Transmitting module and laser radar device
By installing a heat dissipation member in the lidar device and using the shell to contact the atmospheric environment for heat dissipation, the heat accumulation problem caused by the sealed structure is solved, and the heat dissipation efficiency and life of the laser are improved.
Patent Information
- Application Number
- CN202422013313.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-19
- Publication Date
- 2025-07-08
- Estimated Expiration
- 2034-08-19
AI Technical Summary
The closed structure of the lidar device makes it difficult to dissipate heat, affecting the performance and life of the laser.
A heat dissipation member is arranged inside the casing of the lidar device, which can efficiently dissipate heat through contact with the atmospheric environment, and a heat dissipation member is connected to the emitting circuit board and the casing with a thermally conductive adhesive layer to ensure effective heat transfer.
It realizes efficient heat dissipation of light sources, avoids the performance degradation and damage of the laser in high-temperature environments, and extends the life of the laser.
Smart Images

Figure CN223078471U_ABST
Abstract
Description
Technical Field
[0001] Embodiments of the present disclosure relate to, but are not limited to, the field of lidar, and more particularly, to a transmitting module and a lidar device. Background Art
[0002] A laser can be applied to a lidar device. By emitting a laser to an object to be measured, the distance between the object to be measured and the lidar device can be calculated based on the emission time, return time, and the speed of light of the laser. Since the housing of the lidar device is a closed structure, components such as lasers and motors inside it will generate a large amount of heat during operation. Moreover, the closed structure of the lidar device makes it difficult for the heat inside the lidar device to dissipate. If the lidar device works in a high-temperature environment for a long time, it will affect the reliability of the lidar device. Especially for the emission cavity including the laser, if the temperature in the emission cavity is not conducted out in time to reduce the temperature in the emission cavity, it may lead to a decline in the performance of the laser, thermal runaway, or even damage, greatly shortening the lifespan of the laser that emits the laser beam. Summary of the Utility Model
[0003] The present utility model aims to solve at least one of the technical problems existing in the prior art, and provides a transmitting module and a lidar device. The heat dissipation member is used to conduct the heat generated when the light source works to the housing. Since the housing is in contact with the atmospheric environment, efficient heat dissipation of the transmitting module can be achieved, solving the problem of ineffective heat dissipation in the related art.
[0004] To achieve the purpose of the present utility model, a transmitting module is provided, which is disposed inside the housing of a lidar device and includes a transmitting circuit board, a light source, and a heat dissipation member disposed on the transmitting circuit board. The heat dissipation member includes a first contact surface and a second contact surface. The first contact surface is connected to the transmitting circuit board, and the second contact surface is connected to the first surface of the housing. The second surface of the housing, which is opposite to the first surface, is configured to be in contact with the atmospheric environment, so that the heat dissipation member can transfer the heat generated when the light source works to the atmospheric environment through the housing.
[0005] In some embodiments, the transmitting module further includes a first thermally conductive adhesive layer and a second thermally conductive adhesive layer. The first contact surface is connected to the transmitting circuit board through the first thermally conductive adhesive layer, and the second contact surface is connected to the first surface of the housing through the second thermally conductive adhesive layer.
[0006] In some embodiments, the transmitting circuit board has a first positioning surface and a second positioning surface disposed opposite to each other. The light source is disposed on the first positioning surface, and the first contact surface of the heat dissipation member is connected to the position corresponding to the light source on the second positioning surface.
[0007] In some embodiments, the heat dissipation member is provided with a first avoidance groove that is recessed from the first contact surface in a direction away from the emission circuit board. The first avoidance groove has a bottom surface and an inner side wall surface. The inner side wall surface is annularly provided on the outer periphery of the bottom surface and is used to connect the first contact surface and the bottom surface. The first avoidance groove is used to accommodate the components on the emission circuit board that protrude from the second positioning surface when the first contact surface is connected to the emission circuit board.
[0008] In some embodiments, the heat dissipation member is further provided with a second avoidance groove that penetrates through to the bottom surface.
[0009] In some embodiments, the heat dissipation member is further provided with a matching structure that protrudes from the first contact surface in a direction close to the emission circuit board. The matching structure has a top surface and an outer side wall surface. The outer side wall surface is annularly provided on the outer periphery of the top surface and is used to connect the first contact surface and the top surface. The matching structure is connected to the emission circuit board through a first fastener.
[0010] In some embodiments, the heat dissipation member includes a first heat dissipation plate having a first contact surface and a second heat dissipation plate having a second contact surface. The included angle between the first heat dissipation plate and the second heat dissipation plate is 90°.
[0011] In some embodiments, the emission module further includes a diaphragm disposed on the emission circuit board. The diaphragm includes a substrate and a plurality of support legs. A light-transmitting hole is provided on the substrate, and the light-transmitting hole is used for the light emitted by the light source to pass through. The substrate is connected to the emission circuit board through the plurality of support legs.
[0012] The present utility model also relates to a lidar device, which includes a housing and an emission module, a lens module, a scanning module, and a receiving module disposed inside the housing. The emission module is configured to emit an emission beam with energy. The lens module is configured to guide the emission beam to the scanning module and guide the received reflected receiving beam received by the scanning module to the receiving module. Among them, the emission module adopts the above-mentioned emission module.
[0013] In some embodiments, the housing includes a first sub-shell and a second sub-shell that are oppositely disposed. The emission circuit board is connected to the first sub-shell, and the second sub-shell has a first surface and a second surface.
[0014] In some embodiments, the first sub-shell is provided with a first connection hole, and the emission circuit board is provided with a second connection hole. The first connection hole and the second connection hole are used for a second fastener to pass through them to connect the first sub-shell and the emission circuit board. Among them, the inner diameter of the second connection hole is greater than the inner diameter of the first connection hole.
[0015] The present utility model has the following beneficial effects:
[0016] Since the light source (e.g., laser) in the transmitting module is a high-heat-generating device, when the transmitting module is applied to a lidar device, the enclosed structure of the lidar device makes it difficult for heat to dissipate. If the transmitting module works in a high-temperature environment for a long time, it may cause the performance of the laser to decline, thermal runaway or even damage, greatly shortening the lifespan of the laser that emits the laser beam. Therefore, in the embodiments of the present disclosure, when the light source is disposed on the transmitting circuit board, the heat is transferred to the housing through the heat dissipation member, and since the outside of the housing is in contact with the atmospheric environment, efficient heat dissipation of the light source can be achieved.
[0017] By reading the specification, claims and drawings of this application, other objects and features of the present utility model will become clear. Brief Description of the Drawings
[0018] The above and / or additional aspects and advantages of the present utility model will become apparent and be readily understood from the following description of the embodiments in conjunction with the accompanying drawings, where:
[0019] Figure 1 is an exploded view of the lidar device according to an embodiment of the present utility model.
[0020] Figure 2 is a partial enlarged view of the lidar device according to an embodiment of the present utility model.
[0021] Figure 3 is a structural schematic diagram of the heat dissipation member according to an embodiment of the present utility model.
[0022] Figure 4 is a structural schematic diagram of the transmitting circuit board according to an embodiment of the present utility model.
[0023] Figure 5 is a structural schematic diagram of the transmitting module according to an embodiment of the present utility model.
[0024] Figure 6 is a structural schematic diagram of the transmitting module from another perspective according to an embodiment of the present utility model.
[0025] Figure 7 is a structural schematic diagram of the aperture of the transmitting module according to an embodiment of the present utility model.
[0026] Figure 8a is a partial exploded view of the lidar device according to an embodiment of the present utility model.
[0027] Figure 8b is Figure 8a a structural schematic diagram after assembly.
[0028] Figure 9 is a partial cross-sectional view of the lidar device according to an embodiment of the present utility model.
[0029] Figure 10 This is a partial exploded view of the lidar device according to the embodiment of the present utility model.
[0030] Description of main component symbols:
[0031] 10. Lidar device;
[0032] 110. First sub-shell; 112. Resting surface; 120. Second sub-shell; 121. First surface;
[0033] 122. Second surface; 123. Window; 200. Transmitting module; 300. Scanning module; 500. Receiving module; 600. Lens module; 700. Power plug; 810. First PCB board; 820. Second PCB board; 900. Breather valve;
[0034] 210. Transmitting circuit board; 213. Second connection hole; 220. Cable; 230. Heat sink; 240. First thermally conductive adhesive layer; 250. Second thermally conductive adhesive layer; 260. Diaphragm; 261. Substrate; 262. Light-transmitting hole; 263. Support leg; 270. First fastener;
[0035] 280. Component; 290. Second fastener;
[0036] 211. First positioning surface; 212. Second positioning surface;
[0037] 231. First heat sink plate; 231a. First contact surface; 232. Second heat sink plate; 232a. Second contact surface; 233. First relief groove; 234. Second relief groove; 235. Fitting structure. Specific embodiments
[0038] The following details the embodiments of the present utility model. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present utility model and should not be construed as limiting the present utility model.
[0039] An embodiment of the present disclosure proposes a transmitting module 200. The following refers to Figure 2 and 3 to describe the transmitting module 200 according to the embodiment of the present application. The transmitting module 200 can be applied to the lidar device 10, and the lidar device 10 can be used to detect the distance, speed, etc. of a target object.
[0040] In the embodiments of the present disclosure, the transmitting module 200 is disposed inside the housing of the lidar device 10. The transmitting module 200 includes a transmitting circuit board 210, a light source, and a heat sink 230.
[0041] In various embodiments, the transmitting module 200 may be configured to emit a transmitting beam having a preset energy distribution. For example, the energy distribution may be uniform or non-uniform. Here, a uniform energy distribution may also be understood as a uniform illuminance or light intensity. In some embodiments, the transmitting beam may be further shaped by using a transmitting optical system. Since there are mature structures in the art for the transmitting optical system, detailed description thereof will not be provided herein.
[0042] The light source and the heat sink 230 are disposed on the transmitting circuit board 210. The above description may include direct contact between the light source or the heat sink 230 and the transmitting circuit board 210, or may include non-direct contact but contact through other features therebetween. Moreover, the light source and the heat sink 230 are located on the surface of the transmitting circuit board 210.
[0043] The heat sink 230 includes a first contact surface 231a and a second contact surface 232a. The first contact surface 231a is connected to the transmitting circuit board 210. The second contact surface 232a is connected to the first surface 121 of the housing. The second surface 122 of the housing, which is disposed opposite to the first surface 121, is configured to be in contact with the atmospheric environment, so that the heat sink 230 can transfer the heat generated when the light source operates to the atmospheric environment through the housing.
[0044] In some embodiments, the light source may be a laser, such as a solid-state laser (such as a Vertical-Cavity Surface-Emitting Laser (VCSEL), an Edge Emitting Laser (EEL), an External-cavity Diode Lasers (ECDL)), a laser diode, or a fiber laser. In some embodiments, the light source may also include a Light Emitting Diode (LED). However, those skilled in the art can easily understand that the present application does not specifically limit the type of the light source device, as long as the output power of the light source is large enough. Since the light source (e.g., a laser) in the emission module 200 is a high-heat-generating device, when the emission module 200 is applied to the lidar device 10, the sealed structure of the lidar device 10 makes it difficult for heat to dissipate. If the emission module 200 operates in a high-temperature environment for a long time, it may cause a decline in the performance of the laser, thermal runaway, or even damage, greatly shortening the life of the laser that emits the laser beam. Therefore, in the embodiments of the present disclosure, when the light source is disposed on the emission circuit board 210, the heat sink 230 is also connected to the emission circuit board 210, and the heat is transferred to the housing through the heat sink 230. Since the outside of the housing is in contact with the atmospheric environment, efficient heat dissipation of the light source can be achieved.
[0045] In an alternative embodiment, the emission module 200 further includes a first thermally conductive adhesive layer 240 and a second thermally conductive adhesive layer 250. The first contact surface 231a is connected to the emission circuit board 210 through the first thermally conductive adhesive layer 240, and the second contact surface 232a is connected to the first surface 121 of the housing through the second thermally conductive adhesive layer 250.
[0046] The inventors of the present disclosure recognize that the first thermally conductive adhesive layer 240 can be formed by applying a thermally conductive adhesive between the emission circuit board 210 and the heat sink 230, and the second thermally conductive adhesive layer 250 can be formed by applying a thermally conductive adhesive between the heat sink 230 and the housing. Through these two connection methods, on the one hand, the stability of heat conduction is achieved. Since the heights of the various components connected to the emission circuit board 210 may be inconsistent, the connection method of the thermally conductive adhesive can make the connection area between the heat sink 230 and the emission circuit board 210 larger and the heat conduction efficiency higher; on the other hand, the stability of the connection of the heat sink 230 can also be ensured, and thus the heat of the light source (e.g., a laser) can be stably transferred to the housing and then to the atmospheric environment. Regarding the material of the thermally conductive adhesive, any material with thermally conductive properties can be used, and no limitation is imposed herein.
[0047] In an alternative embodiment, the emission circuit board 210 has a first positioning surface 211 and a second positioning surface 212 which are arranged opposite to each other. The light source is disposed on the first positioning surface 211. The first contact surface 231a of the heat dissipation member 230 is connected to a position corresponding to the light source on the second positioning surface 212, and the heat conduction path is shorter, which can improve the heat dissipation efficiency.
[0048] In an alternative embodiment, the heat dissipation member 230 is provided with a first avoidance groove 233, and the first avoidance groove 233 is recessed from the first contact surface 231a in a direction away from the emission circuit board 210. The first avoidance groove 233 is used to accommodate the component 280 protruding from the second positioning surface 212 on the emission circuit board 210 when the first contact surface 231a is connected to the emission circuit board 210. The first avoidance groove 233 has a bottom surface and an inner side wall surface. The inner side wall surface is annularly arranged on the outer periphery of the bottom surface and is used to connect the first contact surface 231a and the bottom surface.
[0049] In various embodiments, the present application can avoid the protruding component 280 on the emission circuit board 210 by providing the first avoidance groove 233 on the heat dissipation member 230.
[0050] In the above description, it should be understood that the orientation or positional relationship indicated by the terms "bottom", "inner", and "outer" is based on the Figure 3 orientation or positional relationship shown, and is only for the convenience of describing the first avoidance groove 233, rather than indicating or implying that the first avoidance groove 233 must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model.
[0051] In an alternative embodiment, the heat dissipation member 230 is further provided with a second avoidance groove 234, and the second avoidance groove 234 penetrates through to the bottom surface, and reference can be made to Figure 3 and Figure 4 . The first avoidance groove 233 and the second avoidance groove 234 can avoid components 280 with different heights.
[0052] In an alternative embodiment, the heat dissipation member 230 is further provided with a matching structure 235, and the matching structure 235 protrudes from the first contact surface 231a in a direction close to the emission circuit board 210, and specific reference can be made to Figure 3 . The matching structure 235 has a top surface and an outer side wall surface. The outer side wall surface is annularly arranged on the outer periphery of the top surface and is used to connect the first contact surface 231a and the top surface. The matching structure 235 is connected to the emission circuit board 210 through a first fastener 270. It can be understood that the top surface and the outer side wall surface of the matching structure 235 and the first contact surface 231a jointly form a stepped surface.
[0053] In an alternative embodiment, the heat dissipating member 230 includes a first heat dissipation plate 231 and a second heat dissipation plate 232. The first heat dissipation plate 231 has a first contact surface 231a. The second heat dissipation plate 232 has a second contact surface 232a. The included angle between the first heat dissipation plate 231 and the second heat dissipation plate 232 is 90°, and specific reference can be made to Figure 3 and Figure 5 .
[0054] It should be noted that in the embodiment of the present disclosure, the heat dissipating member 230 is set to an L-shaped structure. The L-shaped heat dissipating member 230 has a simple structure and a relatively thin wall thickness, and can effectively conduct the heat of the light source to the housing, realizing efficient heat dissipation and improving the heat dissipation efficiency. During the heat dissipation process, the light source transfers heat to the heat dissipating member 230 through the thermal conductive adhesive, and the heat dissipating member 230 conducts it to the housing by itself. The housing, as the interaction with the outside air, can effectively dissipate the heat of the light source.
[0055] In each embodiment, the emission module 200 further includes a flexible cable 220 and a diaphragm 260, and specific reference can be made to Figure 6 . Since the laser emitted by the laser is divergent, the diaphragm 260 is required to intercept the unnecessary part of the light. Therefore, the position accuracy of the diaphragm 260 relative to the laser of the emission circuit board 210 is relatively high. Therefore, the emission diaphragm 260 can be assembled to the expected position by means of alignment and adjustment, and then fixed with glue.
[0056] In some embodiments, the diaphragm 260 is disposed on the emission circuit board 210. The diaphragm 260 includes a substrate 261 and a plurality of support legs 263. A light-transmitting hole 262 is provided on the substrate 261. The light-transmitting hole 262 is used for the light emitted by the light source to pass through, and reference can be made to Figure 7 . The substrate 261 is connected to the emission circuit board 210 through a plurality of support legs 263. Optionally, considering cost, the diaphragm 260 is configured as a stamping sheet metal part design. The light-transmitting hole 262 is provided in the middle of the substrate 261 to serve as an optical light-transmitting area. At the same time, the periphery of the substrate 261 can be bent to serve as the support legs 263 when connecting to the emission circuit board 210. The plurality of support legs 263 can lift the whole diaphragm 260 to prevent the substrate 261 from touching other components on the emission circuit board 210. Optionally, the heights of the plurality of support legs 263 can be the same or different to avoid components with different heights on the emission circuit board 210. Specifically, the diaphragm 260 includes four support legs 263, and the four support legs 263 are arranged at intervals along the circumferential direction of the substrate 261 to stably support the substrate 261.
[0057] The embodiment of the present disclosure further provides a lidar device 10. The lidar device 10 includes a housing and an emission module 200, a lens module 600, a scanning module 300, and a receiving module 500 disposed inside the housing, and specific reference can be made toFigure 1 and Figure 10 The emission module 200 is configured to emit an emission light beam with energy. The lens module 600 is configured to guide the emission light beam to the scanning module 300 and guide the reflected received light beam received by the scanning module 300 to the receiving module 500. Among them, the emission module 200 adopts the emission module 200 of the above embodiment.
[0058] In various embodiments, the scanning module 300, such as a rotating mirror, can be configured to rotate around a certain direction to guide the emission light beam to scan a target object within the field of view. The target object can be any object within the scanning field of view of the lidar device 10 that can reflect the scanning laser, such as a vehicle, a pedestrian, an animal, a road sign, an obstacle, a tree, a shelf, a piece of furniture, etc.
[0059] The emission light beam is scattered and returned after irradiating the target object, and a part of it returns to the lidar device 10 as the received light beam and is received by the receiving module 500.
[0060] In various embodiments, the receiving module 500 can be configured to receive and detect the received light beam returned from the target object. For example, the received light beam scattered by the target object can return along the original path to the scanning module 300, then be guided by the scanning module 300 to the lens module 600, and then be reflected by the lens module 600 to the receiving module 500.
[0061] In some embodiments, the receiving module 500 may include a photodetector. The photodetector can measure the power, phase or time characteristics of the received light and generate a corresponding current output.
[0062] In various embodiments, the lens module 600 includes an emission lens, a receiving lens and each diaphragm, which is responsible for the emission and reception of the laser. Through precise optical design, the focusing, diffusion or shaping of the laser beam is realized to meet the detection requirements of the lidar system.
[0063] The lidar device 10 further includes a controller, which is used to generate and modulate the laser signal, and realize the detection function of the lidar device 10 by controlling the emission power and waveform of the laser. The controller is also used to receive and process the laser signal reflected by the target, convert it into an electrical signal, and perform subsequent processing.
[0064] In the embodiments of the present disclosure, each component in the lidar device 10 is modularized, and parts with the same function are integrated into the same functional module, which can not only reduce the use of connecting parts, thereby reducing the number of components, but also facilitate assembly and maintenance. Each module inside the lidar device 10 is responsible for implementing a specific function and is connected to other modules through standardized interfaces. This modular design makes the functions of the lidar device 10 clearer, easier to maintain and upgrade.
[0065] In an alternative embodiment, the housing includes a first sub-housing 110 and a second sub-housing 120, and the first sub-housing 110 and the second sub-housing 120 are disposed opposite to each other. The transmitting circuit board 210 is connected to the first sub-housing 110. The second sub-housing 120 has a first surface 121 and a second surface 122.
[0066] The transmitting module 200 is fixed on the first sub-housing 110, and the light source transfers heat to the side surface of the L-shaped heat sink 230 through a heat-conducting adhesive. After the first sub-housing 110 and the second sub-housing 120 are installed, the heat sink 230 transfers the heat to the second sub-housing 120 through its own conduction to achieve heat dissipation.
[0067] In various embodiments, the lidar device 10 further includes a breather valve 900, a power plug connector 700, a first PCB board 810, and a second PCB board 820. Specifically, the breather valve 900, the power plug connector 700, and the first PCB board 810 can all be installed on the second sub-housing 120. The second sub-housing 120 in the embodiments of the present application is used to support and protect the breather valve 900, the power plug connector 700, and the first PCB board 810. Specifically, the first PCB board 810 is used for inlet protection and primary power supply. The inlet protection mainly prevents the adverse effects of external electromagnetic interference, overcurrent, overvoltage, etc. on the internal circuit of the lidar device 10. The primary power supply is responsible for converting the externally input power into the stable voltage required by the lidar device 10 and distributing it to each functional module (for example, the transmitting module 200, the lens module 600, the scanning module 300, and the receiving module 500). Specifically, the second PCB board 820 is connected to the first sub-housing 110. The second PCB board 820 serves as the core control part of the entire lidar device 10 and is responsible for coordinating the work of each functional module to realize the overall function of the lidar device 10.
[0068] It should be noted that a window 123 is provided on the housing, and the window 123 allows lidar signals to pass through while protecting the optical elements inside the lidar device 10 from the external environment. Specifically, the window 123 is provided on the second sub-housing 120.
[0069] In an alternative embodiment, the ventilation valve 900 is configured to be waterproof to ensure the sealing inside the lidar device 10. It can be understood that the ventilation valve 900 allows the internal gas to exchange with the external environment (i.e., the atmospheric environment) to maintain the pressure balance inside the lidar device 10, while preventing external pollutants such as water and dust from entering the inside of the lidar device 10.
[0070] In an alternative embodiment, the power connector 700 is used to connect an external power supply and a circuit board inside the lidar device 10 to provide the required electrical energy for the lidar device 10.
[0071] In various embodiments, the transmitting module 200, the lens module 600, the scanning module 300, and the receiving module 500 are all mounted to the first sub-shell 110. The first sub-shell 110 serves as a support structure for each module, which can not only provide a stable support for the internal components of the lidar device 10, but also ensure that each functional module can be closely combined together through precise dimension and shape design. This close integration not only reduces the overall volume and weight of the system, but also improves the structural strength and stability of the lidar device 10.
[0072] Compared with conventional lidar systems, the functional modules inside the lidar device 10 in the embodiments of the present application are configured for an integrated design to closely combine each functional module together to form an efficient and compact functional unit. This integrated design effectively reduces the interfaces and connections between components and improves the overall performance and reliability of the system.
[0073] In an alternative embodiment, the first sub-shell 110 is provided with a first connection hole, and the transmitting circuit board 210 is provided with a second connection hole 213, as can be seen in Figure 9 The first connection hole and the second connection hole 213 are for the second fastener 290 to pass through to connect the first sub-shell 110 and the transmitting circuit board 210. The inner diameter of the second connection hole 213 is larger than the inner diameter of the first connection hole.
[0074] The second connection hole 213 (e.g., a threaded through-hole) of the transmitting circuit board 210 is larger than the first connection hole (e.g., a threaded through-hole) of the first sub-shell 110 to reserve a margin for installation and adjustment. The first connection hole on the first sub-shell 110 can be set as an M2 thread, and the second connection hole 213 on the transmitting circuit board 210 is set to a diameter of 3.5 mm. Compared with M2, a margin of ±(3.5 - 2) / 2 = 0.75 mm is reserved on each side.
[0075] In addition, the transmitting module 200 will also undergo precise optical alignment to ensure that its position in the optical system reaches an ideal state. As shown in Figure 8a and Figure 8bAs shown, the protruding structure on the first sub-shell 110 is used as the bearing surface 112 for the emission module 200, so that the emission module 200 can be directly contacted and positioned with the first sub-shell 110. Specifically, the emission module 200 is moved along the X direction onto the bearing surface 112, enabling the emission module to achieve translational adjustment in the Y and Z directions and rotational adjustment around the X axis. Since the other three degrees of freedom are not sensitive to the lidar optical system, only the adjustment of three degrees of freedom needs to be considered.
[0076] After the optical adjustment is completed, the emission circuit board 210 will be fixed to the first sub-shell 110 through the second fastener 290 (for example, a screw) to ensure its stability and reliability during operation. The emission module 200 is electrically connected to the second PCB board through the wiring harness 220.
[0077] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present utility model, "a plurality" means two or more unless otherwise specifically defined.
[0078] In the description of the present utility model, it should be noted that unless otherwise clearly defined and limited, the terms "mounted", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a connection that can communicate with each other; it can be directly connected, or indirectly connected through an intermediate medium, and can be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.
[0079] In the description of the present utility model, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through additional features therebetween. Moreover, the first feature being "above", "over" and "on the top of" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "under the bottom of" the second feature includes that the first feature is directly below and obliquely below the second feature, or merely indicates that the horizontal height of the first feature is lower than that of the second feature.
[0080] It can be understood that the above embodiments are merely exemplary embodiments adopted to illustrate the principle of the present utility model. However, the present utility model is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present utility model, and these modifications and improvements are also regarded as the protection scope of the present utility model.
Claims
1. A transmitting module is disposed inside the housing of a lidar device, characterized in that, It includes a transmitting circuit board, a light source and a heat sink disposed on the transmitting circuit board; The heat sink includes a first contact surface and a second contact surface. The first contact surface is connected to the transmitting circuit board, and the second contact surface is connected to the first surface of the housing. The second surface of the housing disposed opposite to the first surface is configured to be in contact with the atmospheric environment, so that the heat sink can transfer the heat generated when the light source works to the atmospheric environment through the housing.
2. The transmitting module according to claim 1, characterized in that, The transmitting module further includes a first thermally conductive adhesive layer and a second thermally conductive adhesive layer; The first contact surface is connected to the transmitting circuit board through the first thermally conductive adhesive layer, and the second contact surface is connected to the first surface of the housing through the second thermally conductive adhesive layer.
3. The emission module according to claim 1, characterized in that The transmitting circuit board has a first positioning surface and a second positioning surface disposed opposite to each other. The light source is disposed on the first positioning surface, and the first contact surface of the heat sink is connected to the position corresponding to the light source on the second positioning surface.
4. The emission module according to claim 3, characterized in that, The heat sink is provided with a first avoidance groove recessed from the first contact surface away from the transmitting circuit board. The first avoidance groove has a bottom surface and an inner side wall surface. The inner side wall surface is annularly arranged on the outer periphery of the bottom surface and is used to connect the first contact surface and the bottom surface; The first avoidance groove is used to accommodate the components protruding from the second positioning surface on the transmitting circuit board when the first contact surface is connected to the transmitting circuit board.
5. The transmitting module according to claim 4, wherein A second avoidance groove is further provided on the heat sink, and the second avoidance groove penetrates through to the bottom surface.
6. The transmitting module according to claim 1, characterized in that, The heat sink is further provided with a matching structure protruding from the first contact surface towards the transmitting circuit board. The matching structure has a top surface and an outer side wall surface. The outer side wall surface is annularly arranged on the outer periphery of the top surface and is used to connect the first contact surface and the top surface; The matching structure is connected to the transmitting circuit board through a first fastener.
7. The transmitting module according to any one of claims 1 to 6, characterized in that, The heat sink includes a first heat dissipation plate having the first contact surface and a second heat dissipation plate having the second contact surface, and the included angle between the first heat dissipation plate and the second heat dissipation plate is 90°.
8. The transmitting module according to any one of claims 1 to 6, characterized in that The transmitting module further includes a diaphragm disposed on the transmitting circuit board. The diaphragm includes a substrate and a plurality of support legs. A light-transmitting hole is provided on the substrate, and the light-transmitting hole is used for the light emitted by the light source to pass through; The substrate is connected to the transmitting circuit board through the plurality of support legs.
9. A lidar device, characterized in that, It includes a housing and a transmitting module, a lens module, a scanning module and a receiving module disposed inside the housing. The transmitting module is configured to emit an emission beam with energy. The lens module is configured to guide the emission beam to the scanning module and guide the received beam reflected back by the scanning module to the receiving module; Wherein, the transmitting module adopts the transmitting module according to any one of claims 1 to 8.
10. The lidar device according to claim 9, characterized in that, The housing includes a first sub-housing and a second sub-housing disposed opposite to each other. The transmitting circuit board is connected to the first sub-housing, and the second sub-housing has the first surface and the second surface.
11. The lidar device according to claim 10, characterized in that, The first sub-shell is provided with a first connection hole, and the emission circuit board is provided with a second connection hole. The first connection hole and the second connection hole are for a second fastener to pass through therein to connect the first sub-shell and the emission circuit board; Wherein the inner diameter of the second connection hole is larger than the inner diameter of the first connection hole.