Detachable wafer cleaning device

Abstract

The utility model discloses a detachable wafer cleaning device which comprises a base frame, a cleaning structure and a moving structure, the cleaning structure is detachably installed on the base frame and used for cleaning a wafer, and a first assembling assembly is arranged below the cleaning structure; the moving structure comprises moving wheels and a second assembling assembly, the second assembling assembly is installed at the top ends of the moving wheels, and the second assembling assembly is assembled on the first assembling assembly so that the moving wheels can be installed at the bottom end of the cleaning structure. According to the structure, the first assembling assembly and the external second assembling assembly are arranged below the cleaning structure, when an old cleaning structure needs to be replaced, the old cleaning structure can be replaced through the steps, and the old cleaning structure can be moved out more conveniently in a labor-saving mode.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer cleaning, and particularly relates to a detachable wafer cleaning device. Background Art

[0002] For the semiconductor industry, with the continuous reduction of the critical dimensions of semiconductor devices and the introduction of new materials, during the manufacturing process of semiconductor devices, the requirements for the cleanliness of the surface of semiconductor substrates such as wafers are becoming increasingly stringent. Nowadays, the requirements for the ability to remove contaminants on the substrate and the degree of etching and structural damage on the substrate surface are getting higher and higher. Contaminants on the substrate such as particles, organic substances, and metals usually need to be removed by chemical reactions or physical forces to overcome the gravitational force of chemical bonds or physical adhesion forces.

[0003] Currently, the existing cleaning devices for such requirements all use mass production models / semi-automatic equipment, and for the tank-type cleaning equipment, it can only be fixed for corresponding different processes. If there are requirements for other processes, it is rather troublesome to replace the cleaning module. Summary of the Utility Model

[0004] Therefore, the technical problem to be solved by the utility model is that the existing cleaning devices for such requirements all use mass production models / semi-automatic equipment, and for the tank-type cleaning equipment, it can only be fixed for corresponding different processes. If there are requirements for other processes, it is rather troublesome to replace the cleaning module.

[0005] For this reason, the utility model provides a detachable wafer cleaning device, which includes:

[0006] A base frame;

[0007] A cleaning structure, which is detachably installed on the base frame, is used for cleaning the wafer, and a first assembly component is arranged below the cleaning structure;

[0008] Wherein, a moving structure is further included, the moving structure includes moving wheels and a second assembly component, the second assembly component is installed at the top of the moving wheels, and the second assembly component is assembled on the first assembly component to install the moving wheels at the bottom of the cleaning structure.

[0009] Optionally, the above-mentioned first assembly component includes two relatively arranged first assembly parts, and first assembly grooves are formed on the inner sides of the two first assembly parts, and both sides of the second assembly component are respectively inserted into the corresponding first assembly grooves.

[0010] Optionally, the above-mentioned second assembly component includes:

[0011] A support column, which is connected to the moving wheel;

[0012] A support part, which is arranged on both sides of the bottom end of the support column and can be inserted into the first assembly groove;

[0013] An abutting part, which is connected to the support column and can abut against the top end of the first assembly.

[0014] Optionally, the above-mentioned second assembly component further includes a fixing plate, which is fixed on the two first assemblies.

[0015] Optionally, a plurality of the above-mentioned cleaning structures are provided;

[0016] The cleaning structure includes a base shell, a process tank and a cleaning tank. The base shell is adapted to be connected to the base frame, and both the process tank and the cleaning tank are connected to the base shell.

[0017] Optionally, an air extraction port is provided on the above-mentioned cleaning structure, and an air extraction flange is installed on the air extraction port, and the air extraction flange is adapted to be connected to an air extraction pipeline.

[0018] Optionally, the above-mentioned detachable wafer cleaning device further includes: a cover body and a driving member. The cover body is arranged at the notch position of the process tank, and the driving member is connected to the cover body, and the driving member is used to drive the cover body to approach or move away from the notch of the process tank.

[0019] Optionally, the above-mentioned cleaning tank includes a cleaning tank body and a quick discharge valve. The cleaning tank body is installed on the base shell, and the quick discharge valve is installed at the bottom end of the cleaning tank body and is connected to a pipeline structure.

[0020] Optionally, a closable accommodation space is built in the above-mentioned base frame, and all the cleaning structures are arranged in the accommodation space;

[0021] The cleaning structure further includes an exhaust member, which is used to extract the gas in the accommodation space to the outside.

[0022] Optionally, the above-mentioned wafer cleaning device further includes:

[0023] A first filter member, which is arranged on the base frame to filter the gas flowing from the outside into the accommodation space.

[0024] The technical solution provided by the present utility model has the following advantages:

[0025] 1. The detachable wafer cleaning device provided by the present utility model includes: a base frame, a cleaning structure, and a moving structure. The cleaning structure is detachably mounted on the base frame. The cleaning structure is used for cleaning wafers, and a first assembly component is provided below the cleaning structure; the moving structure includes moving wheels and a second assembly component. The second assembly component is mounted on the top of the moving wheels, and the second assembly component is assembled on the first assembly component to mount the moving wheels at the bottom end of the transmission structure.

[0026] With this structure, by providing a first assembly component below the cleaning structure and an external second assembly component, when it is necessary to replace the old cleaning structure, it is more convenient and labor-saving to remove the old cleaning structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the specific embodiments of the present utility model or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the description of the specific embodiments or the prior art. Obviously, the following drawings are some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0028] Figure 1 It is a schematic diagram of the overall structure of the detachable wafer cleaning device provided in the present utility model;

[0029] Figure 2 It is a schematic diagram of the overall structure of the cleaning structure provided in the present utility model;

[0030] Figure 3 It is a schematic diagram of the overall structure of the process tank provided in the present utility model;

[0031] Figure 4 It is a schematic diagram of the overall structure of the cleaning tank provided in the present utility model;

[0032] Figure 5 It is a bottom view of the cleaning structure provided in the present utility model;

[0033] Figure 6 It is a schematic diagram of the structure of the moving structure provided in the present utility model;

[0034] Figure 7 It is a bottom view of the detachable wafer cleaning device provided in the present utility model;

[0035] Description of the reference numerals:

[0036] 1 - Base frame; 11 - First filter element;

[0037] 2 - Cleaning structure; 21 - Process tank; 22 - Cleaning tank; 221 - Cleaning tank body; 222 - Quick discharge valve;

[0038] 3 - Moving structure; 31 - First assembly component; 311 - First assembly part; 312 - First assembly groove; 32 - Second assembly component; 321 - Support column; 322 - Support part; 323 - Contact part; 324 - Fixed plate; 33 - Moving wheel;

[0039] 4 - Pipeline structure;

[0040] 51 - Exhaust flange; 52 - Drain pipe. Detailed implementation manners

[0041] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Apparently, the described embodiments are some, but not all, of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without making creative efforts shall fall within the protection scope of the present utility model.

[0042] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0043] In the description of the present utility model, it should be noted that unless otherwise clearly defined and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0044] In addition, the technical features involved in different embodiments of the present utility model described below can be combined with each other as long as they do not conflict with each other.

[0045] Embodiment

[0046] This embodiment provides a detachable wafer cleaning device, as Figures 1 to 7As shown in the figure, it includes a base frame 1, a transmission structure, and a cleaning structure 2. The base frame 1 is horizontally placed, and a number of accommodation cavities are horizontally spaced at the bottom end of the base frame 1. The number of the cleaning structures 2 is the same as that of the accommodation cavities, and they are inserted into the accommodation cavities one by one. The cleaning structure 2 includes a base shell, a process tank 21, a cleaning tank 22, and a pipeline structure 4. The base shell is installed in the accommodation cavity on the side of the base frame. Both the process tank 21 and the cleaning tank 22 are connected to the base shell. The process tank 21 is connected to the pipeline structure 4. The cleaning tank 22 includes a cleaning tank body 221 and a quick drain valve 222. The quick drain valve 222 is installed at the bottom end of the cleaning tank body 221 and is connected to the inside of the cleaning tank body 221. The lower part of the quick drain valve 222 is connected to the pipeline structure 4, which speeds up the rapid drainage of the liquid in the cleaning tank 22 and prevents overflow. An air extraction port is provided at the upper end of the cleaning structure 2. An inlet and a drain port are provided on the pipeline structure 4. An air extraction flange 51 is installed on the air extraction port. One end of the air extraction flange 51 away from the air extraction port is connected to an external air extraction pipeline. The drain port is connected to a drain pipe 52, and the inlet is connected to an inlet pipe.

[0047] As Figures 1 to 7 shown in the figure, a moving structure 3 is provided below the cleaning structure 2. The first assembly component 31 includes two relatively arranged first assembly parts 311. The first assembly part 311 is U-shaped, and the open ends of the two first assembly parts 311 forming a group are relatively arranged. The groove of the U-shaped first assembly part 311 is the first assembly groove 312. A second assembly component 32 is fixed on the moving wheel 33. The second assembly component 32 is in the shape of "soil". The second assembly component 32 includes: a support column 321, a support part 322, and an abutting part 323. The support column 321 is vertically arranged. The support part 322 is installed on both sides of the bottom end of the entire support column 321. The abutting part 323 is shorter and is arranged on both sides of the middle part of the support column 321.

[0048] When it is necessary to remove the cleaning structure 2, disconnect the inlet of the pipeline structure 4 from the inlet pipe and the drain port from the drain pipe. At the same time, block the ports of the inlet, the drain port, the inlet pipe, and the drain pipe with plugs to prevent the residual liquid from flowing out. Disconnect the connection between the air extraction pipeline and the air extraction flange 51 and block it with a flange sealing plate. Slowly pull out the cleaning structure 2 from the detachable wafer cleaning device by 1 / 3, and then snap the support part 322 into the first assembly groove 312. At this time, the abutting part 323 abuts against the upper end of the first assembly part 311. Install fixing plates 324 on the front and back sides of the first assembly part 311, then lock the fixing screws, adjust the height of the moving wheel 33 until the caster wheels just touch the ground. After the moving wheel 33 is installed, continue to slowly pull out until it stops at the equipment mark. Repeat the above steps to complete the installation of the moving wheel 33, and then slowly pull out the cleaning structure 2.

[0049] When the cleaning structure needs to be installed, push the cleaning structure 2 to the rear of the detachable wafer cleaning device. Align the cleaning structure with the position where it needs to be installed through the moving wheels 33, slowly push the cleaning structure 2 into the accommodation cavity, and complete the positioning of the cleaning structure 2 by adjusting the side connection screws. After the positioning of the cleaning structure 2 is completed, reconnect the exhaust pipeline, the liquid inlet pipe, and the liquid discharge pipe 52 to the cleaning structure 2.

[0050] By providing a first assembly component 31 below the cleaning structure 2 and an external second assembly component 32, when the old cleaning structure 2 needs to be replaced, it can be replaced through the above steps. When removing the old cleaning structure 2, it is more convenient and labor-saving, improving the replacement efficiency. There are multiple process tanks 21 and cleaning tanks 22, and one process tank 21 corresponds to one process, and this process needs to be implemented according to requirements. Specifically, for example, the cleaning agents in different multi-piece cleaning structures 2 are different.

[0051] Specifically, as Figures 1 to 7 shown, there is a closed accommodation space above the base frame 1, and only an openable and closable inlet and outlet are provided at the loading and unloading area position. The cleaning structure 2 and the transmission structure are arranged in the accommodation space. During the process of wafer cleaning, acid gas will be generated. By fixedly installing an exhaust component on the accommodation space, the acid gas in the accommodation space can be extracted to the outside, preventing the acid gas from corroding the internal components. The wafer cleaning device further includes: a first filter element 11. During the process of the exhaust component extracting air, fresh air needs to enter the accommodation space. At this time, a first filter element 11 is arranged on the base frame 1. While realizing air circulation, it can filter the gas flowing from the outside into the accommodation space, preventing impurities from entering and causing impurities to adhere to the surface of the wafer after cleaning.

[0052] In other implementable ways, the detachable wafer cleaning device further includes: a cover body and a driving component. The cover body is arranged at the notch position of the process tank 21, and the surface area of the cover body is greater than or equal to the area of the notch. The driving component is connected to the cover body, and the driving component is used to drive the cover body to approach or move away from the notch of the process tank 21, facilitating the addition of the cleaning liquid into the process tank 21 and preventing the cleaning liquid from splashing during the cleaning process.

[0053] Obviously, the above embodiments are only examples clearly described and not limitations on the implementation manners. For those of ordinary skill in the art, other different forms of changes or variations can be made based on the above description. It is not necessary and impossible to enumerate all the implementation manners here. And the obvious changes or variations derived therefrom are still within the protection scope of the present invention.

Claims

1. A detachable wafer cleaning device, characterized in that, Comprising: Base frame (1); Cleaning structure (2), the cleaning structure (2) is detachably mounted on the base frame (1), the cleaning structure (2) is used for cleaning the wafer, and a first assembly component (31) is provided below the cleaning structure (2); Wherein, it further includes a moving structure (3), the moving structure (3) includes moving wheels (33) and a second assembly component (32), the second assembly component (32) is mounted on the top of the moving wheels (33), and the second assembly component (32) is assembled on the first assembly component (31) to mount the moving wheels (33) at the bottom end of the cleaning structure (2).

2. The detachable wafer cleaning device according to claim 1, characterized in that, The first assembly component (31) includes two relatively arranged first assembly parts (311), and first assembly grooves (312) are formed on the inner sides of the two first assembly parts (311), and both sides of the second assembly component (32) are respectively inserted into the corresponding first assembly grooves (312).

3. The detachable wafer cleaning device according to claim 2, wherein, The second assembly component (32) includes: Support columns (321), the support columns (321) are connected to the moving wheels (33); Support parts (322), the support parts (322) are arranged on both sides of the bottom end of the support columns (321), and the support parts (322) can be inserted into the first assembly grooves (312); Abutting parts (323), the abutting parts (323) are connected to the support columns (321), and the abutting parts (323) can abut against the top ends of the first assembly parts (311).

4. The detachable wafer cleaning device according to claim 3, wherein, The second assembly component (32) further includes a fixing plate (324), and the fixing plate (324) is fixed on the two first assembly parts (311).

5. The detachable wafer cleaning device according to claim 1, wherein A plurality of the cleaning structures (2) are provided; The cleaning structure (2) includes a base shell, a process tank (21) and a cleaning tank (22), the base shell is adapted to be connected to the base frame (1), and both the process tank (21) and the cleaning tank (22) are connected to the base shell.

6. The detachable wafer cleaning device according to claim 1, wherein, An air extraction port is formed on the cleaning structure (2), and an air extraction flange (51) is installed on the air extraction port, and the air extraction flange (51) is adapted to be connected to an air extraction pipeline.

7. The detachable wafer cleaning device according to claim 5, wherein, The detachable wafer cleaning device further includes: a cover body and a driving member, the cover body is arranged at the notch position of the process tank (21), and the driving member is connected to the cover body, and the driving member is used for driving the cover body to approach or move away from the notch of the process tank (21).

8. The detachable wafer cleaning device according to claim 5, wherein The cleaning tank (22) includes a cleaning tank body (221) and a quick discharge valve (222), the cleaning tank body (221) is mounted on the base shell, and the quick discharge valve (222) is mounted at the bottom end of the cleaning tank body (221) and is connected to a pipeline structure.

9. The detachable wafer cleaning device according to any one of claims 1-8, characterized in that, A closable accommodation space is provided inside the base frame (1), and the cleaning structure (2) is arranged inside the accommodation space; The cleaning structure (2) further includes an exhaust member, and the exhaust member is used for exhausting the gas inside the accommodation space to the outside.

10. The detachable wafer cleaning device according to claim 9, characterized in that, The wafer cleaning device further includes: A first filter member (11), the first filter member (11) is arranged on the base frame (1) to filter the gas flowing from the outside into the accommodation space.

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