuit according to claim 1, wherein The base of the NPN transistor is connected to the power supply terminal of the co-packaged chip, a power supply resistor is connected between them, and a zener diode is set for voltage stabilization.

3. The driving VCC power supply circuit according to claim 1, characterized in that, The base of the NPN transistor is electrically connected to a drive IC or an external power supply circuit, and the drive IC or the external power supply circuit provides a voltage source signal to the base of the NPN transistor.

4. The driving VCC power supply circuit according to claim 2, characterized in that, One end of the power supply resistor is connected to the power supply terminal of the co-packaged chip, the other end is connected to the base of the NPN transistor, the base of the NPN transistor is also connected to the negative electrode of the zener diode, and the positive electrode of the zener diode is grounded.

5. The driving VCC power supply circuit according to claim 2, wherein The power supply resistor and the zener diode are integrated inside the co-packaged chip.

6. The driving VCC power supply circuit according to claim 2, characterized in that, The power supply resistor and the zener diode are integrated inside the NPN transistor.

7. The driving VCC power supply circuit according to any one of claims 1-6, characterized in that, The NPN transistor is disposed on an independent base island of the co-packaged chip.

8. The driving VCC power supply circuit according to claim 7, wherein The NPN transistor wafer is pasted on the independent base island through a conductive adhesive, and the Pad pads on the NPN transistor wafer are respectively connected to the pins of the co-packaged chip through metal wires.

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