Efficient chip carrying assembly
Through the combination of X-direction, Y-direction, Z-axis drive modules and nozzles, combined with movable carrier plates and variable distance modules, the problem of inefficiency of chip carrier mechanisms in the existing technology is solved, and efficient pick-up and independent pick-up of multiple chips is achieved to meet the needs of different scenarios.
Patent Information
- Application Number
- CN202422183082.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-06
- Publication Date
- 2025-07-08
- Estimated Expiration
- 2034-09-06
AI Technical Summary
The existing chip carriers cannot achieve batch handling and independent pick-up and placement, resulting in inefficiency or adverse interference during pick-up and placement.
The combination of X-direction, Y-direction, Z-axis drive modules and nozzles is adopted, combined with the movable carrier plate and variable distance module, and multiple chips are picked up and taken and placed independently through the blade cylinder, and precise positioning is performed using a visual bracket and a light source.
It realizes efficient picking and handling of multiple chips, while ensuring the safety of other chips during independent pick-up and placement, and adapting to the needs of different scenarios.
Smart Images
Figure CN223079099U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chip testing, in particular to a high-efficiency chip carrying component. Background Art
[0002] In recent years, the miniaturization trend of chips has become increasingly obvious, and the detection requirements for chips are also constantly increasing. The market share of chips depends more on their own quality. The quality detection of chips usually requires the use of corresponding carrying mechanisms. The chip carrying mechanisms in the prior art have the problems of low efficiency due to the inability to carry chips in batches, or even if multiple chips can be carried in batches, the chips cannot be independently picked up and placed, resulting in adverse interference to other chips during the picking and placing process. Content of the Utility Model
[0003] The purpose of the utility model is to provide a high-efficiency chip carrying component, which can not only simultaneously pick up and carry multiple chips, but also independently pick up and place the chips by the contraction of the blade cylinder without affecting the chips on other suction nozzles.
[0004] To achieve the above purpose, the technical solution adopted by the utility model is: a high-efficiency chip carrying component includes: an X-direction driving module, a Y-direction driving module movably installed on the X-direction driving module, a Z-axis driving module movably installed on the Y-direction driving module, and a plurality of suction nozzles for picking up chips. The vertically arranged suction nozzles are movably installed on the Z-axis driving module. One surface of a movable carrier plate that can move in the vertical direction is installed on the Z-axis driving module. A variable pitch module is installed on the other surface of the movable carrier plate. A support bar is installed on each variable pitch slider of the variable pitch module. A blade cylinder is installed at the lower end of each support bar whose upper end is connected to the variable pitch slider. The upper end of each suction nozzle is connected to the corresponding blade cylinder.
[0005] The further improved solutions in the above technical solutions are as follows:
[0006] 1. In the above solution, a vision bracket is installed on the Y-direction driving module and on one side of the Z-axis driving module. A camera and a light source located directly below the camera are installed on the surface of the vision bracket that can move in the Y direction and is opposite to the Y-direction driving module.
[0007] 2. In the above solution, 4 to 10 of the blade cylinders are arranged at equal intervals.
[0008] 3. In the above solution, the variable pitch module is installed on the movable carrier plate through a bracket.
[0009] Due to the application of the above technical solutions, the utility model has the following advantages compared with the prior art:
[0010] The high-efficiency chip carrier assembly of the present utility model has one surface of a movable carrier plate that can move in the vertical direction mounted on a Z-axis drive module. A variable pitch module is mounted on the other surface of the movable carrier plate. A support bar is mounted on each variable pitch slider of the variable pitch module. A blade cylinder is mounted at the lower end of each support bar whose upper end is connected to the variable pitch slider. The upper end of each suction nozzle is connected to the corresponding blade cylinder. It can not only pick up and transport multiple chips simultaneously, but also independently pick up and place chips through the contraction of the blade cylinder without affecting the chips on other suction nozzles. It can also compensate for the pitch difference of chips between the front and rear ends of the transport by adjusting the distance between the suction nozzles, thereby improving the chip transport efficiency while meeting the requirements of different scenarios. Description of the Drawings
[0011] Appendix Figure 1 is a schematic diagram of the overall structure of the high-efficiency chip carrier assembly of the present utility model;
[0012] Appendix Figure 2 is Figure 1 an enlarged view of the partial structure at A in
[0013] Appendix Figure 3 is a schematic diagram of the partial structure of the variable pitch module of the high-efficiency chip carrier assembly of the present utility model.
[0014] In the above drawings: 100, chip; 1, X-axis drive module; 2, Y-axis drive module; 21, vision bracket; 22, camera; 23, light source; 3, Z-axis drive module; 4, suction nozzle; 5, movable carrier plate; 6, variable pitch module; 61, variable pitch slider; 62, bracket; 7, support bar; 8, blade cylinder. Detailed Embodiments
[0015] The present utility model can be further clearly understood through the following specific embodiments given, but they do not limit the present utility model.
[0016] Embodiment 1: A high-efficiency chip carrier assembly includes: an X-axis drive module 1, a Y-axis drive module 2 movably mounted on the X-axis drive module 1, a Z-axis drive module 3 movably mounted on the Y-axis drive module 2, and a plurality of suction nozzles 4 for picking up chips 100. The vertically arranged suction nozzles 4 are movably mounted on the Z-axis drive module 3. One surface of a movable carrier plate 5 that can move in the vertical direction is mounted on the Z-axis drive module 3. A variable pitch module 6 is mounted on the other surface of the movable carrier plate 5. A support bar 7 is mounted on each variable pitch slider 61 of the variable pitch module 6. A blade cylinder 8 is mounted at the lower end of each support bar 7 whose upper end is connected to the variable pitch slider 61. The upper end of each suction nozzle 4 is connected to the corresponding blade cylinder 8.
[0017] A vision bracket 21 is installed on the above-mentioned Y-direction driving module 2 and on one side of the Z-axis driving module 3. A camera 22 and a light source 23 located directly below the camera 22 are installed on the surface of the vision bracket 21 that can move along the Y direction and is opposite to the side of the Y-direction driving module 2.
[0018] The 6 blade cylinders 8 are arranged at equal intervals.
[0019] One surface of a movable carrier plate 5 that can move in the vertical direction is installed on the Z-axis driving module 3. A variable pitch module 6 is installed on the other surface of the movable carrier plate 5. A support bar 7 is installed on each variable pitch slider 61 of the variable pitch module 6, and a suction nozzle 4 is installed at the lower end of each support bar 7 whose upper end is connected to the variable pitch slider 61.
[0020] Embodiment 2: A high-efficiency chip carrying component includes: an X-direction driving module 1, a Y-direction driving module 2 movably installed on the X-direction driving module 1, a Z-axis driving module 3 movably installed on the Y-direction driving module 2, and a plurality of suction nozzles 4 for picking up chips 100. The vertically arranged suction nozzles 4 are movably installed on the Z-axis driving module 3. One surface of a movable carrier plate 5 that can move in the vertical direction is installed on the Z-axis driving module 3. A variable pitch module 6 is installed on the other surface of the movable carrier plate 5. A support bar 7 is installed on each variable pitch slider 61 of the variable pitch module 6, and a blade cylinder 8 is installed at the lower end of each support bar 7 whose upper end is connected to the variable pitch slider 61. The upper end of each suction nozzle 4 is connected to the corresponding blade cylinder 8.
[0021] A vision bracket 21 is installed on the above-mentioned Y-direction driving module 2 and on one side of the Z-axis driving module 3. A camera 22 and a light source 23 located directly below the camera 22 are installed on the surface of the vision bracket 21 that can move along the Y direction and is opposite to the side of the Y-direction driving module 2.
[0022] The above-mentioned variable pitch module 6 is installed on the movable carrier plate 5 through a bracket 62.
[0023] The 8 blade cylinders 8 are arranged at equal intervals.
[0024] Through the suction nozzles of the high-efficiency chip carrying component, pick up the chip tray located at the top layer in the loading box of the material bin component to pick up the chips to be tested, and then through the combined movement of the X-direction, Y-direction, and Z-axis in the high-efficiency chip carrying component, transport the chips to be tested into the chip socket of the test component;
[0025] The nozzle for efficiently transporting components of the chip picks up the tested chips from the chip socket, and then, through the combined movement of the X-axis, Y-axis, and Z-axis in the chip efficient transport component, transports the tested chips above the bin component. According to the classification of the chips obtained during the testing process, different grades of chips are placed in the chip trays in different discharging boxes. For example, grade A chips are placed in the chip trays in the A discharging box, and grade B chips are placed in the chip trays in the B discharging box. When it is necessary to place a tested chip in the corresponding chip tray in the discharging box, first, through the combined movement of the X-axis, Y-axis, and Z-axis, the nozzle picking up the tested chip is moved above the corresponding chip tray, and then the blade cylinder further drives the nozzle to move down to place the chip in the corresponding chip tray. During this process, the chips on the other nozzles will not be affected by adverse interference and will not collide, fall off, etc.
[0026] After all the tested chips in the test component are moved to the chip trays in the discharging box, continue to use the nozzle of the chip efficient transport component to pick up the chip tray at the top layer in the feeding box of the bin component to pick up the chips to be tested, and then, through the combined movement of the X-axis, Y-axis, and Z-axis in the chip efficient transport component, transport the chips to be tested into the chip socket of the test component for the next round of testing, and so on in sequence.
[0027] When using the above chip efficient transport component, it can not only pick up and transport multiple chips simultaneously, but also realize the independent picking and placing of chips through the contraction of the blade cylinder without affecting the chips on other nozzles. It can also compensate for the pitch difference of the chips between the front and rear ends of the transport by adjusting the distance between the nozzles, thereby improving the chip transport efficiency while meeting the requirements of different scenarios.
[0028] The above embodiments are only used to illustrate the technical concept and features of the present invention, and their purpose is to enable those who are familiar with this technology to understand the content of the present invention and implement it accordingly. It should not be used to limit the protection scope of the present invention. All equivalent changes or modifications made according to the spirit and essence of the present invention should be covered within the protection scope of the present invention.
Claims
1. An efficient chip carrying component, comprising: An X-direction driving module (1), a Y-direction driving module (2) movably mounted on the X-direction driving module (1), a Z-axis driving module (3) movably mounted on the Y-direction driving module (2), and a plurality of suction nozzles (4) for picking up chips (100). The vertically arranged suction nozzles (4) are movably mounted on the Z-axis driving module (3). It is characterized in that: one surface of a movable carrier plate (5) movable in the vertical direction is mounted on the Z-axis driving module (3), a pitch-changing module (6) is mounted on the other surface of the movable carrier plate (5), a support bar (7) is mounted on each pitch-changing slider (61) of the pitch-changing module (6), a blade cylinder (8) is mounted at the lower end of each support bar (7) with the upper end connected to the pitch-changing slider (61), and the upper end of each suction nozzle (4) is connected to the corresponding blade cylinder (8).
2. The highly efficient chip carrier assembly according to claim 1, wherein: A vision bracket (21) is mounted on the Y-direction driving module (2) and on one side of the Z-axis driving module (3). A camera (22) and a light source (23) located directly below the camera (22) are mounted on the surface of the vision bracket (21) movable in the Y-direction and opposite to the Y-direction driving module (2).
3. The chip high-efficiency carrier assembly according to claim 1, characterized in that: 4 to 10 of the blade cylinders (8) are arranged at equal intervals.
4. The chip high-efficiency carrier component according to claim 1, wherein: The pitch-changing module (6) is mounted on the movable carrier plate (5) through a bracket (262).