Condensation plate part assembly and heat dissipation device comprising condensation plate part assembly

Abstract

The utility model relates to a condensation plate part assembly and a heat dissipation device comprising the condensation plate part assembly, in particular to an evaporation plate part assembly which is provided with a storage part for storing a refrigerant capable of generating phase change according to temperature and enables at least one part of the surface of the lower part to be in thermal contact with a heating surface of a heating body; and a plurality of condensation plate part assemblies coupled to the evaporation plate part assembly so as to communicate with the storage part, and releasing heat transferred from the heat generating body by heat exchange with outside air (outside air), in which each of the plurality of condensation plate part assemblies includes: a one-side heat transfer plate that is provided on one side of the evaporation plate part assembly, and a side heat transfer plate that is provided on the other side of the evaporation plate part assembly; as a metal plate component with the thermal conductivity higher than the preset thermal conductivity, metal plate machining is carried out through a punch forming technology; and the heat conduction plate on the other side is used as a metal plate component the same as the heat conduction plate on one side, and sheet metal processing is performed through a punch forming process, so that the heat dissipation performance of the heat dissipation device is maximized.

Description

Technical Field

[0001] The utility model relates to a condensate plate component and a heat dissipation device including the condensate plate component. More specifically, it relates to a condensate plate component and a heat dissipation device including the condensate plate component, which can prevent physical shaking caused by the increase in internal pressure during the gas-liquid circulation of the refrigerant and achieve a shorter gas-liquid circulation period. Background Art

[0002] In various industrial fields such as communication, electronics, and electrics, related technologies are in a continuous high-level development trend to be applicable to more advanced industries. High-level technology development requires high-power energy, and equipment using high-power energy inevitably faces the problem of high heat generation. Therefore, it is necessary to develop a heat dissipation system suitable for this level simultaneously.

[0003] Heat dissipation systems are used in various industries such as air conditioners, mobile communications, data centers, aviation mobiles, electric vehicles, energy storage devices, and displays. Such heat dissipation systems are one of the main reasons for power consumption, and with the development of the industry, power consumption shows a gradually increasing trend.

[0004] Generally, heat dissipation devices are roughly divided into active cooling devices and passive cooling devices. Active cooling devices mainly utilize forced convection generated by fans, while passive cooling devices can be classified as technologies that utilize natural convection without using fans.

[0005] However, existing heat dissipation systems have limitations in dissipating the high heat generated by continuously developing advanced technologies. Therefore, in related industrial fields, innovative technologies that can solve these problems are needed. As a part of solving these problems, heat dissipation appliances are being developed.

[0006] Phase change refers to the change in the inherent state of a substance when a large amount of energy is accumulated or the stored thermal energy is released in a liquid / gas / solid state.

[0007] Phase change refers to the change in the physical arrangement of molecules, rather than chemical reactions such as chemical bonding or formation. The heat in a state where a substance does not undergo a phase change when energy is applied is called sensible heat, and the heat used during a phase change is called latent heat.

[0008] However, since the temperature is directly proportional to the pressure, there is a problem that the pressure also increases when the temperature of the heat dissipation device rises. In a sealed heat dissipation device, if the pressure increases due to the high temperature conducted from the heating element, it will cause the problem of the heat dissipation device itself cracking. To solve this problem, it is necessary to prevent the pressure from rising, and in the heat dissipation device, there needs to be sufficient internal volume to achieve pressure balance during the process of realizing the phase change cycle of the substance.

[0009] In addition, as much heat transferred to the heat dissipation device as possible should be used for the phase change of the refrigerant. However, in the case where energy is used for the shaking (flow) of the heat dissipation device itself caused by the increase in internal pressure, since the gas-liquid circulation period is long, there may be a problem of deteriorating heat dissipation performance. SUMMARY OF THE UTILITY MODEL

[0010] The present utility model is proposed to solve the above technical problems, and its purpose is to provide a condensing plate component capable of maximizing heat dissipation performance and a heat dissipation device including the condensing plate component.

[0011] Moreover, another object of the present utility model is to provide a condensing plate component and a heat dissipation device including the condensing plate component that minimize the conversion of thermal energy required for the phase change of liquid refrigerant into gaseous refrigerant into physical force, thereby shortening the gas-liquid circulation period and enabling a more active gas-liquid circulation.

[0012] In addition, yet another object of the present utility model is to provide a condensing plate component and a heat dissipation device including the condensing plate component that improve heat dissipation performance by quickly guiding the liquid refrigerant that condenses the gaseous refrigerant to quickly capture and move to a position close to the heating element.

[0013] The technical problems of the present utility model are not limited to the above-mentioned technical problems, and those of ordinary skill in the technical field to which the present utility model belongs can clearly understand other technical problems not mentioned through the following description.

[0014] The condensing plate component according to an embodiment of the present utility model includes: one-side heat conducting plate, which is a metal plate component with a thermal conductivity above a predetermined value and is processed by sheet metal through a stamping process; and the other-side heat conducting plate, which is the same metal plate component as the one-side heat conducting plate and is processed by sheet metal through a stamping process. Among them, the one-side heat conducting plate and the other-side heat conducting plate are joined at their edge ends except for the lower ends with the gravity direction as the reference, so as to form a refrigerant flow space for the refrigerant to flow. The lower ends of the one-side heat conducting plate and the other-side heat conducting plate are combined to communicate with the evaporation plate component. Among them, a storage part is formed in the evaporation plate component for the liquid refrigerant condensed from the refrigerant flow space to fall and be stored.

[0015] Among them, a plurality of strength reinforcing portions may be formed in the one-side heat conducting plate and the other-side heat conducting plate, which are processed to be recessed inward in a manner of contacting each other in the refrigerant flow space.

[0016] In addition, the portions where the plurality of strength reinforcing portions contact each other in the refrigerant flow space may be joined by welding.

[0017] In addition, the refrigerant flow space may include: a first refrigerant flow path, which is formed as the maximum separation distance between the one-side heat conducting plate and the other-side heat conducting plate, and is formed to be separated by the maximum distance along the thickness direction of the refrigerant flow space, and is formed to surround the periphery of each of the plurality of strength reinforcing portions; and a second refrigerant flow path, which is formed to be recessed from the one-side heat conducting plate and the other-side heat conducting plate toward the inside of the refrigerant flow space, and is formed between each of the plurality of strength reinforcing portions and the first refrigerant flow path.

[0018] In addition, the second refrigerant flow path may be formed to be recessed toward the inside of the refrigerant flow space in a manner of being separated from each other along the thickness direction in the refrigerant flow space.

[0019] In addition, the recess depth of the second refrigerant flow path may be at least greater than the recess depth of the first refrigerant flow path and less than the recess depth of the plurality of strength reinforcing portions.

[0020] In addition, the second refrigerant flow path may be defined as being separated from an adjacent second refrigerant flow path by the first refrigerant flow path.

[0021] In addition, the lower ends of the one-side heat conducting plate and the other-side heat conducting plate may be combined to cover the storage portion of the evaporation plate component.

[0022] In addition, the lower ends of the one-side heat conducting plate and the other-side heat conducting plate may penetrate through the installation slots formed in the installation panel combined with the upper surface of the evaporation plate component and be combined with the storage portion in a manner of being placed in the storage portion to mediate the combination with the evaporation plate component.

[0023] In addition, after the one-side heat conducting plate and the other-side heat conducting plate are combined with the installation slots of the installation panel, they may be welded and combined along the periphery of the installation slots.

[0024] In addition, in the storage portion of the evaporation plate component, a plurality of rigid reinforcing members that support the lower surface of the installation panel and the bottom surface of the storage portion may be arranged in a plurality of rows at intervals, and the upper surfaces of the one-side heat conducting plate and the other-side heat conducting plate, which are separated by a distinguishing groove formed in a groove shape on the upper portion of the plurality of rigid reinforcing members, are supported on the lower surface of the installation panel.

[0025] In addition, the one-side heat conduction plate and the other-side heat conduction plate can make the remaining edge ends except the lower end part of the evaporator plate part assembly be joined to each other to form the refrigerant flow space.

[0026] In addition, the condenser plate part assembly may further include: a plurality of condensed refrigerant trapping and absorbing bodies, which are arranged in the refrigerant flow space formed between the one-side heat conduction plate and the other-side heat conduction plate and guide the condensed refrigerant.

[0027] The condenser plate part assembly according to another embodiment of the present invention includes: a one-side heat conduction plate, which is a metal plate part having a heat conductivity of more than a predetermined value and is processed by sheet metal working through a stamping process; and an other-side heat conduction plate, which is the same metal plate part as the one-side heat conduction plate and is processed by sheet metal working through a stamping process; and a plurality of condensed refrigerant trapping and absorbing bodies (hereinafter simply referred to as "absorbing bodies"), which are arranged in the refrigerant flow space formed between the one-side heat conduction plate and the other-side heat conduction plate and are arranged longer along the gravity direction to contact and support the inner surface of the one-side heat conduction plate forming one heat dissipation surface in the refrigerant flow space and the inner surface of the other-side heat conduction plate forming the other heat dissipation surface in the refrigerant flow space.

[0028] In addition, the absorbing body can be configured as any one of a metal body woven by metal wires of a metal material or a metal sintered body sintered by powder of a metal material.

[0029] In addition, the absorbing body may be formed with a plurality of pores, and the plurality of pores have a size such that the liquid refrigerant condensed in the refrigerant flow space is absorbed by capillary force or surface tension.

[0030] In addition, in the one-side heat conduction plate and the other-side heat conduction plate, a plurality of absorbing body setting grooves supported in a manner of preventing the flow of the absorbing body in the refrigerant flow space can be formed corresponding to the number of the absorbing bodies.

[0031] In addition, the plurality of absorbing bodies and the plurality of absorbing body setting grooves can be arranged to be separated from each other along the horizontal direction respectively.

[0032] In addition, when the lower end parts of the one-side heat conduction plate and the other-side heat conduction plate are joined to the evaporator plate part assembly formed with a storage part for dropping and storing the liquid refrigerant condensed from the refrigerant flow space, the absorbing body can have a length protruding more downward than the lower ends of the one-side heat conduction plate and the other-side heat conduction plate, so that the lower end is located in the storage part of the evaporator plate part assembly.

[0033] In addition, the one-side heat conducting plate and the other-side heat conducting plate can make the remaining edge ends except for the lower end part of the evaporator plate part assembly be mutually joined to form the refrigerant flow space.

[0034] In addition, a plurality of strength reinforcing parts can be formed in the one-side heat conducting plate and the other-side heat conducting plate, and the plurality of strength reinforcing parts are formed by being recessed inward in a manner of contacting each other in the refrigerant flow space.

[0035] In addition, the parts where the plurality of strength reinforcing parts contact each other in the refrigerant flow space can be joined by welding.

[0036] In addition, in the one-side heat conducting plate and the other-side heat conducting plate, a plurality of absorber setting grooves supported in a manner of preventing the flow of the absorber are formed corresponding to the number of absorbers in the refrigerant flow space, and the plurality of strength reinforcing parts can be formed in the one-side heat conducting plate and the other-side heat conducting plate not occupied by the plurality of absorber setting grooves.

[0037] In addition, the lower end parts of the one-side heat conducting plate and the other-side heat conducting plate can penetrate through the setting slots formed in the mounting panel joined to the upper surface of the evaporator plate part assembly and be joined to the storage part in a manner of being placed in the storage part to mediate the joining with the evaporator plate part assembly.

[0038] In addition, after the one-side heat conducting plate and the other-side heat conducting plate are joined to the setting slots of the mounting panel, they can be joined by welding along the periphery of the setting slots.

[0039] In addition, in the storage part of the evaporator plate part assembly, a plurality of rigid reinforcing members joined to support the lower surface of the mounting panel and the bottom surface of the storage part are arranged in a plurality of columns, and the one-side heat conducting plate and the other-side heat conducting plate support one side surface of the lower end part and the other side surface of the lower end part between the plurality of rigid reinforcing members.

[0040] A heat dissipation device according to an embodiment of the present utility model includes: an evaporator plate part assembly, having a surface in thermal contact with the heat generating surface of a heat generating body and forming a storage part for storing the liquid refrigerant in the refrigerant; a plurality of condenser plate part assemblies, joined to the evaporator plate part assembly and diffusing and condensing the gaseous refrigerant that has undergone a phase change in the storage part; and a mounting panel, mediating the slot connection between the evaporator plate part assembly and the condenser plate part assemblies, wherein the evaporator plate part assembly is made of copper, and the condenser plate part assemblies are made of stainless steel (SUS).

[0041] Among them, the multiple condenser plate assemblies can be formed by joining the edge ends of two base material panels made of SUS material and the strength reinforcement parts formed at multiple positions inside thereof, so as to form a refrigerant flow space for the flow of the liquid refrigerant and the gaseous refrigerant.

[0042] In addition, multiple refrigerant flow paths for the liquid refrigerant to flow in the direction of gravity can be formed in the multiple condenser plate assemblies, and absorbers made of woven wire mesh are respectively provided in the multiple refrigerant flow paths.

[0043] In addition, in the evaporation plate assembly, multiple strength reinforcement components for strengthening the strength between the evaporation plate assembly and the mounting panel can be joined by a brazing process.

[0044] A heat dissipation device according to another embodiment of the present utility model includes: an evaporation plate assembly, which forms a storage part for storing a refrigerant capable of undergoing a phase change according to temperature, and makes at least a part of the lower surface in thermal contact with the heat generating surface of the heat generating body; and multiple condenser plate assemblies, which are joined to the evaporation plate assembly in a manner communicating with the storage part, and release the heat transferred from the heat generating body through heat exchange with external air (outside air), wherein each of the multiple condenser plate assemblies includes: a first heat conducting plate, which is a metal plate component having a thermal conductivity above a predetermined value and is processed by a stamping process; and a second heat conducting plate, which is the same metal plate component as the first heat conducting plate and is processed by a stamping process, wherein the first heat conducting plate and the second heat conducting plate are joined to each other at the edge ends except for the lower end parts with the direction of gravity as a reference, so as to form a refrigerant flow space for the refrigerant to flow, and the lower end parts of the first heat conducting plate and the second heat conducting plate are joined to communicate with the storage part of the evaporation plate assembly.

[0045] Among them, the first heat conducting plate and the second heat conducting plate can be joined to each other at the remaining edge ends except for the lower end parts joined to the evaporation plate assembly to form the refrigerant flow space.

[0046] In addition, multiple strength reinforcement parts can be formed in the first heat conducting plate and the second heat conducting plate, and the multiple strength reinforcement parts are processed to be recessed inward in a manner of contacting each other in the refrigerant flow space.

[0047] In addition, the parts where the multiple strength reinforcement parts contact each other in the refrigerant flow space can be joined by welding.

[0048] In addition, the refrigerant flow space may include: a first refrigerant flow path, which is the maximum distance between the one-side heat conducting plate and the other-side heat conducting plate, and is formed to be separated by the maximum distance in the thickness direction of the refrigerant flow space, and is formed to surround the periphery of each of the plurality of strength reinforcing portions; and a second refrigerant flow path, which is formed to be recessed from the one-side heat conducting plate and the other-side heat conducting plate toward the inside of the refrigerant flow space, and is formed between each of the plurality of strength reinforcing portions and the first refrigerant flow path.

[0049] In addition, the second refrigerant flow path may be formed to be recessed toward the inside of the refrigerant flow space in a manner of being separated from each other in the thickness direction within the refrigerant flow space.

[0050] In addition, the recessed depth of the second refrigerant flow path may be at least greater than the recessed depth of the first refrigerant flow path and less than the recessed depth of the plurality of strength reinforcing portions.

[0051] In addition, the second refrigerant flow path may be defined as being distinguished from an adjacent second refrigerant flow path by means of the first refrigerant flow path.

[0052] In addition, the lower ends of the one-side heat conducting plate and the other-side heat conducting plate may be combined to cover the storage portion of the evaporation plate unit assembly.

[0053] In addition, the heat dissipation device may further include: a mounting panel, which is combined with the upper surface of the evaporation plate unit assembly to mediate the combination of the evaporation plate unit assembly and the plurality of condensation plate unit assemblies, and the lower ends of the one-side heat conducting plate and the other-side heat conducting plate penetrate through the installation slots formed in the mounting panel and are combined with the storage portion in a manner of being placed in the storage portion.

[0054] In addition, after the one-side heat conducting plate and the other-side heat conducting plate are combined with the installation slots of the mounting panel, they may be welded and combined along the periphery of the installation slots.

[0055] In addition, in the storage portion of the evaporation plate unit assembly, a plurality of rigid reinforcing members for supporting the lower surface of the mounting panel and the bottom surface of the storage portion may be arranged in a plurality of rows at intervals, and the upper surfaces of the one-side heat conducting plate and the other-side heat conducting plate, which are distinguished by the distinguishing grooves formed in a groove shape on the upper portions of the plurality of rigid reinforcing members, are supported on the lower surface of the mounting panel.

[0056] In addition, the condensate plate unit assembly may further include: a plurality of condensate refrigerant trapping absorbers (hereinafter simply referred to as "absorbers"), arranged in the refrigerant flow space formed between the one heat conduction plate and the other heat conduction plate, and simultaneously arranged elongated in the gravity direction to contact and support the inner surface of the one heat conduction plate forming one heat dissipation surface in the refrigerant flow space and the inner surface of the other heat conduction plate forming the other heat dissipation surface in the refrigerant flow space.

[0057] In addition, the absorber may be configured as either a metal body woven from metal wires made of a metal material or a metal sintered body sintered from metal powder made of a metal material.

[0058] In addition, the absorber may be formed with a plurality of pores having a size such that the liquid refrigerant condensed in the refrigerant flow space is absorbed by capillary force or surface tension.

[0059] In addition, in the one heat conduction plate and the other heat conduction plate, a plurality of absorber setting grooves supported in a manner to prevent the flow of the absorber in the refrigerant flow space may be formed corresponding to the number of the absorbers.

[0060] In addition, the plurality of absorbers and the plurality of absorber setting grooves may be arranged to be separated from each other in the horizontal direction.

[0061] In addition, when the lower ends of the one heat conduction plate and the other heat conduction plate are coupled to an evaporation plate unit assembly formed with a storage unit for allowing the liquid refrigerant condensed from the refrigerant flow space to fall and be stored, the absorber may have a length that protrudes more downward than the lower ends of the one heat conduction plate and the other heat conduction plate so that the lower end is located in the storage unit of the evaporation plate unit assembly.

[0062] In addition, the heat dissipation device may further include: a heat transfer plate assembly that mediates the transfer of heat to the lower surface of the evaporation plate unit assembly after receiving the heat generated by the heating body.

[0063] In addition, the heat transfer plate assembly may include: a coupling frame configured in a quadrilateral frame shape with a hollow middle; and a heat transfer panel coupled to the middle part of the coupling frame, and having its lower surface in surface thermal contact with the heating surface of the heating body and its upper surface in surface thermal contact with the lower surface of the evaporation plate unit assembly.

[0064] In addition, at least a pair of panel fixing hooks for fixing the heat transfer panel may be integrally formed at the inner end of the coupling frame.

[0065] In addition, the heat dissipation device may further include: a mounting panel, which is coupled to the upper surface of the evaporation plate component to mediate the coupling between the evaporation plate component and the plurality of condensation plate components. Wherein, a support hook portion is formed on the coupling frame, and after being inserted through the extension holes formed in the evaporation plate component and the mounting panel, the support hook portion is clamped to the upper surface of the mounting panel and fastened.

[0066] The condensation plate component according to the present utility model and the heat dissipation device including the same have the following effects: preventing physical shaking caused by the increase in internal pressure during the gas-liquid circulation of the refrigerant, and being able to achieve a shorter gas-liquid circulation cycle.

[0067] Moreover, it has the following effect: in order to input almost all of the heat generated by the heating element into the gas-liquid change (phase change) of the refrigerant that substantially performs the heat dissipation function, the thickness of the condensation plate component can be manufactured thinner.

[0068] Furthermore, the condensation plate component according to the present utility model and the heat dissipation device including the same have the following effect: by quickly collecting and moving the liquid refrigerant formed by condensing the gaseous refrigerant to a position close to the heating element, the heat dissipation performance is maximized.

[0069] The effects of the present utility model are not limited to the above-mentioned effects, and other effects not mentioned can be clearly understood by those of ordinary skill in the technical field to which the present utility model belongs through the description in the claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0070] Figure 1 It is a downward perspective view and an upward perspective view of a heat dissipation device according to an embodiment of the present utility model.

[0071] Figure 2 It is a downward perspective view and an upward perspective view of a heat dissipation device according to another embodiment of the present utility model.

[0072] Figure 3 It is a perspective view of a condensation plate component according to an embodiment of the present utility model.

[0073] Figure 4 is Figure 3 exploded perspective view of.

[0074] Figure 5a is Figure 3 front view (a), sectional view (b) taken along line B-B, and its partial enlarged view (c) of.

[0075] Figure 5b is along Figure 5a sectional perspective view taken along line B-B of (a) of and its partial enlarged view.

[0076] Figure 6 It is a perspective view showing a condensate plate component according to another embodiment of the present invention.

[0077] Figure 7 It is Figure 6 an exploded perspective view of.

[0078] Figure 8 It is Figure 6 the front view (a), the cross-sectional view (b) taken along the line A-A, and its sectional perspective view (c) of.

[0079] Figure 9a and Figure 9b It is Figure 1 the respective exploded perspective views of.

[0080] Figure 10 It is to Figure 1 separate the condensate plate component according to the first implementation example in the structure of from the evaporation plate component, an exploded perspective view.

[0081] Figure 11 It is a perspective view showing the combined state of a single condensate plate component according to the first implementation example of the evaporation plate component.

[0082] Figure 12 It is Figure 11 an exploded perspective view of.

[0083] Figure 13 It is to Figure 1 separate the other heat conducting plate in the structure of the condensate plate component according to the first implementation example of, an exploded perspective view.

[0084] Figure 14 It is to show Figure 1 the state of removing the other heat conducting plate in the state where a single condensate plate component according to the first implementation example in the structure of the heat dissipation device is combined with the evaporation plate component, a perspective view.

[0085] Figure 15 It is to show Figure 1 the perspective view of the evaporation plate component in the structure of.

[0086] Figure 16 It is to Figure 15 separate the mounting panel in the structure of, an exploded perspective view.

[0087] Figure 17 It is to Figure 15 separate the mounting panel and the heat transfer plate assembly in the structure of, an exploded perspective view.

[0088] Figure 18 It is to Figure 15Perspective view of the state where the mounting panel in the structure is removed.

[0089] Figure 19 It is Figure 16 Exploded perspective view of separating one column of multiple rigid reinforcing members.

[0090] Figure 20 It is Figure 2 Exploded perspective view of separating the condensate plate component of the second implementation example in the structure from the evaporation plate component.

[0091] Figure 21 It is Figure 20 Exploded perspective view.

[0092] Figure 22 It is Figure 20 Exploded perspective view of separating the other heat conduction plate in the structure of the condensate plate component of the second implementation example.

[0093] Figure 23 It shows Figure 20 Perspective view of the state where the mounting panel is removed in the state where a single condensate plate component of the second implementation example in the structure of the heat dissipation device is combined with the evaporation plate component.

[0094] Figure 24 Exploded perspective view of separating the mounting panel from the evaporation plate component.

[0095] Figure 25 Exploded perspective view of separating the mounting panel and multiple rigid reinforcing members in the structure.

[0096] Figure 26 It is Figure 24 Perspective view of the state where the mounting panel in the structure is removed.

[0097] Figure 27 It is to separate Figure 24 Exploded perspective view of one of the multiple rigid reinforcing members.

[0098] Figure 28 It is a cross-sectional view taken along the A'-A' line of Figure 1

[0099] Figure 29a It is Figure 2 Front view (a) and cross-sectional view (b) taken along the B'-B' line.

[0100] Figure 29b It is Figure 2 Front view (a) and cross-sectional view (b) taken along the C'-C' line.

[0101] Explanation of reference numerals

[0102] 1, 2: Heat dissipation device 50: Ventilation pipe

[0103] 60: Screw boss 70: Snap boss

[0104] 75: Fastening boss 80: Mounting screw

[0105] 100: Evaporation plate component 110: Storage part

[0106] 120A, 120B: Screw assembly holes 120A: First assembly hole

[0107] 120B: Second assembly hole 125: Extension hole

[0108] 130: Vacuum groove part 150, 150': Rigidity strengthening components

[0109] 170: Heat transfer plate assembly 171: Binding frame

[0110] 174: Panel fixing hook 175: Guide pin

[0111] 177: Support hook part 200, 202: Condensation plate components

[0112] 200A, 202A: One - side heat conduction plate 200B, 202B: The other - side heat conduction plate

[0113] 205: Refrigerant flow space 210; Edge end

[0114] 205a: First refrigerant flow path 205b: Second refrigerant flow path

[0115] 230: Strength strengthening part 240: Lower end part

[0116] 250: Absorber 300: Mounting panel

[0117] 310: Setting slot 320A, 320B: Screw fastening holes

[0118] 320A: First fastening hole 320B: Second fastening hole

[0119] 325: Extension hole Detailed implementation mode

[0120] Hereinafter, with reference to the accompanying drawings, a heat dissipation device according to an embodiment of the present utility model will be described in detail.

[0121] It should be noted that when assigning reference numerals to the components of each drawing, for the same components, even if they are shown in different drawings, the same reference numerals should be assigned as much as possible. In addition, during the process of describing the embodiments of the present invention, if it is determined that the specific description of the relevant well-known structures or functions hinders the understanding of the embodiments of the present invention, then the detailed description thereof will be omitted.

[0122] When describing the components of the embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only used to distinguish one component from other components, and the nature, order or sequence of the corresponding components are not limited by these terms. In addition, unless otherwise defined, all terms used here, including technical terms or scientific terms, have the same meaning as the ordinary understanding of those with ordinary knowledge in the technical field to which the present invention belongs. Terms that are the same as those defined in the commonly used dictionaries should be interpreted as having the same meaning as the meaning in the context of the related technology, and should not be interpreted as ideal or overly formal meanings unless clearly defined in this application.

[0123] Figure 1 is a downward perspective view and an upward perspective view of a heat dissipation device according to an embodiment of the present invention, Figure 2 is a downward perspective view and an upward perspective view of a heat dissipation device according to another embodiment of the present invention, Figure 3 is a perspective view of a condensation plate unit assembly according to an embodiment of the present invention, Figure 4 is Figure 3 exploded perspective view of Figure 5a is Figure 3 front view (a), cross-sectional view (b) taken along line B-B, and its partial enlarged view (c) of Figure 5b is along Figure 5a sectional perspective view taken along line B-B of (a) of Figure 6 is a perspective view of a condensation plate unit assembly according to another embodiment of the present invention, Figure 7 is Figure 6 exploded perspective view of Figure 8 is Figure 6 front view (a), cross-sectional view (b) taken along line A-A, and its sectional perspective view (c) of Figure 9a and Figure 9b is Figure 1 each exploded perspective view of

[0124] As Figures 1 to 9bAs shown, the heat dissipation device 1 according to an embodiment of the present invention includes: an evaporation plate component 100, which is in thermal contact with the heat generating surface of a heat generating body (not shown) on its surface and forms a storage portion 110 for storing the liquid refrigerant in the refrigerant; a plurality of condensation plate components 200, 202, which are coupled to the evaporation plate component 100 and diffuse and condense the gaseous refrigerant that has undergone a phase change in the storage portion 110; and a mounting panel 300, which mediates the slot connection between the evaporation plate component 100 and the condensation plate components 200, 202.

[0125] Among them, the evaporation plate component 100 can be made of copper (Cu), and the condensation plate components 200, 202 can be made of stainless steel (SUS).

[0126] In addition, the plurality of condensation plate components 200, 202 can be formed by joining the edge ends 210 of one side heat conducting plates 200A, 202A and the other side heat conducting plates 200B, 202B made of SUS material and the strength strengthening portions 230 formed at multiple positions on their surfaces, so as to form a refrigerant flow space 205 for the liquid refrigerant and the gaseous refrigerant to flow.

[0127] Moreover, a plurality of refrigerant flow paths 205a, 205b for the liquid refrigerant to flow along the gravity direction are formed in the plurality of condensation plate components 200, 202, and absorbers 250 formed of woven metal wire mesh can be respectively provided in the plurality of refrigerant flow paths 205a, 205b.

[0128] Among them, in the evaporation plate component 100, a plurality of strength strengthening members for strengthening the strength are joined between the evaporation plate component 100 and the above mounting panel 300 by a brazing process (refer to the reference numerals "150" in the drawings described later Figure 16 and Figure 20 the reference numeral "150" of).

[0129] In addition, a plurality of setting slots 310 for inserting and joining the lower ends of the plurality of condensation plate components 200, 202 can be formed in the mounting panel 300.

[0130] Moreover, a ventilation pipe 50 for filling the refrigerant or for evacuating the refrigerant flow space 205 before or after injecting the refrigerant can be provided in the evaporation plate component 100.

[0131] The heat dissipation device 1 according to an embodiment of the present invention described above can be implemented as specific embodiments of the heat dissipation devices 1, 2 according to another embodiment and still another embodiment of the present invention described later.

[0132] First, as Figure 1 and Figure 2As shown, the heat dissipation devices 1 and 2 according to another embodiment of the present utility model include: an evaporation plate component 100, which forms a storage portion for storing a refrigerant that can undergo a phase change according to temperature (refer to the reference numeral 110 in Figure 3 ), and at least a part of the lower surface is in thermal contact with the heat generating surface of a heat generating body (not shown); a plurality of condensation plate components 200 and 202, which are combined with the evaporation plate component 100 in a manner communicating with the storage portion 110, and release the heat transferred from the heat generating body through heat exchange with external air (outside air).

[0133] Among them, the heat dissipation devices 1 and 2 of the present utility model can be distinguished by an embodiment (heat dissipation device 1) as shown in Figure 1 and another embodiment (heat dissipation device 2) as shown in Figure 2 . The basis for this distinction is that it can be distinguished according to whether the absorber 250 exists in the refrigerant flow space 205 formed by the one-side heat conducting plates 200A and 202A and the other-side heat conducting plates 200B and 202B described later.

[0134] That is, as shown in the following Figures 3 to 5b , the embodiment including the condensation plate component 200 according to the first implementation example is defined as the heat dissipation device 1 according to another embodiment, wherein the first implementation example is configured to condense the refrigerant without providing the absorber 250 in the refrigerant flow space 205. On the contrary, as shown in the following Figures 6 to 8 , the embodiment including the condensation plate component 202 according to the second implementation example is defined as the heat dissipation device 2 according to another embodiment, wherein the second implementation example is configured to condense the refrigerant by providing the absorber 250 in the refrigerant flow space 205.

[0135] As shown in Figure 1 and Figure 2 , a plurality of condensation plate components 200 and 202 according to the embodiments of the present utility model are combined with the evaporation plate component 100, thereby constituting the heat dissipation devices 1 and 2.

[0136] Figure 10 is an exploded perspective view of separating the condensation plate component according to the first implementation example in the structure of Figure 1 from the evaporation plate component, Figure 11 is a perspective view showing the combined state of a single condensation plate component according to the first implementation example of the evaporation plate component, Figure 12 is Figure 11 's exploded perspective view, Figure 13 is separating the other-side heat conducting plate in the structure of the condensation plate component according to the first implementation example of Figure 1 's exploded perspective view, Figure 14 is showing in accordance with Figure 1A perspective view of a single condensation plate component in the structure of the heat dissipation device according to the first implementation example in a state where it is combined with the evaporation plate component and the other heat conduction plate is removed.

[0137] Hereinafter, the heat dissipation device 1 according to an embodiment of the present invention will be specifically described first.

[0138] As Figures 10 to 14 shown, the heat dissipation device 1 according to an embodiment of the present invention includes: an evaporation plate component 100, which is in surface thermal contact with the heat generating surface of a heat generating body (not shown), and forms a storage portion 110 for storing the liquid refrigerant in the refrigerant; a plurality of condensation plate components 200, which are combined with the evaporation plate component 100 and diffuse and condense the gaseous refrigerant that has undergone a phase change in the storage portion 110.

[0139] Hereinafter, the condensation plate component 200 included in the heat dissipation device 1 according to another embodiment of the present invention will be defined as the condensation plate component 200 according to the first implementation example and described.

[0140] Conversely, the condensation plate component 202 included in the heat dissipation device 2 according to still another embodiment of the present invention will be defined as the condensation plate component 202 according to the second implementation example and described.

[0141] Among them, the evaporation plate component 100 can function to receive heat from the heat generating surface of a heat generating body (not shown) such as an electronic device that necessarily generates heat while being electrically driven and evaporate the liquid refrigerant stored in the storage portion 110 into a gaseous refrigerant.

[0142] And, as described below, the condensation plate component 200 according to the first implementation example is arranged to communicate with the storage portion 110 of the evaporation plate component 100 through the installation panel 300. During the process of the gaseous refrigerant that has undergone a phase change in the evaporation plate component 100 diffusing and flowing and then condensing into a liquid refrigerant again, it can function to release the heat received from the heat generating body to the outside through heat exchange with the external air (outside air).

[0143] More specifically, as Figures 10 to 14 shown, the evaporation plate component 100 can form the storage portion 110 in a groove shape with a predetermined depth, having a substantially rectangular horizontal cross-section in the middle of the upper surface portion.

[0144] Among them, while storing the liquid refrigerant in the storage portion 110, the upper opening portion can be shielded by the installation panel 300 to be described later, and the installation panel 300 mediates the combination of the condensation plate component 200 according to the first implementation example with respect to the evaporation plate component 100.

[0145] That is, the condensation plate unit assembly 200 according to the first implementation example can be coupled to the evaporation plate unit assembly 100 via the mounting panel 300. Among them, when the evaporation plate unit assembly 100 is configured in a rectangular panel shape with the corner portions being substantially arc-shaped, the mounting panel 300 can also be configured in a panel shape capable of completely covering the upper surface portion of the evaporation plate unit assembly 100.

[0146] The mounting panel 300 is configured to cover the storage portion 110 of the evaporation plate unit assembly 100 and can function to insert and support a part of the plurality of condensation plate unit assemblies 200.

[0147] For this purpose, a plurality of installation slots 310 into which the plurality of condensation plate unit assemblies 200 are respectively inserted are formed along the length direction of the mounting panel 300, and can be formed by cutting in a manner that communicates with the storage portion 110 and the refrigerant flow space 205 of the plurality of condensation plate unit assemblies 200 according to the first implementation example.

[0148] A plurality of screw assembly holes 120A, 120B and a plurality of screw fastening holes 320A, 320B for mutual assembly by the mounting screws 80 described later can be respectively formed at the edge end portions of the evaporation plate unit assembly 100 and the edge end portions of the mounting panel 300.

[0149] More specifically, the plurality of screw assembly holes 120A, 120B can include: a first assembly hole 120A formed to penetrate in the vertical direction at one end portion and the other end portion in the length direction among the edge end portions of the evaporation plate unit assembly 100; and a second assembly hole 120B formed to penetrate in the vertical direction at an intermediate portion of the edge end portion in the width direction of the evaporation plate unit assembly 100.

[0150] And, the plurality of screw fastening holes 320A, 320B are formed in the mounting panel 300 and can include: a first fastening hole 320A formed to penetrate in the vertical direction at a position corresponding to the first assembly hole 120A of the evaporation plate unit assembly 100; and a second fastening hole 320B formed to penetrate in the vertical direction at a position corresponding to the second assembly hole 120B of the evaporation plate unit assembly 100.

[0151] Among them, the mounting screw 80 can be fastened via the screw bosses 60 coupled to the plurality of screw assembly holes 120A, 120B and the plurality of screw fastening holes 320A, 320B.

[0152] The screw boss 60 is snap - connected to the edge ends of a plurality of screw fastening holes 320A and 320B on the upper side of the mounting panel 300, and may include: a snap - connection boss 70, when the mounting screw 80 is penetrated, at least the head of the mounting screw 80 is snap - connected, and a fastening boss 75. Thus, the lower side of the evaporation plate component 100 is inserted through and into a plurality of screw assembly holes 120A and 120B, and is internally provided with an internal thread for engaging with the external thread formed on the outer periphery of the body of the mounting screw 80.

[0153] The process of coupling the mounting panel 300 to the evaporation plate component 100 by using the mounting screw 80 will be briefly described below.

[0154] First, after inserting and setting the fastening boss 75 inside a plurality of screw assembly holes 120A and 120B formed in the evaporation plate component 100, place the snap - connection boss 70 at the position formed by a plurality of screw fastening holes 320A and 320B formed in the mounting panel 300, and then rotate and tighten the mounting screw 80 from the upper side of the snap - connection boss 70.

[0155] At this time, the external thread of the mounting screw 80 is engaged and tightened with the internal thread formed inside the fastening boss 75, and the head of the mounting screw 80 is snap - connected inside the snap - connection boss 70, thereby increasing the adhesion or coupling force of the mounting panel 300 with respect to the upper surface of the evaporation plate component 100.

[0156] In addition, the first fastening hole 320A among a plurality of screw fastening holes 320A and 320B and the first assembly hole 120A among a plurality of screw assembly holes 120A and 120B are formed to have at least a diameter for inserting the fastening boss 75 and a diameter that does not allow the snap - connection boss 70 to be inserted. Extension holes 325 and 125 are formed in a communicating manner on one side of the first fastening hole 320A and the first assembly hole 120A, so that the fastening boss 75 can move at least in one direction in the inserted state.

[0157] As a reference, in the extension holes 325 and 125 formed in the evaporation plate component 100 and the mounting panel 300, it can play a role of inserting and snap - connecting the support hook portion 177 of the heat transfer plate assembly 170 described later. This will be described in more detail later.

[0158] The evaporation plate component 100 and the mounting panel 300 coupled by the mounting screw 80 can be sealed to prevent the leakage of the liquid refrigerant (or gaseous refrigerant) stored in the internal storage portion 110.

[0159] Further, at least any one position of the edge end of the evaporation plate component 100 may be processed to form a groove-shaped vacuum groove portion 130 for communicating with a ventilation pipe 50 described later. The vacuum groove portion 130 may be formed to communicate with the storage portion 110.

[0160] In addition, at least any one position of the edge end of the mounting panel 300, a pipe setting hole 330 for fixedly setting the ventilation pipe 50 described later may be formed through the position corresponding to the vacuum groove portion 130 of the evaporation plate component 100 in a manner communicating with the vacuum groove portion 130.

[0161] In the heat dissipation device 1 according to an embodiment of the present invention, when the refrigerant filled inside the condensation plate component 201 according to the first implementation example undergoes a phase change, a vacuum process for evacuating the refrigerant flow space 205 must be performed to be able to cope with the change in internal pressure generated during the phase change. The above-mentioned vacuum process can be performed through the ventilation pipe 50 combined with the vacuum groove portion 130 of the evaporation plate component 100 and the pipe setting hole 330 of the mounting panel 300.

[0162] After the vacuum process is completed, the air pipe caulking process for shielding the communication with the external air may be performed after cutting the ventilation pipe 50. However, it is not necessary to cut the ventilation pipe 50, as long as the caulking process is performed to shield the air flow path of the ventilation pipe 50.

[0163] In addition, referring to Figures 10 to 19 , the heat dissipation device 1 according to another embodiment of the present invention may further include: a heat transfer plate assembly 170, which is combined in such a way as to receive heat from a heat generating body (not shown) and transfer the heat to the lower surface of the evaporation plate component 100. The specific composition and structure of the heat transfer plate assembly 170 will be described in more detail below.

[0164] Preferably, the lower surface of the heat transfer plate assembly 170 is arranged to be in complete contact with the heat generating surface of the heat generating body without any gap. For this purpose, a heat transfer substance (not shown) may obviously be coated therebetween.

[0165] In addition, in the heat dissipation device 1 according to another embodiment of the present invention, as Figures 3 to 5b shown, the condensation plate component 200 according to the first implementation example, which is combined with the evaporation plate component 100 through the mounting panel 300 as a medium, may include a one-side heat conducting plate 200A and a the other-side heat conducting plate 200B.

[0166] Among them, the one-side heat conducting plate 200A and the other-side heat conducting plate 200B are respectively metal plate components having a heat conductivity of a predetermined value or more, and sheet metal processing can be performed through a stamping process.

[0167] More specifically, one side heat conducting plate 200A and the other side heat conducting plate 200B are formed by subjecting a metal plate component as a base material to the above-mentioned stamping process so that the upper side and the lower side are parallel to each other, and the length of the lower side combined with the evaporation plate unit assembly 100 can be formed by sheet metal processing in a trapezoidal shape with a length smaller than that of the upper side.

[0168] That is, one side heat conducting plate 200A and the other side heat conducting plate 200B are combined to protrude upward orthogonally with respect to the upper surface of the evaporation plate unit assembly 100. As it goes gradually upward, the refrigerant flow space 205 inside gradually widens, so that the heat dissipation area with the external air (outside air) can be gradually increased.

[0169] Moreover, in one side heat conducting plate 200A and the other side heat conducting plate 200B, when sheet metal processing according to the stamping process is performed, edge ends 210 for mutual engagement, a plurality of strength reinforcing parts 230 described later, a first refrigerant flow path 205a and a second refrigerant flow path 205b, which are detailed structures of the refrigerant flow space 205, can be formed simultaneously.

[0170] More specifically, after one side heat conducting plate 200A and the other side heat conducting plate 200B are subjected to sheet metal processing in mutually symmetric shapes by the above-mentioned stamping process, each edge end 210 except for the lower end part combined with the evaporation plate unit assembly 100 can be joined by a joining process, so that a refrigerant flow space 205 is formed inside.

[0171] In addition, the refrigerant flow space 205 may include: a first refrigerant flow path 205a, which is formed to be separated by the maximum distance between one side heat conducting plate 200A and the other side heat conducting plate 200B in the thickness direction of the refrigerant flow space 205 and is formed to surround the periphery of each of the plurality of strength reinforcing parts 230 described later; a second refrigerant flow path 205b, which is formed to be recessed from one side heat conducting plate 200A and the other side heat conducting plate 200B toward the inside of the refrigerant flow space 205 and is formed between each of the plurality of strength reinforcing parts 230 described later and the first refrigerant flow path 205a.

[0172] More specifically, one side heat conducting plate 200A and the other side heat conducting plate 200B can join the simultaneously formed edge ends 210 and the plurality of strength reinforcing parts 230 to each other by a joining process during sheet metal processing by the stamping process, so that the refrigerant flow space 205 except for the lower end part, which is the joining part with respect to the evaporation plate unit assembly 100, can be shielded. At this time, the joining process may include a welding method, and the welding method may include laser welding.

[0173] In addition, when performing sheet metal processing through a stamping process, a plurality of strength reinforcing portions 230 may be respectively formed in a dot or elliptical shape by being recessed from the outside of one heat conduction plate 200A and the other heat conduction plate 200B toward the inside where the refrigerant flow space 205 is formed. In the condenser plate unit assembly 200 according to the first implementation example, the plurality of strength reinforcing portions 230 may be formed to be evenly spaced throughout the entire regions of the one heat conduction plate 200A and the other heat conduction plate 200B.

[0174] Among them, the plurality of strength reinforcing portions 230 are formed at positions symmetric to the one heat conduction plate 200A and the other heat conduction plate 200B, and are arranged such that the recessed portions contact each other's surfaces in the refrigerant flow space 205, and the surface-contact portions may be joined by a welding method including a laser welding method.

[0175] The plurality of strength reinforcing portions 230 formed as described above can also serve to enhance the self-rigidity of the one heat conduction plate 200A and the other heat conduction plate 200B during sheet metal processing through a stamping process.

[0176] Among them, the second refrigerant flow paths 205b respectively formed in the one heat conduction plate 200A and the other heat conduction plate 200B may be recessed toward the inside of the refrigerant flow space 205 in a manner of being spaced apart from each other in the thickness direction within the refrigerant flow space 205.

[0177] Preferably, the recessed depth of the second refrigerant flow paths 205b may be formed to be at least greater than the recessed depth of the first refrigerant flow paths 205a and less than the recessed depth of the plurality of strength reinforcing portions 230.

[0178] In particular, the first refrigerant flow paths 205a, as the portions that are not compressed when performing sheet metal processing on the one heat conduction plate 200A and the other heat conduction plate 200B through a stamping process, can be understood as corresponding to the base surface.

[0179] After the liquid refrigerant is evaporated in the storage portion 110 of the evaporator plate unit assembly 100 and is phase-changed into a gaseous refrigerant, it diffuses and flows into the refrigerant flow space 205, and then is condensed again through heat exchange with external air (outside air), so that when it is phase-changed into a liquid refrigerant, the first refrigerant flow paths 205a as described above, with the gravity direction as a reference, serve to guide the liquid refrigerant to flow to the side of the storage portion 110 of the evaporator plate unit assembly 100 located below.

[0180] Therefore, preferably, the first refrigerant flow paths 205a are formed in a pattern that is inclined or vertical in a manner that does not generate flow resistance when flowing downward with the gravity direction as a reference.

[0181] In addition, the second refrigerant flow path 205b can function to facilitate the diffusion and dispersion of the gaseous refrigerant evaporated in the storage portion 110 of the evaporation plate unit 100. That is, since the liquid refrigerant is usually guided to flow through the first refrigerant flow path 205a, the gaseous refrigerant can flow, diffuse, and disperse more actively through the second refrigerant flow path 205b, the thickness direction dimension of which is smaller than that of the first refrigerant flow path 205a, thereby shortening the gas-liquid circulation cycle as a whole.

[0182] Among them, the second refrigerant flow path 205b can be formed to be distinguished from each of the plurality of strength reinforcement portions 230 by means of the first refrigerant flow path 205a.

[0183] More specifically, the plurality of strength reinforcement portions 230 are arranged to have a uniform spacing distance in the entire regions of the one heat conducting plate 200A and the other heat conducting plate 200B. When defined as being recessed in a point shape toward the refrigerant flow space 205, the second refrigerant flow path 205b can be recessed in a predetermined pattern shape to surround the periphery of each strength reinforcement portion 230.

[0184] Among them, the pattern shape of the second refrigerant flow path 205b includes a hexagonal shape, a pentagonal shape, or a quadrilateral shape, and preferably adopts a shape that does not affect the inclined shape of the above-mentioned first refrigerant flow path 205a.

[0185] In addition, the first refrigerant flow path 205a can be formed into a pattern shape that distinguishes the respective pattern shapes of the above-mentioned second refrigerant flow path 205b from each other.

[0186] The following will refer to Figures 10 to 14 to briefly describe the manufacturing method of the condensation plate unit 202 according to an embodiment of the present utility model.

[0187] First, as a base metal plate component, preferably, a metal plate component made of SUS material is symmetrically formed left and right with respect to the middle portion in the length direction through sheet metal processing of a stamping process, so as to be able to form and manufacture the one heat conducting plate 200A and the other heat conducting plate 200B.

[0188] In particular, when performing the stamping process, a refrigerant flow space 205 is formed inside the one heat conducting plate 200A and the other heat conducting plate 200B with a predetermined thickness, and the edge ends 210 are simultaneously processed and formed in a manner that can be joined to each other to close the refrigerant flow space 205 except for the lower end portion 240 joined to the evaporation plate unit 100.

[0189] In addition, when performing the stamping process, within the refrigerant flow space 205 between the one-side heat conducting plate 200A and the other-side heat conducting plate 200B, a plurality of strength reinforcing portions 230 for being joined to each other by welding can be formed simultaneously by machining, and for each of the plurality of strength reinforcing portions 230, the respective pattern shapes of the first refrigerant flow path 205a and the second refrigerant flow path 205b formed around can also be formed simultaneously.

[0190] After forming the above-mentioned edge end portions 210, strength reinforcing portions 230, first refrigerant flow path 205a and second refrigerant flow path 205b by the stamping process, the edge end portions 210 and strength reinforcing portions 230 of the one-side heat conducting plate 200A and the other-side heat conducting plate 200B are joined by welding through the joining process, so that the refrigerant flow space 205 can be formed inside.

[0191] In addition, as Figure 13 and Figure 14 shown, the condensing plate unit assembly 200 according to the first implementation example manufactured through the above-mentioned process can be arranged such that its lower end portion 240 is immersed in the storage portion 110 of the evaporating plate unit assembly 100.

[0192] Figure 15 is a perspective view of the evaporating plate unit assembly in the structure shown in Figure 1 , Figure 16 is an exploded perspective view of separating the mounting panel in the structure shown in Figure 15 , Figure 17 is an exploded perspective view of separating the mounting panel and the heat transfer plate assembly in the structure shown in Figure 15 , Figure 18 is a perspective view of the state where the mounting panel in the structure shown in Figure 15 is removed, Figure 19 is an exploded perspective view of separating one row of the plurality of rigid reinforcing members in the structure shown in Figure 16 .

[0193] The evaporating plate unit assembly 100 provided with the condensing plate unit assembly 200 according to the first implementation example will be described in more detail below.

[0194] As Figures 15 to 19 shown, the evaporating plate unit assembly 100 can be configured to be in surface thermal contact with the heat generating surface of the heat generating body respectively, so as to function as a heat dissipation plate for changing the liquid refrigerant stored in the internal storage portion 110 into a gaseous refrigerant by the heat supplied from the heat generating body.

[0195] To this end, the evaporation plate unit assembly 100 may be made of a metal material with excellent thermal conductivity. Preferably, the evaporation plate unit assembly 100 may be made of copper (Cu) material. Except for the edge end 210 for bonding the mounting panel 300, the part where the storage part 110 directly receives heat from the heating element may be formed with as thin a thickness as possible.

[0196] In addition, in the mounting panel 300 that shields the upper surface of the storage part 110 of the evaporation plate unit assembly 100, a plurality of setting slots 310 for separating and arranging a plurality of condensation plate unit assemblies 200 may be formed through in the up and down direction.

[0197] More specifically, in the case where the mounting panel 300 is provided as a rectangular metal plate member formed to be longer in the left - right direction, when the lower end 240 of the condensation plate unit assembly 200 is set to be longer in the left - right direction, a plurality of setting slots 310 may be formed at intervals along the width direction defined as the front - rear direction.

[0198] In an embodiment of the present utility model, eight condensation plate unit assemblies 200 are respectively and long - combined along the left - right direction on the upper surface of a single evaporation plate unit assembly 100, and a heat dissipation device 1 defined to be arranged at a predetermined distance apart in the width direction will be described.

[0199] Among them, since the part where the storage part 110 is formed in the evaporation plate unit assembly 100 is a metal plate member made of copper (Cu) material and has very low strength (hardness), a plurality of rigid strengthening members 150 for strengthening this part may be provided in the storage part 110.

[0200] As Figures 15 to 19 shown, a plurality of rigid strengthening members 150 may be arranged to have a plurality of columns that are generally long in the left - right direction of the storage part 110.

[0201] More specifically, in the condensation plate unit assembly 200 according to the first implementation example, a plurality of rigid strengthening members 150 are arranged such that their lower surfaces are installed in the storage part 110 of the evaporation plate unit assembly 100 by a fixing method including welding, and may be arranged to have four columns in the width direction defined as the front - rear direction.

[0202] Among them, adjacent a plurality of rigid strengthening members 150 are equipped such that their upper surface parts are divided in groups of two by the dividing groove 155, and the respective divided upper surfaces may be in contact with the lower surface between the setting slots 310 of the mounting panel 300.

[0203] Among them, when there are a total of eight condensing plate unit assemblies 200 according to the first implementation example provided by the mounting panel 300, eight setting slots 310 are also formed in the mounting panel 300. However, the mounting panel 300 is configured as a thin plate made of SUS material, and sagging in the vertical direction may occur due to the formation of the eight setting slots 310. Therefore, a plurality of rigid reinforcement members 150 are provided to support this situation.

[0204] More specifically, four of the plurality of rigid reinforcement members 150 are arranged at intervals in the width direction. The total of eight upper surfaces divided by the dividing slots 155 of the rigid reinforcement members 150 are respectively fixed and supported to the lower surface of the mounting panel 300 corresponding to between the eight setting slots 310 in a fixing manner including welding, so as to support the mounting panel 300 upward.

[0205] The lower end portions 240 of the plurality of condensing plate unit assemblies 200 are inserted into each side surface of the above-mentioned plurality of rigid reinforcement members 150, so that the outer surfaces of the lower end portions of the one-side heat conduction plate 200A and the other-side heat conduction plate 200B that respectively constitute the condensing plate unit assembly 202 can be supported.

[0206] More specifically, the plurality of rigid reinforcement members 150 are arranged in a plurality of rows to be able to support the lower surface of the mounting panel 300 and the bottom surface of the storage portion 110 in the storage portion 110 of the evaporation plate unit assembly 100. The one-side heat conduction plate 200A and the other-side heat conduction plate 200B can support one side surface of the lower end portion and the other side surface of the lower end portion between the plurality of rigid reinforcement members 150.

[0207] As described above, after the plurality of condensing plate unit assemblies 200 according to the first implementation example are combined through the respective setting slots 310 of the mounting panel 300, welding combination can be performed along the periphery of the setting slots 310 to prevent the liquid refrigerant stored in the storage portion 110 of the evaporation plate unit assembly 100 or the gaseous refrigerant that diffuses and flows through the refrigerant flow space 205 of the condensing plate unit assembly 200 after phase change from the liquid refrigerant from leaking to the outside.

[0208] In this way, the plurality of rigid reinforcement members 150 can play a role in enhancing the rigidity of the respective parts of the evaporation plate unit assembly 100 and the mounting panel 300 with a relatively thin thickness by joining the respective contact end portions on the lower side and the upper side to the evaporation plate unit assembly 100 and the mounting panel 300.

[0209] In addition, a plurality of rigid reinforcing members 150 as described above are located in the storage portion 110 of the evaporation plate unit assembly 100 and are immersed by the stored liquid refrigerant, so as to be able to indirectly transfer the heat received from the heating element to the liquid refrigerant. At this time, by increasing the heat transfer area, it can assist in achieving a more active gas-liquid conversion (phase change).

[0210] For this reason, the plurality of rigid reinforcing members 150 may be made of a metal material with excellent thermal conductivity, and preferably, the same SUS material as the condenser plate unit assembly 200 or the same Cu material as the evaporation plate unit assembly 100 may be adopted.

[0211] In addition, as Figures 15 to 19 shown, the heat dissipation device 2 according to an embodiment of the present invention may further include: a heat transfer plate assembly 170, which directly receives the heat generated by the heating element and then mediates the transfer to the lower surface of the evaporation plate unit assembly 100.

[0212] Generally, in terms of heat transfer efficiency, it is the most preferred design to directly surface-thermally contact the lower surface of the evaporation plate unit assembly 100 with the heating surface of the heating element. However, due to various reasons, it can be assumed that the heating surface of the heating element and the lower surface of the evaporation plate unit assembly 100 are separated in a way that surface thermal contact cannot be achieved.

[0213] Among them, the heat transfer plate assembly 170 is arranged in the space separated from the heating surface of the above-mentioned heating element to play a role of transferring the heat received from the heating surface of the heating element to the evaporation plate unit assembly 100 by using a relatively high thermal conductivity.

[0214] As Figure 17 shown, the heat transfer plate assembly 170 as described above may include: a coupling frame 171, made of a non-conductive material equipped in a frame shape approximately in a quadrilateral shape; a heat transfer panel 180, coupled to the middle part of the coupling frame 171, and the lower surface is surface-thermally contacted with the heating surface of the heating element, and the upper surface is surface-thermally contacted with the lower surface of the evaporation plate unit assembly 100.

[0215] Among them, a predetermined space 173 may be formed between the coupling frame 171 and the heat transfer panel 180.

[0216] In the case where a relatively high thermal conductivity is required, the heat transfer panel 180 may be made of gold material according to the heat dissipation requirement value for the heating element. However, not all panels must be made of gold material, and gold plating treatment may also be performed to facilitate heat transfer.

[0217] In addition, in the structure of the heat transfer plate assembly 170, the coupling frame 171 is used as a structure for heat transfer of the above-mentioned heat transfer panel 180, and is formed to penetrate in the vertical direction in the middle. At least a pair of panel fixing hooks 174 for fixing the heat transfer panel 180 can be integrally formed at the inner end of the penetration of the coupling frame 171.

[0218] Moreover, a support hook portion 177 can also be formed on the coupling frame 171. After being inserted through the extension holes 125 and 325 formed in the evaporation plate portion assembly 100 and the mounting panel 300, it is finally snapped onto the upper surface of the mounting panel 300 for fastening.

[0219] Furthermore, the heat transfer plate assembly 170 may further include at least one guide pin 175 for guiding when the coupling frame 171 is hooked to the evaporation plate portion assembly 100 and the mounting panel 300.

[0220] In addition, in the heat dissipation device 1 according to an embodiment of the present invention, although not shown, the condensation plate portion assembly 200 according to the first implementation example may further include a plurality of condensation refrigerant trapping and absorbing bodies (hereinafter simply referred to as "absorbing bodies") provided on the condensation plate portion assembly 202 according to the second implementation example described below.

[0221] Among them, it is only necessary to understand that the absorbing bodies are formed in the same manner as the condensation plate portion assembly 202 according to the second implementation example described below. Therefore, the specific description thereof is replaced by the description of the condensation plate portion assembly 202 according to the second implementation example.

[0222] The above has described in detail the condensation plate portion assembly 200 of the first implementation example included in the heat dissipation device 1 according to another embodiment of the present invention.

[0223] Hereinafter, a heat dissipation device 2 according to still another embodiment of the present invention and a condensation plate portion assembly 202 of the second implementation example included therein will be described.

[0224] As Figures 6 to 8 shown, the condensation plate portion assembly 202 according to the second implementation example may further include a plurality of condensation refrigerant trapping and absorbing bodies 250 (hereinafter simply referred to as "absorbing bodies"), which are arranged in the refrigerant flow space 205 formed between the one-side heat conducting plate 202A and the other-side heat conducting plate 202B, and are arranged along the gravity direction for a long distance to contact and support the inner surface of the one-side heat conducting plate 202A forming one-side heat dissipation surface in the refrigerant flow space 205 and the inner surface of the other-side heat conducting plate 202B forming the other-side heat dissipation surface in the refrigerant flow space 205.

[0225] Among them, the absorber 250 is located in the storage part 110 of the evaporation plate unit assembly 100. When the phase-changed gaseous refrigerant in the liquid refrigerant state diffuses and flows into the refrigerant flow space 205 between the one heat conduction plate 202A and the other heat conduction plate 202B, the liquid refrigerant condensed from the gaseous refrigerant is re-captured through heat exchange with the external air (outside air), thereby enabling the liquid refrigerant to flow smoothly to the storage part 110 of the lower evaporation plate unit assembly 100.

[0226] In particular, a plurality of absorbers 250 are arranged in the refrigerant flow space 205 between the one heat conduction plate 202A and the other heat conduction plate 202B that are arranged longer in the left-right direction at the upper part of the evaporation plate unit assembly 100. By being evenly arranged in the left-right direction at intervals of a predetermined length, the liquid refrigerant that is uniformly condensed with respect to the entire refrigerant flow space 205 will not be biased to one side and can be directly captured by the adjacent absorbers 250, so as to play a role in uniform flow.

[0227] Although not shown in the drawings, the absorber 250 may include: a plurality of air holes having a size that allows the refrigerant in the gas state (gaseous refrigerant) to flow through without interference and allows the refrigerant in the liquid state (liquid refrigerant) to be absorbed by capillary force or surface tension.

[0228] Moreover, the absorber 250 can be configured in any one of a metal body woven from metal wires of a metal material or a metal sintered body sintered from powder of a metal material to form the above-mentioned plurality of air holes.

[0229] In particular, preferably, the absorber 250 can be made of a metal material and more preferably made of SUS material, so that it can receive the heat transferred from the heating element through the evaporation plate unit assembly 100 and effectively evaporate the absorbed liquid refrigerant.

[0230] As described above, the above-mentioned plurality of absorbers 250 can be respectively supported on a plurality of absorber setting grooves 220 provided in the refrigerant flow space 205 of the one heat conduction plate 202A and the other heat conduction plate 202B.

[0231] In addition, the plurality of absorbers 250 and the plurality of absorber setting grooves 220 can be arranged separately at intervals in the horizontal direction (more specifically, the length direction in the left-right direction of the evaporation plate unit assembly 100).

[0232] Among them, as described above, when the absorber 250 is configured as a metal body and a metal sintered body of a metal material, it has its own rigidity and hardness. As described below, it can play a role in assisting to enhance the strength of the one heat conduction plate 202A and the other heat conduction plate 202B manufactured with a relatively thin thickness.

[0233] For example, in order to provide a plurality of absorbers 250, a plurality of absorber setting grooves 220 formed by a stamping process on the refrigerant flow space 205 side increase the rigidity of the one heat conducting plate 202A and the other heat conducting plate 202B themselves. And for an external force acting from the outside toward the refrigerant flow space 205 side, the plurality of absorbers 250 provided in the refrigerant flow space 205 support themselves outward, so that the outer shapes of the one heat conducting plate 202A and the other heat conducting plate 202B can be maintained.

[0234] On the contrary, contrary to the shape retention force provided by the plurality of absorbers 250 against an external force acting from the outside toward the refrigerant flow space 205 side, as will be described later, the plurality of strength reinforcement portions 230 are joined to each other in the refrigerant flow space 205, so as to prevent the one heat conducting plate 202A and the other heat conducting plate 202B from separating from or shaking against each other corresponding to a change in the internal pressure generated during the phase change of the refrigerant, so as to be able to provide a shape retention force against the internal pressure.

[0235] Among them, as Figures 6 to 8 shown, in the one heat conducting plate 202A and the other heat conducting plate 202B, a plurality of absorber setting grooves 220 for supporting to prevent the flow of the absorber 250 in the refrigerant flow space 205 are arranged to be evenly spaced in the middle part between the two ends in the left - right direction, and the plurality of strength reinforcement portions 230 can be formed in the one heat conducting plate 202A and the other heat conducting plate 202B that are not occupied by the plurality of absorber setting grooves 220.

[0236] In addition, as Figure 6 and Figure 7 shown, the plurality of absorbers 250 can be formed to protrude more downward than the lower ends of the one heat conducting plate 202A and the other heat conducting plate 202B, so that the lower end portions are immersed in the storage portion 110 of the evaporation plate unit assembly 100.

[0237] That is, when the liquid refrigerant condensed from the refrigerant flow space 205 falls and the lower end portions of the one heat conducting plate 202A and the other heat conducting plate 202B are joined to the evaporation plate unit assembly 100, the plurality of absorbers 250 can have a length that protrudes more downward than the lower ends of the one heat conducting plate 202A and the other heat conducting plate 202B, so that the lower ends are located in the storage portion 110 of the evaporation plate unit assembly 100.

[0238] Figure 20 is an exploded perspective view of separating the condensation plate unit assembly of the second implementation example in the structure according to Figure 2 from the evaporation plate unit assembly, Figure 21 is Figure 20 an exploded perspective view of Figure 22 is separating the condensation plate unit assembly according to Figure 20Exploded perspective view of the structure of the condensing plate component of the second implementation example, with the other heat conducting plate separated Figure 23 Shows in accordance with Figure 20 Perspective view of the state where the single condensing plate component of the second implementation example in the structure of the heat dissipation device is combined with the evaporation plate component, with the mounting panel removed Figure 24 Exploded perspective view of separating the mounting panel from the evaporation plate component Figure 25 Exploded perspective view of separating the mounting panel and the plurality of rigid strengthening components in the structure Figure 26 Is Figure 24 Perspective view of the state where the mounting panel in the structure of is removed Figure 27 Is to separate Figure 24 Exploded perspective view of separating one of the plurality of rigid strengthening components

[0239] In the heat dissipation device 2 according to another embodiment of the present utility model, the structures of the evaporation plate component 100 and the mounting panel 300 are described on the premise that they are the same as those of the heat dissipation device 1 according to one embodiment of the present utility model that has been described

[0240] However, in the heat dissipation device 2 according to another embodiment of the present utility model, the plurality of rigid strengthening components 150' can be configured in a different manner compared to the heat dissipation device 1 according to another embodiment of the present utility model that has been described

[0241] That is, the plurality of rigid strengthening components 150' can be arranged to be installed in the storage portion 110 of the evaporation plate component 100, and can be arranged to have eight columns in the width direction defined as the front - rear direction

[0242] Among them, the adjacent plurality of rigid strengthening components (refer to Figure 25 The reference numerals "150 - 1" and "150 - 2" in the figure) are arranged to have a predetermined interval distance respectively along the front - rear width direction, and each interval distance can be arranged directly below the setting slot 310 of the mounting panel 300 arranged above it

[0243] Insert the lower ends 240 of the plurality of condensing plate components 202 according to the second implementation example into the space corresponding to the interval distance of the above - mentioned plurality of rigid strengthening components 150 - 1, 150 - 2, so that the plurality of rigid strengthening components 150' can play a role in supporting the outer surfaces of the lower ends of the one - side heat conducting plate 202A and the other - side heat conducting plate 202B that respectively constitute the condensing plate component 202 according to the second implementation example

[0244] More specifically, a plurality of rigid reinforcing members 150' may be arranged to support the lower surface of the mounting panel 300 and the bottom surface of the storage portion 110 in the storage portion 110 of the evaporation plate unit assembly 100, and one side heat conduction plate 202A and the other side heat conduction plate 202B may support one side surface of the lower end portion and the other side surface of the lower end portion between the plurality of rigid reinforcing members 150'.

[0245] As described above, after a plurality of condensation plate unit assemblies 202 according to the second implementation example are combined through the respective setting slots 310 of the mounting panel 300, welding combination may be performed along the periphery of the setting slots 310 to prevent leakage of the liquid refrigerant stored in the storage portion 110 of the evaporation plate unit assembly 100 or the gaseous refrigerant that diffuses and flows through the refrigerant flow space 205 after phase change from the liquid refrigerant.

[0246] In addition, the plurality of rigid reinforcing members 150' are formed to have a vertical cross-section with a wavy shape, the lower end surface 150B contacts the bottom surface 115 of the storage portion 110 of the evaporation plate unit assembly 100, the upper end surface 150A contacts the lower surface 355 corresponding to between the setting slots 310 of the mounting panel 300, and the respective contacting portions can be joined in a welding combination manner.

[0247] As described above, the plurality of rigid reinforcing members 150' join the respective contact end portions 150A and 150B on the lower side and the upper side to the evaporation plate unit assembly 100 and the mounting panel 300, so that they can play a role in enhancing the rigidity of the respective portions of the evaporation plate unit assembly 100 and the mounting panel 300 configured to have a relatively thin thickness.

[0248] In addition, the plurality of rigid reinforcing members 150' as described above are located in the storage portion 110 of the evaporation plate unit assembly 100 and are immersed by the stored liquid refrigerant, so that they can play a role in indirectly transferring the heat received from the heating element to the liquid refrigerant. At this time, by increasing the heat transfer area, they can play a role in assisting in achieving a more active gas-liquid conversion (phase change).

[0249] For this purpose, the plurality of rigid reinforcing members 150' may be made of a metal material having excellent thermal conductivity, and preferably, the same SUS material as the condensation plate unit assembly 202 according to the second implementation example or the same Cu material as the evaporation plate unit assembly 100 may be adopted.

[0250] Figure 28 is a cross-sectional view taken along the A'-A' line of Figure 1 , Figure 29a is Figure 2 the front view (a) of Figure 29b isFigure 2 Front view (a) and sectional view taken along line C'-C' (b).

[0251] Refer to Figure 28 , and briefly describe the heat dissipation process of the heat dissipation device 1 according to another embodiment of the present invention. If the liquid refrigerant (liquid refrigerant) stored in the storage part 110 of the evaporation plate part assembly 100 uses the lower surface of the evaporation plate part assembly 100 or the heat transfer panel 180 of the heat transfer plate assembly 170 as a medium and changes to a gaseous refrigerant (gaseous refrigerant) after receiving heat from the heating body, it diffuses and flows toward the refrigerant flow space 205 side of the plurality of condensation plate part assemblies 200 implemented by the first implementation example. The liquid refrigerant that has been condensed through heat exchange with external air (outside air) easily falls along the gravity direction through the first refrigerant flow path 205a in the refrigerant flow space 205, so that the liquid refrigerant is captured again in the storage part 110 of the evaporation plate part assembly 100 to perform the gas-liquid cycle.

[0252] At this time, the evaporation plate part assembly 100 firmly supports the mounting panel 300 through a plurality of rigid strengthening members 150, and the condensation plate part assembly 200 can have its own rigidity that can easily cope with the internal pressure change during the gas-liquid cycle through a plurality of strength strengthening parts 230.

[0253] In addition, as Figure 29a and Figure 29b shown, the heat dissipation device 2 according to still another embodiment of the present invention is also like the heat dissipation device 1 according to an embodiment of the present invention described above. In the storage part 110 of the evaporation plate part assembly 100, it changes from a liquid refrigerant to a gaseous refrigerant, and through the refrigerant flow space 205 of the plurality of condensation plate part assemblies 200 according to the second implementation example, it can realize the gas-liquid cycle period of repeatedly changing from a gaseous refrigerant to a liquid refrigerant.

[0254] At this time, the liquid refrigerant condensed inside the plurality of condensation plate part assemblies 200 is arranged to be easily captured uniformly in the storage part 110 of the evaporation plate part assembly 100 located on the lower side through the absorber 250 based on the gravity direction, so that a more rapid gas-liquid cycle can be realized.

[0255] In the heat dissipation devices 1 and 2 according to the embodiments of the present invention having the structure described above, each of the condenser plate assemblies 200 and 202 does not use the most commonly used aluminum (Al) material, but instead uses a metal material of a metal plate component that forms the base material of one side heat conduction plates 200A and 202A and the other side heat conduction plates 200B and 202B. The metal material is SUS material with a thermal conductivity of 1 / 10 or less. Not only is it manufactured with an ultra-thin thickness, so that almost all of the heat generated from the heat source is input into the gas-liquid change (phase change) of the refrigerant that substantially functions as heat dissipation, but it is also designed to have the technical feature of minimizing the conversion of thermal energy into physical force through the internal pressure change in the refrigerant flow space 205 according to the ultra-thin manufacturing of the thickness. Thus, it has the advantage of maximizing the heat dissipation performance.

[0256] As described above, the condenser plate assembly according to the embodiment of the present invention and the heat dissipation devices 1 and 2 including the condenser plate assembly have been described in detail with reference to the drawings. However, the embodiments of the present invention are not limited to the above-described one embodiment, and it is natural that those skilled in the art having ordinary knowledge in the technical field to which the present invention pertains can make various modifications and implement them within an equivalent range. Therefore, the true scope of the rights of the present invention should be determined by the claims.

Claims

1. A condensing plate component, characterized in that, Comprising: One side heat conducting plate, which is a metal plate component having a heat conductivity of a predetermined value or more; And The other side heat conducting plate, which is a metal plate component the same as the one side heat conducting plate, wherein, with respect to the direction of gravity as a reference, the one side heat conducting plate and the other side heat conducting plate are joined at their edge ends except for the lower ends thereof, thereby forming a refrigerant flow space for refrigerant to flow; The lower ends of the one side heat conducting plate and the other side heat conducting plate are joined to communicate with the evaporation plate unit assembly, wherein a storage part for allowing the liquid refrigerant condensed from the refrigerant flow space to fall and be stored is formed in the evaporation plate unit assembly.

2. The condensation plate unit assembly according to claim 1, wherein A plurality of strength reinforcing parts are formed in the one side heat conducting plate and the other side heat conducting plate, and the plurality of strength reinforcing parts are formed by being recessed inward in a manner of being in contact with each other in the refrigerant flow space.

3. The condensation plate unit assembly according to claim 2, wherein The portions of the plurality of strength reinforcing parts in contact with each other are joined by welding in the refrigerant flow space.

4. The condensation plate unit assembly according to claim 2, wherein The refrigerant flow space includes: A first refrigerant flow path, which is formed as the maximum separation distance between the one side heat conducting plate and the other side heat conducting plate, and is formed so as to be separated maximally in the thickness direction of the refrigerant flow space, and is formed to surround the periphery of each of the plurality of strength reinforcing parts; and A second refrigerant flow path, which is formed by being recessed from the one side heat conducting plate and the other side heat conducting plate toward the inside of the refrigerant flow space, and is formed between each of the plurality of strength reinforcing parts and the first refrigerant flow path.

5. The condensation plate unit assembly according to claim 4, wherein The second refrigerant flow path is formed by being recessed toward the inside of the refrigerant flow space in a manner of being separated from each other in the thickness direction within the refrigerant flow space.

6. The condensation plate unit assembly according to claim 4, wherein The recessed depth of the second refrigerant flow path is at least greater than the recessed depth of the first refrigerant flow path and less than the recessed depth of the plurality of strength reinforcing parts.

7. The condensation plate unit assembly according to claim 4, wherein The second refrigerant flow path is defined as being separated from an adjacent second refrigerant flow path by the first refrigerant flow path.

8. The condensation plate unit assembly according to claim 1, wherein The lower ends of the one side heat conducting plate and the other side heat conducting plate are joined to cover the storage part of the evaporation plate unit assembly.

9. The condensation plate unit assembly according to claim 8, wherein The lower ends of the one side heat conducting plate and the other side heat conducting plate penetrate through a setting slot formed in a mounting panel joined to the upper surface of the evaporation plate unit assembly and are joined to the storage part in a manner of being placed in the storage part, so as to mediate the joining with the evaporation plate unit assembly.

10. The condensation plate unit assembly according to claim 9, wherein After the one side heat conducting plate and the other side heat conducting plate are joined to the setting slot of the mounting panel, they are joined by welding along the periphery of the setting slot.

11. The condensing plate unit assembly according to claim 9, wherein: In the storage portion of the evaporation plate unit assembly, a plurality of rigid reinforcing members that support the lower surface of the mounting panel and the bottom surface of the storage portion are arranged at intervals in a plurality of columns. The one-side heat conducting plate and the other-side heat conducting plate support the upper surface, which is separated by a dividing groove formed in a groove shape on the upper portion of the plurality of rigid reinforcing members, on the lower surface of the mounting panel.

12. The condensing plate unit assembly according to claim 1, wherein: The one-side heat conducting plate and the other-side heat conducting plate are joined to each other at the remaining edge ends except for the lower end portion joined to the evaporation plate unit assembly to form the refrigerant flow space.

13. The condenser plate unit assembly according to claim 1, characterized in that, Further comprising: A plurality of condensing refrigerant trapping and absorbing bodies, which are arranged in the refrigerant flow space formed between the one-side heat conducting plate and the other-side heat conducting plate and guide the condensing refrigerant.

14. A condensate plate component, characterized in that, Comprising: A one-side heat conducting plate, which is a metal plate member having a heat conductivity of a predetermined value or more; An other-side heat conducting plate, which is the same metal plate member as the one-side heat conducting plate; And A plurality of condensing refrigerant trapping and absorbing bodies, which are arranged in the refrigerant flow space formed between the one-side heat conducting plate and the other-side heat conducting plate, and are arranged elongated in the direction of gravity to contact and support the inner surface of the one-side heat conducting plate forming one heat dissipation surface in the refrigerant flow space and the inner surface of the other-side heat conducting plate forming the other heat dissipation surface in the refrigerant flow space.

15. The condensing plate unit assembly according to claim 14, wherein: The plurality of condensing refrigerant trapping and absorbing bodies are provided as either a metal body woven from metal wires of a metal material or a metal sintered body sintered from metal powder of a metal material.

16. The condensing plate unit assembly according to claim 14, wherein: The plurality of condensing refrigerant trapping and absorbing bodies are formed with a plurality of pores having a size such that the liquid refrigerant condensed in the refrigerant flow space is absorbed by capillary force or surface tension.

17. The condensing plate unit assembly according to claim 14, wherein: In the one-side heat conducting plate and the other-side heat conducting plate, a plurality of absorber setting grooves, which are supported in the refrigerant flow space in a manner to prevent the flow of the plurality of condensing refrigerant trapping and absorbing bodies, are formed corresponding to the number of the plurality of condensing refrigerant trapping and absorbing bodies.

18. The condensing plate unit assembly according to claim 17, wherein: The plurality of condensing refrigerant trapping and absorbing bodies and the plurality of absorber setting grooves are arranged separately at intervals in the horizontal direction.

19. The condensing plate unit assembly according to claim 14, wherein: When the lower end portions of the one-side heat conducting plate and the other-side heat conducting plate are joined to the evaporation plate unit assembly formed with a storage portion for dropping and storing the liquid refrigerant condensed from the refrigerant flow space, The plurality of condensing refrigerant trapping and absorbing bodies have a length that protrudes more downward than the lower ends of the one-side heat conducting plate and the other-side heat conducting plate so that the lower ends are located in the storage portion of the evaporation plate unit assembly.

20. The condensate plate unit assembly according to claim 19, characterized in that the one-side heat conducting plate and the other-side heat conducting plate make the remaining edge ends except for the lower end part combined with the evaporation plate unit assembly contact each other and form the refrigerant flow space.

21. The condensate plate unit assembly according to claim 20, characterized in that a plurality of strength reinforcing parts are formed in the one-side heat conducting plate and the other-side heat conducting plate, and the plurality of strength reinforcing parts are processed to be recessed inward in a manner of contacting each other in the refrigerant flow space.

22. The condensate plate unit assembly according to claim 21, characterized in that the plurality of strength reinforcing parts are joined by welding at the parts where they contact each other in the refrigerant flow space.

23. The condensate plate unit assembly according to claim 21, characterized in that in the one-side heat conducting plate and the other-side heat conducting plate, a plurality of absorber setting grooves supported in a manner of preventing the flow of the plurality of condensate refrigerant trapping absorbers are formed corresponding to the number of the plurality of condensate refrigerant trapping absorbers in the refrigerant flow space.

24. The condensate plate unit assembly according to claim 19, characterized in that the lower end parts of the one-side heat conducting plate and the other-side heat conducting plate penetrate through the setting slots formed in the mounting panel combined with the upper surface of the evaporation plate unit assembly and are combined with the storage part in a manner of being placed in the storage part to mediate the combination with the evaporation plate unit assembly.

25. The condensate plate unit assembly according to claim 24, characterized in that after the one-side heat conducting plate and the other-side heat conducting plate are combined with the setting slots of the mounting panel, they are welded and combined along the periphery of the setting slots.

26. The condensate plate unit assembly according to claim 24, characterized in that in the storage part of the evaporation plate unit assembly, a plurality of rigid reinforcing members combined to support the lower surface of the mounting panel and the bottom surface of the storage part are arranged in a plurality of rows, one-side surfaces and the other-side surfaces of the lower end parts of the one-side heat conducting plate and the other-side heat conducting plate are supported between the plurality of rigid reinforcing members.

27. A heat dissipation device, characterized in that, Comprising: an evaporation plate unit assembly, having a surface in thermal contact with the heat generating surface of the heat generating body and formed with a storage part for storing the liquid refrigerant in the refrigerant; a plurality of condensate plate unit assemblies, combined with the evaporation plate unit assembly and diffusing and condensing the gaseous refrigerant that has undergone a phase change in the storage part; and a mounting panel, mediating the slot connection between the evaporation plate unit assembly and the condensate plate unit assembly, wherein, the evaporation plate unit assembly is made of copper material, and the condensate plate unit assembly is made of stainless steel material.

28. The heat dissipation device according to claim 27, characterized in that the plurality of condensate plate unit assemblies form a refrigerant flow space for flowing the liquid refrigerant and the gaseous refrigerant by joining the edge ends of two base material panels made of stainless steel material and the strength reinforcing parts formed at a plurality of positions inside.

29. The heat dissipation device according to claim 27, characterized in that a plurality of refrigerant flow paths for flowing the liquid refrigerant in the direction of gravity are formed in the plurality of condensate plate unit assemblies. Absorbers made of braided metal wire mesh are respectively provided in the plurality of refrigerant flow paths.

30. The heat dissipation device according to claim 27, characterized in that, In the evaporation plate unit assembly, a plurality of strength reinforcement members for strengthening the strength between the evaporation plate unit assembly and the mounting panel are joined by a brazing process.

31. A heat dissipation device, characterized in that, Comprising: An evaporation plate unit assembly, which forms a storage part for storing a refrigerant that can undergo a phase change according to temperature, and at least a part of the lower surface thereof is in thermal contact with the heat generating surface of the heat generating body; And A plurality of condensation plate unit assemblies, which are joined to the evaporation plate unit assembly in a manner communicating with the storage part, and release the heat transferred from the heat generating body through heat exchange with external air, Wherein, each of the plurality of condensation plate unit assemblies includes: One side heat conducting plate, which is a metal plate member having a heat conductivity of a predetermined value or more; and The other side heat conducting plate, which is the same metal plate member as the one side heat conducting plate, Wherein, the one side heat conducting plate and the other side heat conducting plate are joined to each other at the edge ends except for the lower end parts with the gravity direction as a reference, so as to form a refrigerant flow space for the refrigerant to flow, The lower end parts of the one side heat conducting plate and the other side heat conducting plate are joined to communicate with the storage part of the evaporation plate unit assembly.

32. The heat dissipation device according to claim 31, characterized in that, The one side heat conducting plate and the other side heat conducting plate are joined to each other at the remaining edge ends except for the lower end parts joined to the evaporation plate unit assembly to form the refrigerant flow space.

33. The heat dissipation device according to claim 31, characterized in that, A plurality of strength reinforcement parts are formed in the one side heat conducting plate and the other side heat conducting plate, and the plurality of strength reinforcement parts are formed by being recessed inward in a manner of contacting each other in the refrigerant flow space.

34. The heat dissipation device according to claim 33, characterized in that, The parts where the plurality of strength reinforcement parts contact each other in the refrigerant flow space are joined by welding.

35. The heat dissipation device according to claim 33, characterized in that, The refrigerant flow space includes: A first refrigerant flow path, which is formed as the maximum distance between the one side heat conducting plate and the other side heat conducting plate, and is formed to be separated by the maximum distance along the thickness direction of the refrigerant flow space, and is formed to surround the periphery of each of the plurality of strength reinforcement parts; and A second refrigerant flow path, which is formed by being recessed from the one side heat conducting plate and the other side heat conducting plate toward the inside of the refrigerant flow space, and is formed between each of the plurality of strength reinforcement parts and the first refrigerant flow path.

36. The heat dissipation device according to claim 35, characterized in that, The second refrigerant flow path is formed by being recessed toward the inside of the refrigerant flow space in a manner of being separated from each other along the thickness direction in the refrigerant flow space.

37. The heat dissipation device according to claim 35, characterized in that, The recessed depth of the second refrigerant flow path is at least greater than the recessed depth of the first refrigerant flow path and less than the recessed depth of the plurality of strength reinforcement parts.

38. The heat dissipation device according to claim 35, wherein the second refrigerant flow path is defined to be separated from an adjacent second refrigerant flow path by means of the first refrigerant flow path.

39. The heat dissipation device according to claim 31, wherein lower end portions of the one heat conducting plate and the other heat conducting plate are combined to cover a storage portion of the evaporation plate unit assembly.

40. The heat dissipation device according to claim 39, characterized in that, Further comprising: a mounting panel, combined with an upper surface of the evaporation plate unit assembly to mediate combination of the evaporation plate unit assembly and the plurality of condensation plate unit assemblies, lower end portions of the one heat conducting plate and the other heat conducting plate penetrate through a setting slot formed in the mounting panel and are combined with the storage portion in a manner of being placed in the storage portion.

41. The heat dissipation device according to claim 40, wherein after the one heat conducting plate and the other heat conducting plate are combined with the setting slot of the mounting panel, they are welded and combined along a periphery of the setting slot.

42. The heat dissipation device according to claim 40, wherein in the storage portion of the evaporation plate unit assembly, a plurality of rigid reinforcing members combined to support a lower surface of the mounting panel and a bottom surface of the storage portion are arranged in a plurality of rows at intervals, upper surfaces of the one heat conducting plate and the other heat conducting plate, which are separated by a distinguishing groove formed in a groove shape on upper portions of the plurality of rigid reinforcing members, are supported on the lower surface of the mounting panel.

43. The heat dissipation device according to claim 31, wherein the condensation plate unit assembly further comprises: a plurality of condensation refrigerant trapping and absorbing bodies, arranged in a refrigerant flow space formed between the one heat conducting plate and the other heat conducting plate, and elongated along a gravity direction to contact and support an inner surface of the one heat conducting plate forming one heat dissipation surface in the refrigerant flow space and an inner surface of the other heat conducting plate forming the other heat dissipation surface in the refrigerant flow space.

44. The heat dissipation device according to claim 43, wherein the plurality of condensation refrigerant trapping and absorbing bodies are configured as any one of a metal body woven by metal wires of a metal material or a metal sintered body sintered from powders of a metal material.

45. The heat dissipation device according to claim 43, wherein the plurality of condensation refrigerant trapping and absorbing bodies are formed with a plurality of air holes having a size such that liquid refrigerant condensed in the refrigerant flow space is absorbed by capillary force or surface tension.

46. The heat dissipation device according to claim 44, wherein in the one heat conducting plate and the other heat conducting plate, a plurality of absorber setting grooves supported in a manner of preventing flow of the plurality of condensation refrigerant trapping and absorbing bodies are formed in the refrigerant flow space to correspond to the number of the plurality of condensation refrigerant trapping and absorbing bodies.

47. The heat dissipation device according to claim 46, wherein the plurality of condensation refrigerant trapping and absorbing bodies and the plurality of absorber setting grooves are arranged to be separated from each other along a horizontal direction.

48. The heat dissipation device according to claim 44, wherein When the lower ends of the one heat conduction plate and the other heat conduction plate are combined with an evaporation plate unit assembly formed with a storage unit for allowing the liquid refrigerant condensed from the refrigerant flow space to fall and be stored, the plurality of condensed refrigerant trapping and absorbing bodies have a length that protrudes more downward than the lower ends of the one heat conduction plate and the other heat conduction plate, so that the lower ends are located in the storage unit of the evaporation plate unit assembly.

49. The heat dissipation device according to claim 31, characterized in that, Further comprising: a heat transfer plate assembly that mediates the transfer to the lower surface of the evaporation plate unit assembly after receiving heat generated by the heating body.

50. The heat dissipation device according to claim 49, wherein the heat transfer plate assembly includes: a coupling frame configured in a quadrilateral frame shape that is hollow in the middle; and a heat transfer panel coupled to the middle part of the coupling frame, having its lower surface in surface thermal contact with the heating surface of the heating body and its upper surface in surface thermal contact with the lower surface of the evaporation plate unit assembly.

51. The heat dissipation device according to claim 50, wherein at least a pair of panel fixing hooks for fixing the heat transfer panel are integrally formed at the inner ends of the coupling frame.

52. The heat dissipation device according to claim 50, wherein Further comprising: a mounting panel coupled to the upper surface of the evaporation plate unit assembly to mediate the coupling between the evaporation plate unit assembly and the plurality of condensation plate unit assemblies, wherein a support hook portion is formed on the coupling frame, and after being inserted through the extension holes formed in the evaporation plate unit assembly and the mounting panel, the support hook portion is snapped onto and fastened to the upper surface of the mounting panel.

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