Circuit board convenient for heat dissipation
By designing structures such as micro-radiation fans, U-shaped support plates and thermal conduction plates on the circuit board, the problem of difficult heat dissipation of circuit boards is solved, and efficient heat conduction and component stability are achieved.
Patent Information
- Application Number
- CN202421600771.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-08
- Publication Date
- 2025-07-04
- Estimated Expiration
- 2034-07-08
AI Technical Summary
The heat generated by the circuit board during use is difficult to effectively disperse, causing electronic components to overheat and affecting working efficiency.
A circuit board structure is designed to facilitate heat dissipation, including a base, a micro-heat dissipation fan, a U-shaped support plate, a heat conduction plate and a heat dissipation plate. The heat conduction plate and a heat dissipation plate are blown and heat conduction are used to increase the heat conduction effect, and the support plate and the pressure seat are fixed at the limit.
Effectively dissipate heat on the circuit board, avoid overheating of electronic components, and improve work efficiency and stability.
Smart Images
Figure CN223067254U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit boards, in particular to a circuit board convenient for heat dissipation. Background Art
[0002] A circuit board is also called a printed circuit board. The circuit board miniaturizes and visualizes the circuit, and plays an important role in the mass production of fixed circuits and the optimization of the layout of electrical appliances. According to the number of layers, circuit boards are divided into three major categories: single-sided boards, double-sided boards, and multi-layer circuit boards. A single-sided board, on the most basic PCB, components are concentrated on one side, and conductors are concentrated on the other side. Since the conductors only appear on one side, this kind of PCB is called a single-sided circuit board. Single-sided boards are usually simple to manufacture and low in cost, but the disadvantage is that they cannot be applied to too complex products. A double-sided board is an extension of a single-sided board. When single-layer wiring cannot meet the needs of electronic products, a double-sided board is used. There is copper plating and traces on both sides, and the circuits between the two layers can be conducted through vias to form the required network connections. A multi-layer board refers to a printed circuit board formed by laminating three or more conductive pattern layers and the insulating materials between them with intervening layers, and the conductive patterns are interconnected as required. Multi-layer circuit boards are the products of the development of electronic information technology towards high speed, multi-function, large capacity, small volume, thinness, and light weight.
[0003] In the prior art, when a circuit board is in use, a large amount of heat is generated when the electronic components arranged on the circuit board work. Generally, the circuit board is arranged inside various machines, and the ventilation is poor. The heat is easy to accumulate on the circuit board and cannot be dissipated, thus burning out the electronic components and affecting the working efficiency. Based on this, this application proposes a circuit board convenient for heat dissipation to solve the above problems. Summary of the Utility Model
[0004] The purpose of the utility model is to overcome the shortcomings of the prior art and provide a circuit board convenient for heat dissipation.
[0005] The purpose of the utility model is realized through the following technical solutions: A circuit board convenient for heat dissipation, including a base. A plurality of micro cooling fans are installed in the middle of the top surface of the base. Support plates that can slide left and right are installed on both sides of the outside of the base. The overall shapes of the two support plates are both U-shaped, with their openings facing each other, and one side is long and the other side is short. A circuit board is placed on the top surface between the two support plates. Elastic plates are installed on both sides of the middle position of the top surface of the base, and a heat conducting plate is placed between them, which is attached to the bottom surface of the circuit board. A plurality of uniformly arranged heat dissipation plates are installed on the outer surfaces of the long sides of the two support plates. Pressure seats are installed at both ends of the top surfaces of the two support plates, and the four pressure seats are respectively located at the four corners outside the circuit board.
[0006] Optionally, through slots are formed on both sides of the top surface of the base, and limiting through slots are formed on the inner walls of the outer sides thereof. The long sides of the two support plates are slidably installed in the limiting through slots. Long slots are formed in the middle positions of the long sides of the two support plates. Threaded rods are installed in the middle positions of the bottom walls of the two limiting through slots respectively, and the threaded rods penetrate through the two long slots respectively. Locking caps are installed on the outer parts of the two threaded rods in a threaded manner.
[0007] Optionally, a plurality of uniformly arranged slots are formed in the middle position of the top surface of the base. The two slingshot plates are both U-shaped, and their two ends are respectively inserted into any group of slots.
[0008] Optionally, a plurality of uniformly arranged card slots are formed on both sides of the top surfaces of the two support plates. Plug blocks are installed on the bottom surfaces of the four pressing seats, and the plug blocks are inserted into any card slot.
[0009] Optionally, a plurality of uniformly arranged mounting openings are formed in the middle position of the top surface of the base. A plurality of micro cooling fans are respectively installed in the plurality of mounting openings.
[0010] The utility model has the following advantages:
[0011] For the circuit board convenient for heat dissipation, the circuit board is installed on the base. A plurality of micro cooling fans are installed in the middle position of the base, and the circuit board can be blown and cooled by the micro cooling fans. Two support plates with a U-shaped overall structure are slidably installed on both sides of the outside of the base, and the support plates can be fixed by the locking caps, so as to facilitate placing circuit boards of different specifications on the two support plates. Moreover, a plurality of heat dissipation plates are installed on the outer surfaces below the support plates, and the contact area with the air is increased by the heat dissipation plates, so as to improve the heat conduction effect.
[0012] Among them, slingshot plates are installed on both sides of the middle position of the top surface of the base. A heat conduction plate is installed on the two slingshot plates, and the heat conduction plate is in contact with the bottom surface of the circuit board. The heat generated by the circuit board is conducted by the heat conduction plate, so that the heat can be taken out by the flowing air.
[0013] Among them, a plurality of uniformly arranged card slots are formed on both sides of the top surfaces of the two support plates. A pressing seat is clamped in any card slot. The four pressing seats are placed at the four corners outside the circuit board, and the circuit board is limited and pressed by the pressing seats, so as to avoid the circuit board from shaking and affecting the use and processing. Description of the Drawings
[0014] Figure 1 is the first perspective schematic diagram of the overall structure in the utility model;
[0015] Figure 2 is the second perspective schematic diagram of the overall structure in the utility model;
[0016] Figure 3 is the Figure 1 internal structure schematic diagram of the utility model;
[0017] Figure 4 This is the overall structural schematic diagram of the base in the present utility model;
[0018] Figure 5 This is the overall structural schematic diagram of the support plate in the present utility model;
[0019] Figure 6 This is the overall structural schematic diagram of the pressing seat in the present utility model.
[0020] In the figure: 1 - base, 2 - support plate, 3 - circuit board, 4 - pressing seat, 5 - mini cooling fan, 6 - locking cap, 7 - heat conducting plate, 8 - installation opening, 9 - through groove, 10 - limiting through groove, 11 - threaded rod, 12 - slot, 13 - slingshot plate, 14 - heat dissipation plate, 15 - card slot, 16 - long slot opening. Specific embodiments
[0021] The following further describes the present utility model with reference to the accompanying drawings, but the protection scope of the present utility model is not limited to the following.
[0022] As Figures 1 to 6 shown, a circuit board facilitating heat dissipation includes a base 1. A plurality of mini cooling fans 5 are installed in the middle of the top surface of the base 1. Support plates 2 that can slide left and right are installed on both sides of the outside of the base 1. The overall shapes of the two support plates 2 are both U-shaped, with their openings facing each other and one side being long and the other side being short. A circuit board 3 is placed on the top surface between the two support plates 2. Slingshot plates 13 are installed on both sides of the middle of the top surface of the base 1, and a heat conducting plate 7 is placed between them, which is in contact with the bottom surface of the circuit board 3. A plurality of heat dissipation plates 14 arranged in a uniform array are installed on the outer surfaces of the long sides of the two support plates 2. Pressing seats 4 are installed at both ends of the top surfaces of the two support plates 2, and the four pressing seats 4 are respectively located at the four corners outside the circuit board 3.
[0023] As an alternative technical solution of the present utility model, through grooves 9 are opened on both sides of the top surface of the base 1, and limiting through grooves 10 are opened on the inner walls of their outsides. The long sides of the two support plates 2 are slidably installed in the limiting through grooves 10. Long slot openings 16 are opened in the middle of the long sides of the two support plates 2. Threaded rods 11 are installed in the middle of the bottom walls of the two limiting through grooves 10, which respectively penetrate through the two long slot openings 16. Locking caps 6 are threadedly installed on the outsides of the two threaded rods 11. The size of the long side of the support plate 2 is adapted to the size inside the limiting through groove 10 to prevent the support plate 2 from shaking. Moreover, after the threaded rod 11 penetrates through the long slot opening 16, the movement stroke of the support plate 2 can be limited, and the position of the support plate 2 can be fixed by tightening the locking cap 6.
[0024] As an alternative technical solution of the present utility model, a plurality of uniformly arrayed slots 12 are provided in the middle of the top surface of the base 1. Both of the slingshot plates 13 are U-shaped, and their two ends are respectively inserted into any group of slots 12. This facilitates the installation and disassembly of the slingshot plates 13, and by adjusting the installation positions of the slingshot plates 13, heat conducting plates 7 of different sizes can be supported.
[0025] As an alternative technical solution of the present utility model, a plurality of uniformly arrayed card slots 15 are provided on both sides of the top surfaces of the two support plates 2. Plug blocks 17 are installed on the bottom surfaces of the four pressure seats 4, and they are inserted into any card slot 15. This facilitates the use of the pressure seats 4 to limit and place circuit boards 3 of different specifications, and prevents the circuit boards 3 from shifting.
[0026] As an alternative technical solution of the present utility model, a plurality of uniformly arrayed mounting openings 8 are provided in the middle of the top surface of the base 1. A plurality of micro cooling fans 5 are respectively installed in the plurality of mounting openings 8.
[0027] In summary, the features, assembly methods, usage processes, and functions achieved by the various components in the present utility model are as follows: The circuit board 3 is installed on the base 1. A plurality of micro cooling fans 5 are installed in the middle of the base 1, which can blow air to cool the circuit board 3. Two U-shaped support plates 2 are slidably installed on both sides outside the base 1, and they can be fixed by the locking caps 6, so as to facilitate placing circuit boards 3 of different specifications on the two support plates 2. A plurality of heat conducting plates 14 are installed on the outer surfaces below the support plates 2, which increases the contact area with the air and improves the heat conduction effect. Slingshot plates 13 are installed on both sides in the middle of the top surface of the base 1. Heat conducting plates 7 are installed on the two slingshot plates 13, which are in contact with the bottom surface of the circuit board 3, and conduct the heat generated by the circuit board 3, so that the heat can be taken out by the flowing air. A plurality of uniformly arrayed card slots 15 are provided on both sides of the top surfaces of the two support plates 2. Pressure seats 4 are clamped in any card slot 15. The four pressure seats 4 are placed at the four corners outside the circuit board 3, which limit and press the circuit board 3 to prevent the circuit board 3 from shaking and affecting use and processing.
[0028] Although the embodiments of the present utility model have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.
Claims
1. A circuit board facilitating heat dissipation, characterized in that: It includes a base (1). A plurality of micro cooling fans (5) are installed in the middle of the top surface of the base (1). Support plates (2) that can slide left and right are installed on both sides outside the base (1). The overall shape of the two support plates (2) is U-shaped, with their openings facing each other and one side being long and the other side being short. A circuit board (3) is placed on the top surface between the two support plates (2). Elastic plates (13) are installed on both sides of the middle position of the top surface of the base (1). A heat conducting plate (7) is placed between them, which is in contact with the bottom surface of the circuit board (3). A plurality of heat dissipation plates (14) arranged evenly in an array are installed on the outer surfaces of the long sides of the two support plates (2). Pressure seats (4) are installed at both ends of the top surfaces of the two support plates (2). The four pressure seats (4) are respectively located at the four corners outside the circuit board (3).
2. The circuit board facilitating heat dissipation according to claim 1, wherein: Through grooves (9) are opened on both sides of the top surface of the base (1), and limiting through grooves (10) are opened on the inner walls of their outer sides. The long sides of the two support plates (2) are slidably installed in the limiting through grooves (10). Long slot openings (16) are opened in the middle positions of the long sides of the two support plates (2). Threaded rods (11) are installed in the middle positions of the bottom walls of the two limiting through grooves (10), which respectively penetrate through the two long slot openings (16). Locking caps (6) are threadedly installed on the outer parts of the two threaded rods (11).
3. The circuit board facilitating heat dissipation according to claim 1, wherein: A plurality of evenly arranged slots (12) are opened in the middle of the top surface of the base (1). The two elastic plates (13) are both U-shaped, and their two ends are respectively inserted into any group of slots (12).
4. A circuit board facilitating heat dissipation according to claim 1, characterized in that: A plurality of evenly arranged card slots (15) are opened on both sides of the top surfaces of the two support plates (2). Insert blocks (17) are installed on the bottom surfaces of the four pressure seats (4), which are inserted into any card slot (15).
5. A circuit board facilitating heat dissipation according to claim 1, wherein: A plurality of evenly arranged mounting openings (8) are opened in the middle of the top surface of the base (1). The plurality of micro cooling fans (5) are respectively installed in the plurality of mounting openings (8).