Damping insulating die-cutting film assembly
By designing a die-cut film assembly that includes a double-sided adhesive layer, a single-sided adhesive layer and a protective film layer, the bonding, shock absorption and insulation problems of the internal components of the tablet are solved, and the multifunctional adaptability and shock absorption effect of the components are achieved.
Patent Information
- Application Number
- CN202422058867.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-23
- Publication Date
- 2025-07-08
- Estimated Expiration
- 2034-08-23
AI Technical Summary
The prior art is difficult to meet the bonding, shock absorption and insulation needs of electronic components inside tablets, especially inadequate design in terms of shape and convenience.
A shock-absorbing insulating die-cut film assembly is designed, including a double-sided adhesive layer, a single-sided adhesive layer and a protective film layer. By setting through holes and widening parts, bonding, shock-absorbing and insulation functions are achieved to adapt to the installation space and shape of electronic components.
It realizes effective bonding, shock absorption and insulation of electronic components inside the tablet computer, meets assembly needs and enhances the shock absorption and cushioning effect of the components.
Smart Images
Figure CN223074109U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of die-cutting components for electronic products, and particularly refers to a shock-absorbing and insulating die-cutting film component. Background Art
[0002] At present, the designs of electronic products such as computers, mobile phones, and tablet computers are becoming more and more precise, and the size requirements are getting higher and higher. Therefore, the requirements for various composite die-cutting components used inside them are also getting higher and higher. In order to meet the requirements of the fitting and assembling shapes and convenience of certain products, die-cutting components with different shapes, hierarchical structures, and materials need to be designed. Some components in tablet computers require die-cutting components with the comprehensive functions of adhesion, shock absorption, and insulation. Therefore, targeted design of this film component is required to best suit its use. Summary of the Utility Model
[0003] The purpose of the utility model is to provide a shock-absorbing and insulating die-cutting film component for the assembly requirements of internal electronic components in tablet computers.
[0004] The technical solution adopted by the utility model is: a shock-absorbing and insulating die-cutting film component, which includes a double-sided adhesive layer, a single-sided adhesive layer, and a protective film layer as the main materials. Among them, the adhesive surface of the single-sided adhesive layer is attached to the double-sided adhesive layer, the non-adhesive surface of the single-sided adhesive layer is attached to the protective film layer, and one end of the double-sided adhesive layer has a non-overlapping area that is not covered by the single-sided adhesive layer. This non-overlapping area is attached to and covered by the protective film layer; a first through hole is provided in the non-overlapping area of the double-sided adhesive layer; both ends of the protective film layer protrude from both ends of the double-sided adhesive layer, and a second through hole and a third through hole are respectively provided at both ends of the protective film layer; an isolation film layer is also attached outside the double-sided adhesive layer, and the isolation film layer completely covers the double-sided adhesive layer and the protective film layer.
[0005] The width of the non-overlapping area of the double-sided adhesive layer is greater than the width of the single-sided adhesive layer. Correspondingly, the protective film layer also has a widened part that coincides with this non-overlapping area.
[0006] With the above structure of the utility model, a protective film layer, a single-sided adhesive layer, and a double-sided adhesive layer are provided in the main materials of the film component. The second through hole and the third through hole on the protective film layer play the roles of avoiding electronic components and positioning for assembly. The double-sided adhesive layer plays the role of bonding and connecting with components. The first through hole on the double-sided adhesive layer also plays the role of avoiding electronic components. The single-sided adhesive layer and the protective film layer together play the effect of isolation and insulation. At the same time, the multi-layer composite further enhances the shock-absorbing and buffering effect, thus meeting the assembly requirements of tablet computers. Description of the Drawings
[0007] Figure 1 is the exploded structural schematic diagram of the utility model. Detailed Embodiment
[0008] As Figure 1 shown, the present utility model relates to a shock-absorbing and insulating die-cut film assembly. The die-cut film assembly includes a double-sided adhesive layer h2, a single-sided adhesive layer h1, and a protective film layer h3 as main materials. Among them, the adhesive surface of the single-sided adhesive layer h1 is attached to the double-sided adhesive layer h2, the non-adhesive surface of the single-sided adhesive layer h1 is attached to the protective film layer h3, and one end of the double-sided adhesive layer h2 has a non-overlapping area h21 that is not covered by the single-sided adhesive layer h1. The other areas are all covered by the single-sided adhesive h1 and the contour lines are flush. The non-overlapping area h21 is attached to and covered by the protective film layer h3; a first through hole h22 is formed in the non-overlapping area h21 of the double-sided adhesive layer h2; both ends of the protective film layer h3 protrude beyond both ends of the double-sided adhesive layer h2, and a second through hole h31 and a third through hole h32 are respectively provided at both ends of the protective film layer h3; an isolation film layer h4 is also attached outside the double-sided adhesive layer h2, and the isolation film layer h4 completely covers the double-sided adhesive layer h2 and the protective film layer h3.
[0009] The width of the non-overlapping area h21 of the double-sided adhesive layer h2 is greater than the width of the single-sided adhesive layer h1. Correspondingly, the protective film layer h3 also has a widened portion h33 that coincides with the non-overlapping area h21. The width of the other areas of the protective film layer h3 is the same as the width of the single-sided adhesive layer h1, to adapt to the installation space and the requirements of electronic components.
[0010] In this embodiment, the double-sided adhesive layer h2 is a red acrylic double-sided adhesive tape with a thickness of 0.1 mm, which plays a role in bonding with electronic components. The first through hole h22 on it can avoid the parts that do not need or cannot be bonded; the single-sided adhesive layer h1 has a thickness of 0.01 mm, which plays an isolation insulation or shielding role for the electronic components in its covered area. The protective film layer h3 is a protective film with a thickness of 0.1 mm and slightly sticky on one side. It plays a role in positioning and assembling through the second through hole h31 and the third through hole h32 on it. At the same time, it plays a role in protecting the adhesive layer and components within the covered range, and further enhances the shock-absorbing and insulating effect of the entire film assembly.
[0011] In summary, the present utility model sets a protective film layer, a single-sided adhesive layer, and a double-sided adhesive layer in the main materials of the film assembly, which can comprehensively play roles such as bonding, shock absorption and buffering, insulation and shielding, so as to meet the assembly requirements of tablet computers.
[0012] The above embodiments are only exemplary embodiments adopted to illustrate the principle of the present utility model. However, the present utility model is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present utility model, and these modifications and improvements are also regarded as the protection scope of the present utility model.
Claims
1. A shock-absorbing and insulating die-cut film assembly, characterized in that: The die-cut film assembly includes a double-sided adhesive layer, a single-sided adhesive layer, and a protective film layer as main materials. Among them, the adhesive surface of the single-sided adhesive layer is attached to the double-sided adhesive layer, the non-adhesive surface of the single-sided adhesive layer is attached to the protective film layer, and one end of the double-sided adhesive layer has a non-overlapping area that is not covered by the single-sided adhesive layer. This non-overlapping area is attached to and covered by the protective film layer; a first through hole is provided in the non-overlapping area of the double-sided adhesive layer; both ends of the protective film layer protrude from both ends of the double-sided adhesive layer, and a second through hole and a third through hole are respectively provided at both ends of the protective film layer; an isolation film layer is also attached outside the double-sided adhesive layer, and the isolation film layer completely covers the double-sided adhesive layer and the protective film layer.
2. The shock-absorbing and insulating die-cut film assembly according to claim 1, wherein: The width of the non-overlapping area of the double-sided adhesive layer is greater than the width of the single-sided adhesive layer. Correspondingly, the protective film layer also has a widened portion that coincides with this non-overlapping area.