Heater and semiconductor equipment

Abstract

The utility model discloses a heater and a semiconductor device, belonging to the technical field of semiconductor coating, the heater comprises a heating disc and a heating wire, the disc body is made of ceramic material, and the heating wire is made of platinum rhodium alloy material. The heating wire is made of platinum-rhodium alloy, the disc body is made of ceramic materials, and both the heating wire and the disc body can resist the high temperature of 1000 DEG C and have excellent oxidation resistance, so that the operation requirements in the high-temperature aerobic environment can be effectively met. Meanwhile, the heating disc is formed by splicing a plurality of disc bodies, so that the condition of high-temperature cracking of ceramics can be effectively avoided, and the service life of the heating disc in a high-temperature oxygen-enriched environment when the heating disc is applied to semiconductor coating production is ensured. Moreover, the heating wire is embedded in the dovetail groove of the heating disc, and when the heating disc faces downwards, the heating wire can be prevented from being disengaged.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor coating equipment, and particularly relates to a heater for semiconductor coating equipment and a semiconductor device applying the heater. Background Art

[0002] Vacuum coating, scientifically named physical vapor deposition, is a technology that under vacuum conditions, uses physical methods to vaporize materials into atoms, molecules or ionize them into ions, and deposits thin films with certain special functions on the surface of the substrate through the gas phase process. The main methods of physical vapor deposition include pulsed laser deposition, electron beam evaporation coating, vacuum resistance evaporation coating, magnetron sputtering coating, arc plasma plating, ion plating, molecular beam epitaxy, etc. Developed to the present, physical vapor deposition technology can not only deposit metal films, alloy films, but also deposit compounds, ceramics, semiconductors, polymer films, etc.

[0003] Specific to semiconductor coating equipment, the substrate temperature has a great influence on the film structure. A high substrate temperature increases the kinetic energy of adsorbed atoms, increases the probability of crossing the surface barrier, is easy to crystallize, reduces film defects, and also reduces the internal stress in the film. A low substrate temperature is prone to form an amorphous structure film. Therefore, the temperature is also a very important factor for film formation quality. In some cases, the high temperature required by the substrate can reach 1000 °C, and then oxygen annealing is required, and the heater is arranged downward. The heaters in the related prior art are difficult to effectively meet the operation requirements of high temperature and oxygen resistance. Summary of the Utility Model

[0004] The utility model aims to solve at least one of the technical problems existing in the prior art. For this purpose, in a first aspect, the utility model provides a heater that can meet the high-temperature heating requirements in semiconductor coating equipment.

[0005] In a second aspect, the utility model provides a semiconductor device applying the above heater.

[0006] The heater according to the first aspect embodiment of the utility model includes:

[0007] A heating plate, which is formed by splicing at least two plate bodies. The heating plate includes a first end face and a second end face. In the direction from the first end face to the second end face, the heating plate is provided with a dovetail groove;

[0008] A heating wire, which is embedded in the dovetail groove;

[0009] Wherein, the plate body is made of ceramic material, and the heating wire is made of platinum-rhodium alloy material.

[0010] The heater according to the embodiment of the present utility model has at least the following beneficial effects: In the heater of the present utility model, first, the heating wire is made of platinum-rhodium alloy and the disk body is made of ceramic material, both of which can withstand high temperatures of 1000 °C and have excellent oxidation resistance. Therefore, the heater in the present utility model can effectively meet the working requirements in a high-temperature aerobic environment. At the same time, the heating disk in the present utility model is formed by splicing a plurality of disk bodies, which can effectively avoid the situation of ceramic high-temperature cracking, thereby ensuring the service life in the semiconductor coating production when dealing with a high-temperature oxygen-rich environment. And, the heating wire is embedded in the dovetail groove of the heating disk, which can prevent the heating wire from coming out when the heating disk faces downward.

[0011] According to some embodiments of the present utility model, the disk bodies are spliced around a center to form the circular heating disk, and the dovetail grooves are distributed in a spiral divergence form around the center of the heating disk to each of the disk bodies.

[0012] According to some embodiments of the present utility model, the heater further includes a base and a pressing plate. The base is provided with an installation cavity with one end open. The heating disk is installed in the installation cavity and keeps the first end face facing the opening. The pressing plate is connected to the base, and the pressing plate abuts against the edge position of the first end face.

[0013] According to some embodiments of the present utility model, the heater further includes a heat shield. The heat shield is sleeved on the heating disk along the direction from the second end face to the first end face.

[0014] According to some embodiments of the present utility model, the base protrudes and is provided with a plurality of setscrew assemblies at one end of the installation cavity facing the second end face, and the ends of the setscrew assemblies abut against the heat shield.

[0015] According to some embodiments of the present utility model, there is a first gap between the heat shield and the side wall of the installation cavity. The base is provided with a first air hole on the side wall of the installation cavity, and the first air hole communicates with the first gap.

[0016] According to some embodiments of the present utility model, the base is provided with a plurality of threaded holes for installing the pressing plate on the periphery of the installation cavity. The number of the first air holes is greater than or equal to the number of the threaded holes, and each threaded hole intersects with at least one of the first air holes.

[0017] According to some embodiments of the present utility model, each of the disk bodies is concavely provided with a positioning concave position in the direction from the second end face to the first end face, one end of the heat shield facing the second end face is convexly provided with a plurality of positioning protrusions, the positioning protrusions are inserted into the positioning concave positions, and the height of the positioning protrusions is greater than the depth of the positioning concave positions, so as to form a second gap between the heat shield and the heating disk, and the heat shield is provided with second air holes for communicating the second gap with the first gap.

[0018] According to some embodiments of the present utility model, the second gap extends to the peripheral side of the heating disk, and there is an air passage between the pressing plate and the heat shield for communicating the first gap with the second gap.

[0019] The semiconductor device according to the second aspect embodiment of the present utility model applies the above heater.

[0020] The semiconductor device according to the embodiment of the present utility model has at least the following beneficial effects: The semiconductor device in the present utility model can effectively meet the substrate processing requirements up to 1000 °C by applying the above heater.

[0021] Some additional aspects and advantages of the present utility model will be given in the following description, some additional aspects and advantages will become obvious from the following description, or be understood through the practice of the present utility model. Description of the Drawings

[0022] The following further describes the present utility model in conjunction with the drawings and embodiments, where:

[0023] Figure 1 is a schematic structural diagram of a heating disk in the present utility model;

[0024] Figure 2 is a schematic structural diagram of a disk body of a heating disk in the present utility model;

[0025] Figure 3 is a cross-sectional view of a heater in the present utility model;

[0026] Figure 4 is a schematic partial structural diagram of a heater in the present utility model.

[0027] In the figure:

[0028] 100 - heating disk, 101 - dovetail groove, 102 - disk body;

[0029] 1011 - connection hole;

[0030] 200 - base, 201 - first air hole, 202 - first gap, 203 - setscrew assembly, 204 - threaded hole;

[0031] 300 - Pressure plate;

[0032] 400 - Heat shield, 401 - Positioning protrusion, 402 - Second gap, 403 - Second air hole;

[0033] 500 - Isolation cover;

[0034] 600 - Isolation plate. Detailed implementation mode

[0035] The embodiments of the present utility model will be described in detail below. The examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary and are only used to explain the present utility model and should not be construed as a limitation of the present utility model.

[0036] In the description of the present utility model, it should be understood that for the orientation description, such as the orientation or positional relationship indicated by up, down, front, back, left, right, etc. is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present utility model.

[0037] In the description of the present utility model, the meaning of several is more than one, and the meaning of multiple is more than two. Understandings such as greater than, less than, exceeding, etc. do not include the present number, and understandings such as above, below, within, etc. include the present number. If there is a description of first and second, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence relationship of the indicated technical features.

[0038] In the description of the present utility model, unless otherwise clearly defined, words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in the present utility model in combination with the specific content of the technical solution.

[0039] In the description of the present utility model, the description referring to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0040] Vacuum coating, scientifically known as physical vapor deposition, is a technology that, under vacuum conditions, uses physical methods to vaporize materials into atoms, molecules, or ionize them into ions, and through a gas-phase process, deposits a thin film with a certain special function on the surface of a substrate. The main methods of physical vapor deposition include pulsed laser deposition, electron beam evaporation coating, vacuum resistance evaporation coating, magnetron sputtering coating, arc plasma plating, ion plating, molecular beam epitaxy, etc. Developed to the present, physical vapor deposition technology can not only deposit metal films, alloy films, but also deposit compounds, ceramics, semiconductors, polymer films, etc.

[0041] Specifically for semiconductor coating equipment, the substrate temperature has a great influence on the film structure. A high substrate temperature increases the kinetic energy of adsorbed atoms, increases the probability of crossing the surface potential barrier, is easy to crystallize, reduces film defects, and at the same time reduces the internal stress in the film. If the substrate temperature is low, an amorphous structure film is easily formed. Therefore, the temperature is also a very important factor for film formation quality. In some cases, the high temperature required for the substrate can reach 1000 °C, and then oxygen annealing is required. The heaters in the related prior art are difficult to effectively meet the operating requirements of high temperature and oxygen resistance.

[0042] In view of this, the present utility model proposes a heater and a semiconductor device, which can meet the high-temperature heating requirements in semiconductor coating equipment.

[0043] Refer to Figure 1 and Figure 2 As shown in

[0044] and

[0045] A heater according to an embodiment of the present utility model includes a heating plate 100 and a heating wire (not shown in the figure). The heating plate 100 is formed by splicing at least two plate bodies 102. The heating plate 100 includes a first end face and a second end face. In the direction from the first end face to the second end face, the heating plate 100 is provided with a dovetail groove 101. The heating wire is embedded in the dovetail groove 101. Further, the plate body 102 is made of a ceramic material, and the heating wire is made of a platinum-rhodium alloy material. It can be understood that since the sintering temperature of the ceramic material can reach 1700 °C, and the melting point of the platinum-rhodium alloy is about 1600 °C, the heating plate 100 and the heating wire can be used to achieve a heating temperature of 1000 °C by applying these two materials, and can also ensure the service life in an environment of 1000 °C. Moreover, the ceramic material has oxidation resistance characteristics, and the oxidation resistance performance of the platinum-rhodium alloy is also quite excellent. The combination of the two makes the heating plate 100 and the heating wire have outstanding high-temperature and oxidation resistance characteristics, and can provide stable high heat output for the coating process.Thus, for the heater in the present utility model, firstly, the heating wire is made of platinum-rhodium alloy and the disc body 102 is made of ceramic material, both of which can withstand high temperatures of 1000°C and have excellent oxidation resistance. Therefore, the heater in the present utility model can effectively meet the operation requirements in a high-temperature aerobic environment. At the same time, the heating disc 100 in the present utility model is formed by splicing multiple disc bodies 102, which can effectively avoid the situation of ceramic high-temperature cracking, thus ensuring the service life in the high-temperature oxygen-rich environment during semiconductor coating production. Moreover, the heating wire is embedded in the dovetail groove 101 of the heating disc 100, which can prevent the heating wire from coming out when the heating disc 100 faces downward.

[0046] Referring to Figure 1 , in some embodiments of the present utility model, the disc bodies 102 are spliced around a center to form a circular heating disc 100, and the dovetail grooves 101 are distributed in a spiral divergence form around the center of the heating disc 100 to each disc body 102. Specifically, each disc body 102 is in a fan-shaped structure, and in order to ensure uniform heat, the central angle corresponding to each disc body 102 is kept consistent.

[0047] Referring to Figure 1 , in some embodiments, the heating disc 100 includes two disc bodies 102, both of which are in a semi-circular structure and are used to be spliced into a circular heating disc 100. The heating disc 100 is spirally provided with dovetail grooves 101 around its own center on the first end face, that is, the length direction of the dovetail grooves 101 extends in a spiral divergence direction within the first end face, and the groove depth direction is along the direction from the first end face to the second end face. Corresponding to the width direction, the width of the dovetail groove 101 at the end close to the first end face is smaller than the width of the inner side. When the heating wire is embedded therein, it is limited and prevented from coming out through the structural form of the dovetail groove 101. Moreover, the heating disc 100 is provided with connection holes 1011 at both ends in the length direction of the dovetail groove 101. The connection holes 1011 are arranged along the direction from the first end face to the second end face and are exposed on the second end face. Both ends of the heating wire are led out from the connection holes 1011 for convenient wiring.

[0048] Referring to Figure 3 , in some embodiments of the present utility model, the heater further includes a base 200 and a pressing plate 300. The base 200 is provided with an installation cavity with one end open, and the heating disc 100 is installed in the installation cavity and keeps the first end face facing the opening of the installation cavity. The pressing plate 300 is arranged at the opening position of the base 200 and abuts against the edge position of the first end face. In this embodiment, the heating disc 100 is pressed in the installation cavity by the pressing plate 300, and the structural design is simple and reliable.

[0049] Since the base 200 needs to be connected to the transmission component, when the heating temperature reaches 1000 °C or even exceeds 1000 °C, the transmission component faces a relatively high temperature. In some embodiments of the present utility model, the heater further includes a heat insulation cover 400, and the heat insulation cover 400 is sleeved on the heating plate 100 along the direction from the second end face to the first end face. Since the first end face of the heating plate 100 is for heating the substrate, and the second end face is closer to the transmission component, by sleeving the heat insulation cover 400 on the second end face in this embodiment, the heat transfer and radiation of the heating plate 100 in the direction away from the first end face can be reduced, thereby facilitating the reduction of the temperature of the transmission component and improving the stability of the equipment operation.

[0050] Referring to Figure 3 , in some embodiments of the present utility model, a plurality of setscrew assemblies 203 are protrudingly provided at one end of the mounting cavity of the base 200 facing the second end face, and the ends of the setscrew assemblies 203 abut against the heat insulation cover 400. With the structural arrangement of this embodiment, by using the setscrew assemblies 203 in cooperation with the pressing plate 300, clamping can be performed from both ends of the heating plate 100 to ensure the firm installation of the heating plate 100. At the same time, since the setscrew assemblies 203 are protrudingly provided in the mounting cavity, a first gap 202 is formed between the heat insulation cover 400 and the side wall of the mounting cavity. Through the setting of the first gap 202, heat transfer can be further reduced.

[0051] Referring to Figure 3 , the size of the mounting cavity is larger than the outer contour dimensions of the heating plate 100 and the heat insulation cover 400. Therefore, a first gap 202 exists between the circumferential side of the heat insulation cover 400 and the bottom of the mounting cavity where the setscrew assemblies 203 are located. Considering that the equipment needs to be evacuated, for the convenience of evacuation, further, a first air hole 201 is opened on the side wall of the mounting cavity of the base 200, and the first air hole 201 communicates with the first gap 202. In this way, during the evacuation stage, the air in the first gap 202 can be evacuated through the first air hole 201.

[0052] Referring to Figure 3 , the base 200 is provided with a plurality of threaded mounting holes at a position opposite to the second end face of the mounting cavity, and the threaded mounting holes penetrate through the base 200. The setscrew assemblies 203 are set as hexagon socket head cap screws, and the hexagon socket head cap screws penetrate from one end of the threaded mounting hole away from the mounting cavity, and the protruding distance relative to the inner wall of the mounting cavity is adjusted by threads to ensure the stability of the installation. Further, a spherical convex portion is provided at one end of the hexagon socket head cap screw extending into the mounting cavity to reduce the friction on the heat insulation cover 400 during installation.

[0053] Referring to Figure 4, in some embodiments of the present utility model, the base 200 is provided with a plurality of threaded holes 204 for installing the pressing plate 300 on the periphery of the installation cavity. The pressing plate 300 can be installed and fixed by screws arranged in the threaded holes 204. The number of the first air holes 201 is equal to the number of the threaded holes 204, so that each threaded hole 204 intersects with a first air hole 201. With the structural arrangement of this embodiment, the first air hole 201 can be used to suck air in the first gap 202 and also to suck air in the threaded holes 204. The structural design is simple and can avoid opening too many holes on the base 200.

[0054] Referring to Figure 4 , considering that the heating plate 100 in the present utility model is a structure formed by splicing a plurality of plate bodies 102, in order to improve the installation stability of the plate bodies 102, in some embodiments of the present utility model, each plate body 102 is concavely provided with a positioning recess in the direction from the second end face to the first end face, and one end of the heat insulation cover 400 facing the second end face is convexly provided with a plurality of positioning protrusions 401. The positioning protrusions 401 are inserted into the positioning recesses, so as to realize the positioning and fixing between the plate body 102 and the heat insulation cover 400 through the cooperation of the positioning protrusions 401 and the positioning recesses. At the same time, based on the mutual splicing relationship between the plate bodies 102, even if there is only one positioning recess, the positioning effect can be ensured.

[0055] The number of the plate bodies 102 can be flexibly set according to needs, such as 2, 3, 4, etc. Since the dovetail grooves 101 are spirally distributed on the first end face and the heating wires are embedded in the dovetail grooves 101, the heating wires distributed on each plate body 102 are relatively uniform, and the situation of cracking due to oversize can be effectively avoided.

[0056] In some embodiments, a mutually matching step structure or male-female structure is arranged between two adjacent plate bodies 102 to realize the positioning between the two plate bodies 102. The positioning angle and direction can be flexibly set according to needs. For example, they are positioned at an angle perpendicular to the first end face and the second end face, so as to cooperate with the positioning protrusions 401 and the positioning recesses to improve the positioning effect of the plate body 102.

[0057] Furthermore, the height of the positioning protrusions 401 is greater than the depth of the positioning recesses, so as to form a second gap 402 between the heat insulation cover 400 and the heating plate 100. The heat insulation cover 400 is provided with a second air hole 403 for communicating the second gap 402 with the first gap 202. Similarly, with the structural arrangement of this embodiment, firstly, the positioning protrusions 401 are used to support the plate body 102, reducing the contact area between the heat insulation cover 400 and the heating plate 100, and then reducing heat transfer to achieve the heat insulation effect. Secondly, the second gap 402 is used to communicate with the first gap 202 to facilitate vacuum pumping, which helps to improve production efficiency.

[0058] Reference Figure 4 In some embodiments, the outer peripheral dimension of the heat shield 400 is larger than that of the heating plate 100, so that the second gap 402 extends to the circumferential side of the heating plate 100. At the same time, the pressing plate 300 abuts against the first end face of the heating plate 100, and there is a distance between the heat shield 400 and the pressing plate 300, so as to form an air passage for the first gap 202 to communicate with the second gap 402. With the structural arrangement of this embodiment, both the first gap 202 and the second gap 402 can provide heat insulation, and at the same time, it is convenient to evacuate the air through mutual connection.

[0059] Furthermore, in some embodiments, an isolation cover 500 and an isolation plate 600 are provided on the side of the heater away from the opening of the base 200. The isolation cover 500 and the isolation plate 600 are arranged at intervals to form multiple heat insulations.

[0060] In addition, the present utility model also proposes a semiconductor device applying the above-mentioned heater. It can be understood that by applying the foregoing heater, the semiconductor device in the present utility model can meet the operation requirements at 1000 °C, and at the same time can ensure the service life and the requirements for evacuation.

[0061] The embodiments of the present utility model have been described in detail above with reference to the drawings. However, the present utility model is not limited to the above embodiments. Without departing from the gist of the present utility model, various changes can be made within the knowledge scope of those of ordinary skill in the art. In addition, the embodiments of the present utility model and the features in the embodiments can be combined with each other without conflict.

Claims

1. A heater, characterized in that, Comprising: A heating plate, which is formed by splicing at least two plate bodies. The heating plate includes a first end face and a second end face. In the direction from the first end face to the second end face, the heating plate is provided with a dovetail groove; A heating wire, which is embedded in the dovetail groove; Wherein, the plate body is made of ceramic material, and the heating wire is made of platinum-rhodium alloy material.

2. The heater according to claim 1, characterized in that, The plate bodies are spliced around a center to form the circular heating plate, and the dovetail grooves are distributed around the center of the heating plate in a spiral divergence form to each of the plate bodies.

3. The heater according to claim 1, characterized in that The heater further includes a base and a pressing plate. The base is provided with an installation cavity with one end open. The heating plate is installed in the installation cavity, and the first end face is kept facing the opening. The pressing plate is connected to the base, and the pressing plate abuts against the edge position of the first end face.

4. The heater according to claim 3, characterized in that, The heater further includes a heat insulation cover, and the heat insulation cover is sleeved on the heating plate in the direction from the second end face to the first end face.

5. The heater according to claim 4, characterized in that, The base protrudes and is provided with a plurality of setscrew assemblies at one end of the installation cavity facing the second end face, and the ends of the setscrew assemblies abut against the heat insulation cover.

6. The heater according to claim 5, characterized in that, There is a first gap between the heat insulation cover and the side wall of the installation cavity. The base is provided with a first air hole on the side wall of the installation cavity, and the first air hole communicates with the first gap.

7. The heater according to claim 6, characterized in that, The base is provided with a plurality of threaded holes for installing the pressing plate on the periphery of the installation cavity. The number of the first air holes is greater than or equal to the number of the threaded holes, and each threaded hole intersects at least one of the first air holes.

8. The heater according to claim 6, characterized in that, Each plate body is recessed with a positioning recess in the direction from the second end face to the first end face. One end of the heat insulation cover facing the second end face protrudes and is provided with a plurality of positioning protrusions. The positioning protrusions are inserted into the positioning recesses, and the height of the positioning protrusions is greater than the depth of the positioning recesses, so as to form a second gap between the heat insulation cover and the heating plate. The heat insulation cover is provided with a second air hole for communicating the second gap with the first gap.

9. The heater according to claim 8, characterized in that, The second gap extends to the periphery of the heating plate, and there is an air passage for communicating the first gap with the second gap between the pressing plate and the heat insulation cover.

10. A semiconductor device, characterized in that, Applying the heater according to any one of claims 1 to 9.

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