Etching device
By designing an etching device including an etching groove, a conveying mechanism and a grasping mechanism, the silicon wafer over-etching problem caused by a chain machine is solved, and the silicon wafer etching yield is improved.
Patent Information
- Application Number
- CN202421693019.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-16
- Publication Date
- 2025-07-08
- Estimated Expiration
- 2034-07-16
AI Technical Summary
The existing chain-type machines are likely to cause the silicon wafer to be over-etched during the etching of silicon wafers, which affects the yield of silicon wafers. The main factors include machine automation lag, chemical concentration deviation, roller level not flat enough, wind fluctuations and water film unevenness.
An etching device including an etching groove, a conveying mechanism and a grasping mechanism is designed. The conveying mechanism and a grasping mechanism are controlled by the controller to accurately control the etching time and depth of the silicon wafer, avoid over-etching, and improve the etching yield of the silicon wafer.
By accurately controlling the etching time and depth of the silicon wafer, the silicon wafer is avoided and the yield of etching of the silicon wafer is improved.
Smart Images
Figure CN223079076U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of solar cells, in particular to an etching device. Background Art
[0002] The purpose of removing BSG (phosphate glass) / PSG (borophosphate glass) is to remove the BSG / PSG on the edge and back of the silicon wafer while retaining the BSG / PSG on the front (back) side of the silicon wafer to prepare for alkali polishing.
[0003] At present, the existing BSG / PSG removal uses a chain-type machine. There are many factors that affect the silicon wafer yield when using a chain-type machine, such as machine automation jamming, machine chemical concentration deviation, machine roller levelness, machine exhaust fluctuation or machine water film, which will cause the silicon wafer to be over-engraved, thereby reducing the silicon wafer yield. Utility Model Content
[0004] (I) The utility model provides an etching device that alleviates the technical problem of over-etching of silicon wafers in the prior art, thereby reducing the yield of silicon wafers.
[0005] (II) Technical solution
[0006] In order to solve the above technical problems, an embodiment of the utility model provides an etching device, including an etching tank, a conveying mechanism, a grasping mechanism and a controller;
[0007] The conveying mechanism is arranged above the etching groove, and the grabbing mechanism is telescopically installed below the conveying mechanism for grabbing the silicon wafer to be etched, and the conveying mechanism is used to transport the grabbing mechanism;
[0008] The conveying mechanism and the grasping mechanism are both electrically connected to the controller.
[0009] Furthermore, the grabbing mechanism includes a telescopic rod and a suction cup assembly, one end of the telescopic rod is movably mounted on the conveying mechanism, and the other end of the telescopic rod is connected to the suction cup assembly.
[0010] Furthermore, the grabbing mechanism is also provided with a connecting plate and a connecting rod, the end of the telescopic rod away from the conveying mechanism is connected to one side of the connecting plate, the other side of the connecting plate is connected to the connecting rod, and the lower section of the connecting rod is connected to the suction cup assembly.
[0011] Furthermore, the suction cup assembly includes a suction cup, the upper surface of which is connected to the connecting rod, and the lower surface of which is used to absorb the silicon wafer to be etched.
[0012] Furthermore, the suction cup assembly also includes a suction cup frame, the suction cup is installed below the suction cup frame, and the top end of the suction cup frame is connected to the end of the connecting rod away from the connecting plate.
[0013] Furthermore, the suction cup is provided with a plurality of suction holes.
[0014] Furthermore, the suction cup assembly also includes a detection sensor, which is installed on the suction cup and is used to detect the position of the silicon wafer to be etched.
[0015] Furthermore, the conveying mechanism includes a guide rail, which is arranged above the etching groove. The end of the telescopic rod can be slidably installed in the guide rail and can move along the extension direction of the guide rail.
[0016] Furthermore, the conveying mechanism also includes a driving member, which is electrically connected to the controller. The driving member is arranged at one end of the guide rail, and the output end of the driving member is connected to the end of the telescopic rod to drive the telescopic rod to move in the guide rail.
[0017] Furthermore, a roller is installed at the end of the telescopic rod, the roller is located in the guide rail, and the roller is transmission-connected to the driving member.
[0018] The beneficial effects of the utility model: the utility model provides an etching device, including an etching groove, a conveying mechanism, a grabbing mechanism and a controller. The etching solution required for etching is placed in the etching groove to etch the silicon wafer to be etched. A conveying mechanism is arranged above the etching groove, and a grabbing mechanism is retractably installed below the conveying mechanism to grab the silicon wafer to be etched, and the grabbing mechanism drives the etched silicon wafer to move along the parallel and vertical directions of the conveying mechanism for etching. The conveying mechanism and the grabbing mechanism are controlled by the controller to control the etching time and etching depth of the silicon wafer, thereby ensuring that the silicon wafer will not be over-etched, thereby improving the yield of silicon wafer etching. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0020] Figure 1 A schematic diagram of the overall structure of an etching device provided by an embodiment of the utility model;
[0021] Figure 2A side view of the overall structure of an etching device provided by an embodiment of the present utility model;
[0022] Figure 3 A schematic diagram of a suction cup of an etching device provided by an embodiment of the present utility model adsorbing a silicon wafer to be etched.
[0023] Icon: 100 - etching tank;
[0024] 200 - conveying mechanism; 201 - guide rail;
[0025] 300 - grasping mechanism; 301 - telescopic rod; 302 - suction cup assembly; 3021 - suction cup; 3022 - detection sensor; 303 - connecting plate; 304 - connecting rod;
[0026] 400 - silicon wafer to be etched. Specific embodiments
[0027] Next, the technical solutions of the present utility model will be clearly and completely described in conjunction with the embodiments. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.
[0028] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by terms such as "upper" and "lower" is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.
[0029] In the description of the present utility model, it should be noted that unless otherwise clearly specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the connection inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations. In addition, in the description of the present utility model, unless otherwise stated, the meaning of "a plurality" is two or more.
[0030] Such as Figures 1 to 3As shown in the figure, the present utility model provides an etching device, which includes an etching tank 100, a conveying mechanism 200, a grasping mechanism 300 and a controller; the conveying mechanism 200 is arranged above the etching tank 100, the grasping mechanism 300 is telescopically installed below the conveying mechanism 200 for grasping the silicon wafer 400 to be etched, and the conveying mechanism 200 is used for conveying the grasping mechanism 300; both the conveying mechanism and the grasping mechanism are electrically connected to the controller.
[0031] In this embodiment, it includes an etching tank 100, a conveying mechanism 200, a grasping mechanism 300 and a controller. The etching solution required for etching is placed in the etching tank 100 to etch the silicon wafer 400 to be etched. A conveying mechanism 200 is arranged above the etching tank 100, and a grasping mechanism 300 is telescopically installed below the conveying mechanism 200 to facilitate grasping the silicon wafer 400 to be etched. The silicon wafer to be etched is driven by the grasping mechanism 300 to move in the parallel and vertical directions of the conveying mechanism 200 for etching. The conveying mechanism 200 and the grasping mechanism 300 are controlled by the controller to control the etching time and depth of the silicon wafer, so as to ensure that the silicon wafer will not be over-etched, thereby improving the yield of silicon wafer etching.
[0032] According to an embodiment provided by the present utility model, as Figure 1 and Figure 2 shown in the figure, the grasping mechanism 300 includes a telescopic rod 301 and a suction cup assembly 302. One end of the telescopic rod 301 is movably installed on the conveying mechanism 200, and the other end of the telescopic rod 301 is connected to the suction cup assembly 302.
[0033] In this embodiment, the grasping mechanism 300 includes a telescopic rod 301 and a suction cup assembly 302. The end of the telescopic rod 301 is movably installed on the conveying mechanism 200. At the same time, a suction cup assembly 302 is also connected to the other end of the telescopic rod 301. The telescopic rod 301 itself can be telescoped in the vertical direction of the conveying mechanism 200 and can also move on the conveying mechanism 200, so as to ensure that after driving the suction cup assembly 302 to adsorb the silicon wafer 400 to be etched, it can be conveyed above the etching tank 100 along the conveying mechanism 200 and then lowered into the solution in the etching tank 100 for etching. By controlling the above operations through the controller, it is more intelligent and can accurately control the lowering depth, thereby avoiding the occurrence of over-etching. When the reaction is completed, the suction cup assembly 302 is driven by the telescopic rod 301 to the tank filled with clean water to clean the silicon wafer.
[0034] According to an embodiment provided by the present utility model, as Figure 1 and Figure 2As shown, the grasping mechanism 300 is further provided with a connecting plate 303 and a connecting rod 304. One end of the telescopic rod 301 away from the conveying mechanism 200 is connected to one side of the connecting plate 303. The other side of the connecting plate 303 is connected to the connecting rod 304. The lower section of the connecting rod 304 is connected to the suction cup assembly 302.
[0035] In this embodiment, the grasping mechanism 300 is further provided with a connecting plate 303 and a connecting rod 304. By integrating the suction cup assembly 302 and the telescopic rod 301 through the connecting plate 303 and the connecting rod 304 and connecting the two together, it can play a certain transitional role, making the adsorption of the silicon wafer 400 to be etched by the suction cup 3021 more stable during the movement, and preventing the silicon wafer 400 to be etched from falling, ensuring the accuracy of the entire etching process.
[0036] According to an embodiment provided by the present invention, as Figure 1 and Figure 2 shown, the suction cup assembly 302 includes a suction cup 3021. The upper surface of the suction cup 3021 is connected to the connecting rod 304. The lower surface of the suction cup 3021 is used to adsorb the silicon wafer 400 to be etched.
[0037] In this embodiment, the suction cup assembly 302 includes a suction cup 3021. The suction cup 3021 is connected to the connecting plate 303 through the connecting rod 304. At the same time, the silicon wafer to be etched is adsorbed on the lower surface of the suction cup 3021. The telescopic rod 301 drives the connecting plate 303 to move to drive the suction cup 3021 to move above the etching tank 100 for etching.
[0038] According to an embodiment provided by the present invention, as Figure 1 and Figure 2 shown, the suction cup assembly 302 further includes a suction cup holder. The suction cup 3021 is installed below the suction cup holder. The top end of the suction cup holder is connected to the end of the connecting rod 304 away from the connecting plate 303.
[0039] In this embodiment, the suction cup assembly 302 further includes a suction cup holder. The top end of the suction cup holder is connected to the end of the connecting rod 304. At the same time, the suction cup 3021 is installed below the suction cup holder. The number of suction cups 3021 can be increased according to the usage situation. Correspondingly, the number of the suction cup holder and the connecting rod 304 is increased or decreased together, so that the number of the suction cup holder and the connecting rod 304 corresponds to the number of the suction cups 3021. Connecting the suction cup 3021 and the connecting rod 304 through the suction cup holder can ensure the stability of the suction cup 3021 during use and prevent the connecting rod 304 from affecting the etching process.
[0040] According to an embodiment provided by the present invention, as Figure 3 shown, a plurality of suction holes are provided on the suction cup 3021.
[0041] In this embodiment, a plurality of suction holes are provided on the suction cup 3021. By sucking air through the suction holes, the silicon wafer 400 to be etched is tightly adsorbed on the suction cup 3021. As Figure 3 shown, the direction of the arrow is the air flow direction during the air suction process of the suction cup 3021. The suction pipe arranged above the suction cup 3021 sucks air to suck the silicon wafer 400 to be etched, so as to facilitate subsequent etching operations.
[0042] According to an embodiment provided by the present invention, as Figure 3 shown, the suction cup assembly 302 further includes a detection sensor 3022. The detection sensor 3022 is installed on the suction cup 3021 and is used to detect the position of the silicon wafer 400 to be etched.
[0043] In this embodiment, the suction cup assembly 302 further includes a detection sensor 3022. The detection sensor 3022 is installed on the suction cup 3021 so as to be able to detect the silicon wafer. The detection sensor 3022 is electrically connected to the controller. When the detection sensor 3022 detects that there is a silicon wafer 400 to be etched below the suction cup 3021, it transmits a signal to the controller. The controller controls the telescopic rod 301 to move to ensure that the suction cup 3021 can adsorb the silicon wafer 400 to be etched for transmission, and controls it to be transported into the etching tank 100 for reaction.
[0044] According to an embodiment provided by the present invention, as Figure 1 shown, the conveying mechanism 200 includes a guide rail 201. The guide rail 201 is arranged above the etching tank 100. The end of the telescopic rod 301 is slidably installed in the guide rail 201 and can move along the extending direction of the guide rail 201.
[0045] In this embodiment, the conveying mechanism 200 includes a guide rail 201. The guide rail 201 is arranged above the etching tank 100. Among them, preferably, the end of the telescopic rod 301 is slidably installed in the guide rail 201 to ensure that the suction cup 3021 can move along the extending direction of the guide rail 201 under the drive of the telescopic rod 301.
[0046] According to an embodiment provided by the present invention, the conveying mechanism 200 further includes a driving member. The driving member is electrically connected to the controller. The driving member is arranged at one end of the guide rail 201, and the output end of the driving member is connected to the end of the telescopic rod 301 to drive the telescopic rod 301 to move in the guide rail 201.
[0047] In this embodiment, the conveying mechanism 200 further includes a driving member. Preferably, the driving member is disposed at one end of the guide rail 201. At the same time, the driving member is directly connected to the controller. The output end of the driving member is in transmission connection with the end of the telescopic rod 301. The controller controls the driving member to drive the telescopic rod 301 to move along the extension direction of the guide rail 201 within the guide rail 201, and further drives the suction cup 3021 to adsorb the silicon wafer 400 to be etched and then move above the etching tank 100, and then place the silicon wafer 400 to be etched below into the solution placed in the etching tank 100 for reaction.
[0048] Preferably, the driving member is provided with a driving motor. The output shaft of the driving motor is in transmission connection with the telescopic rod 301 to drive the telescopic rod 301 to move along the extension direction of the guide rail 201. The driving member can also be a driving method such as a cylinder, an oil cylinder or a lead screw. As long as its purpose does not depart from the design concept of the present invention, it should fall within the protection scope of the present invention.
[0049] According to an embodiment provided by the present invention, a roller is installed at the end of the telescopic rod 301. The roller is located within the guide rail 201, and the roller is in transmission connection with the driving member.
[0050] In this embodiment, a roller is installed at the end of the telescopic rod 301. Preferably, the size of the roller matches the size of the guide rail 201, and the roller is installed within the guide rail 201. By transmitting the connection between the roller and the output end of the driving member, the driving member can drive the roller to rotate, so as to drive the telescopic rod 301 to move along the extension direction of the guide rail 201 within the guide rail 201.
[0051] The above are only the preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.
Claims
1. An etching device, characterized in that, It includes an etching tank (100), a conveying mechanism (200), a grasping mechanism (300) and a controller; The conveying mechanism (200) is arranged above the etching tank (100), and the grasping mechanism (300) is telescopically installed below the conveying mechanism (200) for grasping the silicon wafer to be etched (400), and the conveying mechanism (200) is used to convey the grasping mechanism (300); Both the conveying mechanism (200) and the grasping mechanism (300) are electrically connected to the controller.
2. The etching device according to claim 1, characterized in that, The grasping mechanism includes a telescopic rod (301) and a suction cup assembly (302). One end of the telescopic rod (301) is movably installed on the conveying mechanism (200), and the other end of the telescopic rod (301) is connected to the suction cup assembly (302).
3. An etching device according to claim 2, characterized in that, The grasping mechanism (300) is further provided with a connecting plate (303) and a connecting rod (304). One end of the telescopic rod (301) away from the conveying mechanism (200) is connected to one side of the connecting plate (303), the other side of the connecting plate (303) is connected to the connecting rod (304), and the lower section of the connecting rod (304) is connected to the suction cup assembly (302).
4. An etching device according to claim 3, characterized in that, The suction cup assembly (302) includes a suction cup (3021). The upper surface of the suction cup (3021) is connected to the connecting rod (304), and the lower surface of the suction cup (3021) is used for adsorbing the silicon wafer to be etched (400).
5. An etching device according to claim 4, characterized in that, The suction cup assembly (302) further includes a suction cup holder. The suction cup (3021) is installed below the suction cup holder, and the top end of the suction cup holder is connected to the end of the connecting rod (304) away from the connecting plate (303).
6. An etching device according to claim 4, characterized in that, A plurality of suction holes are provided on the suction cup (3021).
7. An etching device according to claim 4, characterized in that, The suction cup assembly (302) further includes a detection sensor (3022). The detection sensor (3022) is installed on the suction cup (3021) for detecting the position of the silicon wafer to be etched (400).
8. An etching device according to claim 2, characterized in that, The conveying mechanism (200) includes a guide rail (201). The guide rail (201) is arranged above the etching tank (100). The end of the telescopic rod (301) is slidably installed in the guide rail (201) and can move along the extending direction of the guide rail (201).
9. An etching device according to claim 8, characterized in that The conveying mechanism (200) further includes a driving member. The driving member is electrically connected to the controller. The driving member is arranged at one end of the guide rail (201), and the output end of the driving member is connected to the end of the telescopic rod (301) to drive the telescopic rod (301) to move in the guide rail (201).
10. An etching device according to claim 9, characterized in that, A roller is installed at the end of the telescopic rod (301). The roller is located in the guide rail (201), and the roller is in transmission connection with the driving member.