Communication conversion device based on semiconductor equipment

Abstract

The utility model relates to the technical field of communication technology, in particular to a communication conversion device based on semiconductor equipment, which comprises a plastic shell, a PCB (printed circuit board) is correspondingly mounted and connected in the plastic shell, the PCB comprises two RS-232 communication circuits, and each RS-232 communication circuit comprises a burning interface, a microprocessor, a signal transceiving chip, a key, an input interface and an output interface. The beneficial effects are that the communication conversion device based on the semiconductor equipment provided by the utility model redesigns the communication conversion module used for constructing communication between the novel temperature controller and the machine after confirming the respective communication modes of the novel temperature controller and the machine, so that normal communication between the novel temperature controller and the machine can be realized. And meanwhile, the EMC circuit is added, so that external interference signals are protected to a certain extent, safety and stability of communication are ensured, normal communication can be carried out between the machine table and the temperature controller, and normal production operation of semiconductor equipment is realized.

Description

Technical Field

[0001] The utility model relates to the technical field of communication, and particularly relates to a communication conversion device based on semiconductor equipment. Background Art

[0002] With the popularization of information technology, the communication problem between semiconductor devices has been increasingly emphasized by the public. The further development of the communication module of semiconductor devices is an important driving force for promoting the development of the semiconductor industry. Semiconductor production is a highly precise, complex and important process, and more timely and accurate signal transmission is crucial in the production process.

[0003] Traditional temperature controllers are all old models and cannot meet the current production requirements. New temperature controllers are fully functional but have different communication methods from the old models and cannot communicate directly with the machine tools, thus unable to meet the specific conditions during the use of on-site machine tools. Therefore, the utility model proposes a communication conversion device based on semiconductor equipment to solve the above problems. Content of the Utility Model

[0004] The purpose of the utility model is to provide a communication conversion device based on semiconductor equipment to solve the problems raised in the above background art.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A communication conversion device based on semiconductor equipment, the communication conversion device based on semiconductor equipment includes: a plastic shell, a PCB board is correspondingly installed and connected inside the plastic shell, the PCB board includes two-way RS-communication circuits, and the RS-communication circuits include a programming interface, a microprocessor, a signal transceiver chip, a key, an input interface, and an output interface.

[0006] Preferably, the programming interface is electrically connected to the lower left corner of the upper end face of the PCB board, and the four interfaces of the programming interface are respectively TX, RX, VCC, and GND.

[0007] Preferably, the pins of the microprocessor are soldered to the middle part of the upper end face of the PCB board.

[0008] Preferably, the pins of the EMC circuit are soldered to the middle right side of the upper end face of the PCB board.

[0009] Preferably, the pins of the power conversion circuit are soldered to the right end of the upper end face of the PCB board.

[0010] Preferably, the pins of the signal transceiver chip are soldered to the middle upper part of the upper end face of the PCB board, and input interfaces and output interfaces are arranged on both sides of the signal transceiver chip.

[0011] Preferably, the input interface is electrically connected to the upper left side above the upper end surface of the PCB board, and the input interface is composed of two 4Pin wiring terminals.

[0012] Preferably, the output interface is electrically connected to the upper right side above the upper end surface of the PCB board, and the output interface is composed of two 4Pin wiring terminals.

[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0014] The communication conversion device based on semiconductor equipment proposed by the present utility model can achieve normal communication between the new temperature controller and the machine tool by redesigning the communication conversion module for building communication between the two after confirming the respective communication methods of the new temperature controller and the machine tool. At the same time, an EMC circuit is added to provide certain protection against external interference signals, ensuring the safety and stability of communication, enabling normal communication between the machine tool and the temperature controller, and realizing the normal production operation of semiconductor equipment. Description of the Drawings

[0015] Figure 1 is the hardware block diagram of this communication conversion module;

[0016] Figure 2 is the circuit board diagram of this communication conversion module.

[0017] In the figure: 1. Programming interface; 2. Microprocessor; 3. EMC circuit; 4. Power conversion circuit; 5. Signal transceiver chip; 6. Input interface; 7. Output interface. Detailed Embodiments

[0018] In order to clearly and completely describe the objectives, technical solutions of the present utility model, and make the advantages more clearly understood, the following further details the embodiments of the present utility model with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are some embodiments of the present utility model, rather than all embodiments, and are only used to explain the embodiments of the present utility model, not to limit the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of the present utility model.

[0019] Embodiment 1: Please refer to Figure 1 - Figure 2 , the present utility model provides a technical solution: A communication conversion device based on semiconductor equipment, the communication conversion device based on semiconductor equipment includes: a plastic shell, a PCB board is correspondingly installed and connected inside the plastic shell, the PCB board includes two RS-232 communication circuits, and the RS-232 communication circuit includes a programming interface 1, a microprocessor 2, a signal transceiver chip 5, a key, an input interface 6, and an output interface 7.

[0020] Embodiment 2: On the basis of Embodiment 1, the programming interface 1 is electrically connected to the lower left corner of the upper end face of the PCB board. The four interfaces of the programming interface 1 are TX, RX, VCC, and GND respectively. The pins of the microprocessor 2 are soldered to the middle part of the upper end face of the PCB board. The pins of the EMC circuit 3 are soldered to the middle right side of the upper end face of the PCB board. The pins of the power conversion circuit 4 are soldered to the right end of the upper end face of the PCB board. The pins of the signal transceiver chip 5 are soldered to the upper middle part of the upper end face of the PCB board. Input interfaces 6 and output interfaces 7 are arranged on both sides of the signal transceiver chip 5. The input interface 6 is electrically connected to the upper left side of the upper end face of the PCB board and consists of two 4Pin terminal blocks. The output interface 7 is electrically connected to the right side of the upper end face of the PCB board and consists of two 4Pin terminal blocks. The programming interface 1 is used to write programs into the microprocessor 2. At the same time, the communication conversion module can also be monitored through this interface to read the current state of the communication conversion module. The microprocessor 2 is mainly used to process the received signals, so that the register addresses of the new and old devices for communication are in one-to-one correspondence, enabling normal communication between devices; the EMC circuit 3 is used to filter out external electromagnetic interference, making the signals received and transmitted to the microprocessor 2 more accurate and reducing errors in the communication process; the power conversion circuit 4 stabilizes and steps down the power obtained by the module from the machine platform and converts it into the 5V and 3.3V voltages required by each device in the module, enabling each device in the module to operate normally and realizing the function of communication conversion; the signal transceiver chip 5 is close to the input interface 6 and the output interface 7. The signals obtained from the input interface 6 are first confirmed for signal types, and then pass through the corresponding signal transceiver chip 5 to establish a connection with the microprocessor 2, convert and process the signals. After the processing is completed, the signals are output from the output interface 7 through the signal transceiver chip 5 to complete the signal conversion and realize the communication between the machine platform and the temperature control module; the input interface 6 consists of two 4Pin terminal blocks, forming two channels, which are used to receive signals from two temperature control modules and transmit them to the signal transceiver chip to complete signal collection; the output interface 7 consists of two 4Pin terminal blocks, forming two channels, which are used to output signals from the signal transceiver chip and transmit them to two temperature control modules to complete the signal output function.

[0021] In actual use, first, according to the definitions of the input interface 6 and the output interface 7, correctly connect them to two temperature control modules and the machine tool. After the wiring is completed, this communication conversion module converts the communication between the machine tool and the temperature control module; the signal sent from the machine tool enters this module through the input interface 6, and the received signal is received by the signal transceiver chip 5 and then sent to the microprocessor 2 for processing. The microprocessor 2 converts the signal it receives and then transmits it. The signal transceiver chip 5 sends the signal converted by the microprocessor 2 to the output interface 7 after receiving it, and sends it to the next level through the output interface 7; during the operation of the module, the EMC circuit 3 plays a protective role, reducing external electromagnetic interference and ensuring the accuracy and stability of communication. The power conversion circuit 4 plays a power supply role, stabilizing the voltage connected to this communication conversion module and converting it into the voltage required by specific devices to meet the normal operation of the communication conversion module.

[0022] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A communication conversion device based on semiconductor devices, characterized in that: The communication conversion device based on semiconductor equipment includes: A plastic housing, inside which a PCB board is correspondingly installed and connected. The PCB board includes two RS-232 communication circuits, and the RS-232 communication circuit includes a programming interface (1), a microprocessor (2), a signal transceiver chip (5), a button, an input interface (6), and an output interface (7).

2. The communication conversion device based on a semiconductor device according to claim 1, characterized in that: The programming interface (1) is electrically connected to the lower left corner of the upper end face of the PCB board. The four interfaces of the programming interface (1) are respectively TX, RX, VCC, and GND.

3. A communication conversion device based on a semiconductor device according to claim 1, characterized in that: The pins of the microprocessor (2) are soldered to the middle part of the upper end face of the PCB board.

4. A communication conversion device based on a semiconductor device according to claim 1, characterized in that: The PCB board includes an EMC circuit (3), and the pins of the EMC circuit (3) are soldered to the middle right side of the upper end face of the PCB board.

5. A communication conversion device based on a semiconductor device according to claim 1, characterized in that: The PCB board includes a power conversion circuit (4), and the pins of the power conversion circuit (4) are soldered to the right end of the upper end face of the PCB board.

6. A communication conversion device based on a semiconductor device according to claim 1, characterized in that: The pins of the signal transceiver chip (5) are soldered to the upper middle part of the upper end face of the PCB board. The input interface (6) and the output interface (7) are arranged on both sides of the signal transceiver chip (5).

7. A communication conversion device based on a semiconductor device according to claim 1, characterized in that: The input interface (6) is electrically connected to the upper left side of the upper end face of the PCB board. The input interface (6) is composed of two 4Pin wiring terminals.

8. A communication conversion device based on a semiconductor device according to claim 1, characterized in that: The output interface (7) is electrically connected to the right side of the upper end face of the PCB board. The output interface (7) is composed of two 4Pin wiring terminals.

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