Splicing type silicon wafer carrier plate

Abstract

The utility model discloses a splicing type silicon wafer carrier plate. The device comprises a plurality of carrier plate groups and a frame, and the plurality of carrier plate groups are detachably arranged and fixedly arranged in the frame; each carrier plate group comprises a plurality of supporting plates, the supporting plates are provided with placing grooves for placing silicon wafers, and every two adjacent supporting plates are spliced end to end; one end of each supporting plate extends in the length direction of the carrier plate set to be provided with at least two limiting protrusions, the other end of each supporting plate is provided with at least two limiting holes, and the limiting protrusion of each supporting plate is inserted into the limiting hole of the adjacent supporting plate; at least one bolt is arranged among the plurality of supporting plates of each carrier plate group in a penetrating manner; according to the scheme, the support plate is formed by splicing the plurality of support plates and the frame, and the support plates can be conveniently disassembled and assembled, so that the maintenance and cleaning work is easier to carry out, and when the support plate needs to be cleaned or damaged parts need to be replaced, the disassembly and replacement work can be quickly completed, and dead angles can be cleaned in place.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer coating, in particular to a spliced silicon wafer carrier plate. Background Art

[0002] Silicon wafer coating carrier plates are widely used in fields such as solar photovoltaics and semiconductor manufacturing. During the coating process of silicon wafers, it is necessary to keep them stable and motionless to avoid uneven coating or damage. As the support platform for silicon wafers, the carrier plate can ensure that the silicon wafers maintain a stable position during the coating process.

[0003] After the silicon wafer carrier plate works for a long time, a thick layer of copper will be plated on the carrier plate, which affects subsequent work and requires cleaning the silicon wafer slots. When coating silicon wafers currently, an integrated carrier plate is usually used. Due to its integrity and fixity, the integrated silicon wafer carrier plate often has cleaning dead corners that are difficult to reach. These areas are prone to accumulating copper coatings and other dirt during long-term use, resulting in difficult cleaning; moreover, once the integrated silicon wafer carrier plate is damaged or worn, it often needs to be replaced as a whole instead of replacing only the damaged part, which increases the maintenance and replacement costs. Summary of the Utility Model

[0004] In view of the problems existing in the above-mentioned prior art, the utility model provides a spliced silicon wafer carrier plate, which can effectively solve the problems existing in the above-mentioned prior art.

[0005] The technical solution of the utility model is as follows:

[0006] According to one aspect of the utility model, it includes: a plurality of carrier plate groups and a frame, and the plurality of carrier plate groups are detachably arranged and fixed within the frame; each of the carrier plate groups includes a plurality of support plates, the support plates are provided with placement grooves for placing silicon wafers, and every two adjacent support plates are spliced end to end; at least two limiting protrusions are arranged at one end of each support plate along the length direction of the carrier plate group, and at least two limiting holes are arranged at the other end. The limiting protrusions of each support plate are inserted into the limiting holes of the adjacent support plate; it also includes a plurality of pins, and at least one pin is inserted through the plurality of support plates of each carrier plate group.

[0007] Further, a convex strip is arranged at one end of the pin extending outwards; the support plate is correspondingly provided with a mounting hole, and the pin is fitted with the mounting hole.

[0008] Further, a limiting boss is fixed at one end of the pin.

[0009] Further, two pins are inserted into each carrier plate group, and the two pins are respectively inserted at the left and right ends of the carrier plate group; one end of the limiting boss abuts against the carrier plate group.

[0010] Further, the frame includes at least two first fixing rods and at least two second fixing rods, and the first fixing rods and the second fixing rods are combined to form a closed frame.

[0011] Further, both the first fixing rods and the second fixing rods are provided with mounting grooves for clamping the carrier plate groups, and the edges of several carrier plate groups are fitted with the mounting grooves.

[0012] Further, it further includes a groove, and at least one groove is provided at the edge of the placement groove.

[0013] Adopting the above technical solution, compared with the prior art, the beneficial effects of the present utility model are as follows:

[0014] First, this solution is composed of multiple support plates and a frame spliced together, and the support plates can be conveniently disassembled and assembled, which makes the maintenance and cleaning work easier. When it is necessary to clean the carrier plate or replace damaged parts, the disassembly and replacement work can be quickly completed, and the dead corners can be cleaned thoroughly.

[0015] Second, the pins are used to enhance the strength of the overall structure of the carrier plate group. The pins further firmly connect several support plates together, preventing the relative movement or dislocation of several support plates during use, and facilitating the assembly of the carrier plate group.

[0016] Third, the frame in this solution is detachable. When it is necessary to maintain or replace the silicon wafer, the frame can be easily disassembled to clean, inspect or replace the internal support plates, reducing the complexity and difficulty of the maintenance work. Since the frame is detachable, the sizes of the first fixing rods and the second fixing rods can be adjusted according to the number of carrier plate groups. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained according to these drawings without creative efforts.

[0018] Figure 1 It is a three-dimensional structure diagram of the present utility model;

[0019] Figure 2 It is a schematic diagram of the splicing of the support plates in the present utility model;

[0020] Figure 3 It is a three-dimensional structure diagram of the support plate in the present utility model;

[0021] Figure 4 It is a schematic diagram of the frame structure in the present utility model;

[0022] Figure 5 In the present utility model, it is a schematic diagram of the bolt structure;

[0023] Figure 6 In the present utility model, it is a schematic diagram of the structure where multiple support plates are spliced with bolts;

[0024] In the figure: support plate - 1, placement groove - 11, mounting hole - 12, limiting protrusion - 13, limiting hole - 14, groove - 15, first fixing rod - 2, second fixing rod - 3, bolt - 4, rib - 41, limiting boss - 42, fixing hole - 5, mounting groove - 6, frame - 100, carrier plate group - 200. Specific embodiments

[0025] The following will further describe the present utility model in detail in conjunction with the drawings and embodiments. It should be specifically pointed out that the following embodiments are only used to illustrate the present utility model, but do not limit the scope of the present utility model. Similarly, the following embodiments are only partial embodiments of the present utility model rather than all embodiments. All other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present utility model.

[0026] As Figures 1 to 6 shown, this solution provides a spliced silicon wafer carrier plate.

[0027] Please refer to Figure 1 , the present utility model includes a number of carrier plate groups 200 and a frame 100, and a number of carrier plate groups 200 are detachably arranged and fixed within the frame 100; in this embodiment, the number of carrier plate groups 200 is five, and the five carrier plate groups 200 are arranged horizontally within the frame 100, and every two adjacent carrier plate groups 200 are in contact with each other.

[0028] Please refer to Figure 2 , Figure 3 and Figure 6 , each carrier plate group 200 includes a number of support plates 1. In this embodiment, the number of support plates 1 in each carrier plate group 200 is five, and the number can be increased or decreased as needed, and the number is not limited herein. The support plate 1 is provided with a placement groove 11 (not shown in the figure) for placing silicon wafers, and every two adjacent support plates 1 are spliced end to end; preferably, at least two limiting protrusions 13 are arranged at one end of the support plate 1 along the length direction of the carrier plate group 200, and at least two limiting holes 14 are arranged at the other end. The limiting protrusion 13 of each support plate 1 is inserted into the limiting hole 14 of the adjacent support plate 1; preferably, the limiting protrusion 13 is cylindrical. Of course, the number of limiting protrusions 13 can also be multiple, and the number is not limited herein.

[0029] Please refer to Figure 2 ,Figure 3 , Figure 5 and Figure 6 , further comprising a plurality of pins 4, at least one pin 4 is inserted through between a plurality of support plates 1 of each carrier plate group 200. Preferably, a rib 41 is extended outward at one end of the pin 4; the rib 41 is used to limit the rotation of the plurality of support plates 1. The support plate 1 is correspondingly provided with a mounting hole 12, and the pin 4 is fitted with the mounting hole 12. A limiting boss 42 is fixedly provided at one end of the pin 4. Preferably, two pins 4 are inserted into each carrier plate group 200, and the two pins 4 are respectively inserted at the left and right ends of the carrier plate group 200; one end of the limiting boss 42 abuts against the carrier plate group 200. The pin 4 is used to enhance the strength of the overall structure of the carrier plate group 200. The pin 4 further firmly connects the plurality of support plates 1 together, preventing the plurality of support plates 1 from relatively moving or being displaced during use, and facilitating the assembly of the carrier plate group 200.

[0030] Please refer to Figure 1 and Figure 4 , the frame 100 includes at least two first fixing rods 2 and at least two second fixing rods 3, and the first fixing rods 2 and the second fixing rods 3 are combined to form a closed frame 100. The first fixing rods 2 and the second fixing rods 3 are both provided with mounting grooves 6 for clamping the carrier plate group 200, and the edges of the plurality of carrier plate groups 200 are fitted with the mounting grooves 6. Fixing holes 5 are provided at the ends of the first fixing rods 2 and the second fixing rods 3, and bolts (not shown in the figure) are assembled, and the bolts are matched with the fixing holes 5 to fixedly connect the first fixing rods 2 and the second fixing rods 3. When maintenance or replacement of the silicon wafer is required, the frame 100 can be easily disassembled so as to clean, inspect or replace the internal support plates 1, reducing the complexity and difficulty of the maintenance work. Since the frame 100 is detachable, the sizes of the first fixing rods 2 and the second fixing rods 3 can be adjusted according to the number of the carrier plate groups 200.

[0031] Please refer to Figure 2 , further comprising a groove 15, at least one groove 15 is provided at the edge of the placing groove 11. The groove 15 provides additional operating space for the operator to use tools, enabling them to more accurately position and grasp the silicon wafer, avoiding damage to the silicon wafer due to improper operation during the taking-out process.

[0032] Working principle: The plurality of support plates 1 are spliced end to end, and the limiting protrusions 13 of each support plate 1 are inserted into the limiting holes 14 of another support plate 1. After sequential splicing, a plurality of carrier plate groups 200 are formed;

[0033] Then, bolts are used to assemble two first fixing rods 2 and a second fixing rod 3. One end of each of the two first fixing rods 2 is fixedly connected to both ends of the second fixing rod 3 respectively, and the mounting grooves 6 of the two first fixing rods 2 face each other. Then, a plurality of assembled carrier plate groups 200 are sequentially inserted into the mounting grooves 6 from the unclosed opening end of the frame. After the insertion is completed, finally, both ends of another second fixing rod 3 are fixedly connected to the ends of the two first fixing rods 2 to form a closed frame 100.

[0034] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A spliced silicon wafer carrier plate, characterized in that Including: A plurality of carrier groups (200) and a frame (100), the plurality of carrier groups (200) are detachably arranged and fixed within the frame (100); each of the carrier groups (200) includes a plurality of support plates (1), the support plates (1) are provided with placement grooves (11) for placing silicon wafers, and every two adjacent support plates (1) are spliced end to end; one end of the support plate (1) is provided with at least two limiting protrusions (13) extending along the length direction of the carrier group (200), and the other end is provided with at least two limiting holes (14), and the limiting protrusions (13) of each support plate (1) are inserted into the limiting holes (14) of the adjacent support plate (1); It further includes a plurality of pins (4), and at least one pin (4) is inserted through the plurality of support plates (1) of each carrier group (200).

2. The spliced silicon wafer carrier according to claim 1, wherein, One end of the pin (4) extends outwardly and is provided with a rib (41); the support plate (1) is correspondingly provided with a mounting hole (12), and the pin (4) is fitted with the mounting hole (12).

3. The spliced silicon wafer carrier according to claim 2, characterized in that, One end of the pin (4) is fixedly provided with a limiting boss (42).

4. The spliced silicon wafer carrier according to claim 3, characterized in that, Two pins (4) are inserted into each carrier group (200), and the two pins (4) are respectively inserted at the left and right ends of the carrier group (200); one end of the limiting boss (42) abuts against the carrier group (200).

5. The spliced silicon wafer carrier according to claim 1, wherein The frame (100) includes at least two first fixing rods (2) and at least two second fixing rods (3), and the first fixing rods (2) and the second fixing rods (3) are combined to form a closed frame (100).

6. The spliced silicon wafer carrier according to claim 5, wherein Both the first fixing rod (2) and the second fixing rod (3) are provided with mounting grooves (6) for clamping the carrier group (200), and the edges of the plurality of carrier groups (200) are fitted with the mounting grooves (6).

7. The spliced silicon wafer carrier according to claim 1, wherein, It further includes a groove (15), and at least one groove (15) is provided at the edge of the placement groove (11).

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