Multi-size wafer cleaning clamp

Abstract

The utility model discloses a multi-size wafer cleaning clamp which comprises a cleaning disc and a positioning rod arranged in the center of the cleaning disc, and is characterized in that a plurality of mounting grooves are formed in the cleaning disc, partition plates are arranged in the mounting grooves, the mounting grooves are divided into first mounting areas and second mounting areas by the partition plates, the first mounting areas are located in the inner ring of the cleaning disc, and the second mounting areas are located in the outer ring of the cleaning disc. The second mounting area is located on the outer ring of the cleaning disc, and a plurality of clamping jaw mechanisms are arranged in the mounting groove. The wafer cleaning disc is simple in structure, the first clamping jaw is located on the inner ring of the cleaning disc and used for clamping a four-inch wafer, and the second clamping jaw is located on the outer ring of the cleaning disc and used for clamping an eight-inch wafer, so that the cleaning disc can be suitable for cleaning wafers of various sizes, the application range of the cleaning disc is widened, and due to the fact that the side edges of the wafers are clamped by the clamping jaws, the wafer cleaning efficiency is improved. Therefore, no damage is caused to the surface of the wafer, the wafer is protected to the greatest extent, and subsequent normal use of the wafer is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer cleaning, in particular to a multi-size wafer cleaning fixture. Background Technique

[0002] With the progress of microelectronics technology, the integration of chips has been continuously improved, the scale of components has been continuously reduced, and correspondingly, the requirements for the cleanliness of silicon wafers have become higher and higher. When cleaning semiconductor wafers, high-purity water is generally used for rinsing. During the rinsing process, due to the limitations of the surface tension and viscosity of the liquid, it is difficult to clean the fine gaps inside the wafers. In order to ensure the cleaning efficiency of semiconductor wafers, supercritical carbon dioxide with low viscosity, high diffusivity, and low surface tension is used to clean the wafers. Supercritical carbon dioxide cleaning is an environmentally friendly and efficient cleaning technology.

[0003] The prior art with the application number CN202122559066.2 discloses a cleaning fixture suitable for 8-inch wafers, which is applicable to the cleaning process and baking process of chip wafers. There are 8 nylon studs inside for support. There is no contact between the chip acting surface and the fixture to protect the chip. It is designed for 8-inch wafers, but it is only applicable to the cleaning of 8-inch wafers, and the applicable range is small. Summary of the Invention

[0004] The purpose of the utility model is to provide a multi-size wafer cleaning fixture to solve the problems raised in the above background technique. To achieve the above purpose, the utility model provides the following technical solution: A multi-size wafer cleaning fixture, including a cleaning disk, a positioning rod is provided at the central position of the cleaning disk. It is characterized in that: a plurality of installation grooves are opened on the cleaning disk, partition plates are arranged in the installation grooves, and the installation grooves are divided into a first installation area and a second installation area by the partition plates. The first installation area is located in the inner circle of the cleaning disk, and the second installation area is located in the outer circle of the cleaning disk. A plurality of clamping jaw mechanisms are arranged in the installation grooves. The clamping jaw mechanism includes a first connecting jaw and a second connecting jaw, and the first connecting jaw and the second connecting jaw are connected by a pressing block. The first connecting jaw, the second connecting jaw, and the pressing block are all hinged. A spring is arranged on one side of the pressing block, and the spring is arranged between the pressing block and the partition plate.

[0005] Preferably, the bottom of the pressing block is movably connected to the inner side of the second installation area. The end of the first connecting jaw is connected to the first clamping jaw through a first connecting rod, and the end of the second connecting jaw is connected to the second clamping jaw through a second connecting rod. The bottoms of the first connecting rod and the second connecting rod are both movably connected to a collar and can swing left and right in the collar.

[0006] Preferably, the first clamping jaw is located in the inner circle of the cleaning disk, and the second clamping jaw is located in the outer circle of the cleaning disk.

[0007] Preferably, the length of the first clamping jaw is less than the length of the second clamping jaw.

[0008] Preferably, collar rings are provided at the bottoms of both the first installation area and the second installation area, and openings are made in the bottom areas of the first installation area and the second installation area in the middle of the collar rings.

[0009] Preferably, the distance from the axis of the first connecting rod to the partition board is less than the distance from the axis of the second connecting rod to the partition board.

[0010] Preferably, there are four first clamping jaws and also four second clamping jaws, and they are symmetrically distributed.

[0011] Compared with the prior art, the beneficial effects of the present utility model are as follows: The present utility model has a novel design. By using a reasonable mechanical structure, it ingeniously exploits the inherent potential of each element. The first clamping jaws are located inside the cleaning tray and are used to clamp four-inch wafers, while the second clamping jaws are located outside the cleaning tray and are used to clamp eight-inch wafers. This enables the cleaning tray to be applicable to the cleaning of wafers of various sizes, increasing the applicable range of the cleaning tray. Moreover, since the clamping jaws clamp the sides of the wafers, no damage will be caused to the surface of the wafers, protecting the wafers to the greatest extent and ensuring the normal subsequent use of the wafers. Description of the Drawings

[0012] Figure 1 is a schematic structural diagram of the present utility model;

[0013] Figure 2 is Figure 1 the enlarged view of part A in

[0014] Figure 3 is a top view of the structure of the present utility model;

[0015] Figure 4 is Figure 3 the enlarged view of part B in

[0016] Figure 5 is a side view of the structure of the present utility model;

[0017] Figure 6 is a cross-sectional view of the structure of the present utility model;

[0018] In the figure, cleaning tray - 1, positioning rod - 2, installation groove - 3, first installation area - 31, second installation area - 32, collar ring - 33, partition board - 4, clamping jaw mechanism - 5, first connecting claw - 51, second connecting claw - 52, pressing block - 53, first connecting rod - 54, first clamping jaw - 55, second connecting rod - 56, second clamping jaw - 57, spring - 6, four-inch wafer - 71, eight-inch wafer - 72. Detailed Embodiments

[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts belong to the scope of protection of the present utility model.

[0020] Please refer to Figures 1-5 , the present utility model provides a technical solution: a multi-size wafer cleaning fixture, including a cleaning disk 1, a positioning rod 2 is provided at the central position of the cleaning disk 1, and the cleaning disk 1 is installed in a cleaning machine through the positioning rod 2.

[0021] A plurality of installation slots 3 are opened on the cleaning disk 1, and partition plates 4 are provided in the installation slots 3. The installation slots 3 are divided into a first installation area 31 and a second installation area 32 by the partition plates 4. The first installation area 31 is located in the inner circle of the cleaning disk 1, and the second installation area 32 is located in the outer circle of the cleaning disk 1. Sleeve rings 33 are provided at the bottoms of both the first installation area 31 and the second installation area 32, and openings are provided in the bottom areas of the first installation area 31 and the second installation area 32 in the middle of the sleeve rings 33.

[0022] A plurality of jaw mechanisms 5 are provided in the installation slots 3. The jaw mechanism 5 includes a first connecting jaw 51 and a second connecting jaw 52. The first connecting jaw 51 and the second connecting jaw 52 are connected by a pressing block 53. The first connecting jaw 51, the second connecting jaw 52, and the pressing block 53 are all hinged. The bottom of the pressing block 53 is movably connected to the inner side of the second installation area 32. The end of the first connecting jaw 51 is connected to the first jaw 55 through a first connecting rod 54, and the end of the second connecting jaw 52 is connected to the second jaw 57 through a second connecting rod 56. The length of the first jaw 55 is less than the length of the second jaw 57.

[0023] There are four first jaws 55 and four second jaws 57, and they are symmetrically distributed.

[0024] The distance from the axis of the first connecting rod 54 to the partition plate 4 is less than the distance from the axis of the second connecting rod 56 to the partition plate 4. The connection points of the first connecting jaw 51, the second connecting jaw 52, and the pressing block 53 are located above the partition plate 4. Thus, the top of the pressing block 53 is inclined inward.

[0025] The first jaws 55 are located in the inner circle of the cleaning disk 1 and are used to clamp four-inch wafer chips 71. The second jaws 57 are located in the outer circle of the cleaning disk 1 and are used to clamp eight-inch wafer chips 72, so that the cleaning disk 1 can be applicable to the cleaning of wafer chips of multiple sizes, increasing the applicable range of the cleaning disk 1.

[0026] The bottoms of the first connecting rod 54 and the second connecting rod 56 are both movably connected to the sleeve ring 33 and can swing left and right within the sleeve ring 33.

[0027] One side of the briquetting block 53 is provided with a spring 6. The spring 6 is arranged between the briquetting block 53 and the partition plate 4, and both ends of the spring 6 are fixedly connected.

[0028] When the briquetting block 53 is squeezed, the top of the briquetting block 53 inclines towards the positioning rod 2. At this time, the spring 6 is squeezed. The bottoms of the first clamping jaw 55 and the second clamping jaw 57 both incline outwards. When it is necessary to clean the four-inch wafer 71, place the four-inch wafer 71 between the first clamping jaws 55. When it is necessary to clean the eight-inch wafer 72, place the eight-inch wafer 72 between the second clamping jaws 57. Then stop squeezing the briquetting block 53, and the spring 6's elastic force returns the briquetting block 53 to its original position. At this time, both the first clamping jaw 55 and the second clamping jaw 57 return to their original positions, thereby clamping the wafer to be cleaned. Since the clamping jaws clamp the side of the wafer, no damage will be caused to the surface of the wafer, protecting the wafer to the greatest extent and ensuring the subsequent normal use of the wafer.

[0029] The component for squeezing the briquetting block 53 is not shown in the drawings. Its shape is similar to a ring, and it is pushed by a cylinder built in the cleaning machine, and then the briquetting blocks 53 on the cleaning disk 1 are simultaneously squeezed through the ring, thereby realizing the synchronous movement of the first clamping jaw 55 and the second clamping jaw 57.

[0030] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A multi-size wafer cleaning fixture, including a cleaning tray (1), a positioning rod (2) is provided at the central position of the cleaning tray (1), and it is characterized in that: The cleaning disc (1) is provided with a plurality of mounting grooves (3). A partition plate (4) is arranged in each of the mounting grooves (3). The partition plate (4) divides the mounting groove (3) into a first mounting area (31) and a second mounting area (32). The first mounting area (31) is located in the inner circle of the cleaning disc (1), and the second mounting area (32) is located in the outer circle of the cleaning disc (1). A plurality of clamping jaw mechanisms (5) are arranged in the mounting groove (3). The clamping jaw mechanism (5) includes a first connecting jaw (51) and a second connecting jaw (52). The first connecting jaw (51) and the second connecting jaw (52) are connected by a pressing block (53). The first connecting jaw (51), the second connecting jaw (52), and the pressing block (53) are all hinged. A spring (6) is arranged on one side of the pressing block (53). The spring (6) is arranged between the pressing block (53) and the partition plate (4).

2. The multi-size wafer cleaning fixture according to claim 1, wherein: The bottom of the pressing block (53) is movably connected to the inner side of the second mounting area (32). The end of the first connecting jaw (51) is connected to the first clamping jaw (55) through a first connecting rod (54). The end of the second connecting jaw (52) is connected to the second clamping jaw (57) through a second connecting rod (56). The bottoms of the first connecting rod (54) and the second connecting rod (56) are both movably connected to a collar (33) and can swing left and right within the collar (33).

3. The multi-size wafer cleaning fixture according to claim 2, wherein: The first clamping jaw (55) is located in the inner circle of the cleaning disc (1), and the second clamping jaw (57) is located in the outer circle of the cleaning disc (1).

4. The multi-size wafer cleaning fixture according to claim 3, wherein: The length of the first clamping jaw (55) is less than the length of the second clamping jaw (57).

5. The multi-size wafer cleaning fixture according to claim 4, wherein: Collars (33) are arranged at the bottoms of both the first mounting area (31) and the second mounting area (32). Openings are provided in the bottom areas of the first mounting area (31) and the second mounting area (32) in the middle of the collar (33).

6. The multi-size wafer cleaning fixture according to claim 5, characterized in that: The distance from the axis of the first connecting rod (54) to the partition plate (4) is less than the distance from the axis of the second connecting rod (56) to the partition plate (4).

7. The multi-size wafer cleaning fixture according to claim 6, wherein: There are four first clamping jaws (55), and there are also four second clamping jaws (57), and they are symmetrically distributed.

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