Device for detecting upper and lower smudginess of silicon wafer
By simplifying the optical path design and camera components adjustment, the problems of complex optical path debugging and unstable imaging in traditional silicon wafer detection devices are solved, and efficient and accurate silicon wafer dirt detection is achieved.
Patent Information
- Application Number
- CN202421807824.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-29
- Publication Date
- 2025-07-08
- Estimated Expiration
- 2034-07-29
AI Technical Summary
In traditional silicon wafer dirt detection devices, the optical path debugging of the reflector is inconvenient, and the angle fluctuations of the silicon wafer on the conveying line affect the imaging stability, resulting in poor detection effect.
Using upper and lower detection components without complex reflectors, the adjustable camera components and light sources are used to simplify the optical path and imaging accuracy through the light transmittance, adapting to the detection of silicon wafers of different specifications.
The equipment debugging process is simplified, imaging accuracy and working efficiency are improved, and the complete surface features are detected during the high-speed transportation of silicon wafers, and missed inspections.
Smart Images
Figure CN223078206U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of silicon wafer detection equipment, in particular to a silicon wafer upper and lower dirt detection device. Background Art
[0002] As an important raw material for solar cells, silicon wafers are widely used in the production and manufacturing of solar cells, circuit boards and other products. During the production and transportation process of silicon wafers, dirt may stick to the upper and lower surfaces of the silicon wafers, which will affect the quality of the silicon wafers. Therefore, dirt detection is required on the upper and lower surfaces of the silicon wafers during silicon wafer inspection. The traditional silicon wafer dirt detection mechanism includes a detection camera, a reflection mechanism and a laser transmitter. The laser transmitter emits light to illuminate the surface of the silicon wafer, and a series of complex reflectors are used to form a reflection mechanism. After the laser is irradiated on the surface of the silicon wafer, the light path is reflected into the detection camera through the reflector. Reflection through the reflector has specific requirements for the light path, which is not convenient during the debugging process and requires a lot of manpower. In addition, the silicon wafer obtains an image through the reflection of the reflector light path. When the silicon wafer fluctuates on the conveyor line and produces a certain angle, it will affect the imaging effect of the silicon wafer and the stability is not high. Utility Model Content
[0003] In order to solve the above technical problems, the utility model provides a silicon wafer upper and lower dirt detection device.
[0004] The technical solution of the utility model is: a device for detecting dirt on upper and lower parts of silicon wafers, comprising a substrate and a conveyor line, wherein the substrate is provided with a conveyor line, and silicon wafers are placed on the conveyor line. An upper detection assembly is provided above the conveyor line, and a lower detection assembly is provided below the conveyor line. Both the upper detection assembly and the lower detection assembly are fixedly connected to the substrate, and both the upper detection assembly and the lower detection assembly are provided with a camera assembly in a sliding connection in the vertical direction. The camera assembly comprises a detection camera, a lateral adjustment slider, and a height adjustment slider; the lateral adjustment slider is slidably connected to the height adjustment slider, and a threaded adjustment screw is provided in the horizontal direction of the height adjustment slider, and one end of the adjustment screw passes through the height adjustment slider and contacts the lateral adjustment slider.
[0005] Furthermore, the conveyor line includes two conveyor belts, and the silicon wafers move under the drive of the conveyor belts. A driving mechanism is provided below the conveyor line, and the driving mechanism includes a motor, and the motor is driven by the conveyor belt through a pulley mechanism.
[0006] Furthermore, the upper detection assembly includes a camera assembly, an upper vertical plate, a side vertical plate and an upper light source. The camera assembly is slidably connected to the upper vertical plate, the bottom of the upper vertical plate is fixedly connected to the horizontal plate, the two ends of the horizontal plate are fixedly connected to the top of the side vertical plate, the bottom end of the side vertical plate is fixedly connected to the base plate, an upper light source is arranged between the side vertical plates, and an upper light-transmitting groove is arranged on the horizontal plate.
[0007] Further, an upper adjusting screw rod is rotatably connected in the vertical direction of the upper vertical plate. An upper knob is provided at the top of the upper adjusting screw rod, and the upper adjusting screw rod is threadedly connected to the height adjusting slider.
[0008] Further, the lower detection assembly includes a camera assembly, a lower vertical plate, a bottom plate, and a lower light source. The camera assembly is slidably connected to the lower vertical plate. A bottom plate is provided at the top of the lower vertical plate. A lower light-transmitting groove is provided on the bottom plate. Mounting seats are provided at both ends of the bottom plate, and the top of the mounting seat is fixedly connected to the lower light source. The bottom plate is fixedly connected to the substrate.
[0009] Further, a blowing block is provided at the position of the lower detection assembly corresponding to the camera assembly. The blowing block is fixedly connected to the camera assembly through a blowing support seat.
[0010] Further, a lower adjusting screw rod is rotatably connected in the vertical direction of the lower vertical plate. An upper knob is provided at the top of the lower adjusting screw rod, and the lower adjusting screw rod is threadedly connected to the height adjusting slider.
[0011] Further, the camera assembly is threadedly connected to the lower adjusting screw rod through a connecting block. A marking ruler is fixedly connected to one end of the connecting block, and the top of the marking ruler passes through the indicating block on the bottom plate.
[0012] Compared with the prior art, the advantages of the present utility model are as follows: The upper detection assembly and the lower detection assembly do not have complex reflection mechanisms, which facilitates the debugging of the equipment, has accurate imaging, and improves work efficiency. The vertically adjustable camera assembly is convenient for obtaining different visual fields and can be compatible with different specifications of silicon wafers for detection. By rotating the adjusting screw to change the length of the adjusting screw screwed into the height adjusting slider, the horizontal position of the camera assembly is changed, so as to ensure that the image of the silicon wafer along the conveying line direction is centered in the detection camera, and to ensure the complete surface features of the silicon wafer are captured during the high-speed conveying of the silicon wafer, ensuring that there is no risk of missed detection. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.
[0014] Figure 1 It is a schematic diagram of the whole of the present utility model;
[0015] Figure 2 It is a schematic diagram of the upper detection assembly of the present utility model;
[0016] Figure 3 It is Figure 2 the enlarged view of part A in
[0017] Figure 4 This is a schematic diagram of the lower detection component of the utility model.
[0018] Among them: 1. conveyor line; 2. upper detection component; 3. lower detection component; 4. substrate; 5. silicon wafer; 6. camera component; 11. drive mechanism; 201. side plate; 202. fixed horizontal bar; 203. upper light source; 204. horizontal plate; 205. upper plate; 206. first reinforcing rib; 207. upper knob; 208. upper adjustment screw; 209. upper light-transmitting groove; 301. lower light source; 302. mounting seat; 303. bottom plate ; 304, lower knob; 305, indicator block; 306, marking ruler; 307, second reinforcing rib; 308, lower adjusting screw; 309, connecting block; 310, lower vertical plate; 311, blowing block; 312, blowing support; 313, lower light-transmitting groove; 601, detection camera; 602, lens; 603, height adjustment slider; 604, horizontal adjustment slider; 605, adjustment seat; 606, adjustment screw; 607, connecting piece. DETAILED DESCRIPTION
[0019] In order to make the purpose, technical solution and advantages of the utility model clearer, the technical solution of the utility model will be described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work belong to the scope of protection of the utility model.
[0020] The specific implementation of the utility model will be described below in conjunction with the accompanying drawings:
[0021] like Figures 1 to 4 As shown, a device for detecting dirt on upper and lower parts of silicon wafers includes a substrate 4 and a conveyor line 1. The substrate 4 is provided with the conveyor line 1, and the silicon wafer 5 is placed on the conveyor line 1. The conveyor line 1 includes two conveyor belts, and the silicon wafer 5 moves driven by the conveyor belts. An upper detection component 2 is provided above the conveyor line 1, and a lower detection component 3 is provided below the conveyor line 1. The upper detection component 2 and the lower detection component 3 are both fixedly connected to the substrate 4. A driving mechanism 11 is provided below the conveyor line 1, and the driving mechanism 11 includes a motor, which is driven by a pulley mechanism and the conveyor belt. The silicon wafer 5 passes through the upper part of the lower detection component 3 and the lower part of the upper detection component 2 in sequence along with the conveyor line 1.
[0022] On both the upper detection component 2 and the lower detection component 3 in the vertical direction, there is a camera component 6 connected in a sliding manner. The camera component 6 includes a detection camera 601, a horizontal adjustment slider 604, and a height adjustment slider 603. The detection camera 601 is slidably connected to the upper detection component 2 and the lower detection component 3 through a height adjustment block. By adjusting the vertical height of the detection camera 601, the detection field of view of the detection camera 601 can be changed, thereby adapting to the detection of silicon wafers 5 of different specifications. A lens 602 is provided at the end of the detection camera 601, and the detection camera 601 is fixedly connected to the horizontal adjustment slider 604 through a connecting member 607. The lens 602 of the upper detection component 2 faces downward, and the lens 602 of the lower detection component 3 faces upward. The horizontal adjustment slider 604 is slidably connected to the height adjustment slider 603. On the horizontal direction of the height adjustment slider 603, there is an adjustment screw 606 connected by a thread. One end of the adjustment screw 606 passes through an adjustment seat 605 on the height adjustment slider 603 and contacts one side of the horizontal adjustment slider 604. By changing the length of the adjustment screw 606 screwed in, the horizontal position of the horizontal adjustment slider 604 is adjusted to ensure that the image of the silicon wafer 5 along the conveying line 1 direction is centered in the detection camera 601 and ensure the imaging quality.
[0023] The upper detection component 2 includes a camera component 6, an upper vertical plate 205, side vertical plates 201, and an upper light source 203. The upper vertical plate 205 is provided with a vertical chute for cooperating with the height adjustment slider 603. The bottom of the upper vertical plate 205 is fixedly connected to a cross plate 204. The upper vertical plate 205 is provided with a first reinforcing rib 206 to improve the anti-deformation ability of the upper vertical plate 205 through the first reinforcing rib 206. Both ends of the cross plate 204 are fixedly connected to the tops of the side vertical plates 201. The assembly strength is improved between the side vertical plates 201 through a fixed cross bar 202, and the anti-deformation ability of the side vertical plates 201 is improved.
[0024] The bottom ends of the side vertical plates 201 are fixedly connected to the substrate 4. An upper light source 203 is provided between the side vertical plates 201. An upper light transmission groove 209 is provided on the cross plate 204. The light emitted by the upper light source 203 shoots downward onto the silicon wafer 5 and enters the detection camera 601 through the light transmission groove to form an image. An upper adjustment screw 208 is rotatably connected in the vertical direction of the upper vertical plate 205. An upper knob 207 is provided at the top of the upper adjustment screw 208. The upper adjustment screw 208 is threadedly connected to the height adjustment slider 603. By rotating the upper knob 207, the upper adjustment screw 208 drives the height adjustment slider 603 to move along the vertical direction, thereby changing the height of the detection camera 601.
[0025] The lower detection component 3 includes a camera component 6, a lower vertical plate 310, a bottom plate 303, and a lower light source 301. The camera component 6 is slidably connected to the lower vertical plate 310. The top of the lower vertical plate 310 is provided with a bottom plate 303. A lower light-transmitting groove 313 is provided on the bottom plate 303. The lower vertical plate 310 is provided with a second reinforcing rib 307 to enhance the anti-deformation ability of the lower vertical plate 310 through the second reinforcing rib 307. Mounting seats 302 are provided at both ends of the bottom plate 303. The top of the mounting seat 302 is fixedly connected to the lower light source 301. The bottom plate 303 is fixedly connected to the substrate 4. The light of the lower light source 301 shines on the surface of the silicon wafer 5 and enters the detection camera 601 through the lower light-transmitting groove 313 for imaging. A rotatably connected lower adjusting screw 308 is provided in the vertical direction of the lower vertical plate 310. A lower knob 304 is provided at the top of the lower adjusting screw 308. The lower adjusting screw 308 is threadedly connected to the height adjusting slider 603. By rotating the lower knob 304, the detection camera 601 moves up and down under the drive of the lower adjusting screw 308. A blowing block 311 is provided at the position of the lower detection component 3 corresponding to the camera component 6. The blowing block 311 is fixedly connected to the camera component 6 through a blowing support 312. Airflow sprays out from the blowing block 311 to purge and clean the lens 602 of the detection camera 601, preventing dirt from remaining on the lens 602 and affecting the imaging quality. The camera component 6 is threadedly connected to the lower adjusting screw 308 through a connecting block 309. One end of the connecting block 309 is provided with a fixedly connected identification scale 306. The top of the identification scale 306 passes through the indicating block 305 on the bottom plate 303. The connecting block 309 moves up and down with the detection camera 601, and the identification scale 306 also moves accordingly. Thus, the distance of the up and down movement of the detection camera 601 is quantified by the reading of the identification scale 306.
[0026] The working principle of the specific embodiment of the present invention is as follows: The silicon wafer 5 sequentially passes through the upper part of the lower detection component 3 and the lower part of the upper detection component 2 under the action of the conveyor line 1. When the silicon wafer 5 passes through the lower detection component 3, the light of the lower light source 301 irradiates the lower bottom surface of the silicon wafer 5, and then enters the detection camera 601 through the lower light-transmitting groove 313 to form an image of the lower surface of the silicon wafer 5. When the silicon wafer 5 passes through the upper detection component 2, the light of the upper light source 203 irradiates the upper surface of the silicon wafer 5, and then enters the detection camera 601 through the lower light-transmitting groove 313 to form an image of the upper surface of the silicon wafer 5.
[0027] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "upper", "lower", "left", "right", "front", "rear" and similar expressions used herein are only for the purpose of illustration.
[0028] The above are only the preferred embodiments of the present invention and do not impose any form of limitation on the present invention. Although the present invention has been disclosed above in the preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some changes or modifications to equivalent embodiments by using the disclosed technical content within the scope of the technical solution of the present invention. However, as long as it does not depart from the content of the technical solution of the present invention, any brief modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention still fall within the scope of the technical solution of the present invention.
Claims
1. A silicon wafer upper and lower contamination detection device, comprising a substrate (4) and a conveyor line (1), wherein the conveyor line (1) is provided on the substrate (4), and the silicon wafer (5) is placed on the conveyor line (1), characterized in that: Above the conveyor line (1), there is an upper detection component (2). Below the conveyor line (1), there is a lower detection component (3). Both the upper detection component (2) and the lower detection component (3) are fixedly connected to the substrate (4). In the vertical direction of the upper detection component (2) and the lower detection component (3), there is a camera component (6) connected in a sliding manner; the camera component (6) includes a detection camera (601), a lateral adjustment slider (604), and a height adjustment slider (603); the lateral adjustment slider (604) is slidably connected to the height adjustment slider (603). On the horizontal direction of the height adjustment slider (603), there is an adjustment screw (606) connected by a thread. One end of the adjustment screw (606) passes through the height adjustment slider (603) and contacts the lateral adjustment slider (604).
2. The silicon wafer top and bottom contamination detection device according to claim 1, characterized in that: The conveyor line (1) includes two conveyor belts. The silicon wafer (5) moves driven by the conveyor belts; below the conveyor line (1), there is a driving mechanism (11). The driving mechanism (11) includes a motor, and the motor is in transmission connection with the conveyor belts through a pulley mechanism.
3. The silicon wafer upper and lower contamination detection device according to claim 1, wherein: The upper detection component (2) includes a camera component (6), an upper vertical plate (205), side vertical plates (201), and an upper light source (203); the camera component (6) is slidably connected to the upper vertical plate (205). The bottom of the upper vertical plate (205) is fixedly connected to a horizontal plate (204). Both ends of the horizontal plate (204) are fixedly connected to the top ends of the side vertical plates (201). The bottom ends of the side vertical plates (201) are fixedly connected to the substrate (4). An upper light source (203) is arranged between the side vertical plates (201). An upper light-transmitting groove (209) is arranged on the horizontal plate (204).
4. The silicon wafer top and bottom contamination detection device according to claim 3, wherein: In the vertical direction of the upper vertical plate (205), there is an upper adjustment screw rod (208) connected in a rotational manner. The top end of the upper adjustment screw rod (208) is provided with an upper knob (207). The upper adjustment screw rod (208) is in threaded connection with the height adjustment slider (603).
5. The silicon wafer upper and lower contamination detection device according to claim 1, characterized in that: The lower detection component (3) includes a camera component (6), a lower vertical plate (310), a bottom plate (303), and a lower light source (301); the camera component (6) is slidably connected to the lower vertical plate (310). The top end of the lower vertical plate (310) is provided with the bottom plate (303). A lower light-transmitting groove (313) is arranged on the bottom plate (303). Mounting seats (302) are arranged at both ends of the bottom plate (303). The top of the mounting seats (302) is fixedly connected to the lower light source (301). The bottom plate (303) is fixedly connected to the substrate (4).
6. The silicon wafer upper and lower contamination detection device according to claim 5, wherein: At the position corresponding to the camera component (6) of the lower detection component (3), there is a blowing block (311). The blowing block (311) is fixedly connected to the camera component (6) through a blowing support seat (312).
7. The wafer top and bottom contamination detection device according to claim 5, characterized in that: The lower vertical plate (310) is provided with a lower adjusting screw rod (308) rotatably connected in the vertical direction. The top end of the lower adjusting screw rod (308) is provided with a lower knob (304), and the lower adjusting screw rod (308) is threadedly connected to the height adjusting slider (603).
8. The silicon wafer upper and lower contamination detection device according to claim 7, wherein: The camera assembly (6) is threadedly connected to the lower adjusting screw rod (308) through a connecting block (309); one end of the connecting block (309) is provided with a fixedly connected marking scale (306), and the top end of the marking scale (306) passes through an indicating block (305) on the bottom plate (303).