Heat dissipation type power adapter

Abstract

The utility model discloses a power adapter, and particularly relates to a heat dissipation type power adapter. Comprising an upper shell, a lower shell, an upper aluminum shell, a lower aluminum shell, a PCB, a heat conduction patch and a polyurethane foam board, the upper shell is clamped on the lower shell, the upper aluminum shell is clamped on the lower aluminum shell, the upper aluminum shell and the lower aluminum shell are arranged between the upper shell and the lower shell, an insulation assembly is arranged on the outer side of the PCB, and a heat conduction patch is arranged on the heat conduction patch. The PCB is arranged between the upper aluminum shell and the lower aluminum shell through a plurality of groups of fixing assemblies, the heat conduction patch is arranged at the bottom of the PCB, the polyurethane foam board is arranged at the top of the PCB, and a plurality of trapezoidal heat dissipation grooves are formed in one side of the lower aluminum shell at intervals. The heat dissipation area is increased by forming the trapezoidal heat dissipation grooves in the bottom of the lower aluminum shell, the heat dissipation patches can be compacted and fixed through the fixing assemblies to increase the heat dissipation capacity, the temperature difference inside and outside the aluminum shell is balanced through the heat conduction patches on the two sides of the PCB, the polyurethane foam board and the heat pipes, and heat backflow is avoided to accelerate heat dissipation.

Description

Technical Field

[0001] The utility model relates to the field of power adapters, and particularly relates to a heat-dissipating power adapter. Background Technique

[0002] Power adapters are an indispensable part of modern electronic devices. Their main function is to convert the alternating current provided by the power grid into direct current suitable for use by electronic devices, and at the same time adjust the voltage and current. With the progress of technology, the power of power adapters increases while the volume decreases. When high-power power adapters are working, the heat generated by the components inside the power adapter is much higher than that of conventional adapters. Due to the small volume, it is difficult for the heat to dissipate inside the power adapter, resulting in extremely high local temperature, which causes the temperature of the outer shell of the power adapter to increase accordingly. The heat cannot be dissipated in time, which affects the normal use of the product. Moreover, the existing power adapter structures are arranged in a scattered manner, with numerous processes and difficult assembly. Summary of the Invention

[0003] The purpose of the utility model is to provide a heat-dissipating power adapter to solve the problems that with the progress of technology, the power of power adapters increases while the volume decreases. When high-power power adapters are working, the heat generated by the components inside the power adapter is much higher than that of conventional adapters. Due to the small volume, it is difficult for the heat to dissipate inside the power adapter, resulting in extremely high local temperature, which causes the temperature of the outer shell of the power adapter to increase accordingly. The heat cannot be dissipated in time, which affects the normal use of the product. Moreover, the existing power adapter structures are arranged in a scattered manner, with numerous processes and difficult assembly.

[0004] To achieve this purpose, the utility model adopts the following technical solutions:

[0005] Provide a heat-dissipating power adapter, including an upper shell, a lower shell, an upper aluminum shell, a lower aluminum shell, a PCB board, a heat-conducting patch, and a polyurethane foam board. The upper shell is snap-connected to the lower shell, the upper aluminum shell is snap-connected to the lower aluminum shell, and the upper aluminum shell and the lower aluminum shell are arranged between the upper shell and the lower shell. An insulating component is arranged outside the PCB board. The PCB board is arranged between the upper aluminum shell and the lower aluminum shell through multiple sets of fixing components. The heat-conducting patch is arranged at the bottom of the PCB board, the polyurethane foam board is arranged at the top of the PCB board, and a plurality of trapezoidal heat dissipation grooves are spaced apart on one side of the lower aluminum shell.

[0006] As a preferred solution of a heat-dissipating power adapter, the insulating component includes a first insulating sheet, the first insulating sheet is arranged at the bottom of the PCB board, fixing plates are arranged on both sides of the first insulating sheet, second insulating sheets are arranged at the tops of both sides of the fixing plates, and the first insulating sheet and the second insulating sheet are located on both sides of the PCB board and fix the PCB board.

[0007] As a preferred solution of a heat-dissipating power adapter, a plurality of plug-in devices and surface-mounted devices are provided on both the upper and lower surfaces of the PCB board, and the plug-in devices and the surface-mounted devices include a rectifier bridge and a switching MOS.

[0008] As a preferred solution of a heat-dissipating power adapter, the fixing component includes fixing columns, the fixing columns are heat pipes, springs and pressing pieces are sleeved on the fixing columns, the pressing pieces are located at the bottoms of the springs to press the PCB board, and a layer of thermal paste is provided between the thermal patch and both the first insulating sheet and the lower aluminum shell.

[0009] Advantages of the present utility model:

[0010] By providing trapezoidal heat dissipation grooves at the bottom of the lower aluminum shell, the heat dissipation area is increased while the heat conduction transfer efficiency is improved. Moreover, part of the heat is dispersed through the fixing component, and the heat dissipation patch can also be compacted to increase the heat dissipation capacity.

[0011] The temperature difference inside and outside the aluminum shell is balanced by the thermal patches on both sides of the PCB board and the polyurethane foam board and the heat pipes, avoiding heat reflux and thus accelerating heat dissipation. Description of the drawings

[0012] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required to be used in the embodiments of the present utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0013] Figure 1 is a three-dimensional structural schematic diagram of a heat-dissipating power adapter according to an embodiment of the present utility model.

[0014] Figure 2 is an exploded structural schematic diagram of a heat-dissipating power adapter according to an embodiment of the present utility model.

[0015] Figure 3 is a three-dimensional structural schematic diagram of parts such as the upper aluminum shell, the lower aluminum shell and the PCB board of a heat-dissipating power adapter according to an embodiment of the present utility model.

[0016] In the figure:

[0017] 1, upper shell; 2, lower shell; 3, upper aluminum shell; 4, lower aluminum shell; 5, PCB board; 6, first insulating sheet; 7, fixing plate; 8, second insulating sheet; 9, fixing column; 10, spring; 11, pressing piece; 12, thermal patch; 13, polyurethane foam board. Detailed implementation manners

[0018] The technical solution of the present utility model will be further described below in conjunction with the accompanying drawings and through specific embodiments.

[0019] Among them, the accompanying drawings are only for illustrative purposes, showing only schematic diagrams, rather than physical diagrams, and should not be construed as a limitation on this patent; in order to better illustrate the embodiments of the present utility model, some components in the accompanying drawings will be omitted, enlarged or reduced, and do not represent the dimensions of the actual product; for those skilled in the art, it is understandable that some well-known structures and their descriptions in the accompanying drawings may be omitted.

[0020] In the accompanying drawings of the embodiments of the present utility model, the same or similar reference numerals correspond to the same or similar components; in the description of the present utility model, it should be understood that if terms such as "upper", "lower", "left", "right", "inner", "outer", etc. are used to indicate the orientation or positional relationship, it is based on the orientation or positional relationship shown in the accompanying drawings. This is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms used to describe the positional relationship in the accompanying drawings are only for illustrative purposes and should not be construed as a limitation on this patent. For those of ordinary skill in the art, the specific meanings of the above terms can be understood according to specific circumstances.

[0021] In the description of the present utility model, unless otherwise clearly specified and limited, if terms such as "connection" are used to indicate the connection relationship between components, this term should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0022] Such as Figures 1-3As shown in the figure, the utility model provides a technical solution: a heat-dissipating power adapter, which includes an upper shell 1, a lower shell 2, an upper aluminum shell 3, a lower aluminum shell 4, a PCB board 5, a heat-conducting patch 12, and a polyurethane foam board 13. The upper shell 1 is snap-connected to the top of the lower shell 2, and the upper aluminum shell 3 is snap-connected to the top of the lower aluminum shell 4. After the upper aluminum shell 3 and the lower aluminum shell 4 are snap-connected, they are placed between the upper shell 1 and the lower shell 2. An insulating component is arranged on the outer side of the PCB board 5. The insulating component is an insulating vein pull sheet to prevent the PCB board 5 from short-circuiting. The PCB board 5 is fixed between the upper aluminum shell 3 and the lower aluminum shell 4 through multiple fixing components. A total of four groups of fixing components are provided, which are respectively located at the four corners of the top of the lower aluminum shell 4. A number of trapezoidal heat dissipation grooves are equidistantly spaced on the bottom of the lower aluminum shell 4. By means of the trapezoidal heat dissipation grooves, while increasing the heat dissipation area, the heat conduction transfer efficiency is improved. A plurality of plug-in devices and patch devices are arranged on both the upper and lower surfaces of the PCB board 5. The plug-in devices and patch devices include a rectifier bridge and a switching MOS. A heat-conducting patch 12 is fixed at the bottom of the insulating component. The heat-conducting patch 12 completely wraps the PCB board 5 and a plurality of plug-in devices and patch devices at the bottom of the PCB board 5. A layer of heat-conducting paste is evenly applied between the contact surface of the heat-conducting patch 12 and the top of the lower aluminum shell 4 to ensure the heat conduction efficiency between the two, and further fill the tiny gaps between the heat-conducting patch 12 and the top surface of the lower aluminum shell 4 to reduce the thermal resistance, so as to effectively transfer the heat generated by the PCB board 5 to the lower aluminum shell 4 quickly through the heat-conducting patch 12. A polyurethane foam board 13 is placed on the top of the PCB board 5 to insulate heat, so as to ensure that the heat on the aluminum shell 3 will not flow back to the top of the PCB board 5.

[0023] As Figure 2 shown in the figure, the insulating component includes a first insulating sheet 6. A fixing plate 7 is installed on both the left and right sides of the first insulating sheet 6. A second insulating sheet 8 is installed on the top of both fixing plates 7. Both the first insulating sheet 6 and the second insulating sheet 8 are insulating vein pull sheets. A layer of heat-conducting paste is evenly applied between the contact surface of the first insulating sheet 6 and the top of the heat-conducting patch 12 to ensure the heat conduction efficiency between the two. The inner bottom of both second insulating sheets 8 catches the top edge of the PCB board 5, thereby fixing the PCB board 5 and preventing the PCB board 5 from short-circuiting while fixing it.

[0024] As Figure 2 shown in the figure, the fixing component includes a fixing column 9. The fixing column 9 is a heat pipe. A spring 10 and a pressing piece 11 are sleeved on the fixing column 9. The pressing piece 11 is located at the bottom of the spring 10. When in use, the PCB board 5 is snap-connected to the fixing column 9, and then a pressing piece 11 and a spring 10 are sleeved on the four fixing columns 9 in sequence. The pressing piece 11 is pressed tightly on the top of the PCB board 5 by the elastic force of the spring 10. While pressing the PCB board 5 tightly, the heat-conducting patch 12 is compacted and fixed, increasing the heat dissipation capacity.

[0025] Working principle: During use, apply thermal paste evenly on the thermal paste patch 12 and then paste it on the inner bottom of the lower aluminum shell 4. Fix the PCB board 5 between the first insulating sheet 6, the fixing plate 7 and the second insulating sheet 8, and position it through the fixing posts 9 to fix the PCB board 5 inside the lower aluminum shell 4. The first insulating sheet 6 is attached to the thermal paste patch 12. Cover the top of the PCB board 5 with the polyurethane foam board 13. Sleeve the pressing pieces 11 and the springs 10 on the surrounding fixing posts 9 in sequence. Cover the upper aluminum shell 3 to compress the springs 10 and thus compress the pressing pieces 11. The pressing pieces 11 compress the bottom PCB board 5 and thus compact the bottom thermal paste patch 12. After the upper aluminum shell 3 is snap-connected to the lower aluminum shell 4, place it between the upper shell 1 and the lower shell 2.

[0026] It should be noted that the above specific implementation manners are only the preferred embodiments of the present utility model and the applied technical principles. Those skilled in the art should understand that various modifications, equivalent replacements, changes, etc. can be made to the present utility model. However, as long as these transformations do not deviate from the spirit of the present utility model, they should be within the protection scope of the present utility model. In addition, some terms used in the specification and claims of this application are not restrictive, but are only for the convenience of description.

Claims

1. A heat-dissipating power adapter, characterized in that, It includes an upper shell (1), a lower shell (2), an upper aluminum shell (3), a lower aluminum shell (4), a PCB board (5), a heat-conducting patch (12) and a polyurethane foam board (13). The upper shell (1) is snap-connected to the lower shell (2), the upper aluminum shell (3) is snap-connected to the lower aluminum shell (4), and the upper aluminum shell (3) and the lower aluminum shell (4) are arranged between the upper shell (1) and the lower shell (2). An insulating component is arranged on the outer side of the PCB board (5). The PCB board (5) is arranged between the upper aluminum shell (3) and the lower aluminum shell (4) through a plurality of fixing components. The heat-conducting patch (12) is arranged at the bottom of the PCB board (5), and the polyurethane foam board (13) is arranged at the top of the PCB board (5). A plurality of trapezoidal heat dissipation grooves are spaced apart on one side of the lower aluminum shell (4).

2. The heat-dissipating power adapter according to claim 1, wherein The insulating component includes a first insulating sheet (6). The first insulating sheet (6) is arranged at the bottom of the PCB board (5). Fixing plates (7) are arranged on both sides of the first insulating sheet (6). Second insulating sheets (8) are arranged at the tops of the fixing plates (7) on both sides. The first insulating sheet (6) and the second insulating sheets (8) are located on both sides of the PCB board (5) and fix the PCB board (5).

3. The heat-dissipating power adapter according to claim 1, wherein, A plurality of plug-in devices and surface-mounted devices are arranged on both the upper and lower surfaces of the PCB board (5). The plug-in devices and the surface-mounted devices include a rectifier bridge and a switching MOS.

4. The heat dissipating power adapter according to claim 2, wherein The fixing component includes a fixing column (9). The fixing column (9) is a heat pipe. A spring (10) and a pressing piece (11) are sleeved on the fixing column (9). The pressing piece (11) is located at the bottom of the spring (10) to press the PCB board (5). A layer of thermal paste is arranged between the heat-conducting patch (12) and the first insulating sheet (6) and between the heat-conducting patch (12) and the lower aluminum shell (4).

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