Semiconductor film growth temperature control device

Abstract

The utility model relates to a semiconductor film growth temperature control device applied to the field of semiconductor films, which comprises a top plate and a bottom plate, a fixed shell is fixedly connected between the top plate and the bottom plate, a plurality of heating rods are fixedly embedded in the fixed shell, and the outer surface of the fixed shell is fixedly connected with a plurality of fixed plates. The end, away from the fixing shell, of the fixing plate is rotationally connected with a heat preservation plate, the end, close to the heat preservation plate, of the fixing plate is fixedly connected with a mounting block, a telescopic rod is rotationally connected into the mounting block, and a sliding groove is formed in the end, close to the fixing shell, of the heat preservation plate. By the adoption of the structures such as the heat preservation plates, during heating, the multiple heat preservation plates define a complete circular tube shape, so that heat preservation is conducted on a cavity of the temperature control equipment, the heating effect is improved, during cooling, the angles of the multiple heat preservation plates are adjusted, the contact area between the shell and air is increased, and the cooling effect is improved.

Description

Technical Field

[0001] The utility model relates to a temperature control device, in particular to a semiconductor thin film growth temperature control device applied to the field of semiconductor thin films. Background Technique

[0002] Semiconductor thin film materials are a major field of modern semiconductor technology, and their development is very rapid. The preparation of semiconductor thin films is inseparable from growth devices. So far, dozens of semiconductor thin film growth devices and their growth methods have been developed. According to different growth methods, the growth temperature of semiconductor thin films ranges from room temperature to 1100 degrees, and generally, heating is carried out by means of resistance wire heating or heating rod heating, etc.

[0003] During the heating process, generally, a heat preservation board is surrounded around the shell of the temperature control equipment to improve the heating effect. After the equipment is used, the cavity cover will be opened to expose the cavity to the air for natural cooling. However, the effect of natural cooling is poor, and the heat preservation board will also reduce the efficiency of natural cooling, resulting in that the temperature control equipment may take several hours to reach room temperature, thus reducing the use efficiency of the equipment. Content of the Utility Model

[0004] Aiming at the above-mentioned existing technology, the technical problem to be solved by the utility model is that the existing temperature control equipment will set a heat preservation board to improve the heating effect, but when cooling the inside of the equipment, the heat preservation board will also reduce the cooling effect of the equipment, resulting in a longer time required for the equipment to cool down, and further reducing the use efficiency of the temperature control equipment.

[0005] To solve the above problems, the utility model provides a semiconductor thin film growth temperature control device, which includes a top plate and a bottom plate. A fixed shell is fixedly connected between the top plate and the bottom plate. A plurality of heating rods are fixedly embedded inside the fixed shell. A plurality of fixing plates are fixedly connected to the outer surface of the fixed shell. One end of the fixing plate away from the fixed shell is rotatably connected to a heat preservation board. One end of the fixing plate close to the heat preservation board is fixedly connected to a mounting block. A telescopic rod is rotatably connected inside the mounting block. A chute is dug at one end of the heat preservation board close to the fixed shell. One end of the telescopic rod away from the mounting block is located inside the chute. One end of the heat preservation board is fixedly connected to an adjusting shaft. The upper end of the adjusting shaft sequentially passes through the fixing plate and the top plate movably and is fixedly connected to a first gear. A toothed ring is rotatably connected to the upper end of the top plate. An L-shaped plate is also fixedly connected to the upper end of the top plate. A motor is fixedly connected to the lower end of the L-shaped plate. The output end of the motor is fixedly connected to a second gear. A plurality of ventilation pipes corresponding to the plurality of heat preservation boards respectively are fixedly connected to the upper end of the top plate.

[0006] In the above semiconductor thin film growth temperature control device, during heating, a plurality of heat preservation plates are formed into a complete circular tube shape, so as to insulate the cavity of the temperature control equipment and improve the heating effect. During cooling, the angles of the plurality of heat preservation plates are adjusted to increase the contact area between the housing and the air, thereby improving the cooling effect.

[0007] As a further improvement of the present application, a plurality of heating rods and a plurality of fixing plates are both distributed in an annular array around the central axis of the fixed shell, and the end of the telescopic rod close to the heat preservation plate is processed into a round head.

[0008] As a further improvement of the present application, a plurality of first gears are all meshed with the toothed ring, and a second gear is meshed with one of the first gears.

[0009] As a further improvement of the present application, the cross section of the heat preservation plate is arc-shaped, and a plurality of heat preservation plates form a complete ring.

[0010] As another improvement of the present application, a temperature sensor is further fixedly connected to the upper end of the top plate, and the temperature sensor, the motor and the heating rod are all signal-connected to an external controller.

[0011] As another improvement of the present application, a plurality of positioning rods corresponding to the plurality of fixing plates are fixedly connected to the outer surface of the fixed shell, and a pressure sensor is fixedly connected to the end of the positioning rod close to the heat preservation plate, and the pressure sensor is in contact with the heat preservation plate.

[0012] In summary, in the actual application process, when heating is required, the heating rod can be started to heat the object inside the fixed shell, and a plurality of heat preservation plates form a complete ring around the fixed shell, thereby improving the heating effect. When cooling is required, the motor can be started to drive the second gear to rotate, the second gear drives the adjacent first gear to rotate, so that the toothed ring also rotates accordingly, thereby causing a plurality of first gears to rotate, and a plurality of heat preservation plates simultaneously rotate around the adjustment axis as the center and unfold outward, so that the surface of the fixed shell is exposed, and then cold air is discharged through the ventilation pipe to accelerate the heat dissipation on the surface of the fixed shell, thereby improving the cooling effect of the equipment, shortening the time required for the equipment to cool down, and further improving the use efficiency of the temperature control equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 is a schematic three-dimensional structure diagram of the first embodiment of the present application;

[0014] Figure 2 is a schematic diagram when a plurality of heat preservation plates of the first embodiment of the present application form a complete ring;

[0015] Figure 3 is a schematic structural diagram of the heat preservation plate of the first embodiment of the present application;

[0016] Figure 4Schematic diagram when the insulation board of the first embodiment of the present application unfolds outward;

[0017] Figure 5 Schematic diagram of the top plate structure of the first embodiment of the present application;

[0018] Figure 6 Schematic diagram of the positioning rod structure of the second embodiment of the present application.

[0019] Description of the reference numerals in the figure:

[0020] 1 Top plate, 2 Bottom plate, 3 Fixed shell, 4 Fixed plate, 5 Insulation board, 6 Installation block, 7 Telescopic rod, 8 Sliding groove, 9 Adjusting shaft, 10 First gear, 11 Tooth ring, 12 L-shaped plate, 13 Motor, 14 Second gear, 15 Ventilation pipe, 16 Temperature sensor, 17 Positioning rod, 18 Pressure sensor, 19 Heating rod. Specific embodiments

[0021] The following will describe in detail the two embodiments of the present application with reference to the accompanying drawings.

[0022] First embodiment:

[0023] Figure 1 And Figure 2 Shows: A semiconductor thin film growth temperature control device, including a top plate 1 and a bottom plate 2. A fixed shell 3 is fixedly connected between the top plate 1 and the bottom plate 2. A plurality of heating rods 19 are fixedly embedded inside the fixed shell 3. Those skilled in the art can select a suitable model of the heating rod 19 according to actual needs. For example: Q10X80. The outer surface of the fixed shell 3 is fixedly connected with a plurality of fixed plates 4. One end of the fixed plate 4 away from the fixed shell 3 is rotatably connected with an insulation board 5. The plurality of heating rods 19 and the plurality of fixed plates 4 are both distributed in a circular array around the central axis of the fixed shell 3. Starting the heating rod 19 can heat the inside of the fixed shell 3. The upper end of the top plate 1 is also fixedly connected with a temperature sensor 16. Those skilled in the art can select a suitable model of the temperature sensor 16 according to actual needs. For example, WZP-231. The temperature sensor 16, the motor 13 and the heating rod 19 are all signal-connected to an external controller. The temperature sensor 16 can monitor the temperature inside the fixed shell 3 in real time. The upper end of the top plate 1 is fixedly connected with a plurality of ventilation pipes 15 corresponding to the plurality of insulation boards 5 respectively. The upper end of the ventilation pipe 15 is connected to a refrigeration device, and cold air is blown into the lower end of the top plate 1 through the ventilation pipe 15, thereby accelerating heat dissipation.

[0024] Figure 2 、 Figure 3 And Figure 4It is shown that: One end of the fixed plate 4 close to the heat preservation plate 5 is fixedly connected with a mounting block 6. A telescopic rod 7 is rotatably connected inside the mounting block 6. A chute 8 is dug at one end of the heat preservation plate 5 close to the fixed shell 3. One end of the telescopic rod 7 away from the mounting block 6 is located inside the chute 8. The telescopic rod 7 expands and contracts as the heat preservation plate 5 moves, making a triangle among the heat preservation plate 5, the fixed plate 4 and the telescopic rod 7, thereby improving the stability of the heat preservation plate 5. The upper end of the heat preservation plate 5 is fixedly connected with an adjusting shaft 9. The upper end of the adjusting shaft 9 sequentially passes through the fixed plate 4 and the top plate 1 movably and is fixedly connected with a first gear 10. One end of the telescopic rod 7 close to the heat preservation plate 5 is processed into a round head, which is convenient for the telescopic rod 7 to move inside the chute 8. The cross section of the heat preservation plate 5 is arc-shaped. A plurality of heat preservation plates 5 form a complete ring, thereby effectively reducing the contact area between the fixed shell 3 and the air.

[0025] Figure 5 It is shown that: A toothed ring 11 is rotatably connected to the upper end of the top plate 1. An L-shaped plate 12 is also fixedly connected to the upper end of the top plate 1. A motor 13 is fixedly connected to the lower end of the L-shaped plate 12. Those skilled in the art can select a suitable model of the motor 13 according to actual needs. For example: BWDOXWD2. The output end of the motor 13 is fixedly connected with a second gear 14. A plurality of first gears 10 are all meshed with the toothed ring 11. The second gear 14 is meshed with one of the first gears 10. Starting the motor 13 drives the second gear 14 to rotate. The second gear 14 drives the adjacent first gear 10 to rotate, making the toothed ring 11 also rotate accordingly, thereby making a plurality of first gears 10 rotate.

[0026] When in use, when heating is required, the heating rod 19 can be started to heat the object inside the fixed shell 3. A plurality of heat preservation plates 5 form a complete ring around the fixed shell 3, thereby improving the heating effect. When cooling is required, the motor 13 can be started to drive the second gear 14 to rotate. The second gear 14 drives the adjacent first gear 10 to rotate, making the toothed ring 11 also rotate accordingly, thereby making a plurality of first gears 10 rotate. A plurality of heat preservation plates 5 rotate around the adjusting shaft 9 as the center and unfold outward at the same time, so that the surface of the fixed shell 3 is exposed, and then cold air is discharged through the ventilation pipe 15 to accelerate the heat dissipation on the surface of the fixed shell 3, thereby improving the cooling effect of the equipment, shortening the time required for the equipment to cool down, and further improving the use efficiency of the temperature control equipment.

[0027] The second implementation mode:

[0028] On the basis of the first implementation mode, this implementation mode adds a positioning rod 17 and a pressure sensor 18, and the rest is the same as the first implementation mode.

[0029] Figure 6It is shown that: a plurality of positioning rods 17 corresponding to a plurality of fixing plates 4 respectively are fixedly connected to the outer surface of the fixed housing 3. One end of the positioning rod 17 close to the heat preservation plate 5 is fixedly connected with a pressure sensor 18. Those skilled in the art can select a pressure sensor 18 of a suitable model according to actual needs. For example: SQB. The pressure sensor 18 is in contact with the heat preservation plate 5.

[0030] During use, when the heat preservation plate 5 needs to be reset and rotated to contact the pressure sensor 18, the motor 13 is turned off, so that the heat preservation plate 5 stops rotating, thus facilitating the use of the staff.

[0031] Combined with the current actual needs, the above-mentioned implementation manner adopted in this application, the protection scope is not limited thereto. Within the knowledge scope of those skilled in the art, various changes made without departing from the concept of this application still fall within the protection scope of this utility model.

Claims

1. A temperature control device for semiconductor thin film growth, comprising a top plate (1) and a bottom plate (2), characterized in that: A fixed shell (3) is fixedly connected between the top plate (1) and the bottom plate (2). A plurality of heating rods (19) are fixedly embedded inside the fixed shell (3). A plurality of fixing plates (4) are fixedly connected to the outer surface of the fixed shell (3). One end of the fixing plate (4) away from the fixed shell (3) is rotatably connected to a heat preservation plate (5). One end of the fixing plate (4) close to the heat preservation plate (5) is fixedly connected to a mounting block (6). A telescopic rod (7) is rotatably connected inside the mounting block (6). A chute (8) is dug at one end of the heat preservation plate (5) close to the fixed shell (3). One end of the telescopic rod (7) away from the mounting block (6) is located inside the chute (8). An adjusting shaft (9) is fixedly connected to the upper end of the heat preservation plate (5). The upper end of the adjusting shaft (9) sequentially passes through the fixing plate (4) and the top plate (1) movably and is fixedly connected to a first gear (10). A toothed ring (11) is rotatably connected to the upper end of the top plate (1). An L-shaped plate (12) is also fixedly connected to the upper end of the top plate (1). A motor (13) is fixedly connected to the lower end of the L-shaped plate (12). The output end of the motor (13) is fixedly connected to a second gear (14). A plurality of ventilation pipes (15) corresponding to the plurality of heat preservation plates (5) respectively are fixedly connected to the upper end of the top plate (1).

2. The temperature control device for semiconductor thin film growth according to claim 1, wherein: The plurality of heating rods (19) and the plurality of fixing plates (4) are both distributed in a circular array around the central axis of the fixed shell (3). One end of the telescopic rod (7) close to the heat preservation plate (5) is processed with a round head.

3. A semiconductor thin film growth temperature control device according to claim 1, characterized in that: The plurality of first gears (10) are all meshed with the toothed ring (11). The second gear (14) is meshed with one of the first gears (10).

4. A semiconductor thin film growth temperature control device according to claim 1, characterized in that: The cross-section of the heat preservation plate (5) is arc-shaped. The plurality of heat preservation plates (5) form a complete ring.

5. The temperature control device for semiconductor thin film growth according to claim 1, characterized in that: A temperature sensor (16) is also fixedly connected to the upper end of the top plate (1). The temperature sensor (16), the motor (13) and the heating rods (19) are all signal-connected to an external controller.

6. The temperature control device for semiconductor thin film growth according to claim 1, wherein: A plurality of positioning rods (17) corresponding to the plurality of fixing plates (4) respectively are fixedly connected to the outer surface of the fixed shell (3). A pressure sensor (18) is fixedly connected to one end of the positioning rod (17) close to the heat preservation plate (5). The pressure sensor (18) is in contact with the heat preservation plate (5).

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