Temperature control device for low-temperature deposition of silicon dioxide

Abstract

The utility model discloses a temperature control device for silicon dioxide low-temperature deposition, which belongs to the technical field of silicon dioxide deposition and comprises a bottom plate and a hot plate, a base plate is arranged between the bottom plate and the hot plate, and a plurality of guide columns are fixed between the base plate and the hot plate. A movable plate is further arranged between the base plate and the bottom plate, a plurality of inserting grooves are formed in the top face of the base plate, two grooves are formed in the inner sides of the inserting grooves, check blocks are fixed to the lower portions of the inner sides of the grooves, inclined faces are formed in the top faces of the check blocks, inserting rods and movable rods are further arranged on the inner sides of the inserting grooves, and clamping grooves are formed in the outer sides of the inserting rods. Two elastic buckles are fixed to the upper end of the movable plate, and two supports are fixed to the bottom face of the bottom plate. According to the utility model, the hot plate can be quickly assembled and disassembled, so that the problem that the hot plate is fixed with the base through screws, and the disassembly and the assembly are relatively inconvenient is solved.

Description

Technical Field

[0001] The utility model belongs to the technical field of silicon dioxide deposition, and more specifically, particularly relates to a temperature control device for low-temperature deposition of silicon dioxide. Background Art

[0002] In the semiconductor manufacturing process, the deposition of thin films is one of the core steps. As an important deposition source, TEOS plays an irreplaceable role especially in the process of generating low-temperature silicon oxide. TEOS is a common silicon source in chemical vapor deposition processes and is generally used to generate SiO2 thin films. Such thin films can be used as dielectric layers, isolation layers, protection layers, etc. In the existing temperature control device for low-temperature deposition of silicon dioxide, the substrate is heated by a hot plate, and the model of the hot plate matches the substrate. Therefore, when replacing the substrate, the corresponding hot plate needs to be replaced. The hot plate is fixed to the base by screws, and the disassembly and installation are relatively inconvenient. Therefore, a temperature control device for low-temperature deposition of silicon dioxide is proposed. Summary of the Utility Model

[0003] Aiming at the deficiencies of the prior art, the utility model provides a temperature control device for low-temperature deposition of silicon dioxide, which can quickly complete the installation and disassembly of the hot plate to solve the problem that the hot plate is fixed to the base by screws and the disassembly and installation are relatively inconvenient as mentioned in the above background art.

[0004] To achieve the above purposes, the utility model is realized through the following technical solutions: A temperature control device for low-temperature deposition of silicon dioxide includes a bottom plate and a hot plate. A substrate is provided between the bottom plate and the hot plate. A plurality of guide posts are fixed between the substrate and the bottom plate. A movable plate is also provided between the substrate and the bottom plate. A plurality of slots are opened on the top surface of the substrate. Two grooves are opened on the inner side of the slots. A stop block is fixed to the lower part of the inner side of the grooves. An inclined surface is opened on the top surface of the stop block. A plug rod and a movable rod are also provided on the inner side of the slots. A clamping groove is opened on the outer side of the plug rod. Two elastic buckles are fixed to the upper end of the movable plate. Two supports are fixed to the bottom surface of the bottom plate. A transmission shaft is rotatably connected between the two supports. A worm is rotatably connected to the outer side of one of the supports. A handle is fixed to one end of the worm. A worm gear is meshed and connected to the outer side of the worm. One end of the rotating shaft of the worm gear is coaxially fixed to one end of the rotating shaft of the transmission shaft. A first connecting rod is fixed to the outer side of the transmission shaft. A second connecting rod is rotatably connected between the first connecting rod and the movable plate.

[0005] As a preferred technical solution of the utility model, the plurality of guide posts are parallel to each other.

[0006] As a preferred technical solution of the utility model, the bottom plate is parallel to the movable plate and the substrate.

[0007] As a preferred technical solution of the present utility model, the elastic buckle is located inside the groove.

[0008] As a preferred technical solution of the present utility model, the upper end of the insertion rod is fixedly connected to the bottom surface of the hot plate, and the lower end of the movable rod is fixedly connected to the top surface of the movable plate.

[0009] As a preferred technical solution of the present utility model, the upper end of the buckle is in snap-fit connection with the inner side of the card slot.

[0010] As a preferred technical solution of the present utility model, a plurality of connection holes are provided on the outer side of the movable plate, and the inner side of the connection hole is slidably connected to the outer side of the guide post.

[0011] The present utility model provides a temperature control device for low-temperature deposition of silicon dioxide, which has the following beneficial effects:

[0012] 1. The temperature control device for low-temperature deposition of silicon dioxide can quickly complete the installation and disassembly of the hot plate, thus solving the problem that it is inconvenient to disassemble and install the hot plate fixed to the base by screws.

[0013] 2. In the temperature control device for low-temperature deposition of silicon dioxide, as the movable rod and the elastic buckle continue to move, the elastic buckle moves to the end of the card slot, thereby driving the insertion rod to move downward, so that the hot plate and the substrate are closely attached to achieve the same tightness as screw fixation. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of a temperature control device for low-temperature deposition of silicon dioxide according to the present utility model.

[0015] Figure 2 It is a schematic diagram of the disassembled structure of a temperature control device for low-temperature deposition of silicon dioxide according to the present utility model.

[0016] Figure 3 It is a schematic diagram of a temperature control device for low-temperature deposition of silicon dioxide according to the present utility model Figure 2 at the enlarged view of A in.

[0017] Figure 4 It is a schematic diagram of a temperature control device for low-temperature deposition of silicon dioxide according to the present utility model Figure 2 at the enlarged view of B in.

[0018] In the figure: 1, bottom plate; 2, hot plate; 3, substrate; 4, guide post; 5, movable plate; 6, slot; 7, groove; 8, stop block; 9, inclined surface; 10, insertion rod; 11, movable rod; 12, card slot; 13, elastic buckle; 14, support; 15, transmission shaft; 16, worm; 17, handle; 18, worm gear; 19, first connecting rod; 20, second connecting rod. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0019] The following further describes in detail the implementation manners of the present utility model in conjunction with the accompanying drawings and embodiments. The following embodiments are used to illustrate the present utility model, but cannot be used to limit the scope of the present utility model.

[0020] In the description of the present utility model, unless otherwise specified, "a plurality of" means two or more; the orientation or positional relationships indicated by the terms "upper", "lower", "left", "right", "inner", "outer", "front end", "rear end", "head", "tail", etc. are based on the orientation or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present utility model. In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0021] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "connected" and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0022] Please refer to Figures 1 to 4, the present utility model provides a technical solution: a temperature control device for low-temperature deposition of silicon dioxide, including a bottom plate 1 and a hot plate 2. A substrate 3 is provided between the bottom plate 1 and the hot plate 2. A plurality of guide posts 4 are fixed between the substrate 3 and the bottom plate 1. A movable plate 5 is further provided between the substrate 3 and the bottom plate 1. A plurality of slots 6 are opened on the top surface of the substrate 3. Two grooves 7 are opened on the inner side of the slots 6. A stop block 8 is fixed to the lower part of the inner side of the groove 7. An inclined surface 9 is opened on the top surface of the stop block 8. A plug rod 10 and a movable rod 11 are further provided on the inner side of the slot 6. A card slot 12 is opened on the outer side of the plug rod 10. Two elastic buckles 13 are fixed to the upper end of the movable plate 5. Two supports 14 are fixed to the bottom surface of the bottom plate 1. A transmission shaft 15 is rotatably connected between the two supports 14. A worm 16 is rotatably connected to the outer side of one of the supports 14. A handle 17 is fixed to one end of the worm 16. A worm gear 18 is meshed and connected to the outer side of the worm 16. One end of the rotating shaft of the worm gear 18 is coaxially fixed to one end of the rotating shaft of the transmission shaft 15. A first connecting rod 19 is fixed to the outer side of the transmission shaft 15. A second connecting rod 20 is rotatably connected between the first connecting rod 19 and the movable plate 5. The plurality of guide posts 4 are parallel to each other. The bottom plate 1 is parallel to the movable plate 5 and the substrate 3. The elastic buckles 13 are located inside the grooves 7. The upper end of the plug rod 10 is fixed to the bottom surface of the hot plate 2. The lower end of the movable rod 11 is fixed to the top surface of the movable plate 5. The upper end of the buckle 13 is in snap-fit connection with the inner side of the card slot 12. A plurality of connection holes are opened on the outer side of the movable plate 5. The inner side of the connection holes is slidably connected to the outer side of the guide posts 4;

[0023] During installation, align the insertion rod 10 on the hot plate 2 with the slot 6 on the substrate 3 and insert it. Then, drive the worm 16 to rotate by turning the handle 17. The worm 16 drives the transmission shaft 15 to rotate through the worm gear 18. The transmission shaft 15 drives the first connecting rod 19 to rotate. The first connecting rod 19 pushes the movable plate 5 to move downward along the guide post 4 through the second connecting rod 20. The movable plate 5 drives the movable rod 11 to move downward. During this process, the elastic buckle 13 on the movable rod 11 moves along the groove 7. Then it encounters the stopper 8 and is squeezed and pushed by the inclined surface 9 on the stopper 8, causing the two elastic buckles 13 to move closer to the middle, so that the two elastic buckles 13 extend into the card slot 12 on the insertion rod 10. As the movable rod 11 and the elastic buckle 13 continue to move, the elastic buckle 13 moves to the end of the card slot 12, thereby driving the insertion rod 10 to move downward, making the hot plate 2 and the substrate 3 fit tightly together, achieving the same tightness as screw fixation. When disassembly is required, reverse-rotate the handle 17 to make the worm 16, the worm gear 18, the transmission shaft 15 and the first connecting rod 19 rotate in the reverse direction. The first connecting rod 19 pushes the movable plate 5 and the movable rod 11 back to their original positions through the second connecting rod 20. The elastic buckle 13 on the movable rod 11 is no longer squeezed by the stopper 8, so it expands towards both sides and separates from the card slot 12. Then, remove the hot plate 2. Through the above process, the installation and disassembly of the hot plate 2 can be quickly completed, thus solving the problem that it is inconvenient to disassemble and install the hot plate fixed to the base with screws.

[0024] Specific usage method and function of this embodiment: When installing this utility model, align the insertion rod 10 on the hot plate 2 with the slot 6 on the substrate 3 and insert it. Then, drive the worm 16 to rotate by turning the handle 17. The worm 16 drives the transmission shaft 15 to rotate through the worm gear 18. The transmission shaft 15 drives the first connecting rod 19 to rotate. The first connecting rod 19 pushes the movable plate 5 to move downward along the guide post 4 through the second connecting rod 20. The movable plate 5 drives the movable rod 11 to move downward. During this process, the elastic buckle 13 on the movable rod 11 moves along the groove 7. Then it encounters the stopper 8 and is squeezed and pushed by the inclined surface 9 on the stopper 8, causing the two elastic buckles 13 to move closer to the middle, so that the two elastic buckles 13 extend into the card slot 12 on the insertion rod 10. As the movable rod 11 and the elastic buckle 13 continue to move, the elastic buckle 13 moves to the end of the card slot 12, thereby driving the insertion rod 10 to move downward, making the hot plate 2 and the substrate 3 fit tightly together, achieving the same tightness as screw fixation. When disassembly is required, reverse-rotate the handle 17 to make the worm 16, the worm gear 18, the transmission shaft 15 and the first connecting rod 19 rotate in the reverse direction. The first connecting rod 19 pushes the movable plate 5 and the movable rod 11 back to their original positions through the second connecting rod 20. The elastic buckle 13 on the movable rod 11 is no longer squeezed by the stopper 8, so it expands towards both sides and separates from the card slot 12. Then, remove the hot plate 2.

[0025] The above are only the preferred specific embodiments of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model, according to the technical solution of the present utility model and its inventive concept, makes equivalent substitutions or changes, and should be covered within the protection scope of the present utility model.

Claims

1. A temperature control device for low-temperature deposition of silica, comprising a bottom plate (1) and a hot plate (2), characterized in that: A substrate (3) is provided between the bottom plate (1) and the hot plate (2). A plurality of guide posts (4) are fixed between the substrate (3) and the bottom plate (1). A movable plate (5) is also provided between the substrate (3) and the bottom plate (1). A plurality of slots (6) are formed in the top surface of the substrate (3). Two grooves (7) are formed in the inner side of the slot (6). A stop block (8) is fixed to the lower part of the inner side of the groove (7). An inclined surface (9) is formed in the top surface of the stop block (8). A plug rod (10) and a movable rod (11) are also provided in the inner side of the slot (6). A clamping groove (12) is formed in the outer side of the plug rod (10). Two elastic buckles (13) are fixed to the upper end of the movable plate (5). Two supports (14) are fixed to the bottom surface of the bottom plate (1). A transmission shaft (15) is rotatably connected between the two supports (14). A worm (16) is rotatably connected to the outer side of one of the supports (14). A handle (17) is fixed to one end of the worm (16). A worm gear (18) is meshed and connected to the outer side of the worm (16). One end of the rotating shaft of the worm gear (18) is coaxially fixed to one end of the rotating shaft of the transmission shaft (15). A first connecting rod (19) is fixed to the outer side of the transmission shaft (15). A second connecting rod (20) is rotatably connected between the first connecting rod (19) and the movable plate (5).

2. The temperature control device for low-temperature deposition of silicon dioxide according to claim 1, wherein: The plurality of guide posts (4) are parallel to each other.

3. The temperature control device for low-temperature deposition of silica according to claim 1, characterized in that: The bottom plate (1) is parallel to the movable plate (5) and the substrate (3).

4. A temperature control device for low-temperature deposition of silica according to claim 1, characterized in that: The elastic buckle (13) is located inside the groove (7).

5. The temperature control device for low-temperature deposition of silica according to claim 1, characterized in that: The upper end of the plug rod (10) is fixedly connected to the bottom surface of the hot plate (2), and the lower end of the movable rod (11) is fixedly connected to the top surface of the movable plate (5).

6. The temperature control device for low-temperature deposition of silicon dioxide according to claim 1, characterized in that: The upper end of the buckle (13) is clamped and matched with the inner side of the clamping groove (12).

7. The temperature control device for low-temperature deposition of silicon dioxide according to claim 1, characterized in that: A plurality of connection holes are formed in the outer side of the movable plate (5), and the inner side of the connection holes is slidably connected to the outer side of the guide posts (4).

Images