Optical product test carrier

Abstract

The utility model discloses and provides an optical product test carrier which fixes an optical component in a mode that a profiling groove is matched with a side pushing block, reduces part processing difficulty and is convenient to take and place, and the optical product test carrier comprises a carrier main body, a test module, a product limiting module and a product to be tested, the carrier body comprises a positioning datum plate and a heat conduction block, a rectangular through hole is formed in the carrier body, the positioning datum plate and the heat conduction block are fixed to the two sides of the rectangular through hole respectively, and the testing module is arranged on the heat conduction block. The product limiting module and the to-be-tested product are both arranged on the positioning reference plate, the product limiting module is matched with the to-be-tested product in a limiting manner, and the testing module is matched with the to-be-tested product. The device is applied to the field of optical product testing.

Description

Technical Field

[0001] The utility model is applied to the field of optical product testing, and particularly relates to a testing carrier for optical products. Background Art

[0002] During the testing process of optical components, it is necessary to position, supply power, control temperature, and lead out signals for the products. However, optical components have the characteristics of small size, special structure, high appearance requirements, and sensitivity to changes in the testing position. Therefore, it is required that the product carrier has a high enough positioning accuracy, is not easy to damage the product, and has accurate temperature control. However, most of the current testing carriers use a product profiling groove and an upper cover pressing method to fix the product. This solution's positioning accuracy overly depends on the processing accuracy of the profiling groove parts, resulting in high part processing difficulty. At the same time, the profiling groove size is close to the product size, making it inconvenient to pick and place, and it is easy to damage the product. Moreover, special products cannot use the upper cover pressing method to fix the product. If a method of combining a profiling groove with a side push block can be designed to fix the optical component, and an optical product testing carrier that is convenient for picking and placing while reducing the part processing difficulty can be obtained, the above problems can be well solved. Summary of the Invention

[0003] The technical problem to be solved by the utility model is to overcome the deficiencies of the prior art and provide an optical product testing carrier that uses a method of combining a profiling groove with a side push block to fix the optical component, which is convenient for picking and placing while reducing the part processing difficulty.

[0004] The technical solution adopted by the utility model is as follows: The utility model includes a carrier main body, a testing module, a product limiting module, and a product to be tested. The carrier main body includes a positioning reference plate and a heat conduction block. A rectangular through hole is provided on the carrier main body. The positioning reference plate and the heat conduction block are respectively fixed on both sides of the rectangular through hole. The testing module is arranged on the heat conduction block. Both the product limiting module and the product to be tested are arranged on the positioning reference plate. The product limiting module is in limiting cooperation with the product to be tested, and the testing module is in cooperation with the product to be tested. Thus, it can be seen that the testing module is in cooperation with the product to be tested through the heat conduction block, and the product to be tested is in cooperation with the product limiting module. Because the product to be tested is small in volume and not easy to pick and place, the product limiting module is used to limit the product to be tested. At the same time, the testing result of the product to be tested is obtained through the testing module. By setting the rectangular through hole, the volume and weight of the testing carrier can be reduced, so that each module can be placed in the carrier main body.

[0005] Further, the product limiting module includes a side push block, a spring limiting screw and a first spring. The spring limiting screw and the product to be tested are respectively in limiting cooperation with both sides of the side push block. The first spring is arranged between the spring limiting screw and the side push block, and both ends of the first spring are in limiting cooperation with the spring limiting screw and the side push block respectively.

[0006] Further, positioning guide sleeves are arranged on both sides of the carrier main body, and the positioning guide sleeves are in limiting cooperation with external equipment.

[0007] Further, the testing module includes a probe assembly, a temperature sensor assembly and a PCB board assembly. The probe assembly, the temperature sensor assembly and the PCB board assembly are all in limiting cooperation with the heat conducting block. Both sides of the probe assembly are respectively in contact with the product to be tested and the PCB board assembly, and the temperature sensor assembly is arranged between the probe assembly and the PCB board assembly.

[0008] Further, a profiling groove for limiting cooperation between the product to be tested and the product limiting module is arranged on the positioning reference plate. A product positioning reference edge is arranged on one side of the profiling groove away from the side push block, and the product positioning reference edge cooperates with the product to be tested.

[0009] Further, a plurality of square grooves for limiting cooperation with the probe assembly, the temperature sensor assembly and the PCB board assembly are arranged on the heat conducting block.

[0010] Further, the probe assembly includes a probe fixing block, a plurality of second springs and a plurality of probe elements. The second springs and the probe elements are both fixed on the probe fixing block. The second springs are in limiting cooperation with the heat conducting block, and the probe elements are in contact with the lower surface of the product to be tested.

[0011] Further, the temperature sensor assembly includes a temperature sensor element and a sensor fixing block. The temperature sensor element is in limiting cooperation on the sensor fixing block through a limiting pressure plate. The limiting pressure plate is fixed on the carrier main body, and the temperature sensor element is in contact and cooperation with the PCB board assembly.

[0012] Further, the PCB board assembly includes a PCB flexible board and a PCB cover plate. The PCB flexible board is in limiting cooperation with the carrier main body through the PCB cover plate. One end of the PCB board assembly is respectively in cooperation with the probe assembly and the temperature sensor assembly, and the other end of the PCB board assembly is in cooperation with external equipment. Description of the Drawings

[0013] Figure 1 is the first structural view of the present utility model;

[0014] Figure 2 is the second structural view of the present utility model;

[0015] Figure 3 is the exploded structural view of the present utility model;

[0016] Figure 4 is the structural view of the product limiting module;

[0017] Figure 5 is the structural view of the probe assembly;

[0018] Figure 6 is the structural view of the temperature sensor assembly. Detailed implementation manners

[0019] As Figure 1 and Figure 2 shown, in this embodiment, the present utility model includes a carrier body 1, a test module 2, a product limiting module 3 and a product under test 4. The carrier body 1 includes a positioning reference plate 10 and a heat conducting block 11. A rectangular through hole 12 is provided on the carrier body 1. The positioning reference plate 10 and the heat conducting block 11 are respectively fixed on both sides of the rectangular through hole 12. The test module 2 is arranged on the heat conducting block 11. The product limiting module 3 and the product under test 4 are both arranged on the positioning reference plate 10. The product limiting module 3 is in limiting cooperation with the product under test 4, and the test module 2 is in cooperation with the product under test 4. Thus, it can be seen that the test module 2 cooperates with the product under test 4 through the heat conducting block 11, and the product under test 4 cooperates with the product limiting module 3. Since the product under test 4 is small and not easy to pick up and place, the product limiting module 3 is used to limit the product under test. At the same time, the test result of the product under test 4 is obtained through the test module 2. By providing the rectangular through hole 12, the volume and weight of the test carrier can be reduced, so that each module can be placed in the carrier body 1.

[0020] As Figures 3 to 4 shown, in this embodiment, the product limiting module 3 includes a side push block 30, a spring limit screw 31 and a first spring 32. The spring limit screw 31 and the product under test 4 are respectively in limiting cooperation with both sides of the side push block 30. The first spring 32 is arranged between the spring limit screw 31 and the side push block 30. Both ends of the first spring 32 are in limiting cooperation with the spring limit screw 31 and the side push block 30 respectively.. Thus, it can be seen that the spring limit screw 31 is in limiting cooperation with the side push block 30, and the side push block 30 is in limiting cooperation with the product under test 4. When the side push block 30 is toggled, it will drive the first spring 32 to move. When the first spring 32 is compressed and reset, it will drive the side push block 30 to move towards the product under test 4, playing a reset role for the product limiting module 3.

[0021] As Figure 2 shown, in this embodiment, positioning guide sleeves 13 are provided on both sides of the vehicle body 1, and the positioning guide sleeves 13 are in limiting cooperation with external devices. Thus, it can be seen that positioning guide sleeves 13 are provided on both sides of the vehicle body 1. When the vehicle body 1 is in limiting cooperation with the external devices, the positioning guide sleeves 13 play a role in positioning and limiting.

[0022] As Figure 3 shown, in this embodiment, the test module 2 includes a probe assembly 20, a temperature sensor assembly 21, and a PCB board assembly 22. The probe assembly 20, the temperature sensor assembly 21, and the PCB board assembly 22 are all in limiting cooperation with the heat conducting block 11. Both sides of the probe assembly 20 are in contact with the product under test 4 and the PCB board assembly 22 respectively, and the temperature sensor assembly (21) is arranged between the probe assembly 20 and the PCB board assembly 22. Thus, it can be seen that the test module 2 is composed of the probe assembly 20, the temperature sensor assembly 21, and the PCB board assembly 22. One side of the probe assembly 20 is in contact with the product under test 4, and the other side of the probe assembly 20 is in contact with the PCB board assembly 22. The probe assembly 20 plays a role in connecting the product under test 4 and the PCB board assembly 22. The temperature sensor assembly 21 is arranged between the probe assembly 20 and the PCB board assembly 22, and the temperature sensor assembly 21 monitors the temperature of the product under test 4 through the heat conducting block 11.

[0023] As Figure 3 shown, in this embodiment, a profiling groove for the limiting cooperation between the product under test 4 and the product limiting module 3 is provided on the positioning reference plate 10. A product positioning reference edge is provided on one side of the profiling groove away from the side push block 30, and the product positioning reference edge cooperates with the product under test 4. Thus, it can be seen that the product under test 4 and the product limiting module 3 are arranged in the profiling groove. The product under test 4 is in limiting cooperation with the product limiting module 3. The profiling groove is provided with a product positioning reference edge, and the product positioning reference edge plays a role in positioning and limiting the product under test 4.

[0024] As Figure 2 shown, in this embodiment, a number of square grooves for the limiting cooperation between the probe assembly 20, the temperature sensor assembly 21, and the PCB board assembly 22 are provided on the heat conducting block 11. Thus, it can be seen that a number of square grooves are provided on the heat conducting block 11, so that the probe assembly 20, the temperature sensor assembly 21, and the PCB board assembly 22 are fitted in the square grooves, reducing the volume of the carrier and realizing a lightweight design.

[0025] AsFigure 5 As shown in the figure, in this embodiment, the probe assembly 20 includes a probe fixing block 200, a plurality of second springs 201, and a plurality of probe elements 202. The second springs 201 and the probe elements 202 are both fixed on the probe fixing block 200. The second springs 201 are in limit fit with the heat conducting block 11, and the probe elements 202 are in contact with the lower surface of the product under test 4. It can be seen that both the second springs 201 and the probe elements 202 are fixed on the probe fixing block 200. The probe fixing block 200 drives the second springs 201 and the probe elements 202 to move together, so that the probe elements 202 are in contact with the product under test 4. Also, because the second springs 201 are in limit fit with the heat conducting block 11, the second springs 201 are driven by the probe fixing block 200 to be compressed. When the second springs 201 are compressed, they can absorb part of the thrust of the probe fixing block 200, playing a buffering role and protecting the product under test 4.

[0026] As Figure 6 shown in the figure, in this embodiment, the temperature sensor assembly 21 includes a temperature sensor element 210 and a sensor fixing block 211. The temperature sensor element 210 is in limit fit on the sensor fixing block 211 through a limit pressing plate 212. The limit pressing plate 212 is fixed on the carrier body 1. The temperature sensor element 210 is in contact fit with the PCB board assembly 22. It can be seen that the temperature sensor element 210 is in limit fit on the sensor fixing block 211 through the limit pressing plate 212. The temperature sensor element 210 can accurately read the product under test 4 by monitoring the heat transferred by the product under test 4 on the heat conducting block 11 in real time.

[0027] As Figure 2 shown in the figure, in this embodiment, the PCB board assembly 22 includes a PCB flexible board 220 and a PCB cover plate 221. The PCB flexible board 220 is in limit fit on the carrier body 1 through the PCB cover plate 221. One end of the PCB board assembly 22 is respectively in cooperation with the probe assembly 20 and the temperature sensor assembly 21, and the other end of the PCB board assembly 22 is in cooperation with an external device. It can be seen that the PCB flexible board 220 is in limit fit on the carrier body 1. One end of the PCB flexible board 220 is respectively in cooperation with the probe assembly 20 and the temperature sensor assembly 21. The other end of the PCB flexible board 220, which includes the PCB flexible board 220, is in cooperation with an external device. One end of the PCB flexible board 220 obtains information from the probe assembly 20 and the temperature sensor assembly 21, and the other end of the PCB flexible board 220 transmits it to the external device, playing an intermediate transmission role.

[0028] In this embodiment, the working principle of the present utility model is as follows:

[0029] As Figures 1 to 6 shown, the operator toggles the side push block 30 in a direction away from the product 4 to be tested, places the product 4 to be tested in the positioning position of the positioning reference plate 10, releases the side push block 30, and the side push block 30 pushes the product 4 to be tested to the reference edge of the positioning reference plate 10 under the elastic force of the first spring 32 to limit the product 4 to be tested. Then, the lower surface of the carrier with the product 4 to be tested installed is attached to an external device, and the external device is connected to the contacts on the PCB flexible board 220. The protruding mechanism on the external device pushes the probe assembly 20 upward, driving the probe element 202 to move upward to connect with the lower surface of the product 4 to be tested. After the connection is completed, the operator conducts a test and obtains test information through the external device. After the test is completed, the carrier is separated from the external device, and the operator toggles the side push block 30 in a direction away from the product 4 to be tested, takes out the product 4 to be tested, and then the product can be released. This cycle is repeated.

[0030] Although the embodiments of the present invention are described with actual solutions, they do not constitute a limitation to the meaning of the present invention. For those skilled in the art, modifications to its implementation solutions according to this specification and combinations with other solutions are obvious.

Claims

1. An optical product testing carrier, which comprises a carrier main body (1), and is characterized in that: It also includes a test module (2) and a product limit module (3). The carrier body (1) includes a positioning reference plate (10) and a heat conducting block (11). A rectangular through hole (12) is provided on the carrier body (1). The positioning reference plate (10) and the heat conducting block (11) are respectively fixed on both sides of the rectangular through hole (12). The test module (2) is arranged on the heat conducting block (11). The product limit module (3) and the product to be tested (4) are both arranged on the positioning reference plate (10). The product limit module (3) is in limit cooperation with the product to be tested (4), and the test module (2) is in cooperation with the product to be tested (4).

2. The optical product test carrier according to claim 1, wherein: The product limit module (3) includes a side push block (30), a spring limit screw (31), and a first spring (32). The spring limit screw (31) and the product to be tested (4) are respectively in limit cooperation with both sides of the side push block (30). The first spring (32) is arranged between the spring limit screw (31) and the side push block (30). Both ends of the first spring (32) are in limit cooperation with the spring limit screw (31) and the side push block (30).

3. An optical product test carrier according to claim 1, characterized in that: Positioning guide sleeves (13) are arranged on both sides of the carrier body (1). The positioning guide sleeves (13) are in limit cooperation with external devices.

4. An optical product test carrier according to claim 1, characterized in that: The test module (2) includes a probe assembly (20), a temperature sensor assembly (21), and a PCB board assembly (22). The probe assembly (20), the temperature sensor assembly (21), and the PCB board assembly (22) are all in limit cooperation with the heat conducting block (11). Both sides of the probe assembly (20) are respectively in contact with the product to be tested (4) and the PCB board assembly (22). The temperature sensor assembly (21) is arranged between the probe assembly (20) and the PCB board assembly (22).

5. The optical product test carrier according to claim 2, wherein: A profiling groove for the limit cooperation between the product to be tested (4) and the product limit module (3) is provided on the positioning reference plate (10). A product positioning reference edge is arranged on one side of the profiling groove away from the side push block (30). The product positioning reference edge is in cooperation with the product to be tested (4).

6. The optical product test carrier according to claim 4, wherein: A number of square grooves for the limit cooperation with the probe assembly (20), the temperature sensor assembly (21), and the PCB board assembly (22) are provided on the heat conducting block (11).

7. An optical product test carrier according to claim 4, characterized in that: The probe assembly (20) includes a probe fixing block (200), a number of second springs (201), and a number of probe elements (202). The second springs (201) and the probe elements (202) are both fixed on the probe fixing block (200). The second springs (201) are in limit cooperation with the heat conducting block (11). The probe elements (202) are in contact with the lower surface of the product to be tested (4).

8. The optical product test carrier according to claim 4, wherein: The temperature sensor assembly (21) includes a temperature sensor element (210) and a sensor fixing block (211). The temperature sensor element (210) is position-limited and cooperated on the sensor fixing block (211) through a limit pressing plate (212). The limit pressing plate (212) is fixed on the carrier body (1), and the temperature sensor element (210) is in contact and cooperation with the PCB board assembly (22).

9. An optical product test carrier according to claim 4, characterized in that: The PCB board assembly (22) includes a flexible PCB (220) and a PCB cover plate (221). The flexible PCB (220) is position-limited and cooperated on the carrier body (1) through the PCB cover plate (221). One end of the PCB board assembly (22) is respectively in cooperation with the probe assembly (20) and the temperature sensor assembly (21), and the other end of the PCB board assembly (22) is in cooperation with an external device.

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